TDA7313
DIGITAL CONTROLLED STEREO AUDIO PROCESSOR
WITH LOUDNESS
INPUTMULTIPLEXER:
- 3 STEREO INPUTS
- SELECTABLEINPUT GAINFOR OPTIMAL
ADAPTIONTO DIFFERENT SOURCES
INPUT AND OUTPUT FOR EXTERNAL
EQUALIZER OR NOISE REDUCTION SYS-
TEM
LOUDNESS FUNCTION
VOLUMECONTROL IN 1.25dB STEPS
TREBLEAND BASSCONTROL
FOURSPEAKERATTENUATORS:
- 4 INDEPENDENT SPEAKERSCONTROL
IN 1.25dB STEPS FOR BALANCE AND
FADERFACILITIES
- INDEPENDENT MUTE FUNCTION
ALL FUNCTIONS PROGRAMMABLE VIA SE-
RIAL I2C BUS
DESCRIPTION
The TDA7313 is a volume, tone (bass and treble)
balance (Left/Right) and fader (front/rear) processor
for quality audio applications in car radio and Hi-Fi
systems.
Selectable input gain and externalloudness function
are provided. Control is accomplished by serial I2C
busmicroprocessorinterface.
TheAC signalsettingis obtainedbyresistornetworks
andswitchescombinedwithoperationalamplifiers.
Thanks to the used BIPOLAR/CMOS Tecnology,
LowDistortion, Low Noise andLowDCsteppingare
obtained.
November 1999
DIP28 SO28
ORDERING NUMBERS:
TDA7313 TDA7313D
PIN CONNECTION (Topview)
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THERMAL DATA
Symbol Description SO28 DIP28 Unit
Rthj-pins Thermal Resistance Junction-pins max 85 65 °C/W
QUICK REFERENCE DATA
Symbol Parameter Min. Typ. Max. Unit
VSSupply Voltage 6 9 10 V
VCL Max. input signal handling 2 Vrms
THD Total Harmonic DistortionV = 1Vrms f = 1KHz 0.01 0.1 %
S/N Signal to Noise Ratio 106 dB
SCChannel Separation f = 1KHz 103 dB
Volume Control 1.25dB step -78.75 0 dB
Bass and Treble Control 2db step -14 +14 dB
Fader and Balance Control 1.25dB step -38.75 0 dB
Input Gain 3.75dB step 0 11.25 dB
Mute Attenuation 100 dB
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VSOperating Supply Voltage 10.2 V
Tamb Operating Ambient Temperature -40 to 85 °C
Tstg Storage Temperature Range -55 to +150 °C
TEST CIRCUIT
TDA7313
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L1 15 L1
L2 14 L2
L3 13 L3
INPUT
SELECTOR
+ GAIN
C1
C2
C3
LEFT
INPUTS
3x
2.2µF
SUPPLY
R3 9 R3
R2 10 R2
R1 11 R1
C4
C5
C6
3x
2.2µF
RIGHT
INPUTS
231
V
CC AGND CREF
C9 2.2µF
OUT(L) IN(L)
17 16
VOL
+ LOUD
LOUD(L)
12
100nF
C14
BASS
19
5.6K R2
BOUT(L)
18
BIN(L)
100nF
C15
RB
TREBLE
C17
2.7nF
TREBLE(L)
4
MUTE
D94AU180
SERIAL BUS DECODER + LATCHES
SPKR
ATT 25
VOL
+ LOUD BASS TREBLE
OUT(R) IN(R)
C8 2.2µF
76
100nF
C12 100nF
C13
5.6K R1
BOUT(R) BIN(R)
21 20
RB
2.7nF
C16
TREBLE(R)
MUTE
SPKR
ATT
28
27
26
22
SCL
SDA
DIGGND
BUS
OUT
RIGHT
REAR
OUT LEFT
FRONT
5
22µFC7
8
LOUD(R)
C11
100nF
100nF
C10
MUTE
SPKR
ATT OUT LEFT
REAR
23
MUTE
SPKR
ATT OUT
RIGHT
FRONT
24
BLOCK DIAGRAM
TDA7313
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ELECTRICAL CHARACTERISTICS (refer to the test circuit Tamb =25°C, VS= 9V,RL=10K,
RG= 600, all controls flat (G = 0), f = 1KHz unless otherwise specified)
Symbol Parameter Test Condition Min. Typ. Max. Unit
SUPPLY
VSSupply Voltage 6 9 10 V
ISSupply Current 8 11 mA
SVR Ripple Rejection 60 80 dB
INPUTSELECTORS
RII Input Resistance Input 1, 2, 3 35 50 70 K
VCL Clipping Level 2 2.5 Vrms
SIN Input Separation (2) 80 100 dB
RLOutput Load resistance pin 7, 17 2 K
GINmin Min. Input Gain -1 0 1 dB
GINmax Max. Input Gain 11.25 dB
GSTEP Step Resolution 3.75 dB
eIN Input Noise G = 11.25dB 2 µV
VDC DC Steps adjacent gainsteps 4 20 mV
G = 18.75 to Mute 4 mV
VOLUMECONTROL
RIV Input Resistance 20 33 50 k
CRANGE Control Range 70 75 80 dB
AVMIN Min. Attenuation -1 0 1 dB
AVMAX Max. Attenuation 70 75 80 dB
ASTEP Step Resolution 0.5 1.25 1.75 dB
EAAttenuation Set Error Av = 0 to -20dB
Av = -20 to -60dB -1.25
-3 0 1.25
2dB
dB
ETTracking Error 2dB
V
DC DC Steps adjacent attenuationsteps
From 0dB to Av max 0
0.5 3
7.5 mV
mV
SPEAKERATTENUATORS
Crange Control Range 35 37.5 40 dB
SSTEP Step Resolution 0.5 1.25 1.75 dB
EAAttenuation set error 1.5 dB
AMUTE Output Mute Attenuation 80 100 dB
VDC DC Steps adjacent att.steps
from 0 to mute 0
13
10 mV
mV
BASS CONTROL (1)
Gb Control Range Max. Boost/cut +12 +14 +16 dB
BSTEP Step Resolution 1 2 3 dB
RBInternal Feedback Resistance 34 44 58 K
TREBLE CONTROL (1)
Gt Control Range Max. Boost/cut +13 +14 +15 dB
TSTEP Step Resolution 1 2 3 dB
TDA7313
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ELECTRICAL CHARACTERISTICS (continued)
Symbol Parameter Test Condition Min. Typ. Max. Unit
AUDIO OUTPUTS
VOCL Clipping Level d = 0.3% 2 2.5 Vrms
RLOutput LoadResistance 2 K
CLOutput LoadCapacitance 10 nF
ROUT Output resistance 30 75 120
VOUT DC Voltage Level 4.2 4.5 4.8 V
GENERAL
eNO Output Noise BW = 20-20KHz, flat
output muted
all gains = 0dB 2.5
515
µV
µ
V
A curve all gains = 0dB 3 µV
S/N Signal to Noise Ratio all gains = 0dB; VO= 1Vrms 106 dB
d Distortion AV=0,V
IN = 1Vrms
AV= -20dB VIN = 1Vrms
VIN = 0.3Vrms
0.01
0.09
0.04
0.1
0.3 %
%
%
Sc Channel Separation left/right 80 103 dB
Total Tracking error AV= 0 to -20dB
-20 to -60 dB 0
01
2dB
dB
BUS INPUTS
VIL Input Low Voltage 1V
V
IH Input High Voltage 3 V
IIN Input Current -5 +5 µA
VOOutput VoltageSDA
Acknowledge IO= 1.6mA 0.4 V
Notes:
(1) Bass and Trebleresponse see attached diagram(fig.16). The center frequency and quality of the resonance behaviour can be choosen by
the external circuitry. A standardfirst order bass response can be realized by a standard feedback network
(2) The selected input is grounded thru the 2.2µF capacitor.
Figure2: Loudnessvs. Frequency(CLOUD =
100nF) vs. Volume Attenuation
Figure 1: Loudnessvs. VolumeAttenuation
TDA7313
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Figure6: Distortion& Noisevs. Frequency
Figure 7: Distortion & Noise vs. Frequency Figure8: Distortionvs. Load Resistance
Figure4: Noise vs. Volume/GainSettings
Figure 5: Signal to Noise Ratio vs. Volume
Setting
Figure 3: Loudnessvs. External Capacitors
TDA7313
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Figure12: OutputClipping Level vs. Supply
Voltage
Figure14: SupplyCurrent vs. Temperature
Figure 13: QuiescentCurrent vs. SupplyVoltage
Figure10: InputSeparation(L1 L2, L3, L4) vs.
Frequency
Figure 9: ChannelSeparation(L R) vs.
Frequency
Figure 11: Supply Voltage Rejection vs.
Frequency
TDA7313
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I2C BUS INTERFACE
Data transmission from microprocessor to the
TDA7313 and viceversa takes place thru the 2
wires I2C BUS interface, consisting of the two
lines SDA and SCL (pull-up resistors to positive
supply voltage must be connected).
Data Validity
As shown in fig. 17, the data on the SDA line
must be stable during the high period of the clock.
The HIGH and LOW state of the data line can
only change when the clock signal on the SCL
line is LOW.
Start and Stop Conditions
As shown in fig.18 a start condition is a HIGH to
LOW transition of the SDA line while SCL is
HIGH. The stop condition is a LOW to HIGH tran-
sition of the SDA line while SCL is HIGH.
Byte Format
Every byte transferredon the SDA line must con-
tain 8 bits. Each byte must be followed by an ac-
knowledgebit. The MSB is transferredfirst.
Acknowledge
The master (µP) puts a resistive HIGH level on the
SDA line during the acknowledgeclock pulse (see
fig. 19). The peripheral (audioprocessor) that ac-
knowledges has to pull-down (LOW) the SDA line
during the acknowledge clock pulse, so that the
SDAlineis stableLOWduringthisclockpulse.
The audioprocessor which has been addressed
has to generate an acknowledge after the recep-
tion of each byte, otherwise the SDA line remains
at the HIGH level during the ninth clock pulse
time. In this case the master transmitter can gen-
erate the STOP information in order to abort the
transfer.
Transmissionwithout Acknowledge
Avoiding to detect the acknowledge of the audio-
processor, the µP can use a simplier transmis-
sion: simply it waits one clock without checking
the slave acknowledging, and sends the new
data.
This approach of course is less protected from
misworking and decreasesthe noise immunity.
Figure 17: Data Validity on the I2CBUS
Figure16: TypicalTone Response (with the ext.
components indicatedin the test
circuit)
Figure 15: BassResistancevs. Temperature
TDA7313
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SOFTWARE SPECIFICATION
Interface Protocol
The interfaceprotocol comprises:
A startcondition (s)
A chip address byte, containing the TDA7313
address(the 8th bit of the bytemust be 0). The
TDA7313must always acknowledgeat theend
of each transmitted byte.
A sequenceof data (N-bytes + acknowledge)
A stopcondition (P)
TDA7313 ADDRESS
MSB first byte LSB MSB LSB MSB LSB
S10001000
ACK DATA ACK DATA ACK P
Data Transferred (N-bytes + Acknowledge)
ACK = Acknowledge
S = Start
P = Stop
MAX CLOCK SPEED 100kbits/s
SOFTWARE SPECIFICATION
Chip address
1
MSB 0001000
LSB
DATA BYTES
MSB LSB FUNCTION
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
1
B2
0
1
0
1
0
1
1
B1
B1
B1
B1
B1
G1
0
1
B0
B0
B0
B0
B0
G0
C3
C3
A2
A2
A2
A2
A2
S2
C2
C2
A1
A1
A1
A1
A1
S1
C1
C1
A0
A0
A0
A0
A0
S0
C0
C0
Volume control
Speaker ATT LR
Speaker ATT RR
Speaker ATT LF
Speaker ATT RF
Audio switch
Bass control
Treble control
Ax = 1.25dB steps; Bx = 10dB steps; Cx = 2dB steps; Gx = 3.75dBsteps
Figure 18: TimingDiagramof I2CBUS
Figure 19: Acknowledgeon the I2CBUS
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SOFTWARE SPECIFICATION (continued)
DATA BYTES(detailed description)
Volume
MSB LSB FUNCTION
0 0 B2 B1 B0 A2 A1 A0 Volume 1.25dB steps
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-1.25
-2.5
-3.75
-5
-6.25
-7.5
-8.75
0 0 B2 B1 B0 A2 A1 A0 Volume 10dB steps
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-10
-20
-30
-40
-50
-60
-70
For example a volume of -45dB is givenby:
00100100
Speaker Attenuators
MSB LSB FUNCTION
1
1
1
1
0
0
1
1
0
1
0
1
B1
B1
B1
B1
B0
B0
B0
B0
A2
A2
A2
A2
A1
A1
A1
A1
A0
A0
A0
A0
Speaker LF
Speaker RF
Speaker LR
Speaker RR
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
-1.25
-2.5
-3.75
-5
-6.25
-7.5
-8.75
0
0
1
1
0
1
0
1
0
-10
-20
-30
11111 Mute
For example attenuationof 25dB on speakerRF is given by:
10110100
TDA7313
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Audio Switch
MSB LSB FUNCTION
0 1 0 G1 G0 S2 S1 S0 Audio Switch
0
1
0
0
1
1
0
1
0
1
Stereo 1
Stereo 2
Stereo 3
Stereo 4 (*)
LOUDNESS ON
LOUDNESS OFF
0
0
1
1
0
1
0
1
+11.25dB
+7.5dB
+3.75dB
0dB
For example to select the stereo 2 input with a gain of +7.5dBLOUDNESS ON the 8bit string is:
01001001
(*) Stereo 4 is connectedinternally, but not availableon pins.
Bass andTreble
0
01
11
10
1C3
C3 C2
C2 C1
C1 C0
C0 Bass
Treble
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
0
0
1
1
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
-14
-12
-10
-8
-6
-4
-2
0
0
2
4
6
8
10
12
14
C3 = Sign
For example Bass at -10dB is obtained by the following8 bit string:
01100010
Purchase of I2C Components of STMicroelectronics, conveys a license under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C
StandardSpecificationsas definedby Philips.
TDA7313
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SO28
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.65 0.104
a1 0.1 0.3 0.004 0.012
b 0.35 0.49 0.014 0.019
b1 0.23 0.32 0.009 0.013
C 0.5 0.020
c1 45°(typ.)
D 17.7 18.1 0.697 0.713
E 10 10.65 0.394 0.419
e 1.27 0.050
e3 16.51 0.65
F 7.4 7.6 0.291 0.299
L 0.4 1.27 0.016 0.050
S8°(max.)
OUTLINE AND
MECHANICAL DATA
TDA7313
12/14
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.63 0.025
b 0.45 0.018
b1 0.23 0.31 0.009
0.012
b2 1.27 0.050
D 37.34 1.470
E 15.2 16.68 0.598 0.657
e 2.54 0.100
e3 33.02 1.300
F 14.1 0.555
I 4.445 0.175
L 3.3 0.130 DIP28
OUTLINE AND
MECHANICAL DATA
TDA7313
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as criticalcomponents in life support devices or systems without express written approval of STMicroelectronics.
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TDA7313
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