Intel® Ethernet Controller X550-BT2
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Specifications
Essentials
Networking
Specifications
Package Specifications
Intel® Virtualization
Technology for
Connectivity
Advanced Technologies
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Steppings
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Specifications
-Essentials
Status Launched
Launch Date Q4'15
Expected Discontinuance 2023
Lithography 28 nm
TDP 11 W
Recommended Customer Price $79.61
Datasheet Link
Description
Fully integrated 10GBASE-T
controller designed for LAN-on-
Motherboard (LOM) & Converged
Network Adapters (CNA)
Product Brief Link
Supported Operating Systems
FreeBSD 10.2, Linux RHEL 6.7,
Linux RHEL 7.1, Linux SLES 11
SP4, Linux SLES 11 SP4-IA64,
Linux SLES 12, Linux Stable
Kernel version 2.6/3.x, Linux
Stable Kernel version 4.x, UEFI
2.1, UEFI 2.3, UEFI 2.4, VMware
ESXi 5.5/6.0, Windows 7 SP1,
Windows 8, Windows 8.1,
Windows 10, Windows Server
2008 R2, Windows Server 2008
R2 Core, Windows Server 2008
R2 Hyper-V, Windows Server
2012, Windows Server 2012
Core, Windows Server 2012
Hyper-V, Windows Server 2012
R2, Windows Server 2012 R2
Core, Windows Server 2012 R2
Hyper-V, WinPE 3.0 (2008 R2 PE),
WinPE 4.0 (2012 PE), WinPE 5.0
(2012 R2 PE)
Operating Temperature Range 0°C to 55°C
-Networking Specifications
# of Ports Dual
Data Rate Per Port 10/5.0/2.5/1 GbE (NBASE-T in
Linux Only)
System Interface Type PCIe v2.1 (5.0GT/s)
NC Sideband Interface Yes
Jumbo Frames Supported Yes
Controller ELX550BT2
100Base-T Yes
1000Base-T Yes
10GBase-T Yes
-Package Specifications
Package Size 25mm x 25mm
Low Halogen Options Available See MDDS
-Intel® Virtualization Technology for Connectivity
Related Products
Intel® 10 Gigabit Ethernet
Network Connection
Intel® Ethernet Controller
X550 Series
Products formerly
Sageville
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The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without
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System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709
requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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Flexible Port Partitioning Yes
Virtual Machine Device Queues (VMDq) Yes
PCI-SIG* SR-IOV Capable Yes
-Advanced Technologies
Intel® Virtualization Technology for Connectivity
(VT-c) VMDq, SR-IOV
Fiber Channel over Ethernet Yes
MACsec IEEE 802.1 AE No
IEEE 1588 Yes
Supported Under vPro No
iWARP/RDMA No
Intel® Ethernet Power Management Yes
Intel® Data Direct I/O Technology Yes
Intelligent Offloads Yes
Storage Over Ethernet iSCSI, FCoE, NFS
