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information
provided
is
subject
10
change
at
anytime.
'''ithout
notice.
Intel
may
make
change;
10
manufacturing
lifeqcle.specifiations.and
product
de;criptions
at
any
time.
'''ithout
notice.
The
information
herein
is
provided
""as-is'"
and
Intel
doe:;
not
make
any
repre;enta.tions
or
\...arrantiei> '''hatl;oe-ver
regardingaccuraq
of
the
information.
nor
on
the
product
featura..availability. functionality,
or
compatibility
of
the
product:s listed. Ple.Meconta.ctsY$1em
vendor
for
more
information
on
specific product:s or&Y$1ems.
··1n1el
classifications'"
consist
of
Export
Control
Classification
Numbera
IECCN)
and
Harmoniz.ed Tariff
Schedule
IHTS)
numbera.Any
use
made
of
Intel
classifications
are\\
1
ithout
recouraeto
Intel
and
shall
not
be
construed
as a
repre;entation
or
\W.rranty regarding
the
proper
E
CCN
or
HTS.
Your
company
may
be
the
eicponer
of
record.and
as
such.
your
company
is
re;ponsible
for
determining
the
correct
classification
of
any
item
at
the
time
of
eicpon.
Refer to
Oawheet
for
formal
definitions
of
product
propeniei>
and
feature;.
".Announced"" SKUs
are
not
yet
available. Please
refer
to
the
Launch Date
for
market
availability.
Some
produ<:t:s
an
suppon
AES Nm\•
Instructions
'''ith
a
Proce;sor
Configuration update. in panicular. i7-2630Qt·1/i7-263SQt·1. i7-2670Qt·1/i7-267SQt·1. iS-2430t·1/iS-243St·1. iS-2410t·1/iS-241 St·i. Please
contact
OE t·i
for
the
BIOS
that
include;
the
latest
Proce;sor
configuration
update.
*This
feature
may
not
be
available
on
all
<:omputingsystems. Please<:heck\\1ith
the
system
vendor
to
determine
if
your
system
delil!era this
feature.or
referen<:ethesystem
specifiations
lmotherboard.
processor.
<:hiPGet.
po\\>er
supply.
HOO,graphics
controller.
memory.
BIOS. dril!era.
vinual
machine
monitor-vt.1t.1.
platform
sofhw.re.andfor
operatingsystem)
for
feature<:ompatibility. Functionality.
performance.and
other
benefits
of
this feature
may
vary
depending
on
system
configuration.
"Conflict
free""
and
"conflict-free"" means "ORC<:onflict
free"".
'''hich
is
defined
by
the
U.S. Securitiei>
and
Exchange Commission rule:; to mean produ<:t:s
that
do
not
contain
conflict
minerals !tin.
tantalum.
tun~ten
and
for
gold)
that
directly
or
indirectlyfinan<:eor
benefitarmed
grouPG in
the
Democratic
Republic
of
the
Congo
IDRq
or
adjoining<:ountriei>.
Intel
also
use:;
theterm
""conflict-free"" in a
broader
sense
to
refer
to
suppliera.supply
<:hains.smeltera
and
ref
in era
'''hose
sources
of
conflict
minerals
do
not
finance
conflict
in
the
ORCor
adjoining<:ountriei>.
Intel
proce;sora
manufactured
before
January
1.
201 3
are
not
confirmed
conflict
free.
The
conflict
free designation refera
only
to
product
manufactured
after
that
date.
For
Intel
Boxed
Proce;sora.
the<:onflict free designation refera to
the
proce;soronly.
not
to
any
additional
included
a<:<:e;sories.su<:h as heatsink::s{<:oolera.
See
hnp
://\V\V\Y.intel
.<:om
{<:o
ntent/''"''"'''/
us
fen/
arch
itectu re-.a.nd-1ech
no
logy
/hyper-th
read ing(hyper-1h read ing-1ech
no
logy
.htm
l?\w.pk\,,=
hyper•th
reading
for
mo
re
information
including
details
on
'''h
ich
proce;sora
suppon
Intel~
HT
Technology.
t·iax Turbo Frequency
ref
era to
the
maximum
single-core
processor
frequency
that
an
be
achieved
'''ith
Intel~
Turbo
Boost
Technology. See\\1\\1\\•.intel.<:om/technology/turboboost/
for
more
information.
The
Recommended
Customer
Price l"RCP'1
is
pricing
guidance
for
Intel
produ<:t:s. Prices
are
for
direct
Intel
<:ustomera.
typially
repre;ent
1,000-unit
pur<:hasequantities.and
are
subject
to <:hange\\1
ithout
notice. Taxes
and
shipping,
et<:.
not
included.
Prices
mayvaryforother
pa<:~type;
and
shipment
quantities.and
special
promotional
arrangements
may
apply.
lfsold
in
bulk.
price
repre;ents
indillidual unit.
Listing
of
the;e
RCPdoe:;
not
constitute
a
formal
pricing
offer
from
Intel.
Please\\'Ork
'''ith
your
appropriate
Intel
repre;entatille
to
obtain
a
formal
pricequotation.
S'ystem
and
t·iaximum TOP
is
based
on
\\'OIOtases<:enarios.A<:tual TOP
may
be
IO\\>er
if
not
all
I/Os
for<:hiPGets
are
used.
LO\Y
Halogen:Appliei>
only
to
brominated
and
chlorinated
flame
retardants
IBFR.6/CFR.6)
and
PVC
in
the
final
product.
Intel
components
as
\\>ell
as
purchased
components
on
thefinished
assembly
meet
JS-709
requirements.and
the
PCB/
sub6trate
meet
IEC
61249-2-21
requirements.
The
replacement
of
halogenated
flame
retardants
and
for
PVC
may
not
be
better
for
the
environment.
For
benchmarking
data
see
hnp://\\1\\1\\•.intel.<:om/performan<:e.
Intel
proce;sor
numbera
are
not
a
measure
of
performance.
Proce;sor
numbera
differentiate
feature;
'''ithin
each
proce;sor
family.
not
across
different
proce;sor
familiei>. See hnp://\\1\\1\Y.intel.<:om{<:ontent
/\\1\\1\Y/
us
fen/
pro<:esso ra /
proce;so
r-n
um
bera
.htm
I
for
details.
Pro<:essora
thatsuppon
64-bit<:omputingon
Intel~
architecture
require
an
Intel
64ar<:hitecture-enabled BIOS.
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