DATA SHEET
PHOTOCOUPLERS
PS8601, PS8601L
HIGH SPEED ANALOG OUTPUT TYPE
8 PIN PHOTOCOUPLER
1995©
Document No. P11650EJ2V0DS00 (2nd edition)
(Previous No. LC-2362)
Date Published June 1996 P
Printed in Japan
DATA SHEET
DESCRIPTION
PS8601 and PS8601L is a 8-pin high speed photocoupler containing a GaAIAs LED on input side and a P-N
photodiode and a high speed amplifier transistor on output side on one chip. PS8601 is in a plastic DIP (Dual In-line
Package). PS8601L is lead bending type (Gull wing) for surface mount.
FEATURES
• High supply voltage (VCC = 35 V MAX.)
• High speed response (tPHL, tPLH: 0.8
s MAX.)
• High isolation voltage (BV: 5 000 Vr.m.s. MIN.)
• TTL, CMOS compatible with a resistor
• Taping product number (PS8601L-E3)
• UL recognized [File No. E72422(s)]
• VDE0884 recognized: option
APPLICATIONS
• Interface circuit for various instrumentations, control equipments.
• Computer and peripheral manufactures.
• Electrical isolation of TV video terminals.
ORDERING INFORMATION
PART NUMBER PACKAGE SAFETY STANDARD APPROVAL
PS8601 8 pin DIP
PS8601L 8 pin DIP, lead bending type
PS8601L1
PS8601L2
PS8601-V 8 pin DIP
PS8601L-V 8 pin DIP, lead bending type
PS8601L1-V
PS8601L2-V
[Handling Precaution]
This product is weak for static electricity by designed with high speed integrated circuit. So, protect against static
electricity when handling.
Normal specification products
• UL Approved
8 pin DIP, lead bending type
(for long distance)
VDE0884 specification products (option)
• VDE Approved
8 pin DIP, lead bending type
(for long distance)
2
PS8601, PS8601L
PACKAGE DIMENSIONS (Unit: mm)
85
10.16 MAX.
0.65
1.34 1.27
MAX.
3.8
MAX.
4.55
MAX.
2.8
MIN.
2.54
0.50 ± 0.10 0.25
M
7.62
0 to 15
o
6.5
6.5
14
8765
1234
Output
PIN CONNECTIONS (Top View)
DIP (Dual In-line Package) Lead Bending type (Gull-wing)
PS8601L
Input
1. NC
2. Anode
3. Cathode
4. NC
5. Emitter
6. VO
7. Base
8. VCC
10.16 MAX.
85
14
2.54
1.34 ± 0.10 0.25
M
7.62
3.8 MAX.
1.27
MAX.
0.05 to 0.2
0.9
± 0.25
9.60 ± 0.4
8765
1234
Output
PIN CONNECTIONS (Top View)
Input
1. NC
2. Anode
3. Cathode
4. NC
5. Emitter
6. VO
7. Base
8. VCC
85
10.16 MAX.
0.35
1.34 1.27 MAX.
3.8
MAX.
4.25
MAX.
2.8
MIN.
2.54
0.50 ± 0.10 0.25
M
7.62
0 to 15
o
6.5
10.16
14
85
10.16 MAX.
6.5
14
PS8601L1
Lead Bending type (for long distance)
PS8601L2
2.54
1.34 ± 0.10 0.25
M
7.62
10.16
11.8 ± 0.4
3.8 MAX.
0.05 to 0.2
1.27 MAX. 0.9 ± 0.25
PS8601
3
PS8601, PS8601L
ABSOLUTE MAXIMUM RATINGS (TC = 25
C)
Diode
Forward Current IF25 mA
Reverse Voltage VR5V
Power Dissipation PD45 mW
Detector
Supply Voltage VCC 35 V
Output Voltage VO35 V
Output Current IO8mA
Power Dissipation PC100 mW
Isolation Voltage*1 BV 5 000 Vr.m.s.
Operating Temperature TA
55 to +100
C
Storage Temperature Tstg
55 to +150
C
*1 AC voltage for 1 minute at TA = 25
C, RH = 60 % between input and output.
ELECTRICAL CHARACTERISTICS (TA = 25
C)
PARAMETER SYMBOL MIN. TYP
.MAX. UNIT TEST CONDITIONS
Diode Forward Voltage VF1.7 2.2 V IF = 16 mA
Reverse Current IR10
AV
R
= 5 V
Forward Voltage Temperature
Coefficient
VF
T
1.6 mV/
CI
F
= 16 mA
Junction Capacitance Ct60 pF V = 0, f = 1 MHz
Detector High Level Output Current IOH 1 3 500 nA IF = 0 mA, VCC = VO = 5.5 V
High Level Output Current IOH 2 100
AI
F
= 0 mA, VCC - VO = 35 V
Low Level Output Voltage VOL 0.1 0.4 V IF = 16 mA, VCC = 4.5 V,
IO = 1.2 mA
Low Level Supply Current ICCL 50
AI
F
= 16 mA, VO = Open, VCC = 35 V
High Level Supply Current ICCH 0.01 1
AI
F
= 0 mA, VO = Open, VCC = 35 V
Coupler Current Transfer Ratio CTR 15 % IF = 16 mA, VCC = 4.5 V,
VO = 0.4 V
Isolation Resistance R1-2 1011
Vin-out = 1 kVDC
Isolation Capacitance C1-2 0.7 pF V = 0, f - 1 MHz
Propagation Delay Time
(H
L) *2 tPHL 0.5 0.8
s
IF = 16 mA, VCC = 5 V
RL = 1.9 k
Propagation Delay Time
(L
H) *2 tPLH 0.3 0.8
s
IF = 16 mA, VCC = 5 V
RL = 1.9 k
4
PS8601, PS8601L
*2 Test Circuit for Propagation Delay Time.
18
27
36
45
Pulse Input
I
F
Monitor
I
F
51 Ω
V
CC
= 5 V
V
O
Monitor
V
O
R
L
50 %
5 V
1.5 V
V
OL
I
F
0
V
O
1.5 V
t
PHL
t
PLH
PW = 100 s
Duty Cycle = 1/10
µ
5
PS8601, PS8601L
TYPICAL CHARACTERISTICS (TA = 25
C)
VF - Forward Voltage - V
IF - Forward Current - mA
0.01
1.0
IF - Forward Current - mA
CTR - Current Transfer Raito - %
100 ˚C
50 ˚C
25 ˚C
0 ˚C
–25 ˚C
1.2 1.4 1.6 1.8 2.0 2.2 2.4
0.1
1.0
10
100
FORWARD CURRENT vs.
FORWARD VOLTAGE
VO - Output Voltage - V
IO - Output Current - mA
CTR - Current Transfer Raito
TA - Ambient Temperature - ˚C
CURRENT TRANSFER RATIO
vs. FORWARD CURRENT NORMALIZED OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
30
20
10
0 25 50 75 100 125
TA - Ambient Temperature - ˚C
IF - MAX. Forward Current - mA
MAX. FORWARD CURRENT vs.
AMBIENT TEMPERATURE 120
80
40
0 25 50 75 100 125
TA - Ambient Temperature - ˚C
PC - Transistor Power Dissipation - mW
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
100
60
20
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
50
40
30
20
10
0.1 .5 1 5 10 50 100
VCC = 4.5 V
VO = 0.4 V
TA = 25 ˚C
Normalized to
at TA = 25 ˚C
VCC = 4.5 V
VO = 0.4 V
IF = 16 mA
–75 –50 –20 0 25 50 75 100 125
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IF = 25 mA
IF = 20 mA
IF = 15 mA
IF = 10 mA
IF = 5 mA
10
8
6
4
2
00 2 4 6 8 101214161820
∆
TA =
6
PS8601, PS8601L
RL - Load Resistance - kΩ
t
PHL
, t
PLH
- Propagation Delay Time - s
PROPAGATION DELAY TIME
vs. LOAD RESISTANCE
T
A
- Ambient Temperature - ˚C
t
PHL
, t
PLH
- Propagation Delay Time - s
I
F
- Forward Current - mA
V
O
- Output Voltage - V
OUTPUT VOLTAGE vs.
FORWARD CURRENT
T
A
- Ambient Temperature - ˚C
HIGH LEVEL OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
I
OH
- High Level Output Current - nA
V
CC
= 5 V
R
L
V
CC
I
F
7
6
5
4
3
2
1
002468101214161820
10 kΩ
RL = 1.9 kΩ
5.6 kΩ
1000
100
10
1
.1
–25 0 25 50 75 100
I
F
= 0
V
CC
= V
O
= 35 V
V
CC
= V
O
= 5.5 V
V
CC
= 5 V
I
F
= 16 mA
10
5
1
.5
.1 1 5 10 50 100
t
PLH
t
PHL
–75 –50 –25 0 25 50 75 100 125
V
CC
= 5 V
I
F
= 16 mA
R
L
= 1.9 kΩ
3.0
2.5
2.0
1.5
1.0
0.5
0.0
t
PLH
t
PHL
µ
µ
7
PS8601, PS8601L
TAPING
1. TAPING DIRECTION
NEC JAPAN
PS86××
N 101
APAN
××
101
PS8601L-E3
2. OUTLINE AND DIMENSIONS (TAPE) Unit: mm
SYMBOL RATINGS
A 10.7
0.1
B 10.3
0.1
D0 1.55
0.1
D1 1.55
0.1
E 1.75
0.1
F 7.5
0.1
P0 4.0
0.1
P1 12.0
0.1
P2 2.0
0.1
T0 4.3
0.2
T1 0.3
W 16
0.3
3. OUTLINE AND DIMENSIONS (REEL) Unit: mm
SYMBOL RATINGS
A 330
N 80
5.0
W 16.4
4. PACKING; 1000 pieces/reel
P0
P2 D0
D1 P1
A
EF
W
B
T0
T1
I
2 ± 0.5
18.0 ± 0.5
21 ± 0.8
R1.0
W
A
φ
φ
2 ± 0.5
18.0 ± 0.5
21 ± 0.8
R1.0
W
A
φ
φ
+2.0
0
8
PS8601, PS8601L
SOLDERING PRECAUTION
(1) Infrared reflow soldering
• Peak temperature : 235
C or lower (plastic surface)
• Time : 30 s or less
(Time during plastic surface temperature overs 210
C)
• No. of reflow times : Three
• Flux : Rosin-base flux
INFRARED RAY REFLOW TEMPERATURE PROFILE
235 ˚C MAX
210 ˚C
to 30 s
60 to 90 s
(PRE-HEAT)
TIME (s)
120 to 160 ˚C
PACKAGE’S SURFACE TEM (˚C)
(ACTUAL HEAT)
to 10 s
<NOTES>
(1) Please avoid be removed the residual flux by water after the first reflow processes.
Peak Temperature 235 ˚C or lower
(2) Dip soldering
• Peak temperature : 260
C or lower
• Time : 10 s or less
• Flux : Rosin-base flux
9
PS8601, PS8601L
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
PARAMETER SYMBOL SPECK UNIT
Application classification (DIN VDE0109)
for rated line voltages
300 Veff
for rated line voltages
600 Veff
IV
III
Climatic test class (DIN IEC 68 Teil 1/09.80) 55/100/21
Dielectric strength maximum operating isolation voltage.
Test voltage (partial discharge test procedure a for type test and random test)
Upr = 1.2
UIORM, Pd < 5 pC
UIORM
Upr
890
1 068 Vpeak
Vpeak
Test voltage (partial discharge test procedure b for random test)
Upr = 1.6
UIORM, Pd < 5 pC Upr 1 424 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN VDE 0109) 2
Clearance distance > 7.0 mm
Creepage distance > 7.0 mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1) CTI 175
Material group (DIN VDE0109) IIIa
Storage temperature range Tstg
55 to +150 Cel
Operating temperature range Tamb
55 to +100 Cel
Isolation resistance, minimum value
UIO = 500 V dc at 25 Cel
UIO = 500 V dc at Tamp maximum at least 100 Cel Ris min
Ris min 1012
1011 ohm
ohm
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
UIO = 500 V dc at 175 Cel (Tsi)
Tsi
Isi
Psi
Ris min
175
400
700
109
Cel
mA
mW
ohm
PS8601, PS8601L
CAUTION
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
