LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D2.7-V and 5-V Performance
D−40°C to 125°C Specification at 5 V
DNo Crossover Distortion
DGain Bandwith of 152 kHz
DLow Supply Current
− LPV321 ...9 μA
− LPV358 ...15 μA
− LPV324 ...28 μA
DRail-to-Rail Output Swing at 100-kΩ Load
− VCC+ − 3.5 mV
− VCC− + 90 mV
DVICR . . . −0.2 V to VCC+ − 0.8 V
DStable With Capacitive Load of 1000 pF
DApplications
− Active Filters
− General-Purpose, Low-Voltage
Applications
− Low-Power and/or Portable Applications
DLatch-Up Performance Exceeds 100 mA per
JESD 78, Class II
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The LPV321/358/324 devices are low-power (9 μA per channel at 5 V) versions of the LMV321/358/324
operational amplifiers. These are additions to the LMV321/358/324 family of commodity operational amplifiers.
The LPV321/358/324 devices are the most cost-effective solutions for applications where low voltage,
low-power operation, space saving, and low price are needed. These devices have rail-to-rail output-swing
capability, and the input common-mode voltage range includes ground. They all exhibit excellent speed-power
ratios, achieving 152 kHz of bandwidth, with a supply current of only 9 μA typical.
The LPV321, LPV358, and LPV324 are characterized for operation from −40°C to 85°C. The LPV321I,
LPV358I, and LPV324I are characterized for operation from −40°C to 125°C.
Copyright © 2005, Texas Instruments Incorporated
LPV321 . . . DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
IN+
VCC−
IN−
VCC+
OUTPUT
LPV358 ...D, DDU, OR DGK PACKAGE
(TOP VIEW)
LPV324 ...D OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
VCC+
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
VCC−
3IN+
3IN−
3OUT
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
VCC−
VCC+
2OUT
2IN−
2IN+
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOT23 5 (DBV)
Reel of 3000 LPV321DBVR 5C7_
Single
SOT23-5 (DBV) Reel of 250 LPV321DBVT PREVIEW
Single
SC 70 (DCK)
Reel of 3000 LPV321DCKR 52_
SC-70 (DCK) Reel of 250 LPV321DCKT PREVIEW
SOIC 8 (D)
Tube of 75 LPV358D
PV358
SOIC-8 (D) Reel of 2500 LPV358DR PV358
−40°C to 85°CDual VSSOP-8 (DDU) Reel of 3000 LPV358DDUR 5A56
Dual
VSSOP 8 (DGK)
Reel of 2500 LPV358DGKR 546
VSSOP-8 (DGK) Reel of 250 LPV358DGKT PREVIEW
SOIC 14 (D)
Tube of 50 LPV324D
LPV324
Quad
SOIC-14 (D) Reel of 2500 LPV324DR LPV324
Quad
TSSOP 14 (PW)
Tube of 90 LPV324PW
PV324
TSSOP-14 (PW) Reel of 2000 LPV324PWR PV324
SOT23 5 (DBV)
Reel of 3000 LPV321IDBVR 5C1_
Single
SOT23-5 (DBV) Reel of 250 LPV321IDBVT PREVIEW
Single
SC 70 (DCK)
Reel of 3000 LPV321IDCKR 53_
SC-70 (DCK) Reel of 250 LPV321IDCKT PREVIEW
SOIC 8 (D)
Tube of 75 LPV358ID
PV358I
SOIC-8 (D) Reel of 2500 LPV358IDR PV358I
−40°C to 125°CDual VSSOP-8 (DDU) Reel of 3000 LPV358IDDUR 5AE6
Dual
VSSOP 8 (DGK)
Reel of 2500 LPV358IDGKR 556
VSSOP-8 (DGK) Reel of 250 LPV358IDGKT PREVIEW
SOIC 14 (D)
Tube of 50 LPV324ID
LPV324I
Quad
SOIC-14 (D) Reel of 2500 LPV324IDR LPV324I
Quad
TSSOP 14 (PW)
Tube of 90 LPV324IPW
PV324I
TSSOP-14 (PW) Reel of 2000 LPV324IPWR PV324I
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
symbol (each amplifier)
+
−
IN−
IN+
OUT
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LPV324 simplified schematic
VBIAS4
−
+
−
+
IN+
IN−
VBIAS1
VBIAS2
VBIAS3
−
+
−
+
Output
VCC
VCC
VCC
VCC
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC+ − VCC− (see Note 1) 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) VCC− to VCC+ − 1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 3 and 4): 5-pin DBV package 206°C/W. . . . . . . . . . . . . . . . . . .
5-pin DCK package 252°C/W. . . . . . . . . . . . . . . . . . .
8-pin D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . .
8-pin DDU package TBD°C/W. . . . . . . . . . . . . . . . . .
8-pin DGK package 172°C/W. . . . . . . . . . . . . . . . . . .
14-pin D package 86°C/W. . . . . . . . . . . . . . . . . . . . . .
14-pin PW package 113°C/W. . . . . . . . . . . . . . . . . . .
Maximum junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and VCC specified for the measurement of IOS, are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN−.
3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage 2.7 5 V
T
Operating free air temperature
LPV3xx −40 85 °
C
TAOperating free-air temperature LPV3xxI −40 125 °C
ESD protection
TEST CONDITIONS TYP UNIT
Human-Body Model 2 kV
Machine model 200 V
Charged-Device Model 1 kV
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2.7-V electrical characteristics
TA = 25°C, VCC+ = 2.7 V, VCC− = 0 V, VIC = 1 V, VO = VCC+/2, and RL > 1 MΩ (unless otherwise
noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIO Input offset voltage 1.2 7 mV
αVIO
Average temperature
coefficient of
input offset voltage
4mV/°C
IIB Input bias current 1.7 50 nA
IIO Input offset current 0.6 40 nA
CMRR Common-mode
rejection ratio 0 ≤ VIC ≤ 1.7 V 50 70 dB
kSVR
Supply-voltage
rejection ratio 2.7 V ≤VCC+ ≤5 V, VIC = 1 V, VO = 1 V 50 65 dB
VICR
Common-mode
input voltage range CMRR ≥ 50 dB 0 to 1.7 −0.2 to 1.9 V
V
Output swing
High level VCC+ − 0.100 VCC+ − 0.003
V
VOOutput swing RL = 100 kΩ to 1.35 V Low level 0.080 0.180 V
LPV321 4 8
ICC Supply current LPV358 (both amplifiers) 8 16 mA
ICC
Supply
current
LPV324 (all four amplifiers) 16 24
mA
SR Slew rate‡0.1 V/ms
GBW Gain bandwidth product CL = 22 pF (see Note 5) 205 kHz
FmPhase margin CL = 22 pF (see Note 5) 71 deg
Gain margin CL = 22 pF (see Note 5) 11 dB
Vn
Equivalent input
noise voltage f = 1 kHz 178 nV/√Hz
In
Equivalent input
noise current f = 1 kHz 0.5 pA/√Hz
†All typical values are at VCC = 2.7 V, TA = 25°C.
‡Number specified is the slower of the positive and negative slew rates.
NOTE 5: Closed-loop gain = 18 dB, VIC = VCC+/2
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5-V electrical characteristics
TA = 25°C, VCC+ = 5 V, VCC− = 0 V, VIC = 2 V, VO = VCC+/2, and RL > 1 MΩ (unless otherwise noted)
PARAMETER TEST CONDITIONS TAMIN TYP†MAX UNIT
25°C 1.5 7
VIO Input offset voltage −40°C to 85°C 10 mV
VIO
Input
offset
voltage
−40°C to 125°C11
mV
αVIO
Average temperature
coefficient of
input offset voltage
25°C 4 mV/°C
25°C 2 50
IIB Input bias current −40°C to 85°C 60 nA
IIB
Input
bias
current
−40°C to 125°C 65
nA
CMRR Common-mode
rejection ratio 0 ≤ VIC ≤ 4 V 25°C 50 71 dB
kSVR
Supply-voltage
rejection ratio
2.7 V ≤VCC+ ≤5 V,
VIC = 1 V, VO = 1 V 25°C 50 65 dB
VICR
Common-mode
input voltage range CMRR ≥ 50 dB 25°C0 to 4 −0.2 to 4.2 V
25°C 0.6 40
IIO Input offset current −40°C to 85°C 50 nA
IIO
Input
offset
current
−40°C to 125°C 55
nA
Hi h
25°C VCC+ − 0.100 VCC+ − 0.0035
High
level
−40°C to 85°C VCC+ − 0.200
V
Output swing
R100 kΩto25V
l
eve
l
−40°C to 125°C VCC+ − 0.225
V
VOOutput swing RL = 100 kΩ to 2.5 V
L
25°C 0.090 0.180 V
Low
level
−40°C to 85°C 0.220
l
eve
l
−40°C to 125°C 0.240
I
Output short-circuit Sourcing, VO = 0 V
25°C
2 17
mA
IOS
Output
short circuit
current Sinking, VO = 5 V 25°C20 72 mA
25°C 9 12
LPV321 −40°C to 85°C 15
LPV321
−40°C to 125°C 40
25°C 15 20
ICC Supply current LPV358 (both amplifiers) −40°C to 85°C 24 mA
ICC
Supply
current
LPV358
(both
amplifiers)
−40°C to 125°C 80
mA
25°C 28 42
LPV324 (all four amplifiers) −40°C to 85°C 46
LPV324
(all
four
amplifiers)
−40°C to 125°C 125
Lil
25°C 15 100
AV‡Large-signal
voltage gain
RL = 100 kΩ−40°C to 85°C 10 V/mV
AV
vo
lt
age ga
i
n
RL
100
kΩ
−40°C to 125°C 10
V/mV
SR§Slew rate 25°C 0.1 V/ms
†All typical values are at VCC = 5 V, TA = 25°C.
‡RL is connected to VCC−. The output voltage is 0.5 V ≤VO ≤4.5 V.
§Number specified is the slower of the positive and negative slew rates. Connected as a voltage follower with 3-V step input.
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5-V electrical characteristics
TA = 25°C, VCC+ = 5 V, VCC− = 0 V, VIC = 2 V, VO = VCC+/2, and RL > 1 MΩ (unless otherwise noted)
(continued)
PARAMETER TEST CONDITIONS TAMIN TYP†MAX UNIT
GBW Gain bandwidth product CL = 22 pF (see Note 5) 25°C 237 kHz
FmPhase margin CL = 22 pF (see Note 5) 25°C 74 deg
Gain margin CL = 22 pF (see Note 5) 25°C 12 dB
VnEquivalent input noise voltage f = 1 kHz 25°C 146 nV/√Hz
InEquivalent input noise current f = 1 kHz 25°C 0.3 pA/√Hz
†All typical values are at VCC = 5 V, TA = 25°C.
NOTE 5: Closed-loop gain = 18 dB, VIC = VCC+/2
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 1
0
5
10
15
20
25
30
0123456
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
(LPV324 − All Channels)
ICC − Supply Current − A
TA = 85C
TA = 25C
VCC+ − Supply Voltage − V
TA = 40C
Figure 2
0
1
2
3
4
5
6
−40 −20 0 20 40 60 80 100
INPUT BIAS CURRENT
vs
TEMPERATURE
IB, IIB − Input Bias Current − nA
VCC+ = 5 V
VIN = VCC+/2
TA − Temperature − C
Figure 3
0.001
0.01
0.1
10
100
1K
0.001 0.01 0.1 1 1
0
Output Voltage Referenced to V+ − V
SOURCING CURRENT
vs
OUTPUT VOLTAGE
IO − Source Current − mA
VCC+ = 2.7 V
1
Figure 4
0.001
0.01
0.1
1
10
100
1K
0.001 0.01 0.1 1 10
Output Voltage Referenced to V+ − V
IO − Source Current − mA
SOURCING CURRENT
vs
OUTPUT VOLTAGE
VCC+ = 5 V
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 5
0.001
0.01
0.1
1
10
100
1k
0.001 0.01 0.1 1 10
Output Voltage Referenced to GND − V
SINKING CURRENT
vs
OUTPUT VOLTAGE
IO − Sink Current − mA
VCC+ = 2.7 V
Figure 6
0.001
0.01
0.1
1
10
100
1k
0.001 0.01 0.1 1 10
Output Voltage Referenced to GND − V
SINKING CURRENT
vs
OUTPUT VOLTAGE
IO − Sink Current − mA
VCC+ = 5 V
Figure 7
0
20
40
60
80
100
120
140
160
180
200
220
240
2.5 3 3.5 4 4.5 5 5.5
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
Output Voltage From Supply Voltage − mV
RL = 10 kΩ
Negative Swing
Positive Swing
Rl Terminated to Opposing Supply Rail
RL = 100 kΩ
RL = 100 kΩ
RL = 10 kΩ
VCC+ − Supply Voltage − V
Figure 8
100
120
140
160
180
200
220
10 100 1k
Frequency − Hz
INPUT VOLTAGE NOISE
vs
FREQUENCY
Input Voltage Noise − nV/Hz
VCC+ = 5 V
VCC+ = 2.7 V
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 9
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
10 100 1k 10k
Frequency − Hz
INPUT CURRENT NOISE
vs
FREQUENCY
I
nput
C
urrent
N
o
i
se − p
A/H
z
VCC+ = 2.7 V
VCC+ = 5 V
Figure 10
40
50
60
70
80
90
100
110
120
130
140
100 1k 10k 100k
Frequency − Hz
CROSSTALK REJECTION
vs
FREQUENCY
Crosstalk Rejection − dB
VCC+ = 5 V
RL = 100 k
AV = 1
VI = 3 VPP
Figure 11
Frequency − Hz
PSRR
vs
FREQUENCY
RL = 10 kΩ
−15
−5
5
15
25
35
45
55
65
75
85
PSRR − dB
100 1k 10k 100k 1M
VCC+ = 5 V,
+PSRR
VCC+ = −5 V,
−PSRR
VCC+ = 2.7 V,
+PSRR
VCC+ = −2.7 V,
−PSRR
Figure 12
FREQUENCY
vs
RL
−10
0
10
20
30
40
1k 10k 100k 1M 10M
Frequency − Hz
Gain − dB
−20
0
20
40
60
80
100
120
140
160
180
Phase Margin − Deg
VCC+ = 2.7 V
RL = 10 kΩ
RL = 100 kΩ
Phase
Gain
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 13
−10
0
10
20
30
40
1k 10k 100k 1M
Frequency − Hz
Gain − dB
−20
0
20
40
60
80
100
120
140
160
180
Phase Margin − Deg
FREQUENCY
vs
RL
VCC+ = 5 V
RL = 10 kΩ
RL = 100 kΩ
Phase
Gain
0
Figure 14
FREQUENCY RESPONSE
vs
CL
Gain − dB
−10
10
20
30
40
1k 10k 100k 1M 10M
Frequency − Hz
−60
−40
−20
0
20
40
60
80
100
120
140
Phase Margin − Deg
Gain
Phase CL = 22 pF
CL = 200 pF
CL = 1000 pF
CL = 22 pF
CL = 200 pF
CL = 1,000 pF
VCC+ = 2.7 V
−80
−60
−40
−20
0
20
40
60
80
100
120
Figure 15
FREQUENCY RESPONSE
vs
CL
Gain − dB
−10
0
10
20
30
40
1k 10k 100k 1M
Frequency − Hz
Phase Margin − Deg
VCC+ = 5.0 V
CL = 22 pF
CL = 200 pF
CL = 1,000 pF
Phase
Gain
Figure 16
SLEW RATE
vs
SUPPLY VOLTAGE
Slew Rate − V/s
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
0.11
0.12
0.13
2.5 3 3.5 4 4.5 5 5.5
VCC − Supply Voltage − V
Falling Edge
Positive Edge
Open Loop
VID = 100 mV
VCC+ = 5 V
Not Recommended for New Designs
LPV321 SINGLE, LPV358 DUAL, LPV324 QUAD
GENERAL-PURPOSE, LOW-VOLTAGE, LOW-POWER, RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS
SLOS433I − FEBRUARY 2004 − REVISED MARCH 2005
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
−1
0
1
2
3
4
−1
0
1
2
3
4
100 s/Div
TA = 25°C
RL = 10 kΩ
VCC = 5 V/0 V
AV = 1
Input − 1 V/Div
100 s/Div
TA = 25°C
RL = 10 kΩ
VCC = 5 V/0 V
AV = 1
Output − 1 V/Div
NONINVERTING LARGE-SIGNAL PULSE RESPONSE
Figure 17
−0.04
0
0.04
0.08
0.12
0.16
Figure 18
100 s/Div
VI = 100 mV/0 V
Input − 20 mV/Div
100 s/Div
Output − 20 mV/Div
NONINVERTING SMALL-SIGNAL PULSE RESPONSE
0
0.04
0.08
0.12
0.16
TA = 25°C
VCC+ = 5 V/0 V
RL = 10 kΩ
AV = 1
−4
−2
0
2
4
Figure 19
100 s/Div
TA = 25°C
Input − 1 V/Div
100 s/Div
Output − 1 V/Div
INVERTING LARGE-SIGNAL PULSE RESPONSE
−4
−2
0
2
4
6
TA = 25°C
RL = 10 kΩ
VCC+ = 5 V
6
AV = −5
Rf = 10 kΩ
Ri = 2 kΩ
−0.08
−0.04
0
0.04
0.08
Figure 20
100 s/Div
TA = 25 C
Input − 20 mV/Div
100 s/Div
Output − 20 mV/Div
INVERTING SMALL-SIGNAL PULSE RESPONSE
0
0.04
0.08
0.12
0.16
0.20
TA = 25°C
RL = 10 kΩ
VCC+ = 5 V
AV = −5
Rf = 10 kΩ
Ri = 2 kΩ
Not Recommended for New Designs
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LPV321DBVR NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321DBVRE4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321DBVRG4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321DCKR NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321DCKRE4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321DCKRG4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDBVR NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDBVRE4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDBVRG4 NRND SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDCKR NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDCKRE4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV321IDCKRG4 NRND SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324D NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324DE4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324DG4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324DR NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324DRE4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LPV324DRG4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324ID NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IDE4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IDG4 NRND SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IDR NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IDRE4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IDRG4 NRND SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPW NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPWE4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPWG4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPWR NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPWRE4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324IPWRG4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324PW NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324PWE4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324PWG4 NRND TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324PWR NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV324PWRE4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LPV324PWRG4 NRND TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358D NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DDUR NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DDURE4 NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DDURG4 NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DE4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DG4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DGKR NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DGKRG4 NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DR NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DRE4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358DRG4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358ID NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDDUR NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDDURE4 NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDDURG4 NRND VSSOP DDU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDE4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDG4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LPV358IDGKR NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDGKRG4 NRND VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDR NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDRE4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LPV358IDRG4 NRND SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LPV321DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LPV321DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LPV321IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
LPV321IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
LPV324DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LPV324IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LPV324IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LPV324PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
LPV358DDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
LPV358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LPV358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LPV358IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
LPV358IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LPV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1