The following document contains information on Cypress products. FUJITSU SEMICONDUCTOR DATA SHEET DS702-00009-3v0-E 8-bit Microcontrollers New 8FX MB95630H Series MB95F632H/F632K/F633H/F633K/F634H/F634K/F636H/F636K DESCRIPTION The MB95630H Series is a series of general-purpose, single-chip microcontrollers. In addition to a compact instruction set, the microcontrollers of this series contain a variety of peripheral functions. FEATURES * F2MC-8FX CPU core Instruction set optimized for controllers * Multiplication and division instructions * 16-bit arithmetic operations * Bit test branch instructions * Bit manipulation instructions, etc. Note: F2MC is the abbreviation of FUJITSU Flexible Microcontroller. * Clock * Selectable main clock source - Main oscillation clock (up to 16.25 MHz, maximum machine clock frequency: 8.125 MHz) - External clock (up to 32.5 MHz, maximum machine clock frequency: 16.25 MHz) - Main CR clock (4 MHz 2%) - Main CR PLL clock - The main CR PLL clock frequency becomes 8 MHz 2% when the PLL multiplication rate is 2. - The main CR PLL clock frequency becomes 10 MHz 2% when the PLL multiplication rate is 2.5. - The main CR PLL clock frequency becomes 12 MHz 2% when the PLL multiplication rate is 3. - The main CR PLL clock frequency becomes 16 MHz 2% when the PLL multiplication rate is 4. * Selectable subclock source - Suboscillation clock (32.768 kHz) - External clock (32.768 kHz) - Sub-CR clock (Typ: 100 kHz, Min: 50 kHz, Max: 150 kHz) * Timer * 8/16-bit composite timer x 2 channels * 8/16-bit PPG x 3 channels * 16-bit PPG timer x 1 channel (can work independently or together with the multi-pulse generator) * 16-bit reload timer x 1 channel (can work independently or together with the multi-pulse generator) * Time-base timer x 1 channel * Watch prescaler x 1 channel (Continued) For the information for microcontroller supports, see the following website. http://edevice.fujitsu.com/micom/en-support/ Copyright(c)2011-2013 FUJITSU SEMICONDUCTOR LIMITED All rights reserved 2013.6 MB95630H Series (Continued) * UART/SIO x 1 channel * Full duplex double buffer * Capable of clock asynchronous (UART) serial data transfer and clock synchronous (SIO) serial data transfer * I2C bus interface x 1 channel Built-in wake-up function * Multi-pulse generator (MPG) (for DC motor control) x 1 channel * 16-bit reload timer x 1 channel * 16-bit PPG timer x 1 channel * Waveform sequencer (including a 16-bit timer equipped with a buffer and a compare clear function) * LIN-UART * Full duplex double buffer * Capable of clock asynchronous serial data transfer and clock synchronous serial data transfer * External interrupt x 10 channels * Interrupt by edge detection (rising edge, falling edge, and both edges can be selected) * Can be used to wake up the device from different low power consumption (standby) modes * 8/10-bit A/D converter x 8 channels * 8-bit or 10-bit resolution can be selected. * Low power consumption (standby) modes There are four standby modes as follows: * Stop mode * Sleep mode * Watch mode * Time-base timer mode In standby mode, two further options can be selected: normal standby mode and deep standby mode. * I/O port * MB95F632H/F633H/F634H/F636H (number of I/O ports: 28) - General-purpose I/O ports (CMOS I/O) : 25 - General-purpose I/O ports (N-ch open drain) :3 * MB95F632K/F633K/F634K/F636K (number of I/O ports: 29) - General-purpose I/O ports (CMOS I/O) : 25 - General-purpose I/O ports (N-ch open drain) :4 * On-chip debug * 1-wire serial control * Serial writing supported (asynchronous mode) * Hardware/software watchdog timer * Built-in hardware watchdog timer * Built-in software watchdog timer * Power-on reset A power-on reset is generated when the power is switched on. * Low-voltage detection reset circuit (only available on MB95F632K/F633K/F634K/F636K) Built-in low-voltage detection function (The combination of detection voltage and release voltage can be selected from four options.) * Comparator * Clock supervisor counter Built-in clock supervisor counter * Dual operation Flash memory The program/erase operation and the read operation can be executed in different banks (upper bank/lower bank) simultaneously. * Flash memory security function Protects the content of the Flash memory. 2 DS702-00009-3v0-E MB95630H Series PRODUCT LINE-UP Part number MB95F632H MB95F633H MB95F634H MB95F636H MB95F632K MB95F633K MB95F634K MB95F636K Parameter Type Clock supervisor counter Flash memory product It supervises the main clock oscillation and the subclock oscillation. Flash memory capacity 8 Kbyte 12 Kbyte 20 Kbyte 36 Kbyte 8 Kbyte 12 Kbyte 20 Kbyte 36 Kbyte RAM capacity 256 bytes 512 bytes 1024 bytes 1024 bytes 256 bytes 512 bytes 1024 bytes 1024 bytes Power-on reset Yes Low-voltage detection reset Reset input * * * CPU functions * * * Generalpurpose I/O No Yes Dedicated Selected through software Number of basic instructions Instruction bit length Instruction length Data bit length Minimum instruction execution time Interrupt processing time * I/O port * CMOS I/O * N-ch open drain : 136 : 8 bits : 1 to 3 bytes : 1, 8 and 16 bits : 61.5 ns (machine clock frequency = 16.25 MHz) : 0.6 s (machine clock frequency = 16.25 MHz) : 28 : 25 :3 * I/O port * CMOS I/O * N-ch open drain : 29 : 25 :4 Time-base timer Interval time: 0.256 ms to 8.3 s (external clock frequency = 4 MHz) Hardware/ * Reset generation cycle software Main oscillation clock at 10 MHz: 105 ms (Min) watchdog timer * The sub-CR clock can be used as the source clock of the software watchdog timer. Wild register It can be used to replace 3 bytes of data. LIN-UART * A wide range of communication speed can be selected by a dedicated reload timer. * It has a full duplex double buffer. * Both clock synchronous serial data transfer and clock asynchronous serial data transfer are enabled. * The LIN function can be used as a LIN master or a LIN slave. 8/10-bit A/D converter 8 channels 8-bit or 10-bit resolution can be selected. 2 channels * The timer can be configured as an "8-bit timer x 2 channels" or a "16-bit timer x 1 channel". 8/16-bit * It has the following functions: interval timer function, PWC function, PWM function and input composite timer capture function. * Count clock: it can be selected from internal clocks (seven types) and external clocks. * It can output square wave. External interrupt On-chip debug 10 channels * Interrupt by edge detection (The rising edge, falling edge, and both edges can be selected.) * It can be used to wake up the device from different standby modes. * 1-wire serial control * It supports serial writing (asynchronous mode). (Continued) DS702-00009-3v0-E 3 MB95630H Series Part number MB95F632H MB95F633H MB95F634H MB95F636H MB95F632K MB95F633K MB95F634K MB95F636K Parameter 1 channel UART/SIO * Data transfer with UART/SIO is enabled. * It has a full duplex double buffer, variable data length (5/6/7/8 bits), an internal baud rate generator and an error detection function. * It uses the NRZ type transfer format. * LSB-first data transfer and MSB-first data transfer are available to use. * Both clock asynchronous (UART) serial data transfer and clock synchronous (SIO) serial data transfer are enabled. 1 channel I2C bus interface * Master/slave transmission and reception * It has the following functions: bus error function, arbitration function, transfer direction detection function, wake-up function, and functions of generating and detecting repeated START conditions. 3 channels 8/16-bit PPG * Each channel can be used as an "8-bit timer x 2 channels" or a "16-bit timer x 1 channel". * The counter operating clock can be selected from eight clock sources. 1 channel 16-bit PPG timer * * * * PWM mode and one-shot mode are available to use. The counter operating clock can be selected from eight clock sources. It supports external trigger start. It can work independently or together with the multi-pulse generator. 1 channel 16-bit reload timer Multi-pulse generator (for DC motor control) * * * * * Two clock modes and two counter operating modes are available to use. It can output square wave. Count clock: it can be selected from internal clocks (seven types) and external clocks. Two counter operating modes: reload mode and one-shot mode It can work independently or together with the multi-pulse generator. * * * * 16-bit PPG timer: 1 channel 16-bit reload timer operations: toggle output, one-shot output Event counter: 1 channel Waveform sequencer (including a 16-bit timer equipped with a buffer and a compare clear function) Watch prescaler Eight different time intervals can be selected. Comparator 1 channel Flash memory * It supports automatic programming (Embedded Algorithm), and program/erase/erasesuspend/erase-resume commands. * It has a flag indicating the completion of the operation of Embedded Algorithm. * Flash security feature for protecting the content of the Flash memory Number of program/erase cycles Data retention time 1000 20 years 10000 10 years 100000 5 years (Continued) 4 DS702-00009-3v0-E MB95630H Series (Continued) Part number MB95F632H MB95F633H MB95F634H MB95F636H MB95F632K MB95F633K MB95F634K MB95F636K Parameter There are four standby modes as follows: * Stop mode * Sleep mode Standby mode * Watch mode * Time-base timer mode In standby mode, two further options can be selected: normal standby mode and deep standby mode. Package DS702-00009-3v0-E FPT-32P-M30 DIP-32P-M06 LCC-32P-M19 5 MB95630H Series PACKAGES AND CORRESPONDING PRODUCTS Part number MB95F632H MB95F633H MB95F634H MB95F636H MB95F632K MB95F633K MB95F634K MB95F636K Package FPT-32P-M30 DIP-32P-M06 LCC-32P-M19 : Available 6 DS702-00009-3v0-E MB95630H Series DIFFERENCES AMONG PRODUCTS AND NOTES ON PRODUCT SELECTION * Current consumption When using the on-chip debug function, take account of the current consumption of Flash memory program/erase. For details of current consumption, see " ELECTRICAL CHARACTERISTICS". * Package For details of information on each package, see " PACKAGES AND CORRESPONDING PRODUCTS" and " PACKAGE DIMENSION". * Operating voltage The operating voltage varies, depending on whether the on-chip debug function is used or not. For details of operating voltage, see " ELECTRICAL CHARACTERISTICS". * On-chip debug function The on-chip debug function requires that VCC, VSS and one serial wire be connected to an evaluation tool. For details of the connection method, refer to "CHAPTER 25 EXAMPLE OF SERIAL PROGRAMMING CONNECTION" in "New 8FX MB95630H Series Hardware Manual". DS702-00009-3v0-E 7 MB95630H Series 32 31 30 29 28 27 26 25 Vss PF1/X1 PF0/X0 PF2/RST P17/TO1/SNI0 P16/UI0/PPG21 P15/UO0/PPG20 P14/UCK0/PPG01 PIN ASSIGNMENT 1 2 3 4 5 6 7 8 PF2/RST PF0/X0 PF1/X1 Vss PG2/X1A/SNI2 PG1/X0A/SNI1 Vcc C P67/PPG21/TRG1/OPT5 P66/PPG20/PPG1/OPT4 P65/PPG11/OPT3 P64/EC1/PPG10/OPT2 (TOP VIEW) LQFP32 9 10 11 12 13 14 15 16 P00/INT00/AN00/CMP0_P P01/INT01/AN01/CMP0_N P02/INT02/AN02/SCK P03/INT03/AN03/SOT FPT-32P-M30 P63/TO11/PPG01/OPT1 P62/TO10/PPG00/OPT0 P61/INT09/SCL/TI1 P60/INT08/SDA/DTTI PG2/X1A/SNI2 PG1/X0A/SNI1 Vcc C P67/PPG21/TRG1/OPT5 P66/PPG20/PPG1/OPT4 P65/PPG11/OPT3 P64/EC1/PPG10/OPT2 P63/TO11/PPG01/OPT1 P62/TO10/PPG00/OPT0 P61/INT09/SCL/TI1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 P60/INT08/SDA/DTTI 16 (TOP VIEW) SH-DIP32 DIP-32P-M06 24 23 22 21 P13/PPG00 P12/DBG/EC0 P11/PPG11 P10/PPG10/CMP0_O 20 19 18 17 P07/INT07/AN07 P06/INT06/AN06/TO01 P05/INT05/AN05/TO00 P04/INT04/AN04/SIN/EC0 32 31 30 29 28 27 26 25 24 23 22 21 P17/TO1/SNI0 P16/UI0/PPG21 P15/UO0/PPG20 P14/UCK0/PPG01 P13/PPG00 P12/DBG/EC0 P11/PPG11 P10/PPG10/CMP0_O P07/INT07/AN07 P06/INT06/AN06/TO01 P05/INT05/AN05/TO00 P04/INT04/AN04/SIN/EC0 20 19 18 17 P03/INT03/AN03/SOT P02/INT02/AN02/SCK P01/INT01/AN01/CMP0_N P00/INT00/AN00/CMP0_P (Continued) 8 DS702-00009-3v0-E MB95630H Series 32 31 30 29 28 27 26 25 Vss PF1/X1 PF0/X0 PF2/RST P17/TO1/SNI0 P16/UI0/PPG21 P15/UO0/PPG20 P14/UCK0/PPG01 (Continued) DS702-00009-3v0-E (TOP VIEW) QFN32 16 P03/INT03/AN03/SOT LCC-32P-M19 9 10 11 12 13 14 15 1 2 3 4 5 6 7 8 P63/TO11/PPG01/OPT1 P62/TO10/PPG00/OPT0 P61/INT09/SCL/TI1 P60/INT08/SDA/DTTI P00/INT00/AN00/CMP0_P P01/INT01/AN01/CMP0_N P02/INT02/AN02/SCK PG2/X1A/SNI2 PG1/X0A/SNI1 Vcc C P67/PPG21/TRG1/OPT5 P66/PPG20/PPG1/OPT4 P65/PPG11/OPT3 P64/EC1/PPG10/OPT2 24 23 22 21 P13/PPG00 P12/DBG/EC0 P11/PPG11 P10/PPG10/CMP0_O 20 19 18 17 P07/INT07/AN07 P06/INT06/AN06/TO01 P05/INT05/AN05/TO00 P04/INT04/AN04/SIN/EC0 9 MB95630H Series PIN FUNCTIONS I/O type Pin no. I/O circuit Pin name LQFP32* , SH-DIP32*3 type*4 QFN32*2 1 PG2 5 SNI2 Trigger input pin for the position detection function of the MPG waveform sequencer PG1 General-purpose I/O port 6 Output OD*5 PU*6 Subclock I/O oscillation pin C X0A 2 Input General-purpose I/O port X1A 1 Function Hysteresis CMOS -- Hysteresis CMOS -- Subclock input oscillation pin C Trigger input pin for the position detection function of the MPG waveform sequencer SNI1 3 7 VCC -- Power supply pin -- -- -- -- 4 8 C -- Decoupling capacitor connection pin -- -- -- -- Hysteresis CMOS -- Hysteresis CMOS -- Hysteresis CMOS -- Hysteresis CMOS -- General-purpose I/O port High-current pin P67 PPG21 5 6 7 8 9 10 11 12 TRG1 8/16-bit PPG ch. 2 output pin D 16-bit PPG timer ch. 1 trigger input pin OPT5 MPG waveform sequencer output pin P66 General-purpose I/O port High-current pin PPG20 PPG1 D 8/16-bit PPG ch. 2 output pin 16-bit PPG timer ch. 1 output pin OPT4 MPG waveform sequencer output pin P65 General-purpose I/O port High-current pin PPG11 D 8/16-bit PPG ch. 1 output pin OPT3 MPG waveform sequencer output pin P64 General-purpose I/O port High-current pin EC1 8/16-bit composite timer ch. 1 clock input pin PPG10 OPT2 D 8/16-bit PPG ch. 1 output pin MPG waveform sequencer output pin (Continued) 10 DS702-00009-3v0-E MB95630H Series I/O type Pin no. I/O circuit Pin name LQFP32* , SH-DIP32*3 type*4 QFN32*2 1 13 TO11 D PPG01 TO10 D 13 16 17 18 16-bit reload timer ch. 1 input pin P60 General-purpose I/O port INT08 External interrupt input pin I MPG waveform sequencer input pin P00 General-purpose I/O port INT00 External interrupt input pin AN00 E 8/10-bit A/D converter analog input pin P01 General-purpose I/O port INT01 External interrupt input pin AN01 E SCK CMOS CMOS -- CMOS CMOS -- Hysteresis/ CMOS analog -- 8/10-bit A/D converter analog input pin Hysteresis/ CMOS analog -- Hysteresis/ CMOS analog -- Comparator inverting analog input (negative input) pin General-purpose I/O port INT02 AN02 -- Comparator non-inverting analog input (positive input) pin P02 19 I2C bus interface ch. 0 data I/O pin DTTI CMP0_N 15 I2C bus interface ch. 0 clock I/O pin TI1 SDA Hysteresis CMOS External interrupt input pin I CMP0_P 14 8/16-bit composite timer ch. 1 output pin General-purpose I/O port INT09 12 MPG waveform sequencer output pin P61 SCL -- 8/16-bit PPG ch. 0 output pin OPT0 15 Hysteresis CMOS General-purpose I/O port High-current pin PPG00 11 8/16-bit composite timer ch. 1 output pin MPG waveform sequencer output pin P62 14 Output OD*5 PU*6 8/16-bit PPG ch. 0 output pin OPT1 10 Input General-purpose I/O port High-current pin P63 9 Function External interrupt input pin E 8/10-bit A/D converter analog input pin LIN-UART clock I/O pin (Continued) DS702-00009-3v0-E 11 MB95630H Series I/O type Pin no. I/O circuit Pin name LQFP32* , SH-DIP32*3 type*4 QFN32*2 1 P03 17 18 20 21 22 AN03 External interrupt input pin E LIN-UART data output pin P04 General-purpose I/O port INT04 External interrupt input pin F 23 LIN-UART data input pin EC0 8/16-bit composite timer ch. 0 clock input pin P05 General-purpose I/O port INT05 External interrupt input pin AN05 E General-purpose I/O port INT06 External interrupt input pin E INT07 E PPG10 26 P11 PPG11 G 27 DBG G 28 P13 PPG00 -- Hysteresis/ CMOS analog -- Hysteresis/ CMOS analog -- External interrupt input pin Hysteresis/ CMOS analog -- 8/16-bit PPG ch. 1 output pin Hysteresis CMOS -- General-purpose I/O port 8/16-bit PPG ch. 1 output pin Hysteresis CMOS -- Hysteresis CMOS -- Hysteresis CMOS -- General-purpose I/O port H DBG input pin 8/16-bit composite timer ch. 0 clock input pin EC0 24 CMOS CMOS/ analog Comparator digital output pin P12 23 General-purpose I/O port CMP0_O 22 8/10-bit A/D converter analog input pin 8/10-bit A/D converter analog input pin P10 25 -- General-purpose I/O port AN07 21 Hysteresis/ CMOS analog 8/16-bit composite timer ch. 0 output pin P07 24 8/10-bit A/D converter analog input pin P06 AN06 Output OD*5 PU*6 8/16-bit composite timer ch. 0 output pin TO01 20 8/10-bit A/D converter analog input pin SIN TO00 19 8/10-bit A/D converter analog input pin SOT AN04 Input General-purpose I/O port INT03 16 Function G General-purpose I/O port 8/16-bit PPG ch. 0 output pin (Continued) 12 DS702-00009-3v0-E MB95630H Series (Continued) Pin no. I/O circuit Pin name LQFP32* , SH-DIP32*3 type*4 QFN32*2 1 P14 25 29 UCK0 G UO0 G UI0 29 1 30 2 31 3 32 4 UART/SIO ch. 0 data output pin J UART/SIO ch. 0 data input pin General-purpose I/O port TO1 16-bit reload timer ch. 1 output pin G SNI0 Trigger input pin for the position detection function of the MPG waveform sequencer PF2 General-purpose I/O port RST PF0 X0 PF1 X1 VSS Hysteresis CMOS -- CMOS -- Hysteresis CMOS -- Hysteresis CMOS -- Hysteresis CMOS -- -- Hysteresis CMOS -- -- -- -- CMOS 8/16-bit PPG ch. 2 output pin P17 32 -- General-purpose I/O port PPG21 28 Hysteresis CMOS 8/16-bit PPG ch. 2 output pin P16 31 UART/SIO ch. 0 clock I/O pin General-purpose I/O port PPG20 27 Output OD*5 PU*6 8/16-bit PPG ch. 0 output pin P15 30 Input General-purpose I/O port PPG01 26 I/O type Function A B B -- Reset pin Dedicated reset pin on MB95F632H/F633H/F634H/ F636H General-purpose I/O port Main clock input oscillation pin General-purpose I/O port Main clock I/O oscillation pin Power supply pin (GND) -- -- : Available *1: FPT-32P-M30 *2: LCC-32P-M19 *3: DIP-32P-M06 *4: For the I/O circuit types, see " I/O CIRCUIT TYPE". *5: N-ch open drain *6: Pull-up DS702-00009-3v0-E 13 MB95630H Series I/O CIRCUIT TYPE Type Circuit A Remarks Reset input / Hysteresis input Reset output / Digital output * N-ch open drain output * Hysteresis input * Reset output N-ch B P-ch Port select Digital output N-ch Digital output Standby control Hysteresis input * Oscillation circuit * High-speed side Feedback resistance: approx. 1 M * CMOS output * Hysteresis input Clock input X1 X0 Standby control / Port select P-ch Port select Digital output N-ch Digital output Standby control Hysteresis input C Port select R Pull-up control P-ch P-ch * Oscillation circuit * Low-speed side Feedback resistance: approx. 5 M Digital output N-ch Digital output Standby control Hysteresis input * CMOS output * Hysteresis input * Pull-up control Clock input X1A X0A Standby control / Port select Port select R Pull-up control Digital output P-ch Digital output N-ch Digital output Standby control Hysteresis input (Continued) 14 DS702-00009-3v0-E MB95630H Series Type Circuit Remarks D Pull-up control R P-ch Digital output P-ch * * * * CMOS output Hysteresis input Pull-up control High current output * * * * CMOS output Hysteresis input Pull-up control Analog input * * * * CMOS output CMOS input Pull-up control Analog input Digital output N-ch Standby control Hysteresis input E Pull-up control R P-ch Digital output P-ch Digital output N-ch Analog input A/D control Standby control Hysteresis input F Pull-up control R P-ch Digital output P-ch Digital output N-ch Analog input A/D control Standby control CMOS input G Pull-up control R P-ch * CMOS output * Hysteresis input * Pull-up control Digital output P-ch Digital output N-ch Standby control Hysteresis input H Standby control * N-ch open drain output * Hysteresis input Hysteresis input Digital output N-ch (Continued) DS702-00009-3v0-E 15 MB95630H Series (Continued) Type Circuit Remarks I Digital output * N-ch open drain output * CMOS input N-ch Standby control CMOS input J Pull-up control R P-ch * CMOS output * CMOS input * Pull-up control Digital output P-ch Digital output N-ch Standby control CMOS input 16 DS702-00009-3v0-E MB95630H Series HANDLING PRECAUTIONS Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your FUJITSU SEMICONDUCTOR semiconductor devices. 1. Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. * Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. * Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. * Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. (1) Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. (2) Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. (3) Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. Code: DS00-00004-2E DS702-00009-3v0-E 17 MB95630H Series * Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: (1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. (2) Be sure that abnormal current flows do not occur during the power-on sequence. * Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. * Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. * Precautions Related to Usage of Devices FUJITSU SEMICONDUCTOR semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 2. Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under FUJITSU SEMICONDUCTOR's recommended conditions. For detailed information about mount conditions, contact your sales representative. * Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to FUJITSU SEMICONDUCTOR recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. 18 DS702-00009-3v0-E MB95630H Series * Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions. * Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. * Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: (1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. (2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5 C and 30 C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. (3) When necessary, FUJITSU SEMICONDUCTOR packages semiconductor devices in highly moistureresistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. (4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust. * Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the FUJITSU SEMICONDUCTOR recommended conditions for baking. Condition: 125 C/24 h * Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: (1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. (2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. (3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 M). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. (4) Ground all fixtures and instruments, or protect with anti-static measures. (5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. DS702-00009-3v0-E 19 MB95630H Series 3. Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: (1) Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. (2) Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. (3) Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. (4) Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. (5) Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of FUJITSU SEMICONDUCTOR products in other special environmental conditions should consult with sales representatives. Please check the latest handling precautions at the following URL. http://edevice.fujitsu.com/fj/handling-e.pdf 20 DS702-00009-3v0-E MB95630H Series NOTES ON DEVICE HANDLING * Preventing latch-ups When using the device, ensure that the voltage applied does not exceed the maximum voltage rating. In a CMOS IC, if a voltage higher than VCC or a voltage lower than VSS is applied to an input/output pin that is neither a medium-withstand voltage pin nor a high-withstand voltage pin, or if a voltage out of the rating range of power supply voltage mentioned in "1. Absolute Maximum Ratings" of " ELECTRICAL CHARACTERISTICS" is applied to the VCC pin or the VSS pin, a latch-up may occur. When a latch-up occurs, power supply current increases significantly, which may cause a component to be thermally destroyed. * Stabilizing supply voltage Supply voltage must be stabilized. A malfunction may occur when power supply voltage fluctuates rapidly even though the fluctuation is within the guaranteed operating range of the VCC power supply voltage. As a rule of voltage stabilization, suppress voltage fluctuation so that the fluctuation in VCC ripple (p-p value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the standard VCC value, and the transient fluctuation rate does not exceed 0.1 V/ms at a momentary fluctuation such as switching the power supply. * Notes on using the external clock When an external clock is used, oscillation stabilization wait time is required for power-on reset, wake-up from subclock mode or stop mode. PIN CONNECTION * Treatment of unused pins If an unused input pin is left unconnected, a component may be permanently damaged due to malfunctions or latch-ups. Always pull up or pull down an unused input pin through a resistor of at least 2 k. Set an unused input/output pin to the output state and leave it unconnected, or set it to the input state and treat it the same as an unused input pin. If there is an unused output pin, leave it unconnected. * Power supply pins To reduce unnecessary electro-magnetic emission, prevent malfunctions of strobe signals due to an increase in the ground level, and conform to the total output current standard, always connect the VCC pin and the VSS pin to the power supply and ground outside the device. In addition, connect the current supply source to the VCC pin and the VSS pin with low impedance. It is also advisable to connect a ceramic capacitor of approximately 0.1 F as a bypass capacitor between the VCC pin and the VSS pin at a location close to this device. * DBG pin Connect the DBG pin to an external pull-up resistor of 2 k or above. After power-on, ensure that the DBG pin does not stay at "L" level until the reset output is released. The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool used and the interconnection length, refer to the tool document when selecting a pull-up resistor. * RST pin Connect the RST pin to an external pull-up resistor of 2 k or above. To prevent the device from unintentionally entering the reset mode due to noise, minimize the interconnection length between a pull-up resistor and the RST pin and that between a pull-up resistor and the VCC pin when designing the layout of the printed circuit board. The PF2/RST pin functions as the reset input/output pin after power-on. In addition, the reset output of the PF2/RST pin can be enabled by the RSTOE bit in the SYSC register, and the reset input function and the general-purpose I/O function can be selected by the RSTEN bit in the SYSC register. DS702-00009-3v0-E 21 MB95630H Series * C pin Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. For the connection to a decoupling capacitor CS, see the diagram below. To prevent the device from unintentionally entering a mode to which the device is not set to transit due to noise, minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing the layout of a printed circuit board. * DBG/RST/C pins connection diagram DBG C RST Cs * Note on serial communication In serial communication, reception of wrong data may occur due to noise or other causes. Therefore, design a printed circuit board to prevent noise from occurring. Taking account of the reception of wrong data, take measures such as adding a checksum to the end of data in order to detect errors. If an error is detected, retransmit the data. 22 DS702-00009-3v0-E MB95630H Series BLOCK DIAGRAM F2MC-8FX CPU PF2*1/RST*2 Reset with LVD Dual operation Flash with security function (36/20/12/8 Kbyte) PF0/X0*2 PF1/X1*2 (PG1/X0A*2) Oscillator circuit CR oscillator (PG2/X1A*2) RAM (1024/512/256 bytes) Clock control (P05/TO00) 8/16-bit composite timer ch. 0 (P12*1/DBG) On-chip debug (P06/TO01) P12/EC0, (P04/EC0) Wild register 8/10-bit A/D converter P02/INT02 to P07/INT07 External interrupt P00/INT00, P01/INT01, P60/INT08, P61/INT09 External interrupt C Interrupt controller (P00/AN00 to P07/AN07) (P62*3/TO10) (P03/SOT) LIN-UART Internal bus (P02/SCK) 8/16-bit composite timer ch. 1 (P63*3/TO11) (P64*3/EC1) MPG 16-bit reload timer (P04/SIN) (P61/TI1) (P17/TO1) P62*3/OPT0 to P67*3/OPT5 Waveform sequencer (P14/UCK0) (P15/UO0) UART/SIO P17/SNI0, PG1/SNI1, PG2/SNI2 (P60/DTTI) (P61/TI1) (P16/UI0) (P60*1/SDA) (P61*1/SCL) (P62*3/PPG00), P13/PPG00 (P63*3/PPG01), P14/PPG01 16-bit PPG timer I2C bus interface ch. 0 8/16-bit PPG ch. 1 8/16-bit PPG ch. 0 (P67*3/TRG1) (P66*3/PPG1) P10/PPG10, (P64*3/PPG10) P11/PPG11, (P65*3/PPG11) (P00/CMP0_P) (P66*3/PPG20), P15/PPG20 (P67*3/PPG21), P16/PPG21 8/16-bit PPG ch. 2 Comparator (P01/CMP0_N) (P10/CMP0_O) Port Port Vcc Vss *1: P12, P60, P61 and PF2 are N-ch open drain pins. *2: Software select *3: P62 to P67 are high-current pins. Note: Pins in parentheses indicate that those pins are shared among different peripheral functions. DS702-00009-3v0-E 23 MB95630H Series CPU CORE * Memory space The memory space of the MB95630H Series is 64 Kbyte in size, and consists of an I/O area, an extended I/O area, a data area, and a program area. The memory space includes areas intended for specific purposes such as general-purpose registers and a vector table. The memory maps of the MB95630H Series are shown below. * Memory maps MB95F632H/F632K 0x0000 0x0080 0x0090 0x0100 0x0190 I/O area Access prohibited RAM 256 bytes Registers MB95F633H/F633K 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 512 bytes Registers MB95F634H/F634K 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 1024 bytes Registers MB95F636H/F636K 0x0000 0x0080 0x0090 0x0100 0x0200 I/O area Access prohibited RAM 1024 bytes Registers 0x0290 Access prohibited Access prohibited 0x0490 0x0490 Access prohibited 0x0F80 0x0F80 0x0F80 Extended I/O area 0x1000 Flash memory 4 Kbyte 0x2000 0x0F80 Extended I/O area Extended I/O area Flash memory 4 Kbyte Flash memory 4 Kbyte Flash memory 4 Kbyte 0x2000 0x2000 0x2000 Extended I/O area 0x1000 0x1000 0x1000 Access prohibited Access prohibited Access prohibited 0x8000 Access prohibited Access prohibited Flash memory 32 Kbyte 0xC000 0xE000 Flash memory 16 Kbyte Flash memory 8 Kbyte 0xF000 Flash memory 4 Kbyte 0xFFFF 24 0xFFFF 0xFFFF 0xFFFF DS702-00009-3v0-E MB95630H Series MEMORY SPACE The memory space of the MB95630H Series is 64 Kbyte in size, and consists of an I/O area, an extended I/O area, a data area, and a program area. The memory space includes areas for specific applications such as general-purpose registers and a vector table. * I/O area (addresses: 0x0000 to 0x007F) * This area contains the control registers and data registers for built-in peripheral functions. * As the I/O area forms part of the memory space, it can be accessed in the same way as the memory. It can also be accessed at high-speed by using direct addressing instructions. * Extended I/O area (addresses: 0x0F80 to 0x0FFF) * This area contains the control registers and data registers for built-in peripheral functions. * As the extended I/O area forms part of the memory space, it can be accessed in the same way as the memory. * Data area * Static RAM is incorporated in the data area as the internal data area. * The internal RAM size varies according to product. * The RAM area from 0x0090 to 0x00FF can be accessed at high-speed by using direct addressing instructions. * In MB95F636H/F636K, the area from 0x0090 to 0x047F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. * In MB95F634H/F634K, the area from 0x0090 to 0x047F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. * In MB95F633H/F633K, the area from 0x0090 to 0x028F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. * In MB95F632H/F632K, the area from 0x0090 to 0x018F is an extended direct addressing area. It can be accessed at high-speed by direct addressing instructions with a direct bank pointer set. * In MB95F633H/F633K/F634H/F634K/F636H/F636K, the area from 0x0100 to 0x01FF can be used as a general-purpose register area. * In MB95F632H/F632K, the area from 0x0100 to 0x018F can be used as a general-purpose register area. * Program area * The Flash memory is incorporated in the program area as the internal program area. * The Flash memory size varies according to product. * The area from 0xFFC0 to 0xFFFF is used as the vector table. * The area from 0xFFBB to 0xFFBF is used to store data of the non-volatile register. DS702-00009-3v0-E 25 MB95630H Series * Memory space map 0x0000 0x0080 0x0090 0x0100 I/O area Direct addressing area Access prohibited Registers (General-purpose register area) Extended direct addressing area 0x0200 Data area 0x047F 0x048F 0x0490 Access prohibited 0x0F80 0x0FFF 0x1000 Extended I/O area Program area 0xFFC0 0xFFFF 26 Vector table area DS702-00009-3v0-E MB95630H Series AREAS FOR SPECIFIC APPLICATIONS The general-purpose register area and vector table area are used for the specific applications. * General-purpose register area (Addresses: 0x0100 to 0x01FF*1) * This area contains the auxiliary registers used for 8-bit arithmetic operations, transfer, etc. * As this area forms part of the RAM area, it can also be used as conventional RAM. * When the area is used as general-purpose registers, general-purpose register addressing enables highspeed access with short instructions. * Non-volatile register data area (Addresses: 0xFFBB to 0xFFBF) * The area from 0xFFBB to 0xFFBF is used to store data of the non-volatile register. For details, refer to "CHAPTER 26 NON-VOLATILE REGISTER (NVR) INTERFACE" in "New 8FX MB95630H Series Hardware Manual". * Vector table area (Addresses: 0xFFC0 to 0xFFFF) * This area is used as the vector table for vector call instructions (CALLV), interrupts, and resets. * The top of the Flash memory area is allocated to the vector table area. The start address of a service routine is set to an address in the vector table in the form of data. " INTERRUPT SOURCE TABLE" lists the vector table addresses corresponding to vector call instructions, interrupts, and resets. For details, refer to "CHAPTER 4 RESET", "CHAPTER 5 INTERRUPTS" and "A.2 Special Instruction Special Instruction CALLV #vct" in "New 8FX MB95630H Series Hardware Manual". * Direct bank pointer and access area Direct bank pointer (DP[2:0]) Operand-specified dir Access area 0bXXX (It does not affect mapping.) 0x0000 to 0x007F 0x0000 to 0x007F 0b000 (Initial value) 0x0090 to 0x00FF 0x0090 to 0x00FF 0b001 0x0100 to 0x017F 0b010 0x0180 to 0x01FF*1 0b011 0x0200 to 0x027F 0b100 0x0080 to 0x00FF 0x0280 to 0x02FF*2 0b101 0x0300 to 0x037F 0b110 0x0380 to 0x03FF 0b111 0x0400 to 0x047F *1: Due to the memory size limit, the available access area is up to "0x018F" in MB95F632H/F632K. *2: Due to the memory size limit, the available access area is up to "0x028F" in MB95F633H/F633K. DS702-00009-3v0-E 27 MB95630H Series I/O MAP Address Register abbreviation 0x0000 PDR0 0x0001 Register name R/W Initial value Port 0 data register R/W 0b00000000 DDR0 Port 0 direction register R/W 0b00000000 0x0002 PDR1 Port 1 data register R/W 0b00000000 0x0003 DDR1 Port 1 direction register R/W 0b00000000 0x0004 -- -- -- 0x0005 WATR Oscillation stabilization wait time setting register R/W 0b11111111 0x0006 PLLC PLL control register R/W 0b000X0000 0x0007 SYCC System clock control register R/W 0bXXX11011 0x0008 STBC Standby control register R/W 0b00000000 0x0009 RSRR Reset source register R/W 0b000XXXXX 0x000A TBTC Time-base timer control register R/W 0b00000000 0x000B WPCR Watch prescaler control register R/W 0b00000000 0x000C WDTC Watchdog timer control register R/W 0b00XX0000 0x000D SYCC2 System clock control register 2 R/W 0bXXXX0011 0x000E STBC2 Standby control register 2 R/W 0b00000000 0x000F to 0x0015 -- -- -- 0x0016 PDR6 Port 6 data register R/W 0b00000000 0x0017 DDR6 Port 6 direction register R/W 0b00000000 0x0018 to 0x0027 -- -- -- 0x0028 PDRF Port F data register R/W 0b00000000 0x0029 DDRF Port F direction register R/W 0b00000000 0x002A PDRG Port G data register R/W 0b00000000 0x002B DDRG Port G direction register R/W 0b00000000 0x002C PUL0 Port 0 pull-up register R/W 0b00000000 0x002D PUL1 Port 1 pull-up register R/W 0b00000000 0x002E to 0x0032 -- -- -- 0x0033 PUL6 R/W 0b00000000 0x0034 -- -- -- 0x0035 PULG Port G pull-up register R/W 0b00000000 0x0036 T01CR1 8/16-bit composite timer 01 status control register 1 R/W 0b00000000 0x0037 T00CR1 8/16-bit composite timer 00 status control register 1 R/W 0b00000000 0x0038 T11CR1 8/16-bit composite timer 11 status control register 1 R/W 0b00000000 0x0039 T10CR1 8/16-bit composite timer 10 status control register 1 R/W 0b00000000 (Disabled) (Disabled) (Disabled) (Disabled) Port 6 pull-up register (Disabled) (Continued) 28 DS702-00009-3v0-E MB95630H Series Address Register abbreviation 0x003A PC01 0x003B Register name R/W Initial value 8/16-bit PPG timer 01 control register R/W 0b00000000 PC00 8/16-bit PPG timer 00 control register R/W 0b00000000 0x003C PC11 8/16-bit PPG timer 11 control register R/W 0b00000000 0x003D PC10 8/16-bit PPG timer 10 control register R/W 0b00000000 0x003E PC21 8/16-bit PPG timer 21 control register R/W 0b00000000 0x003F PC20 8/16-bit PPG timer 20 control register R/W 0b00000000 0x0040 TMCSRH1 16-bit reload timer control status register (upper) R/W 0b00000000 0x0041 TMCSRL1 16-bit reload timer control status register (lower) R/W 0b00000000 0x0042 CMR0C Comparator control register R/W 0b00000101 0x0043 -- -- -- 0x0044 PCNTH1 16-bit PPG status control register (upper) R/W 0b00000000 0x0045 PCNTL1 16-bit PPG status control register (lower) R/W 0b00000000 0x0046, 0x0047 -- -- -- 0x0048 EIC00 External interrupt circuit control register ch. 0/ch. 1 R/W 0b00000000 0x0049 EIC10 External interrupt circuit control register ch. 2/ch. 3 R/W 0b00000000 0x004A EIC20 External interrupt circuit control register ch. 4/ch. 5 R/W 0b00000000 (Disabled) (Disabled) 0x004B EIC30 External interrupt circuit control register ch. 6/ch. 7 R/W 0b00000000 0x004C EIC01 External interrupt circuit control register ch. 8/ch. 9 R/W 0b00000000 0x004D -- -- -- 0x004E LVDR R/W 0b00000000 0x004F -- -- -- 0x0050 SCR LIN-UART serial control register R/W 0b00000000 0x0051 SMR LIN-UART serial mode register R/W 0b00000000 0x0052 SSR LIN-UART serial status register R/W 0b00001000 RDR LIN-UART receive data register TDR LIN-UART transmit data register R/W 0b00000000 0x0053 (Disabled) LVD reset voltage selection ID register (Disabled) 0x0054 ESCR LIN-UART extended status control register R/W 0b00000100 0x0055 ECCR LIN-UART extended communication control register R/W 0b000000XX 0x0056 SMC10 UART/SIO serial mode control register 1 R/W 0b00000000 0x0057 SMC20 UART/SIO serial mode control register 2 R/W 0b00100000 0x0058 SSR0 UART/SIO serial status and data register R/W 0b00000001 0x0059 TDR0 UART/SIO serial output data register R/W 0b00000000 0x005A RDR0 UART/SIO serial input data register R 0b00000000 0x005B to 0x005F -- -- -- 0x0060 IBCR00 0x0061 0x0062 0x0063 IBCR10 IBSR0 IDDR0 (Disabled) I2C bus control register 0 ch. 0 R/W 0b00000000 2 R/W 0b00000000 2 R/W 0b00000000 2 R/W 0b00000000 I C bus control register 1 ch. 0 I C bus status register ch. 0 I C data register ch. 0 (Continued) DS702-00009-3v0-E 29 MB95630H Series Address Register abbreviation 0x0064 IAAR0 Register name R/W Initial value R/W 0b00000000 I C clock control register ch. 0 R/W 0b00000000 I2C address register ch. 0 2 0x0065 ICCR0 0x0066 OPCUR 16-bit MPG output control register (upper) R/W 0b00000000 0x0067 OPCLR 16-bit MPG output control register (lower) R/W 0b00000000 0x0068 IPCUR 16-bit MPG input control register (upper) R/W 0b00000000 0x0069 IPCLR 16-bit MPG input control register (lower) R/W 0b00000000 0x006A NCCR 16-bit MPG noise cancellation control register R/W 0b00000000 0x006B TCSR 16-bit MPG timer control status register R/W 0b00000000 0x006C ADC1 8/10-bit A/D converter control register 1 R/W 0b00000000 0x006D ADC2 8/10-bit A/D converter control register 2 R/W 0b00000000 0x006E ADDH 8/10-bit A/D converter data register (upper) R/W 0b00000000 0x006F ADDL 8/10-bit A/D converter data register (lower) R/W 0b00000000 0x0070 -- -- -- 0x0071 FSR2 Flash memory status register 2 R/W 0b00000000 0x0072 FSR Flash memory status register R/W 0b000X0000 0x0073 SWRE0 Flash memory sector write control register 0 R/W 0b00000000 (Disabled) 0x0074 FSR3 Flash memory status register 3 R 0b000XXXXX 0x0075 FSR4 Flash memory status register 4 R/W 0b00000000 0x0076 WREN Wild register address compare enable register R/W 0b00000000 0x0077 WROR Wild register data test setting register R/W 0b00000000 0x0078 -- -- -- 0x0079 ILR0 Interrupt level setting register 0 R/W 0b11111111 0x007A ILR1 Interrupt level setting register 1 R/W 0b11111111 0x007B ILR2 Interrupt level setting register 2 R/W 0b11111111 0x007C ILR3 Interrupt level setting register 3 R/W 0b11111111 0x007D ILR4 Interrupt level setting register 4 R/W 0b11111111 0x007E ILR5 Interrupt level setting register 5 R/W 0b11111111 0x007F -- -- -- 0x0F80 WRARH0 R/W 0b00000000 0x0F81 WRARL0 Wild register address setting register (lower) ch. 0 R/W 0b00000000 0x0F82 WRDR0 Wild register data setting register ch. 0 R/W 0b00000000 0x0F83 WRARH1 Wild register address setting register (upper) ch. 1 R/W 0b00000000 0x0F84 WRARL1 Wild register address setting register (lower) ch. 1 R/W 0b00000000 0x0F85 WRDR1 Wild register data setting register ch. 1 R/W 0b00000000 0x0F86 WRARH2 Wild register address setting register (upper) ch. 2 R/W 0b00000000 0x0F87 WRARL2 Wild register address setting register (lower) ch. 2 R/W 0b00000000 0x0F88 WRDR2 Wild register data setting register ch. 2 R/W 0b00000000 0x0F89 to 0x0F91 -- -- -- Mirror of register bank pointer (RP) and direct bank pointer (DP) (Disabled) Wild register address setting register (upper) ch. 0 (Disabled) (Continued) 30 DS702-00009-3v0-E MB95630H Series Address Register abbreviation 0x0F92 T01CR0 0x0F93 R/W Initial value 8/16-bit composite timer 01 status control register 0 R/W 0b00000000 T00CR0 8/16-bit composite timer 00 status control register 0 R/W 0b00000000 0x0F94 T01DR 8/16-bit composite timer 01 data register R/W 0b00000000 0x0F95 T00DR 8/16-bit composite timer 00 data register R/W 0b00000000 0x0F96 TMCR0 8/16-bit composite timer 00/01 timer mode control register R/W 0b00000000 0x0F97 T11CR0 8/16-bit composite timer 11 status control register 0 R/W 0b00000000 0x0F98 T10CR0 8/16-bit composite timer 10 status control register 0 R/W 0b00000000 0x0F99 T11DR 8/16-bit composite timer 11 data register R/W 0b00000000 0x0F9A T10DR 8/16-bit composite timer 10 data register R/W 0b00000000 0x0F9B TMCR1 8/16-bit composite timer 10/11 timer mode control register R/W 0b00000000 0x0F9C PPS01 8/16-bit PPG01 cycle setting buffer register R/W 0b11111111 0x0F9D PPS00 8/16-bit PPG00 cycle setting buffer register R/W 0b11111111 0x0F9E PDS01 8/16-bit PPG01 duty setting buffer register R/W 0b11111111 0x0F9F PDS00 8/16-bit PPG00 duty setting buffer register R/W 0b11111111 0x0FA0 PPS11 8/16-bit PPG11 cycle setting buffer register R/W 0b11111111 0x0FA1 PPS10 8/16-bit PPG10 cycle setting buffer register R/W 0b11111111 0x0FA2 PDS11 8/16-bit PPG11 duty setting buffer register R/W 0b11111111 0x0FA3 PDS10 8/16-bit PPG10 duty setting buffer register R/W 0b11111111 0x0FA4 PPGS 8/16-bit PPG start register R/W 0b00000000 0x0FA5 REVC 8/16-bit PPG output inversion register R/W 0b00000000 0x0FA6 PPS21 8/16-bit PPG21 cycle setting buffer register R/W 0b11111111 0x0FA7 PPS20 8/16-bit PPG20 cycle setting buffer register R/W 0b11111111 TMRH1 16-bit reload timer timer register (upper) TMRLRH1 16-bit reload timer reload register (upper) R/W 0b00000000 R/W 0b00000000 0x0FA8 0x0FA9 Register name TMRL1 16-bit reload timer timer register (lower) TMRLRL1 16-bit reload timer reload register (lower) 0x0FAA PDS21 8/16-bit PPG21 duty setting buffer register R/W 0b11111111 0x0FAB PDS20 8/16-bit PPG20 duty setting buffer register R/W 0b11111111 0x0FAC to 0x0FAF -- -- -- 0x0FB0 PDCRH1 16-bit PPG downcounter register (upper) R 0b00000000 0x0FB1 PDCRL1 16-bit PPG downcounter register (lower) R 0b00000000 0x0FB2 PCSRH1 16-bit PPG cycle setting buffer register (upper) R/W 0b11111111 0x0FB3 PCSRL1 16-bit PPG cycle setting buffer register (lower) R/W 0b11111111 0x0FB4 PDUTH1 16-bit PPG duty setting buffer register (upper) R/W 0b11111111 0x0FB5 PDUTL1 16-bit PPG duty setting buffer register (lower) R/W 0b11111111 0x0FB6 to 0x0FBB -- -- -- (Disabled) (Disabled) (Continued) DS702-00009-3v0-E 31 MB95630H Series Address Register abbreviation 0x0FBC BGR1 0x0FBD Register name R/W Initial value LIN-UART baud rate generator register 1 R/W 0b00000000 BGR0 LIN-UART baud rate generator register 0 R/W 0b00000000 0x0FBE PSSR0 UART/SIO dedicated baud rate generator prescaler select register R/W 0b00000000 0x0FBF BRSR0 UART/SIO dedicated baud rate generator baud rate setting register R/W 0b00000000 0x0FC0 to 0x0FC2 -- -- -- 0x0FC3 AIDRL A/D input disable register (lower) R/W 0b00000000 0x0FC4 OPDBRH0 16-bit MPG output data buffer register (upper) ch. 0 R/W 0b00000000 0x0FC5 OPDBRL0 16-bit MPG output data buffer register (lower) ch. 0 R/W 0b00000000 0x0FC6 OPDBRH1 16-bit MPG output data buffer register (upper) ch. 1 R/W 0b00000000 0x0FC7 OPDBRL1 16-bit MPG output data buffer register (lower) ch. 1 R/W 0b00000000 0x0FC8 OPDBRH2 16-bit MPG output data buffer register (upper) ch. 2 R/W 0b00000000 0x0FC9 OPDBRL2 16-bit MPG output data buffer register (lower) ch. 2 R/W 0b00000000 0x0FCA OPDBRH3 16-bit MPG output data buffer register (upper) ch. 3 R/W 0b00000000 0x0FCB OPDBRL3 16-bit MPG output data buffer register (lower) ch. 3 R/W 0b00000000 0x0FCC OPDBRH4 16-bit MPG output data buffer register (upper) ch. 4 R/W 0b00000000 0x0FCD OPDBRL4 16-bit MPG output data buffer register (lower) ch. 4 R/W 0b00000000 0x0FCE OPDBRH5 16-bit MPG output data buffer register (upper) ch. 5 R/W 0b00000000 0x0FCF OPDBRL5 16-bit MPG output data buffer register (lower) ch. 5 R/W 0b00000000 0x0FD0 OPDBRH6 16-bit MPG output data buffer register (upper) ch. 6 R/W 0b00000000 0x0FD1 OPDBRL6 16-bit MPG output data buffer register (lower) ch. 6 R/W 0b00000000 0x0FD2 OPDBRH7 16-bit MPG output data buffer register (upper) ch. 7 R/W 0b00000000 0x0FD3 OPDBRL7 16-bit MPG output data buffer register (lower) ch. 7 R/W 0b00000000 0x0FD4 OPDBRH8 16-bit MPG output data buffer register (upper) ch. 8 R/W 0b00000000 0x0FD5 OPDBRL8 16-bit MPG output data buffer register (lower) ch. 8 R/W 0b00000000 0x0FD6 OPDBRH9 16-bit MPG output data buffer register (upper) ch. 9 R/W 0b00000000 0x0FD7 OPDBRL9 16-bit MPG output data buffer register (lower) ch. 9 R/W 0b00000000 0x0FD8 OPDBRHA 16-bit MPG output data buffer register (upper) ch. A R/W 0b00000000 0x0FD9 OPDBRLA 16-bit MPG output data buffer register (lower) ch. A R/W 0b00000000 0x0FDA OPDBRHB 16-bit MPG output data buffer register (upper) ch. B R/W 0b00000000 16-bit MPG output data buffer register (lower) ch. B (Disabled) 0x0FDB OPDBRLB R/W 0b00000000 0x0FDC OPDUR 16-bit MPG output data register (upper) R 0b0000XXXX 0x0FDD OPDLR 16-bit MPG output data register (lower) R 0bXXXXXXXX 0x0FDE CPCUR 16-bit MPG compare clear register (upper) R/W 0bXXXXXXXX 0x0FDF CPCLR 16-bit MPG compare clear register (lower) R/W 0bXXXXXXXX 0x0FE0, 0x0FE1 -- -- -- (Disabled) (Continued) 32 DS702-00009-3v0-E MB95630H Series (Continued) Address Register abbreviation 0x0FE2 TMBUR 0x0FE3 Register name R/W Initial value 16-bit MPG timer buffer register (upper) R 0bXXXXXXXX TMBLR 16-bit MPG timer buffer register (lower) R 0bXXXXXXXX 0x0FE4 CRTH Main CR clock trimming register (upper) R/W 0b000XXXXX 0x0FE5 CRTL Main CR clock trimming register (lower) R/W 0b000XXXXX 0x0FE6 -- -- -- 0x0FE7 CRTDA Main CR clock temperature dependent adjustment register R/W 0b000XXXXX 0x0FE8 SYSC System configuration register R/W 0b11000011 0x0FE9 CMCR Clock monitoring control register R/W 0b00000000 0x0FEA CMDR Clock monitoring data register R 0b00000000 0x0FEB WDTH Watchdog timer selection ID register (upper) R 0bXXXXXXXX 0x0FEC WDTL Watchdog timer selection ID register (lower) R 0bXXXXXXXX 0x0FED, 0x0FEE -- -- -- 0x0FEF WICR R/W 0b01000000 0x0FF0 to 0x0FFF -- -- -- (Disabled) (Disabled) Interrupt pin selection circuit control register (Disabled) * R/W access symbols R/W : Readable/Writable R : Read only * Initial value symbols 0 : The initial value of this bit is "0". 1 : The initial value of this bit is "1". X : The initial value of this bit is undefined. Note: Do not write to an address that is "(Disabled)". If a "(Disabled)" address is read, an indeterminate value is returned. DS702-00009-3v0-E 33 MB95630H Series I/O PORTS * List of port registers Register name Read/Write Initial value Port 0 data register PDR0 R, RM/W 0b00000000 Port 0 direction register DDR0 R/W 0b00000000 Port 1 data register PDR1 R, RM/W 0b00000000 Port 1 direction register DDR1 R/W 0b00000000 Port 6 data register PDR6 R, RM/W 0b00000000 Port 6 direction register DDR6 R/W 0b00000000 Port F data register PDRF R, RM/W 0b00000000 Port F direction register DDRF R/W 0b00000000 Port G data register PDRG R, RM/W 0b00000000 Port G direction register DDRG R/W 0b00000000 Port 0 pull-up register PUL0 R/W 0b00000000 Port 1 pull-up register PUL1 R/W 0b00000000 Port 6 pull-up register PUL6 R/W 0b00000000 Port G pull-up register PULG R/W 0b00000000 A/D input disable register (lower) AIDRL R/W 0b00000000 R/W : Readable/writable (The read value is the same as the write value.) R, RM/W : Readable/writable (The read value is different from the write value. The write value is read by the read-modify-write (RMW) type of instruction.) 34 DS702-00009-3v0-E MB95630H Series 1. Port 0 Port 0 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in "New 8FX MB95630H Series Hardware Manual". (1) Port 0 configuration Port 0 is made up of the following elements. * General-purpose I/O pins/peripheral function I/O pins * Port 0 data register (PDR0) * Port 0 direction register (DDR0) * Port 0 pull-up register (PUL0) * A/D input disable register (lower) (AIDRL) (2) Block diagrams of port 0 * P00/INT00/AN00/CMP0_P pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT00) * 8/10-bit A/D converter analog input pin (AN00) * Comparator non-inverting analog input (positive input) pin (CMP0_P) * P01/INT01/AN01/CMP0_N pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT01) * 8/10-bit A/D converter analog input pin (AN01) * Comparator inverting analog input (negative input) pin (CMP0_N) * Block diagram of P00/INT00/AN00/CMP0_P and P01/INT01/AN01/CMP0_N Comparator analog input Comparator analog input disable Peripheral function input A/D analog input Peripheral function input enable (INT00 and INT01) Hysteresis 0 Pull-up 1 PDR0 read PDR0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write DS702-00009-3v0-E 35 MB95630H Series * P02/INT02/AN02/SCK pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT02) * 8/10-bit A/D converter analog input pin (AN02) * LIN-UART clock I/O pin (SCK) * P03/INT03/AN03/SOT pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT03) * 8/10-bit A/D converter analog input pin (AN03) * LIN-UART data output pin (SOT) * P05/INT05/AN05/TO00 pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT05) * 8/10-bit A/D converter analog input pin (AN05) * 8/16-bit composite timer ch. 0 output pin (TO00) * P06/INT06/AN06/TO01 pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT06) * 8/10-bit A/D converter analog input pin (AN06) * 8/16-bit composite timer ch. 0 output pin (TO01) * Block diagram of P02/INT02/AN02/SCK, P03/INT03/AN03/SOT, P05/INT05/AN05/TO00 and P06/INT06/AN06/TO01 Peripheral function input A/D analog input Peripheral function input enable (INT02, INT03, INT05 and INT06) Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR0 read 1 PDR0 0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write 36 DS702-00009-3v0-E MB95630H Series * P04/INT04/AN04/SIN/EC0 pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT04) * 8/10-bit A/D converter analog input pin (AN04) * LIN-UART data input pin (SIN) * 8/16-bit composite timer ch. 0 clock input pin (EC0) * Block diagram of P04/INT04/AN04/SIN/EC0 Peripheral function input Peripheral function input enable (INT04) A/D analog input 0 1 Pull-up CMOS PDR0 read PDR0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write DS702-00009-3v0-E 37 MB95630H Series * P07/INT07/AN07 pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT07) * 8/10-bit A/D converter analog input pin (AN07) * Block diagram of P07/INT07/AN07 Peripheral function input Peripheral function input enable (INT07) A/D analog input Hysteresis 0 Pull-up 1 PDR0 read PDR0 Pin PDR0 write Internal bus Executing bit manipulation instruction DDR0 read DDR0 DDR0 write Stop mode, watch mode (SPL = 1) PUL0 read PUL0 PUL0 write AIDRL read AIDRL AIDRL write 38 DS702-00009-3v0-E MB95630H Series (3) Port 0 registers * Port 0 register functions Register abbreviation PDR0 DDR0 PUL0 AIDRL Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is "L" level. PDR0 value is "0". As output port, outputs "L" level. 1 Pin state is "H" level. PDR0 value is "1". As output port, outputs "H" level. 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled 0 Analog input enabled 1 Port input enabled * Correspondence between registers and pins for port 0 Correspondence between related register bits and pins Pin name P07 P06 P05 P04 P03 P02 P01 P00 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 PDR0 DDR0 PUL0 AIDRL DS702-00009-3v0-E 39 MB95630H Series (4) Port 0 operations * Operation as an output port * A pin becomes an output port if the bit in the DDR0 register corresponding to that pin is set to "1". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When a pin is used as an output port, it outputs the value of the PDR0 register to external pins. * If data is written to the PDR0 register, the value is stored in the output latch and is output to the pin set as an output port as it is. * Reading the PDR0 register returns the PDR0 register value. * Operation as an input port * A pin becomes an input port if the bit in the DDR0 register corresponding to that pin is set to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When using a pin shared with the analog input function as an input port, set the corresponding bit in the A/D input disable register (lower) (AIDRL) to "1". * If data is written to the PDR0 register, the value is stored in the output latch but is not output to the pin set as an input port. * Reading the PDR0 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. * Operation as a peripheral function output pin * A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. * The pin value can be read from the PDR0 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR0 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. * Operation as a peripheral function input pin * To set a pin as an input port, set the bit in the DDR0 register corresponding to the input pin of a peripheral function to "0". * When using a pin shared with the analog input function as another peripheral function input pin, configure it as an input port by setting the bit in the AIDRL register corresponding to that pin to "1". * Reading the PDR0 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR0 register, the PDR0 register value is returned. * Operation at reset If the CPU is reset, all bits in the DDR0 register are initialized to "0" and port input is enabled. As for a pin shared with analog input, its port input is disabled because the AIDRL register is initialized to "0". * Operation in stop mode and watch mode * If the pin state setting bit in the standby control register (STBC:SPL) is set to "1" and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR0 register value. The input of that pin is locked to "L" level and blocked in order to prevent leaks due to input open. However, if the interrupt input is enabled for the external interrupt (INT00 to INT07), the input is enabled and not blocked. * If the pin state setting bit is "0", the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. * Operation as an analog input pin * Set the bit in the DDR0 register bit corresponding to the analog input pin to "0" and the bit corresponding to that pin in the AIDRL register to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. In addition, set the corresponding bit in the PUL0 register to "0". 40 DS702-00009-3v0-E MB95630H Series * Operation as an external interrupt input pin * Set the bit in the DDR0 register corresponding to the external interrupt input pin to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * The pin value is always input to the external interrupt circuit. When using a pin for a function other than the interrupt, disable the external interrupt function corresponding to that pin. * Operation of the pull-up register Setting the bit in the PUL0 register to "1" makes the pull-up resistor be internally connected to the pin. When the pin output is "L" level, the pull-up resistor is disconnected regardless of the value of the PUL0 register. * Operation as a comparator input pin (only for P00 and P01) * Set the bit in the AIDRL register corresponding to the comparator input pin to "0". * Regardless of the value of the PDR0 register and that of the DDR0 register, if the comparator analog input enable bit in the comparator control register (CMR0C:VCID) is set to "0", the comparator input function is enabled. * To disable the comparator input function, set the VCID bit to "1". * For details of the comparator, refer to "CHAPTER 27 COMPARATOR" in "New 8FX MB95630H Series Hardware Manual". DS702-00009-3v0-E 41 MB95630H Series 2. Port 1 Port 1 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in "New 8FX MB95630H Series Hardware Manual". (1) Port 1 configuration Port 1 is made up of the following elements. * General-purpose I/O pins/peripheral function I/O pins * Port 1 data register (PDR1) * Port 1 direction register (DDR1) * Port 1 pull-up register (PUL1) (2) Block diagrams of port 1 * P10/PPG10/CMP0_O pin This pin has the following peripheral functions: * 8/16-bit PPG ch. 1 output pin (PPG10) * Comparator digital output pin (CMP0_O) * P11/PPG11 pin This pin has the following peripheral function: * 8/16-bit PPG ch. 1 output pin (PPG11) * P13/PPG00 pin This pin has the following peripheral function: * 8/16-bit PPG ch. 0 output pin (PPG00) * P15/UO0/PPG20 pin This pin has the following peripheral functions: * UART/SIO ch. 0 data output pin (UO0) * 8/16-bit PPG ch. 2 output pin (PPG20) * Block diagram of P10/PPG10/CMP0_O, P11/PPG11, P13/PPG00 and P15/UO0/PPG20 Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR1 read 1 PDR1 0 Pin PDR1 write Internal bus Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) PUL1 read PUL1 PUL1 write 42 DS702-00009-3v0-E MB95630H Series * P12/DBG/EC0 pin This pin has the following peripheral functions: * DBG input pin (DBG) * 8/16-bit composite timer ch. 0 clock input pin (EC0) * Block diagram of P12/DBG/EC0 Peripheral function input Hysteresis 0 1 PDR1 read Pin Internal bus PDR1 OD PDR1 write Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) * P14/UCK0/PPG01 pin This pin has the following peripheral functions: * UART/SIO ch. 0 clock I/O pin (UCK0) * 8/16-bit PPG ch. 0 output pin (PPG01) * Block diagram of P14/UCK0/PPG01 Peripheral function input Peripheral function input enable Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR1 read 1 PDR1 0 Pin PDR1 write Internal bus Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) PUL1 read PUL1 PUL1 write DS702-00009-3v0-E 43 MB95630H Series * P16/UI0/PPG21 pin This pin has the following peripheral functions: * UART/SIO ch. 0 data input pin (UI0) * 8/16-bit PPG ch. 2 output pin (PPG21) * Block diagram of P16/UI0/PPG21 Peripheral function input Peripheral function input enable Peripheral function output enable Peripheral function output Pull-up 0 1 CMOS PDR1 read 1 PDR1 Pin 0 PDR1 write Internal bus Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) PUL1 read PUL1 PUL1 write * P17/TO1/SNI0 pin This pin has the following peripheral functions: * 16-bit reload timer ch. 1 output pin (TO1) * Trigger input pin for the position detection function of the MPG waveform sequencer (SNI0) * Block diagram of P17/TO1/SNI0 Peripheral function input Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR1 read 1 PDR1 0 Pin PDR1 write Internal bus Executing bit manipulation instruction DDR1 read DDR1 DDR1 write Stop mode, watch mode (SPL = 1) PUL1 read PUL1 PUL1 write 44 DS702-00009-3v0-E MB95630H Series (3) Port 1 registers * Port 1 register functions Register abbreviation PDR1 DDR1 PUL1 Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is "L" level. PDR1 value is "0". As output port, outputs "L" level. 1 Pin state is "H" level. PDR1 value is "1". As output port, outputs "H" level.* 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. * Correspondence between registers and pins for port 1 Correspondence between related register bits and pins Pin name P17 P16 P15 P14 P13 P12 P11 P10 bit7 bit6 bit5 bit4 bit3 bit2* bit1 bit0 PDR1 DDR1 PUL1 *: Though P12 has no pull-up function, bit2 in the PUL1 register can still be accessed. The operation of P12 is not affected by the setting of bit2 in the PUL1 register. DS702-00009-3v0-E 45 MB95630H Series (4) Port 1 operations * Operation as an output port * A pin becomes an output port if the bit in the DDR1 register corresponding to that pin is set to "1". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When a pin is used as an output port, it outputs the value of the PDR1 register to external pins. * If data is written to the PDR1 register, the value is stored in the output latch and is output to the pin set as an output port as it is. * Reading the PDR1 register returns the PDR1 register value. * Operation as an input port * A pin becomes an input port if the bit in the DDR1 register corresponding to that pin is set to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * If data is written to the PDR1 register, the value is stored in the output latch but is not output to the pin set as an input port. * Reading the PDR1 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. * Operation as a peripheral function output pin * A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. * The pin value can be read from the PDR1 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR1 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. * Operation as a peripheral function input pin * To set a pin as an input port, set the bit in the DDR1 register corresponding to the input pin of a peripheral function to "0". * Reading the PDR1 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR1 register, the PDR1 register value is returned. * Operation at reset If the CPU is reset, all bits in the DDR1 register are initialized to "0" and port input is enabled. * Operation in stop mode and watch mode * If the pin state setting bit in the standby control register (STBC:SPL) is set to "1" and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR1 register value. The input of that pin is locked to "L" level and blocked in order to prevent leaks due to input open. However, if the interrupt input of P14/UCK0 and P16/UI0 is enabled by the external interrupt control register ch. 0 (EIC00) of the external interrupt circuit and the interrupt pin selection circuit control register (WICR) of the interrupt pin selection circuit, the input is enabled and is not blocked. * If the pin state setting bit is "0", the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. * Operation of the pull-up register Setting the bit in the PUL1 register to "1" makes the pull-up resistor be internally connected to the pin. When the pin output is "L" level, the pull-up resistor is disconnected regardless of the value of the PUL1 register. 46 DS702-00009-3v0-E MB95630H Series 3. Port 6 Port 6 is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in "New 8FX MB95630H Series Hardware Manual". (1) Port 6 configuration Port 6 is made up of the following elements. * General-purpose I/O pins/peripheral function I/O pins * Port 6 data register (PDR6) * Port 6 direction register (DDR6) * Port 6 pull-up register (PUL6) (2) Block diagrams of port 6 * P60/INT08/SDA/DTTI pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT08) * I2C bus interface ch. 0 data I/O pin (SDA) * MPG waveform sequencer input pin (DTTI) * P61/INT09/SCL/TI1 pin This pin has the following peripheral functions: * External interrupt circuit input pin (INT09) * I2C bus interface ch. 0 clock I/O pin (SCL) * 16-bit reload timer ch. 1 input pin (TI1) * Block diagram of P60/INT08/SDA/DTTI and P61/INT09/SCL/TI1 Peripheral function input Peripheral function input enable (INT08 and INT09) Peripheral function output enable Peripheral function output CMOS 0 1 PDR6 read Internal bus Pin 1 PDR6 0 OD PDR6 write Executing bit manipulation instruction DDR6 read DDR6 DDR6 write Stop mode, watch mode (SPL = 1) DS702-00009-3v0-E 47 MB95630H Series * P62/TO10/PPG00/OPT0 pin This pin has the following peripheral functions: * 8/16-bit composite timer ch. 1 output pin (TO10) * 8/16-bit PPG ch. 0 output pin (PPG00) * MPG waveform sequencer output pin (OPT0) * P63/TO11/PPG01/OPT1 pin This pin has the following peripheral functions: * 8/16-bit composite timer ch. 1 output pin (TO11) * 8/16-bit PPG ch. 0 output pin (PPG01) * MPG waveform sequencer output pin (OPT1) * P65/PPG11/OPT3 pin This pin has the following peripheral functions: * 8/16-bit PPG ch. 1 output pin (PPG11) * MPG waveform sequencer output pin (OPT3) * P66/PPG20/PPG1/OPT4 pin This pin has the following peripheral functions: * 8/16-bit PPG ch. 2 output pin (PPG20) * 16-bit PPG timer ch. 1 output pin (PPG1) * MPG waveform sequencer output pin (OPT4) * Block diagram of P62/TO10/PPG00/OPT0, P63/TO11/PPG01/OPT1, P65/PPG11/OPT3 and P66/PPG20/PPG1/OPT4 Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR6 read 1 PDR6 0 Pin PDR6 write Internal bus Executing bit manipulation instruction DDR6 read DDR6 DDR6 write Stop mode, watch mode (SPL = 1) PUL6 read PUL6 PUL6 write 48 DS702-00009-3v0-E MB95630H Series * P64/EC1/PPG10/OPT2 pin This pin has the following peripheral functions: * 8/16-bit composite timer ch. 1 clock input pin (EC1) * 8/16-bit PPG ch. 1 output pin (PPG10) * MPG waveform sequencer output pin (OPT2) * P67/PPG21/TRG1/OPT5 pin This pin has the following peripheral functions: * 8/16-bit PPG ch. 2 output pin (PPG21) * 16-bit PPG timer ch. 1 trigger input pin (TRG1) * MPG waveform sequencer output pin (OPT5) * Block diagram of P64/EC1/PPG10/OPT2 and P67/PPG21/TRG1/OPT5 Peripheral function input Peripheral function input enable Peripheral function output enable Peripheral function output Hysteresis Pull-up 0 1 PDR6 read 1 PDR6 0 Pin PDR6 write Internal bus Executing bit manipulation instruction DDR6 read DDR6 DDR6 write Stop mode, watch mode (SPL = 1) PUL6 read PUL6 PUL6 write DS702-00009-3v0-E 49 MB95630H Series (3) Port 6 registers * Port 6 register functions Register abbreviation PDR6 DDR6 PUL6 Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is "L" level. PDR6 value is "0". As output port, outputs "L" level. 1 Pin state is "H" level. PDR6 value is "1". As output port, outputs "H" level.* 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. * Correspondence between registers and pins for port 6 Correspondence between related register bits and pins Pin name P67 P66 P65 P64 P63 P62 bit7 bit6 bit5 bit4 bit3 bit2 PDR6 DDR6 PUL6 50 P61 P60 bit1 bit0 - - DS702-00009-3v0-E MB95630H Series (4) Port 6 operations * Operation as an output port * A pin becomes an output port if the bit in the DDR6 register corresponding to that pin is set to "1". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When a pin is used as an output port, it outputs the value of the PDR6 register to external pins. * If data is written to the PDR6 register, the value is stored in the output latch and is output to the pin set as an output port as it is. * Reading the PDR6 register returns the PDR6 register value. * Operation as an input port * A pin becomes an input port if the bit in the DDR6 register corresponding to that pin is set to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * If data is written to the PDR6 register, the value is stored in the output latch but is not output to the pin set as an input port. * Reading the PDR6 register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. * Operation as a peripheral function output pin * A pin becomes a peripheral function output pin if the peripheral output function is enabled by setting the output enable bit of a peripheral function corresponding to that pin. * The pin value can be read from the PDR6 register even if the peripheral function output is enabled. Therefore, the output value of a peripheral function can be read by the read operation on the PDR6 register. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. * Operation as a peripheral function input pin * To set a pin as an input port, set the bit in the DDR6 register corresponding to the input pin of a peripheral function to "0". * Reading the PDR6 register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDR6 register, the PDR6 register value is returned. * Operation at reset If the CPU is reset, all bits in the DDR6 register are initialized to "0" and port input is enabled. * Operation in stop mode and watch mode * If the pin state setting bit in the standby control register (STBC:SPL) is set to "1" and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDR6 register value. The input of that pin is locked to "L" level and blocked in order to prevent leaks due to input open. However, if the interrupt input from the external interrupt (INT08, INT09) is enabled, or if the interrupt input of P64/EC1 and P67/TRG1 is enabled by the external interrupt control register ch. 0 (EIC00) of the external interrupt circuit and the interrupt pin selection circuit control register (WICR) of the interrupt pin selection circuit, the input is enabled and is not blocked. * If the pin state setting bit is "0", the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. * Operation of the pull-up register Setting the bit in the PUL6 register to "1" makes the pull-up resistor be internally connected to the pin. When the pin output is "L" level, the pull-up resistor is disconnected regardless of the value of the PUL6 register. DS702-00009-3v0-E 51 MB95630H Series 4. Port F Port F is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in "New 8FX MB95630H Series Hardware Manual". (1) Port F configuration Port F is made up of the following elements. * General-purpose I/O pins/peripheral function I/O pins * Port F data register (PDRF) * Port F direction register (DDRF) (2) Block diagrams of port F * PF0/X0 pin This pin has the following peripheral function: * Main clock input oscillation pin (X0) * PF1/X1 pin This pin has the following peripheral function: * Main clock I/O oscillation pin (X1) * Block diagram of PF0/X0 and PF1/X1 Hysteresis 0 1 PDRF read Internal bus PDRF Pin PDRF write Executing bit manipulation instruction DDRF read DDRF DDRF write 52 Stop mode, watch mode (SPL = 1) DS702-00009-3v0-E MB95630H Series * PF2/RST pin This pin has the following peripheral function: * Reset pin (RST) * Block diagram of PF2/RST Reset input Reset input enable Reset output enable Reset output Hysteresis 0 1 PDRF read PDRF Internal bus Pin 1 0 OD PDRF write Executing bit manipulation instruction DDRF read DDRF DDRF write Stop mode, watch mode (SPL = 1) DS702-00009-3v0-E 53 MB95630H Series (3) Port F registers * Port F register functions Register abbreviation PDRF DDRF Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is "L" level. PDRF value is "0". As output port, outputs "L" level. 1 Pin state is "H" level. PDRF value is "1". As output port, outputs "H" level.* 0 Port input enabled 1 Port output enabled *: If the pin is an N-ch open drain pin, the pin state becomes Hi-Z. * Correspondence between registers and pins for port F Correspondence between related register bits and pins Pin name PDRF DDRF - - - - - PF2* PF1 PF0 - - - - - bit2 bit1 bit0 *: PF2/RST is the dedicated reset pin on MB95F632H/F633H/F634H/F636H. 54 DS702-00009-3v0-E MB95630H Series (4) Port F operations * Operation as an output port * A pin becomes an output port if the bit in the DDRF register corresponding to that pin is set to "1". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When a pin is used as an output port, it outputs the value of the PDRF register to external pins. * If data is written to the PDRF register, the value is stored in the output latch and is output to the pin set as an output port as it is. * Reading the PDRF register returns the PDRF register value. * Operation as an input port * A pin becomes an input port if the bit in the DDRF register corresponding to that pin is set to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * If data is written to the PDRF register, the value is stored in the output latch but is not output to the pin set as an input port. * Reading the PDRF register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDRF register, the PDRF register value is returned. * Operation at reset If the CPU is reset, all bits in the DDRF register are initialized to "0" and port input is enabled. * Operation in stop mode and watch mode * If the pin state setting bit in the standby control register (STBC:SPL) is set to "1" and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDRF register value. The input of that pin is locked to "L" level and blocked in order to prevent leaks due to input open. * If the pin state setting bit is "0", the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. DS702-00009-3v0-E 55 MB95630H Series 5. Port G Port G is a general-purpose I/O port. This section focuses on its functions as a general-purpose I/O port. For details of peripheral functions, refer to their respective chapters in "New 8FX MB95630H Series Hardware Manual". (1) Port G configuration Port G is made up of the following elements. * General-purpose I/O pins/peripheral function I/O pins * Port G data register (PDRG) * Port G direction register (DDRG) * Port G pull-up register (PULG) (2) Block diagram of port G * PG1/X0A/SNI1 pin This pin has the following peripheral functions: * Subclock input oscillation pin (X0A) * Trigger input pin for the position detection function of the MPG waveform sequencer (SNI1) * PG2/X1A/SNI2 pin This pin has the following peripheral functions: * Subclock I/O oscillation pin (X1A) * Trigger input pin for the position detection function of the MPG waveform sequencer (SNI2) * Block diagram of PG1/X0A/SNI1 and PG2/X1A/SNI2 Peripheral function input Hysteresis 0 Pull-up 1 PDRG read PDRG Pin PDRG write Internal bus Executing bit manipulation instruction DDRG read DDRG DDRG write Stop mode, watch mode (SPL = 1) PULG read PULG PULG write 56 DS702-00009-3v0-E MB95630H Series (3) Port G registers * Port G register functions Register abbreviation PDRG DDRG PULG Data Read Read by read-modify-write (RMW) instruction Write 0 Pin state is "L" level. PDRG value is "0". As output port, outputs "L" level. 1 Pin state is "H" level. PDRG value is "1". As output port, outputs "H" level. 0 Port input enabled 1 Port output enabled 0 Pull-up disabled 1 Pull-up enabled * Correspondence between registers and pins for port G Correspondence between related register bits and pins Pin name - - - - - PG2 PG1 - - - - - - bit2 bit1 - PDRG DDRG PULG DS702-00009-3v0-E 57 MB95630H Series (4) Port G operations * Operation as an output port * A pin becomes an output port if the bit in the DDRG register corresponding to that pin is set to "1". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * When a pin is used as an output port, it outputs the value of the PDRG register to external pins. * If data is written to the PDRG register, the value is stored in the output latch and is output to the pin set as an output port as it is. * Reading the PDRG register returns the PDRG register value. * Operation as an input port * A pin becomes an input port if the bit in the DDRG register corresponding to that pin is set to "0". * For a pin shared with other peripheral functions, disable the output of such peripheral functions. * If data is written to the PDRG register, the value is stored in the output latch but is not output to the pin set as an input port. * Reading the PDRG register returns the pin value. However, if the read-modify-write (RMW) type of instruction is used to read the PDRG register, the PDRG register value is returned. * Operation as a peripheral function input pin * To set a pin as an input port, set the bit in the DDRG register corresponding to the input pin of a peripheral function to "0". * Reading the PDRG register returns the pin value, regardless of whether the peripheral function uses that pin as its input pin. However, if the read-modify-write (RMW) type of instruction is used to read the PDRG register, the PDRG register value is returned. * Operation at reset If the CPU is reset, all bits in the DDRG register are initialized to "0" and port input is enabled. * Operation in stop mode and watch mode * If the pin state setting bit in the standby control register (STBC:SPL) is set to "1" and the device transits to stop mode or watch mode, the pin is compulsorily made to enter the high impedance state regardless of the DDRG register value. The input of that pin is locked to "L" level and blocked in order to prevent leaks due to input open. * If the pin state setting bit is "0", the state of the port I/O or that of the peripheral function I/O remains unchanged and the output level is maintained. * Operation of the pull-up register Setting the bit in the PULG register to "1" makes the pull-up resistor be internally connected to the pin. When the pin output is "L" level, the pull-up resistor is disconnected regardless of the value of the PULG register. 58 DS702-00009-3v0-E MB95630H Series INTERRUPT SOURCE TABLE Interrupt source External interrupt ch. 0 Interrupt request number Vector table address Upper Lower Interrupt level setting register Register Bit IRQ00 0xFFFA 0xFFFB ILR0 L00 [1:0] IRQ01 0xFFF8 0xFFF9 ILR0 L01 [1:0] IRQ02 0xFFF6 0xFFF7 ILR0 L02 [1:0] IRQ03 0xFFF4 0xFFF5 ILR0 L03 [1:0] IRQ04 0xFFF2 0xFFF3 ILR1 L04 [1:0] 8/16-bit composite timer ch. 0 (lower) IRQ05 0xFFF0 0xFFF1 ILR1 L05 [1:0] 8/16-bit composite timer ch. 0 (upper) IRQ06 0xFFEE 0xFFEF ILR1 L06 [1:0] LIN-UART (reception) IRQ07 0xFFEC 0xFFED ILR1 L07 [1:0] LIN-UART (transmission) IRQ08 0xFFEA 0xFFEB ILR2 L08 [1:0] 8/16-bit PPG ch. 1 (lower) IRQ09 0xFFE8 0xFFE9 ILR2 L09 [1:0] 8/16-bit PPG ch. 1 (upper) IRQ10 0xFFE6 0xFFE7 ILR2 L10 [1:0] 8/16-bit PPG ch. 2 (upper) IRQ11 0xFFE4 0xFFE5 ILR2 L11 [1:0] 8/16-bit PPG ch. 0 (upper) IRQ12 0xFFE2 0xFFE3 ILR3 L12 [1:0] 8/16-bit PPG ch. 0 (lower) IRQ13 0xFFE0 0xFFE1 ILR3 L13 [1:0] 8/16-bit composite timer ch. 1 (upper) IRQ14 0xFFDE 0xFFDF ILR3 L14 [1:0] 8/16-bit PPG ch. 2 (lower) IRQ15 0xFFDC 0xFFDD ILR3 L15 [1:0] IRQ16 0xFFDA 0xFFDB ILR4 L16 [1:0] MPG (position detection/compare interrupt) IRQ17 0xFFD8 0xFFD9 ILR4 L17 [1:0] 8/10-bit A/D converter IRQ18 0xFFD6 0xFFD7 ILR4 L18 [1:0] Time-base timer IRQ19 0xFFD4 0xFFD5 ILR4 L19 [1:0] IRQ20 0xFFD2 0xFFD3 ILR5 L20 [1:0] IRQ21 0xFFD0 0xFFD1 ILR5 L21 [1:0] 8/16-bit composite timer ch. 1 (lower) IRQ22 0xFFCE 0xFFCF ILR5 L22 [1:0] Flash memory IRQ23 0xFFCC 0xFFCD ILR5 L23 [1:0] External interrupt ch. 4 External interrupt ch. 1 External interrupt ch. 5 External interrupt ch. 2 External interrupt ch. 6 External interrupt ch. 3 External interrupt ch. 7 UART/SIO ch. 0 MPG (DTTI) Priority order of interrupt sources of the same level (occurring simultaneously) High 16-bit reload timer ch. 1 MPG (write timing/compare clear) 2 I C bus interface 16-bit PPG timer ch. 1 Watch prescaler Comparator External interrupt ch. 8 External interrupt ch. 9 DS702-00009-3v0-E Low 59 MB95630H Series PIN STATES IN EACH MODE Pin name Normal operation Sleep mode Oscillation input Oscillation input PF0/X0 I/O port*4 I/O port*4 Oscillation input Oscillation input PF1/X1 I/O port*4 I/O port*4 Oscillation input Oscillation input PG1/X0A/ SNI1 PF2/RST I/O port*4/ peripheral function I/O I/O port I/O port*4/ peripheral function I/O Reset input P62/TO10/ PPG00/ OPT0 P63/TO11/ PPG01/ OPT1 SPL=0 SPL=1 SPL=0 SPL=1 Hi-Z Hi-Z Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*2*4 blocked*2*4 Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*2*4 2 *4 blocked* Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*2*4 blocked*2*4 Hi-Z Hi-Z - Previous state - Hi-Z kept - Input - Input blocked*2*4 2*4 blocked* Hi-Z Hi-Z On reset -- - Hi-Z - Input enabled*1 (However, it does not function.) -- - Hi-Z - Input enabled*1 (However, it does not function.) -- I/O port/ peripheral function I/O I/O port/ peripheral function I/O Hi-Z Hi-Z Hi-Z Hi-Z -- - Hi-Z (However, - Hi-Z (However, - Hi-Z the setting of the setting of - Input - Previous state - Previous state the pull-up the pull-up enabled*1 kept kept control is control is (However, it - Input - Input effective.) effective.) does not blocked*2*4 blocked*2*4 - Input - Input function.) blocked*2*4 blocked*2*4 Reset input Reset input Reset input Reset input Reset input*3 I/O port/ peripheral function I/O - Previous state - Previous state - Hi-Z - Hi-Z kept kept 2 Input blocked* - Input blocked*2 - Input blocked*2 - Input blocked*2 (However, an (However, an - Hi-Z (However, an (However, an external external - Input external external interrupt can interrupt can enabled*1 interrupt can interrupt can (However, it be input when be input when be input when be input when does not the external the external the external the external function.) interrupt interrupt interrupt interrupt request is request is request is request is enabled.) enabled.) enabled.) enabled.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - P60/INT08/ SDA/DTTI P61/INT09/ SCL/TI1 Watch mode - Hi-Z (However, - Hi-Z (However, - Hi-Z the setting of the setting of Previous state Previous state - Input I/O port*4/ the pull-up the pull-up I/O port*4/ kept kept enabled*1 peripheral func- peripheral funccontrol is control is (However, it - Input - Input tion I/O tion I/O effective.) effective.) does not blocked*2*4 blocked*2*4 - Input - Input function.) blocked*2*4 blocked*2*4 Oscillation input Oscillation input PG2/X1A/ SNI2 Stop mode Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) (Continued) 60 DS702-00009-3v0-E MB95630H Series Pin name P64/EC1/ PPG10/ OPT2 P65/PPG11/ OPT3 P66/PPG1/ PPG20/ OPT4 P67/TRG1/ PPG21/ OPT5 Normal operation I/O port/ peripheral function I/O I/O port/ peripheral function I/O I/O port/ peripheral function I/O P10/PPG10/ CMP0_O I/O port/ peripheral function I/O P11/PPG11 P12/DBG/ EC0 I/O port/ peripheral function I/O I/O port/ P13/PPG00 peripheral function I/O Sleep mode Stop mode SPL=0 SPL=1 Watch mode SPL=0 SPL=1 On reset I/O port/ peripheral function I/O - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* - Hi-Z effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 - Input external external (However, an (However, an enabled*1 interrupt can interrupt can external external (However, it be input when be input when interrupt can interrupt can does not the external the external be input when be input when function.) interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - I/O port/ peripheral function I/O - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* - Hi-Z effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 - Input external external (However, an (However, an enabled*1 interrupt can interrupt can external external (However, it be input when be input when interrupt can interrupt can does not the external the external be input when be input when function.) interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - I/O port/ peripheral function I/O - Hi-Z - Input - Previous state - Previous state - Hi-Z - Hi-Z enabled*1 kept kept 2 2 (However, it Input blocked* Input blocked* - Input blocked*2 - Input blocked*2 does not function.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) (Continued) DS702-00009-3v0-E 61 MB95630H Series Pin name P14/UCK0/ PPG01 P15/UO0/ PPG20 P16/UI0/ PPG21 P17/TO1/ SNI0 Normal operation I/O port/ peripheral function I/O I/O port/ peripheral function I/O I/O port/ peripheral function I/O I/O port/ peripheral function I/O Sleep mode P03/INT03/ AN03/SOT SPL=1 Watch mode SPL=0 SPL=1 On reset I/O port/ peripheral function I/O - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* - Hi-Z effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 - Input external external (However, an (However, an enabled*1 interrupt can interrupt can external external (However, it be input when be input when interrupt can interrupt can does not the external the external be input when be input when function.) interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - I/O port/ peripheral function I/O - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* - Hi-Z effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 - Input external external (However, an (However, an enabled*1 interrupt can interrupt can external external (However, it be input when be input when interrupt can interrupt can does not the external the external be input when be input when function.) interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) I/O port/ peripheral function I/O - Hi-Z (However, the setting of - Previous state - Previous state the pull-up kept kept control is - Input blocked*2 - Input blocked*2 effective.) - Input blocked*2 - I/O port/ peripheral function I/O/ analog input - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 external external - Hi-Z (However, an (However, an interrupt can interrupt can - Input external external be input when be input when blocked*2 interrupt can interrupt can the external the external be input when be input when interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) P00/INT00/ AN00/ CMP0_P P01/INT01/ AN01/ I/O port/ CMP0_N peripheral P02/INT02/ function I/O/ AN02/SCK analog input Stop mode SPL=0 Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) Hi-Z (However, - Hi-Z the setting of - Input the pull-up enabled*1 (However, it control is does not effective.) Input blocked*2 function.) (Continued) 62 DS702-00009-3v0-E MB95630H Series (Continued) Pin name Normal operation Sleep mode P04/INT04/ AN04/SIN/ EC0 P05/INT05/ AN05/TO00 I/O port/ P06/INT06/ peripheral AN06/TO01 function I/O/ analog input P07/INT07/ AN07 I/O port/ peripheral function I/O/ analog input Stop mode SPL=0 SPL=1 Watch mode SPL=0 SPL=1 On reset - Hi-Z (However, - Hi-Z (However, the setting of the setting of - Previous state - Previous state the pull-up the pull-up kept kept control is control is 2 2 - Input blocked* - Input blocked* effective.) effective.) (However, an (However, an - Input blocked*2 - Input blocked*2 external external - Hi-Z (However, an (However, an interrupt can interrupt can - Input external external be input when be input when blocked*2 interrupt can interrupt can the external the external be input when be input when interrupt interrupt the external the external request is request is interrupt interrupt enabled.) enabled.) request is request is enabled.) enabled.) SPL: Pin state setting bit in the standby control register (STBC:SPL) Hi-Z: High impedance *1: "Input enabled" means that the input function is enabled. While the input function is enabled, a pull-up or pull-down operation has to be performed in order to prevent leaks due to external input. If a pin is used as an output port, its pin state is the same as that of other ports. *2: "Input blocked" means direct input gate operation from the pin is disabled. *3: The PF2/RST pin stays at the state shown when configured as a reset pin. *4: The pin stays at the state shown when configured as a general-purpose I/O port. DS702-00009-3v0-E 63 MB95630H Series ELECTRICAL CHARACTERISTICS 1. Absolute Maximum Ratings Parameter Power supply voltage*1 Input voltage* 1 Output voltage* 1 Maximum clamp current Total maximum clamp current "L" level maximum output current Symbol Rating Min V VI VSS - 0.3 VSS + 6 V *2 VO VSS - 0.3 VSS + 6 V *2 ICLAMP -2 +2 mA Applicable to specific pins*3 |ICLAMP| -- 20 mA Applicable to specific pins*3 IOL -- 15 mA 4 -- IOLAV2 "H" level maximum output current mA 12 Other than P62 to P67 Average output current = operating current x operating ratio (1 pin) P62 to P67 Average output current = operating current x operating ratio (1 pin) IOL -- 100 mA IOLAV -- 37 Total average output current = mA operating current x operating ratio (Total number of pins) IOH -- -15 mA -4 IOHAV1 -- "H" level average current mA -8 IOHAV2 "H" level total maximum output current Remarks VSS - 0.3 VSS + 6 "L" level average current "L" level total average output current Unit VCC IOLAV1 "L" level total maximum output current Max Other than P62 to P67 Average output current = operating current x operating ratio (1 pin) P62 to P67 Average output current = operating current x operating ratio (1 pin) IOH -- -100 mA IOHAV -- -47 Total average output current = mA operating current x operating ratio (Total number of pins) Power consumption Pd -- 320 mW Operating temperature TA -40 +85 C Storage temperature Tstg -55 +150 C "H" level total average output current (Continued) 64 DS702-00009-3v0-E MB95630H Series (Continued) *1: These parameters are based on the condition that VSS is 0.0 V. *2: V1 and V0 must not exceed VCC + 0.3 V. V1 must not exceed the rated voltage. However, if the maximum current to/from an input is limited by means of an external component, the ICLAMP rating is used instead of the VI rating. *3: Specific pins: P00 to P07, P10, P11, P13 to P17, P62 to P67, PF0, PF1, PG1, PG2 * Use under recommended operating conditions. * Use with DC voltage (current). * The HV (High Voltage) signal is an input signal exceeding the VCC voltage. Always connect a limiting resistor between the HV (High Voltage) signal and the microcontroller before applying the HV (High Voltage) signal. * The value of the limiting resistor should be set to a value at which the current to be input to the microcontroller pin when the HV (High Voltage) signal is input is below the standard value, irrespective of whether the current is transient current or stationary current. * When the microcontroller drive current is low, such as in low power consumption modes, the HV (High Voltage) input potential may pass through the protective diode to increase the potential of the VCC pin, affecting other devices. * If the HV (High Voltage) signal is input when the microcontroller power supply is off (not fixed at 0 V), since power is supplied from the pins, incomplete operations may be executed. * If the HV (High Voltage) input is input after power-on, since power is supplied from the pins, the voltage of power supply may not be sufficient to enable a power-on reset. * Do not leave the HV (High Voltage) input pin unconnected. * Example of a recommended circuit: * Input/Output equivalent circuit Protective diode VCC P-ch Limiting resistor HV(High Voltage) input (0 V to 16 V) N-ch R WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. DS702-00009-3v0-E 65 MB95630H Series 2. Recommended Operating Conditions (VSS = 0.0 V) Parameter Symbol Power supply voltage VCC Decoupling capacitor CS Operating temperature TA Value Min Max 2.4*1 5.5 2.3 5.5 0.022 1 - 40 +85 +5 +35 Unit V F C Remarks In normal operation Hold condition in stop mode *2 Other than on-chip debug mode On-chip debug mode *1: The minimum power supply voltage becomes 2.88 V when a product with the low-voltage detection reset is used or when the on-chip debug mode is used. *2: Use a ceramic capacitor or a capacitor with equivalent frequency characteristics. The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. For the connection to a decoupling capacitor CS, see the diagram below. To prevent the device from unintentionally entering an unknown mode due to noise, minimize the distance between the C pin and CS and the distance between CS and the VSS pin when designing the layout of a printed circuit board. * DBG / RST / C pins connection diagram * DBG C RST Cs *: Connect the DBG pin to an external pull-up resistor of 2 k or above. After power-on, ensure that the DBG pin does not stay at "L" level until the reset output is released. The DBG pin becomes a communication pin in debug mode. Since the actual pull-up resistance depends on the tool used and the interconnection length, refer to the tool document when selecting a pull-up resistor. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. 66 DS702-00009-3v0-E MB95630H Series 3. DC Characteristics (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40 C to +85C) Parameter Symbol "H" level input voltage "L" level input voltage Open-drain output application voltage "H" level output voltage "L" level output voltage Input leak current (Hi-Z output leak current) Internal pull-up resistor Input capacitance Pin name Condition VIHI P04, P16, P60, P61 Value Unit Remarks VCC + 0.3 V CMOS input level -- VCC + 0.3 V Hysteresis input 0.8 VCC -- VCC + 0.3 V Hysteresis input -- VSS - 0.3 -- 0.3 VCC V CMOS input level VILS P00 to P07, P10 to P17, P60 to P67, PF0, PF1, PG1, PG2 -- VSS - 0.3 -- 0.2 VCC V Hysteresis input VILM PF2 -- VSS - 0.3 -- 0.2 VCC V Hysteresis input P12, P60, P61, PF2 -- VSS - 0.3 -- Vss + 5.5 V VOH1 Output pins other than P12, IOH = -4 mA P62 to P67, PF2 VCC - 0.5 -- -- V VOH2 P62 to P67 IOH = -8 mA VCC - 0.5 -- -- V VOL1 Output pins other than P62 IOL = 4 mA to P67 -- -- 0.4 V VOL2 P62 to P67 IOL = 12 mA -- -- 0.4 V All input pins 0.0 V < VI < VCC -5 -- +5 When the internal A pull-up resistor is disabled P00 to P07, P10, P11, P13 to P17, P62 to P67, PG1, PG2 VI = 0 V 25 50 100 When the internal k pull-up resistor is enabled -- 5 15 pF Min Typ Max -- 0.7 VCC -- VIHS P00 to P07, P10 to P17, P60 to P67, PF0, PF1, PG1, PG2 -- 0.8 VCC VIHM PF2 -- VILI P04, P16, P60, P61 VD ILI RPULL CIN Other than VCC f = 1 MHz and VSS (Continued) DS702-00009-3v0-E 67 MB95630H Series (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40 C to +85C) Parameter Symbol Pin name Condition Value Min -- FCH = 32 MHz FMP = 16 MHz Main clock mode (divided by 2) ICC Typ*1 Max*2 3.6 Unit Remarks 5.8 Except during Flash memory mA programming and erasing -- 7.5 13.8 During Flash memory mA programming and erasing -- 4.1 9.1 mA At A/D conversion -- 1.3 3 mA -- 49 145 A ICCLS FCL = 32 kHz FMPL = 16 kHz Subsleep mode (divided by 2) TA = +25C -- 10 15 A In deep standby mode ICCT FCL = 32 kHz Watch mode Main stop mode TA = +25C -- 7 13 A In deep standby mode FMCRPLL = 16 MHz FMP = 16 MHz Main CR PLL clock mode (multiplied by 4) TA = +25C -- 4.7 6.8 mA ICCMCR FCRH = 4 MHz FMP = 4 MHz Main CR clock mode -- 1.1 4.6 mA ICCSCR Sub-CR clock mode (divided by 2) TA = +25C -- 58.1 230 A -- 345 395 A In deep standby mode -- 6 10 A In deep standby mode FCH = 32 MHz FMP = 16 MHz Main sleep mode (divided by 2) ICCS ICCL VCC (External clock FCL = 32 kHz operation) FMPL = 16 kHz Subclock mode (divided by 2) TA = +25C Power supply current*3 ICCMPLL VCC ICCTS ICCH FCH = 32 MHz Time-base timer VCC mode (External clock TA = +25C operation) Substop mode TA = +25C (Continued) 68 DS702-00009-3v0-E MB95630H Series (Continued) Parameter (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40 C to +85C) Symbol Pin name Condition Value Min Typ*1 Max*2 Unit IV Current consumption of the comparator -- 60 160 A ILVD Current consumption of the low-voltage detection circuit -- 4 7 A ICRH Current consumption of the main CR oscillator -- 240 320 A ICRL Current consumption of the sub-CR oscillator oscillating at 100 kHz -- 7 20 A INSTBY Current consumption difference between normal standby mode and deep standby mode TA = +25C -- 20 30 A Power supply current*3 VCC Remarks *1: VCC = 5.0 V, TA = +25C *2: VCC = 5.5 V, TA = +85C (unless otherwise specified) *3: * The power supply current is determined by the external clock. When the low-voltage detection circuit is selected, the power supply current is the sum of adding the current consumption of the low-voltage detection circuit (ILVD) to one of the values from ICC to ICCH. In addition, when both the low-voltage detection option and the CR oscillator are selected, the power supply current is the sum of adding up the current consumption of the low-voltage detection circuit (ILVD), the current consumption of the CR oscillators (ICRH, ICRL) and a specified value. In on-chip debug mode, the CR oscillator (ICRH) and the low-voltage detection circuit are always in operation, and current consumption therefore increases accordingly. * See "4. AC Characteristics (1) Clock Timing" for FCH, FCL, FCRH and FMCRPLL. * See "4. AC Characteristics (2) Source Clock/Machine Clock" for FMP and FMPL. * The power supply current value in standby mode is measured in deep standby mode. The current consumption in normal standby is higher than that in deep standby mode. The power supply current value in normal standby can be found by adding the current consumption difference between normal standby mode and deep standby mode (INSTBY) to the power supply current value in deep standby mode. For details of normal standby and deep standby mode, refer to "CHAPTER 3 CLOCK CONTROLLER" in "New 8FX MB95630H Series Hardware Manual". DS702-00009-3v0-E 69 MB95630H Series 4. AC Characteristics (1) Clock Timing (VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Pin name Condition X0, X1 FCH X0 X1: open X0, X1 FCRH -- -- * FCL FCRL -- X0A, X1A -- Max Unit Typ 1 -- 1 -- 12 1 -- 32.5 3.92 4 4.08 Operating conditions MHz * The main CR clock is used. * 0C TA +70C 16.25 MHz When the main oscillation circuit is used MHz When the main external clock MHz is used 3.8 4 4.2 Operating conditions * The main CR clock is used. MHz * - 40 C TA < 0 C, + 70 C < TA + 85 C 7.84 8 8.16 Operating conditions MHz * PLL multiplication rate: 2 * 0C TA +70C 7.6 8 8.4 Operating conditions * PLL multiplication rate: 2 MHz * - 40 C TA < 0 C, + 70 C < TA + 85 C 9.8 10 10.2 Operating conditions MHz * PLL multiplication rate: 2.5 * 0C TA +70C Operating conditions * PLL multiplication rate: 2.5 MHz * - 40 C TA < 0 C, + 70 C < TA + 85 C 9.5 10 10.5 11.76 12 Operating conditions 12.24 MHz * PLL multiplication rate: 3 * 0C TA +70C 11.4 12 12.6 Operating conditions * PLL multiplication rate: 3 MHz * - 40 C TA < 0 C, + 70 C < TA + 85 C 15.68 16 Operating conditions 16.32 MHz * PLL multiplication rate: 4 * 0C TA +70C 15.2 16 16.8 Operating conditions * PLL multiplication rate: 4 MHz * - 40 C TA < 0 C, + 70 C < TA + 85 C -- 32.768 -- kHz When the suboscillation circuit is used -- 32.768 -- kHz When the sub-external clock is used 50 100 150 kHz When the sub-CR clock is used -- -- -- Remarks Min -- Clock frequency FMCRPLL Value (Continued) 70 DS702-00009-3v0-E MB95630H Series (Continued) Parameter (VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = -40C to +85C) Symbol Pin name Condition X0, X1 Clock cycle time tHCYL tWH1, tWL1 X0A, X1A X0 tWH2, tWL2 X0A Max 61.5 1000 ns 83.4 1000 ns * 30.8 1000 ns 30.5 s When the subclock is used 33.4 * 12.4 -- 15.2 ns When an external clock is ns used, the duty ratio should s range between 40% and 60%. -- 5 ns -- -- 5 When an external clock is ns used X0, X0A X1: open Input clock rising time and tCR, tCF X0, X1, * falling time X0A, X1A CR oscillation start time Remarks Typ X1: open X0, X1 Unit Min X1: open X0, X1 tLCYL Input clock pulse width X0 Value When the main oscillation circuit is used When an external clock is used tCRHWK -- -- -- -- 50 s When the main CR clock is used tCRLWK -- -- -- -- 30 s When the sub-CR clock is used -- -- -- -- 100 s When the main CR PLL clock is used PLL oscillation tMCRPLLWK start time *: The external clock signal is input to X0 and the inverted external clock signal to X1. DS702-00009-3v0-E 71 MB95630H Series * Input waveform generated when an external clock (main clock) is used tHCYL tWH1 tWL1 tCR tCF 0.8 VCC 0.8 VCC X0, X1 0.2 VCC 0.2 VCC 0.2 VCC * Figure of main clock input port external connection When a crystal oscillator or a ceramic oscillator is used X0 When an external clock is used When an external clock (X1 is open) is used X0 X1 X1 X0 X1 Open FCH FCH FCH * Input waveform generated when an external clock (subclock) is used tLCYL tWH2 tCR tWL2 tCF 0.8 VCC 0.8 VCC X0A 0.2 VCC 0.2 VCC 0.2 VCC * Figure of subclock input port external connection When a crystal oscillator or a ceramic oscillator is used X0A X1A When an external clock is used X0A X1A Open FCL FCL * Input waveform generated when an internal clock (main CR clock) is used tCRHWK 1/FCRH Main CR clock Oscillation starts 72 Oscillation stabilizes DS702-00009-3v0-E MB95630H Series * Input waveform generated when an internal clock (sub-CR clock) is used tCRLWK 1/FCRL Sub-CR clock Oscillation starts Oscillation stabilizes * Input waveform generated when an internal clock (main CR PLL clock) is used 1/FMCRPLL tMCRPLLWK Main CR PLL clock Oscillation starts DS702-00009-3v0-E Oscillation stabilizes 73 MB95630H Series (2) Source Clock/Machine Clock (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Source clock cycle time*1 Symbol tSCLK Pin name -- FSP Source clock frequency -- FSPL Machine clock cycle time*2 (minimum instruction execution time) tMCLK -- FMPL Unit Remarks Min Typ Max 61.5 -- 2000 ns When the main external clock is used Min: FCH = 32.5 MHz, divided by 2 Max: FCH = 1 MHz, divided by 2 62.5 -- 250 ns When the main CR clock is used Min: FCRH = 4 MHz, multiplied by 4 Max: FCRH = 4 MHz, no division -- 61 -- s When the suboscillation clock is used FCL = 32.768 kHz, divided by 2 -- 20 -- s When the sub-CR clock is used FCL = 100 kHz, divided by 2 0.5 -- 16.25 -- 4 -- MHz When the main CR clock is used -- 16.384 -- kHz When the suboscillation clock is used -- 50 -- kHz 61.5 -- 32000 ns When the main oscillation clock is used Min: FSP = 16.25 MHz, no division Max: FSP = 0.5 MHz, divided by 16 250 -- 4000 ns When the main CR clock is used Min: FSP = 4 MHz, no division Max: FSP = 4 MHz, divided by 16 61 -- 976.5 s When the suboscillation clock is used Min: FSPL = 16.384 kHz, no division Max: FSPL = 16.384 kHz, divided by 16 20 -- 320 s When the sub-CR clock is used Min: FSPL = 50 kHz, no division Max: FSPL = 50 kHz, divided by 16 0.031 -- 16.25 0.25 -- 16 1.024 -- 16.384 3.125 -- 50 MHz When the main oscillation clock is used -- FMP Machine clock frequency Value When the sub-CR clock is used FCRL = 100 kHz, divided by 2 MHz When the main oscillation clock is used MHz When the main CR clock is used kHz When the suboscillation clock is used kHz When the sub-CR clock is used FCRL = 100 kHz *1: This is the clock before it is divided according to the division ratio set by the machine clock division ratio select bits (SYCC:DIV[1:0]). This source clock is divided to become a machine clock according to the division ratio set by the machine clock division ratio select bits (SYCC:DIV[1:0]). In addition, a source clock can be selected from the following. * Main clock divided by 2 * Main CR clock * PLL multiplication of main CR clock (Select a multiplication rate from 2, 2.5, 3 and 4.) * Subclock divided by 2 * Sub-CR clock divided by 2 *2: This is the operating clock of the microcontroller. A machine clock can be selected from the following. * Source clock (no division) * Source clock divided by 4 * Source clock divided by 8 * Source clock divided by 16 74 DS702-00009-3v0-E MB95630H Series * Schematic diagram of the clock generation block FCH (Main oscillation clock) Divided by 2 FCRH (Main CR clock) SCLK (Source clock) FMCRPLL (Main CR PLL clock) FCL (Suboscillation clock) Division circuit x 1 x 1/4 x 1/8 x 1/16 MCLK (Machine clock) Divided by 2 Machine clock divide ratio select bits (SYCC:DIV[1:0]) FCRL (Sub-CR clock) Divided by 2 Clock mode select bits (SYCC:SCS[2:0]) * Operating voltage - Operating frequency (TA = -40C to +85C) 5.5 Operating voltage (V) 5.0 A/D converter operation range 4.0 3.5 3.0 2.7 2.4 16 kHz 3 MHz 10 MHz 16.25 MHz Source clock frequency (FSP/FSPL) DS702-00009-3v0-E 75 MB95630H Series (3) External Reset (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter RST "L" level pulse width Symbol tRSTL Value Min Max 2 tMCLK* Unit Remarks ns *: See "(2) Source Clock/Machine Clock" for tMCLK. tRSTL RST 0.2 VCC 76 0.2 VCC DS702-00009-3v0-E MB95630H Series (4) Power-on Reset (VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Condition Power supply rising time tR Power supply cutoff time tOFF tR Value Unit Min Max 50 ms 1 ms Remarks Wait time until power-on tOFF 2.5 V VCC 0.2 V 0.2 V 0.2 V Note: A sudden change of power supply voltage may activate the power-on reset function. When changing the power supply voltage during the operation, set the slope of rising to a value below within 30 mV/ms as shown below. VCC 2.3 V Set the slope of rising to a value below 30 mV/ms. Hold condition in stop mode VSS DS702-00009-3v0-E 77 MB95630H Series (5) Peripheral Input Timing (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Peripheral input "H" pulse width tILIH Peripheral input "L" pulse width tIHIL Value Pin name INT00 to INT09, EC0, EC1, TI1, TRG1 Unit Min Max 2 tMCLK* ns 2 tMCLK* ns *: See "(2) Source Clock/Machine Clock" for tMCLK. tILIH INT00 to INT09, EC0, EC1, TI1, TRG1 78 0.8 VCC tIHIL 0.8 VCC 0.2 VCC 0.2 VCC DS702-00009-3v0-E MB95630H Series (6) LIN-UART Timing Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is disabled*2. (ESCR register : SCES bit = 0, ECCR register : SCDE bit = 0) (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Serial clock cycle time SCK SOT delay time Symbol Pin name tSCYC SCK tSLOVI SCK, SOT Internal clock operation output pin: SCK, SIN CL = 80 pF + 1 TTL SCK, SIN Valid SIN SCK tIVSHI SCK valid SIN hold time tSHIXI Serial clock "L" pulse width Serial clock "H" pulse width tSLSH tSHSL SCK SOT delay time tSLOVE Valid SIN SCK tIVSHE SCK valid SIN hold time tSHIXE Value Condition SCK SCK SCK, SOT External clock SCK, SIN operation output pin: SCK, SIN CL = 80 pF + 1 TTL Unit Min Max 5 tMCLK*3 -- ns -50 +50 ns MCLK 3 * + 80 -- ns 0 -- ns * -tR -- ns * + 10 -- ns t MCLK 3 3t MCLK 3 t -- * + 60 ns MCLK 3 2t 30 -- ns MCLK 3 * + 30 -- ns t SCK falling time tF SCK -- 10 ns SCK rising time tR SCK -- 10 ns *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See "(2) Source Clock/Machine Clock" for tMCLK. DS702-00009-3v0-E 79 MB95630H Series * Internal shift clock mode tSCYC 0.8 VCC SCK 0.2 VCC 0.2 VCC tSLOVI 0.8 VCC SOT 0.2 VCC tIVSHI tSHIXI 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC * External shift clock mode tSLSH tSHSL 0.8 VCC 0.8 VCC 0.8 VCC SCK 0.2 VCC tF 0.2 VCC tR tSLOVE 0.8 VCC SOT 0.2 VCC tIVSHE tSHIXE 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC 80 DS702-00009-3v0-E MB95630H Series Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is disabled*2. (ESCR register : SCES bit = 1, ECCR register : SCDE bit = 0) (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Serial clock cycle time SCK SOT delay time Symbol Pin name tSCYC SCK tSHOVI SCK, SOT Internal clock operation output pin: SCK, SIN CL = 80 pF + 1 TTL SCK, SIN Valid SIN SCK tIVSLI SCK valid SIN hold time tSLIXI Serial clock "H" pulse width Serial clock "L" pulse width tSHSL tSLSH SCK SOT delay time tSHOVE Valid SIN SCK tIVSLE SCK valid SIN hold time tSLIXE Value Condition SCK SCK SCK, SOT External clock SCK, SIN operation output pin: SCK, SIN CL = 80 pF + 1 TTL Unit Min Max 5 tMCLK*3 -- ns -50 +50 ns MCLK 3 * + 80 -- ns 0 -- ns * - tR -- ns * + 10 -- ns t MCLK 3 3t MCLK 3 t -- * + 60 ns MCLK 3 2t 30 -- ns MCLK 3 * + 30 -- ns t SCK falling time tF SCK -- 10 ns SCK rising time tR SCK -- 10 ns *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See "(2) Source Clock/Machine Clock" for tMCLK. DS702-00009-3v0-E 81 MB95630H Series * Internal shift clock mode tSCYC 0.8 VCC 0.8 VCC SCK 0.2 VCC tSHOVI 0.8 VCC SOT 0.2 VCC tIVSLI tSLIXI 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC * External shift clock mode tSHSL 0.8 VCC tSLSH 0.8 VCC SCK 0.2 VCC tR tF 0.2 VCC 0.2 VCC tSHOVE 0.8 VCC SOT 0.2 VCC tIVSLE tSLIXE 0.7 VCC 0.7 VCC SIN 0.3 VCC 0.3 VCC 82 DS702-00009-3v0-E MB95630H Series Sampling is executed at the rising edge of the sampling clock*1, and serial clock delay is enabled*2. (ESCR register : SCES bit = 0, ECCR register : SCDE bit = 1) (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Pin name Value Condition Serial clock cycle time tSCYC SCK SCK SOT delay time tSHOVI SCK, SOT Internal clock SCK, SIN operation output pin: SCK, SIN CL = 80 pF + 1 TTL Valid SIN SCK tIVSLI SCK valid SIN hold time tSLIXI SOT SCKdelay time tSOVLI SCK, SOT Unit Min Max 5 tMCLK*3 -- ns -50 +50 ns MCLK 3 * + 80 -- ns 0 -- ns * - 70 -- ns t 3t MCLK 3 *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See "(2) Source Clock/Machine Clock" for tMCLK. tSCYC 0.8 VCC SCK 0.2 VCC tSOVLI SOT 0.8 VCC 0.8 VCC 0.2 VCC 0.2 VCC tIVSLI SIN DS702-00009-3v0-E 0.2 VCC tSHOVI tSLIXI 0.7 VCC 0.7 VCC 0.3 VCC 0.3 VCC 83 MB95630H Series Sampling is executed at the falling edge of the sampling clock*1, and serial clock delay is enabled*2. (ESCR register : SCES bit = 1, ECCR register : SCDE bit = 1) (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Pin name Value Condition Serial clock cycle time tSCYC SCK SCK SOT delay time tSLOVI SCK, SOT Internal clock SCK, SIN operation output pin: SCK, SIN CL = 80 pF + 1 TTL Valid SIN SCK tIVSHI SCK valid SIN hold time tSHIXI SOT SCKdelay time tSOVHI Max 5 tMCLK*3 -- ns -50 +50 ns MCLK 3 * + 80 -- ns 0 -- ns * - 70 -- ns t SCK, SOT Unit Min 3t MCLK 3 *1: There is a function used to choose whether the sampling of reception data is performed at a rising edge or a falling edge of the serial clock. *2: The serial clock delay function is a function used to delay the output signal of the serial clock for half the clock. *3: See "(2) Source Clock/Machine Clock" for tMCLK. tSCYC 0.8 VCC SCK 0.8 VCC 0.2 VCC tSOVHI SOT 0.8 VCC 0.2 VCC 0.2 VCC tIVSHI SIN 84 tSLOVI 0.8 VCC tSHIXI 0.7 VCC 0.7 VCC 0.3 VCC 0.3 VCC DS702-00009-3v0-E MB95630H Series (7) Low-voltage Detection (VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Value Unit Remarks Min Typ Max 2.52 2.7 2.88 2.61 2.8 2.99 2.89 3.1 3.31 3.08 3.3 3.52 2.43 2.6 2.77 2.52 2.7 2.88 2.80 3 3.20 2.99 3.2 3.41 VHYS -- -- 100 mV Power supply start voltage Voff -- -- 2.3 V Power supply end voltage Von 4.9 -- -- V Power supply voltage change time (at power supply rise) tr 650 -- -- s Slope of power supply that the reset release signal generates within the rating (VDL+) Power supply voltage change time (at power supply fall) tf 650 -- -- s Slope of power supply that the reset detection signal generates within the rating (VDL-) Reset release delay time td1 -- -- 30 s Reset detection delay time td2 -- -- 30 s LVD reset threshold voltage transition stabilization time tstb 10 -- -- s Release voltage* Detection voltage* Hysteresis width VDL+ VDL- V At power supply rise V At power supply fall *: The release voltage and the detection voltage can be selected by using the LVD reset voltage selection ID register (LVDR) in the low-voltage detection reset circuit. For details of the LVDR register, refer to "CHAPTER 16 LOW-VOLTAGE DETECTION RESET CIRCUIT" in "New 8FX MB95630H Series Hardware Manual". DS702-00009-3v0-E 85 MB95630H Series VCC Von Voff time tf tr VDL+ VHYS VDL- Internal reset signal time td2 86 td1 DS702-00009-3v0-E MB95630H Series (8) I2C Bus Interface Timing (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Value Parameter Standardmode Fast-mode Min Max Min Max 0 100 0 400 kHz SCL, SDA 4.0 -- 0.6 -- s Symbol Pin name Condition SCL clock frequency fSCL (Repeated) START condition hold time SDA SCL tHD;STA SCL Unit SCL clock "L" width tLOW SCL 4.7 -- 1.3 -- s SCL clock "H" width tHIGH SCL 4.0 -- 0.6 -- s 4.7 -- 0.6 -- s (Repeated) START condition setup time SCL SDA tSU;STA SCL, SDA Data hold time SCL SDA tHD;DAT SCL, SDA 0 3.45*2 0 0.9*3 s Data setup time SDA SCL tSU;DAT SCL, SDA 0.25 -- 0.1 -- s STOP condition setup time SCL SDA tSU;STO SCL, SDA 4 -- 0.6 -- s tBUF SCL, SDA 4.7 -- 1.3 -- s Bus free time between STOP condition and START condition R = 1.7 k, C = 50 pF*1 *1: R represents the pull-up resistor of the SCL and SDA lines, and C the load capacitor of the SCL and SDA lines. *2: The maximum tHD;DAT in the Standard-mode is applicable only when the time during which the device is holding the SCL signal at "L" (tLOW) does not extend. *3: A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, provided that the condition of tSU;DAT 250 ns is fulfilled. tWAKEUP SDA tLOW tHD;DAT tHIGH tHD;STA tBUF SCL tHD;STA DS702-00009-3v0-E tSU;DAT fSCL tSU;STA tSU;STO 87 MB95630H Series (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Pin Condition name Value*2 Min Max Unit Remarks SCL clock "L" width tLOW SCL (2 + nm/2)tMCLK - 20 -- ns Master mode SCL clock "H" width tHIGH SCL (nm/2)tMCLK - 20 (nm/2)tMCLK + 20 ns Master mode Master mode Maximum value is applied when ns m, n = 1, 8. Otherwise, the minimum value is applied. START condition hold time tHD;STA SCL, SDA (-1 + nm/2)tMCLK - 20 (-1 + nm)tMCLK + 20 STOP condition setup time tSU;STO SCL, SDA (1 + nm/2)tMCLK - 20 (1 + nm/2)tMCLK + 20 ns Master mode START condition setup time tSU;STA SCL, SDA (1 + nm/2)tMCLK - 20 (1 + nm/2)tMCLK + 20 ns Master mode tBUF SCL, SDA (2 nm + 4) tMCLK - 20 -- ns tHD;DAT SCL, SDA 3 tMCLK - 20 -- ns Master mode Bus free time between STOP condition and START condition Data hold time Data setup time Setup time between clearing interrupt and SCL rising R = 1.7 k, C = 50 pF*1 SCL, SDA Master mode It is assumed that "L" of SCL is not extended. The minimum value is (-2 + nm/2) tMCLK - 20 (-1 + nm/2) tMCLK + 20 ns applied to the first bit of continuous data. Otherwise, the maximum value is applied. tSU;INT SCL The minimum value is applied to the interrupt at the ninth SCL. (1 + nm/2) tMCLK + 20 ns The maximum value is applied to the interrupt at the eighth SCL. tSU;DAT (nm/2) tMCLK - 20 SCL clock "L" width tLOW SCL 4 tMCLK - 20 -- ns At reception SCL clock "H" width tHIGH SCL 4 tMCLK - 20 -- ns At reception (Continued) 88 DS702-00009-3v0-E MB95630H Series (Continued) Parameter START condition detection STOP condition detection RESTART condition detection condition (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Symbol Pin Condition name tHD;STA SCL, SDA tSU;STO SCL, SDA Value*2 Min Max Unit Remarks -- No START condition is detected when 1 ns tMCLK is used at reception. -- No STOP condition is detected when 1 ns tMCLK is used at reception. 2 tMCLK - 20 -- No RESTART condition is ns detected when 1 tMCLK is used at reception. 2 tMCLK - 20 -- ns At reception 2 tMCLK - 20 2 tMCLK - 20 tSU;STA SCL, SDA Bus free time tBUF SCL, SDA Data hold time tHD;DAT SCL, SDA 2 tMCLK - 20 -- ns At slave transmission mode Data setup time tSU;DAT SCL, SDA tLOW - 3 tMCLK - 20 -- ns At slave transmission mode Data hold time tHD;DAT SCL, SDA 0 -- ns At reception Data setup time tSU;DAT SCL, SDA tMCLK - 20 -- ns At reception SDA SCL (with wakeup function in use) tWAKEUP SCL, SDA Oscillation stabilization wait time +2 tMCLK - 20 -- ns R = 1.7 k, C = 50 pF*1 *1: R represents the pull-up resistor of the SCL and SDA lines, and C the load capacitor of the SCL and SDA lines. *2: * See "(2) Source Clock/Machine Clock" for tMCLK. * m represents the CS[4:3] bits in the I2C clock control register ch. 0 (ICCR0). * n represents the CS[2:0] bits in the I2C clock control register ch. 0 (ICCR0). * The actual timing of the I2C bus interface is determined by the values of m and n set by the machine clock (tMCLK) and the CS[4:0] bits in the ICCR0 register. * Standard-mode: m and n can be set to values in the following range: 0.9 MHz < tMCLK (machine clock) < 16.25 MHz. The usable frequencies of the machine clock are determined by the settings of m and n as shown below. (m, n) = (1, 8) : 0.9 MHz < tMCLK 1 MHz (m, n) = (1, 22), (5, 4), (6, 4), (7, 4), (8, 4) : 0.9 MHz < tMCLK 2 MHz (m, n) = (1, 38), (5, 8), (6, 8), (7, 8), (8, 8) : 0.9 MHz < tMCLK 4 MHz (m, n) = (1, 98), (5, 22), (6, 22), (7, 22) : 0.9 MHz < tMCLK 10 MHz (m, n) = (8, 22) : 0.9 MHz < tMCLK 16.25 MHz * Fast-mode: m and n can be set to values in the following range: 3.3 MHz < tMCLK (machine clock) < 16.25 MHz. The usable frequencies of the machine clock are determined by the settings of m and n as shown below. (m, n) = (1, 8) : 3.3 MHz < tMCLK 4 MHz (m, n) = (1, 22), (5, 4) : 3.3 MHz < tMCLK 8 MHz (m, n) = (1, 38), (6, 4), (7, 4), (8, 4) : 3.3 MHz < tMCLK 10 MHz (m, n) = (5, 8) : 3.3 MHz < tMCLK 16.25 MHz DS702-00009-3v0-E 89 MB95630H Series (9) UART/SIO, Serial I/O Timing (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Pin name Value Condition Unit Min Max 4 tMCLK* -- ns -190 +190 ns 2 tMCLK* -- ns Serial clock cycle time tSCYC UCK0 UCK UO time tSLOV UCK0, UO0 Valid UI UCK tIVSH UCK0, UI0 UCK valid UI hold time tSHIX UCK0, UI0 2 tMCLK* -- ns Serial clock "H" pulse width tSHSL UCK0 4 tMCLK* -- ns Serial clock "L" pulse width tSLSH UCK0 4 tMCLK* -- ns UCK UO time tSLOV UCK0, UO0 -- 190 ns Valid UI UCK tIVSH UCK0, UI0 2 tMCLK* -- ns UCK valid UI hold time tSHIX UCK0, UI0 2 tMCLK* -- ns Internal clock operation External clock operation *: See "(2) Source Clock/Machine Clock" for tMCLK. * Internal shift clock mode tSCYC 0.8 VCC UCK0 0.2 VCC 0.2 VCC tSLOV 0.8 VCC UO0 0.2 VCC tIVSH tSHIX 0.7 VCC 0.7 VCC UI0 0.3 VCC 0.3 VCC * External shift clock mode tSLSH tSHSL 0.8 VCC 0.8 VCC UCK0 0.2 VCC 0.2 VCC tSLOV 0.8 VCC UO0 0.2 VCC tIVSH tSHIX 0.7 VCC 0.7 VCC UI0 0.3 VCC 0.3 VCC 90 DS702-00009-3v0-E MB95630H Series (10) MPG Input Timing (VCC = 5.0 V10%, VSS = 0.0 V, TA = -40C to +85C) Parameter Input pulse width Symbol Pin name Condition tTIWH, tTIWL SNI0 to SNI2, DTTI -- 0.8 VCC Value Min Max 4 tMCLK -- Unit Remarks ns 0.8 VCC SNI0 to SNI2, DTTI 0.2 VCC tTIWH DS702-00009-3v0-E 0.2 VCC tTIWL 91 MB95630H Series (11) Comparator Timing (VCC = 2.4 V to 5.5 V, VSS = 0.0 V, TA = -40C to +85C) Parameter Pin name Value Min Typ Max Unit Remarks Voltage range CMP0_P, CMP0_N 0 -- VCC - 1.3 V Offset voltage CMP0_P, CMP0_N -15 -- +15 mV Delay time CMP0_O -- 650 1200 ns Overdrive 5 mV -- 140 420 ns Overdrive 50 mV Power down delay CMP0_O -- -- 1200 ns Power down recovery PD: 1 0 Power up stabilization time CMP0_O -- -- 1200 ns Output stabilization time at power up 92 DS702-00009-3v0-E MB95630H Series 5. A/D Converter (1) A/D Converter Electrical Characteristics (VCC = 2.7 V to 5.5 V, VSS = 0.0 V, TA = -40C to +85C) Parameter Symbol Value Unit Min Typ Max Resolution -- -- 10 bit Total error -3 -- +3 LSB -2.5 -- +2.5 LSB -1.9 -- +1.9 LSB Linearity error -- Differential linearity error Remarks Zero transition voltage V0T VSS - 1.5 LSB VSS + 0.5 LSB VSS + 2.5 LSB V Full-scale transition voltage VFST VCC - 4.5 LSB VCC - 2 LSB VCC + 0.5 LSB V -- 3 -- 10 s 2.7 V VCC 5.5 V 2.7 V VCC 5.5 V, with external impedance < 3.3 k and external capacitance = 10 pF Compare time Sampling time -- 0.941 -- s Analog input current IAIN -0.3 -- +0.3 A Analog input voltage VAIN VSS -- VCC V DS702-00009-3v0-E 93 MB95630H Series (2) Notes on Using A/D Converter * External impedance of analog input and its sampling time The A/D converter of the MB95630H Series has a sample and hold circuit. If the external impedance is too high to keep sufficient sampling time, the analog voltage charged to the capacitor of the internal sample and hold circuit is insufficient, adversely affecting A/D conversion precision. Therefore, to satisfy the A/D conversion precision standard, considering the relationship between the external impedance and minimum sampling time, either adjust the register value and operating frequency or decrease the external impedance so that the sampling time is longer than the minimum value. In addition, if sufficient sampling time cannot be secured, connect a capacitor of about 0.1 F to the analog input pin. * Analog input equivalent circuit Analog input Comparator R C During sampling: ON VCC R C 4.5 V VCC 5.5 V 1.45 k (Max) 14.89 pF (Max) 2.7 V VCC < 4.5 V 2.7 k (Max) 14.89 pF (Max) Note: The values are reference values. * Relationship between external impedance and minimum sampling time [External impedance = 0 k to 100 k] 100 External impedance [k] 80 60 40 20 0 0 2 4 6 8 10 12 14 16 18 20 Minimum sampling time [s] [External impedance = 0 k to 20 k] External impedance [k] 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Minimum sampling time [s] Note: External capacitance = 10 pF * A/D conversion error As |VCC - VSS| decreases, the A/D conversion error increases proportionately. 94 DS702-00009-3v0-E MB95630H Series (3) Definitions of A/D Converter Terms * Resolution It indicates the level of analog variation that can be distinguished by the A/D converter. When the number of bits is 10, analog voltage can be divided into 210 = 1024. * Linearity error (unit: LSB) It indicates how much an actual conversion value deviates from the straight line connecting the zero transition point ("0000000000" "0000000001") of a device to the full-scale transition point ("1111111111" "1111111110") of the same device. * Differential linear error (unit: LSB) It indicates how much the input voltage required to change the output code by 1 LSB deviates from an ideal value. * Total error (unit: LSB) It indicates the difference between an actual value and a theoretical value. The error can be caused by a zero transition error, a full-scale transition errors, a linearity error, a quantum error, or noise. Ideal I/O characteristics Total error VFST 0x3FF 0x3FF 2 LSB 0x3FD Digital output Digital output 0x004 0x003 Actual conversion characteristic 0x3FE 0x3FE 0x3FD V0T {1 LSB x (N - 1) + 0.5 LSB} 0x004 VNT 0x003 1 LSB 0x002 0x002 0x001 Actual conversion characteristic Ideal characteristic 0x001 0.5 LSB VSS Analog input 1 LSB = VCC VCC - VSS V 1024 N VSS Analog input Total error of digital output N = VCC VNT - {1 LSB x (N - 1) + 0.5 LSB} LSB 1 LSB : A/D converter digital output value VNT : Voltage at which the digital output transits from 0x(N - 1) to 0xN (Continued) DS702-00009-3v0-E 95 MB95630H Series (Continued) Zero transition error Full-scale transition error 0x004 Ideal characteristic Actual conversion characteristic 0x3FF Actual conversion characteristic 0x002 Ideal characteristic Digital output Digital output 0x003 Actual conversion characteristic 0x3FE VFST (measurement value) 0x3FD Actual conversion characteristic 0x001 0x3FC V0T (measurement value) VSS Analog input VCC VSS 0x3FE Ideal characteristic Actual conversion characteristic 0x(N+1) Actual conversion characteristic {1 LSB x N + V0T} VFST Digital output Digital output 0x3FD (measurement value) VNT 0x004 0x002 V(N+1)T 0xN VNT 0x(N-1) Actual conversion characteristic 0x003 VCC Differential linearity error Linearity error 0x3FF Analog input Ideal characteristic Actual conversion characteristic 0x(N-2) 0x001 V0T (measurement value) VSS Analog input VCC Linearity error of digital output N = VSS VCC VNT - {1 LSB x N + V0T} 1 LSB Differential linearity error of digital output N = N Analog input V(N+1)T - VNT - 1 1 LSB : A/D converter digital output value VNT : Voltage at which the digital output transits from 0x(N - 1) to 0xN V0T (ideal value) = VSS + 0.5 LSB [V] VFST (ideal value) = VCC - 2 LSB [V] 96 DS702-00009-3v0-E MB95630H Series 6. Flash Memory Program/Erase Characteristics Parameter Value Unit Remarks 1.6*2 s The time of writing "0x00" prior to erasure is excluded. 0.6*1 3.1*2 s The time of writing "0x00" prior to erasure is excluded. 17 272 s System-level overhead is excluded. Program/erase cycle 100000 -- -- cycle Power supply voltage at program/erase 2.4 -- 5.5 V 20*3 -- -- Average TA = +85C Number of program/erase cycles: 1000 or below 10*3 -- -- Average TA = +85C year Number of program/erase cycles: 1001 to 10000 inclusive 5*3 -- -- Min Typ Max Sector erase time (2 Kbyte sector) -- 0.3*1 Sector erase time (32 Kbyte sector) -- Byte writing time -- Flash memory data retention time Average TA = +85C Number of program/erase cycles: 10001 or above *1: VCC = 5.5 V, TA = +25C, 0 cycle *2: VCC = 2.4 V, TA = +85C, 100000 cycles *3: These values were converted from the result of a technology reliability assessment. (These values were converted from the result of a high temperature accelerated test using the Arrhenius equation with the average temperature being +85C.) DS702-00009-3v0-E 97 MB95630H Series SAMPLE CHARACTERISTICS * Power supply current temperature characteristics ICC - VCC TA = +25C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Main clock mode with the external clock operating ICC - TA VCC = 5.5 V, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Main clock mode with the external clock operating 15 15 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 10 ICC[mA] ICC[mA] 10 5 5 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] ICCS - VCC TA = +25C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Main sleep mode with the external clock operating +150 6 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 5 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 5 4 ICCS[mA] 4 ICCS[mA] +100 ICCS - TA VCC = 5.5 V, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Main sleep mode with the external clock operating 6 3 3 2 2 1 1 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] -50 +100 +150 TA[C] ICCL - VCC TA = +25C, FMPL = 16 kHz (divided by 2) Subclock mode with the external clock operating ICCL - TA VCC = 5.5 V, FMPL = 16 kHz (divided by 2) Subclock mode with the external clock operating 140 140 120 120 100 100 80 80 ICCL[A] ICCL[A] +50 TA[C] 60 60 40 40 20 20 0 0 1 2 3 4 VCC[V] 5 6 7 -50 0 +50 +100 +150 TA[C] (Continued) 98 DS702-00009-3v0-E MB95630H Series ICCLS - VCC TA = +25C, FMPL = 16 kHz (divided by 2) Subsleep mode with the external clock operating ICCLS - TA VCC = 5.5 V, FMPL = 16 kHz (divided by 2) Subsleep mode with the external clock operating 30 20 20 ICCLS[A] ICCLS[A] 30 10 10 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] +100 +150 ICCT - TA VCC = 5.5 V, FMPL = 16 kHz (divided by 2) Watch mode with the external clock operating 20 20 18 18 16 16 14 14 12 12 ICCT[A] ICCT[A] ICCT - VCC TA = +25C, FMPL = 16 kHz (divided by 2) Watch mode with the external clock operating 10 10 8 8 6 6 4 4 2 2 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] +50 +100 +150 TA[C] ICCTS - VCC TA = +25C, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Time-base timer mode with the external clock operating ICCTS - TA VCC = 5.5 V, FMP = 2, 4, 8, 10, 16 MHz (divided by 2) Time-base timer mode with the external clock operating 600 600 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 500 FMP = 16 MHz FMP = 10 MHz FMP = 8 MHz FMP = 4 MHz FMP = 2 MHz 500 400 ICCTS[A] 400 ICCTS[A] +50 TA[C] 300 300 200 200 100 100 0 0 1 2 3 4 VCC[V] 5 6 7 -50 0 +50 +100 +150 TA[C] (Continued) DS702-00009-3v0-E 99 MB95630H Series ICCH - VCC TA = +25C, FMPL = (stop) Substop mode with the external clock stopping ICCH - TA VCC = 5.5 V, FMPL = (stop) Substop mode with the external clock stopping 20 16 16 12 12 ICCH[A] ICCH[A] 20 8 8 4 4 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] ICCMCR - VCC TA = +25C, FMP = 4 MHz (no division) Main CR clock mode +100 +150 ICCMCR - TA VCC = 5.5 V, FMP = 4 MHz (no division) Main CR clock mode 10 10 8 8 6 6 ICCMCR[mA] ICCMCR[mA] +50 TA[C] 4 4 2 2 0 0 1 2 3 4 5 6 -50 7 0 VCC[V] +50 +100 +150 TA[C] 10 10 8 8 6 6 ICCMPLL[mA] ICCMPLL[mA] ICCMPLL - TA ICCMPLL - VCC TA = +25C, FMP = 16 MHz (PLL multiplication rate: 4) VCC = 5.5 V, FMP = 16 MHz (PLL multiplication rate: 4) Main CR PLL clock mode Main CR PLL clock mode 4 2 4 2 0 0 1 2 3 4 VCC[V] 5 6 7 -50 0 +50 +100 +150 TA[C] (Continued) 100 DS702-00009-3v0-E MB95630H Series (Continued) ICCSCR - TA VCC = 5.5 V, FMPL = 50 kHz (divided by 2) Sub-CR clock mode 200 200 150 150 ICCSCR[A] ICCSCR[A] ICCSCR - VCC TA = +25C, FMPL = 50 kHz (divided by 2) Sub-CR clock mode 100 50 100 50 0 0 1 2 3 4 VCC[V] DS702-00009-3v0-E 5 6 7 -50 0 +50 +100 +150 TA[C] 101 MB95630H Series * Input voltage characteristics VIHI - VCC and VILI - VCC TA = +25C VIHS - VCC and VILS - VCC TA = +25C 5 5 VIHI VILI VIHS VILS 4 3 3 VIHI/VILI[V] VIHS/VILS[V] 4 2 1 2 1 0 0 2 3 4 5 6 7 2 3 4 VCC[V] 5 6 7 VCC[V] VIHM - VCC and VILM - VCC TA = +25C 5 VIHM VILM VIHM/VILM[V] 4 3 2 1 0 2 3 4 5 6 7 VCC[V] 102 DS702-00009-3v0-E MB95630H Series * Output voltage characteristics (VCC - VOH2) - IOH TA = +25C 1.4 1.4 1.2 1.2 1.0 1.0 VCC - VOH2[V] VCC - VOH1[V] (VCC - VOH1) - IOH TA = +25C 0.8 0.6 0.8 0.6 0.4 0.4 0.2 0.2 0.0 0.0 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 IOH[mA] IOH[mA] VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.5 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.5 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VOL1 - IOL TA = +25C VOL2 - IOL TA = +25C 1.4 1.0 1.2 0.8 0.6 0.8 VOL2[V] VOL1[V] 1.0 0.6 0.4 0.4 0.2 0.2 0.0 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 IOL[mA] VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.5 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V DS702-00009-3v0-E 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 IOL[mA] VCC = 2.4 V VCC = 2.7 V VCC = 3.0 V VCC = 3.5 V VCC = 4.0 V VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 103 MB95630H Series * Pull-up characteristics RPULL - VCC TA = +25C 200 RPULL[k] 150 100 50 0 1 2 3 4 5 6 VCC[V] 104 DS702-00009-3v0-E MB95630H Series MASK OPTIONS Part number No. MB95F632H MB95F633H MB95F634H MB95F636H Selectable/Fixed MB95F632K MB95F633K MB95F634K MB95F636K Fixed 1 Low-voltage detection reset Without low-voltage detection reset With low-voltage detection reset 2 Reset With dedicated reset input Without dedicated reset input DS702-00009-3v0-E 105 MB95630H Series ORDERING INFORMATION Part number Package MB95F632HPMC-G-SNE2 MB95F632KPMC-G-SNE2 MB95F633HPMC-G-SNE2 MB95F633KPMC-G-SNE2 MB95F634HPMC-G-SNE2 MB95F634KPMC-G-SNE2 MB95F636HPMC-G-SNE2 MB95F636KPMC-G-SNE2 32-pin plastic LQFP (FPT-32P-M30) MB95F632HP-G-SH-SNE2 MB95F632KP-G-SH-SNE2 MB95F633HP-G-SH-SNE2 MB95F633KP-G-SH-SNE2 MB95F634HP-G-SH-SNE2 MB95F634KP-G-SH-SNE2 MB95F636HP-G-SH-SNE2 MB95F636KP-G-SH-SNE2 32-pin plastic SH-DIP (DIP-32P-M06) MB95F632HWQN-G-SNE1 MB95F632KWQN-G-SNE1 MB95F633HWQN-G-SNE1 MB95F633KWQN-G-SNE1 MB95F634HWQN-G-SNE1 MB95F634KWQN-G-SNE1 MB95F636HWQN-G-SNE1 MB95F636KWQN-G-SNE1 32-pin plastic QFN (LCC-32P-M19) 106 DS702-00009-3v0-E MB95630H Series PACKAGE DIMENSION 32-pin plastic LQFP Lead pitch 0.80 mm Package width x package length 7.00 mm x 7.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.60 mm MAX (FPT-32P-M30) 32-pin plastic LQFP (FPT-32P-M30) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 9.000.20(.354.008)SQ +0.05 * 7.000.10(.276.004)SQ 0.13 -0.00 +.002 24 .005 -.000 17 16 25 0.10(.004) Details of "A" part 1.60 MAX (Mounting height) (.063) MAX INDEX 0.25(.010) 9 32 0~7 1 0.80(.031) 0.35 .014 C "A" 8 +0.08 -0.03 +.003 -.001 0.20(.008) 0.600.15 (.024.006) 0.100.05 (.004.002) M 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F32051S-c-1-2 Dimensions in mm (inches). Note: The values in parentheses are reference values. Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ (Continued) DS702-00009-3v0-E 107 MB95630H Series 32-pin plastic SDIP Lead pitch 1.778 mm Low space 10.16 mm Sealing method Plastic mold (DIP-32P-M06) 32-pin plastic SDIP (DIP-32P-M06) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. +0.20 *28.00 -0.30 1.102 +.008 -.012 INDEX *8.890.25 (.350.010) 1.02 +0.30 -0.20 +.012 .040 -.008 +0.70 4.70 -0.20 0.51(.020) MIN. +.028 .185 -.008 3.30 +0.20 -0.30 +.008 .130 -.012 +0.03 0.27 -0.07 +.001 .011 -.003 1.27(.050) MAX. C 1.778(.070) 2003-2010 FUJITSU SEMICONDUCTOR LIMITED D32018S-c-1-3 10.16(.400) +0.08 0.48 -0.12 .019 +.003 -.005 0.25(.010) M 0~15 Dimensions in mm (inches). Note: The values in parentheses are reference values (Continued) 108 DS702-00009-3v0-E MB95630H Series (Continued) 32-pin plastic QFN Lead pitch 0.50 mm Package width x package length 5.00 mm x 5.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX Weight 0.06 g (LCC-32P-M19) 32-pin plastic QFN (LCC-32P-M19) 3.500.10 (.138.004) 5.000.10 (.197.004) 5.000.10 (.197.004) 3.500.10 (.138.004) INDEX AREA 0.25 (.010 (3-R0.20) ((3-R.008)) 0.50(.020) +0.05 -0.07 +.002 -.003 ) 0.400.05 (.016.002) 1PIN CORNER (C0.30(C.012)) (TYP) 0.750.05 (.030.002) 0.02 (.001 C +0.03 -0.02 +.001 -.001 (0.20(.008)) ) 2009-2010 FUJITSU SEMICONDUCTOR LIMITED C32071S-c-1-2 Dimensions in mm (inches). Note: The values in parentheses are reference values. Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ DS702-00009-3v0-E 109 MB95630H Series MAJOR CHANGES IN THIS EDITION A change on a page is indicated by a vertical line drawn on the left side of that page. Page Section Details 22 PIN CONNECTION * C pin 66 ELECTRICAL CHARACTERISTICS Corrected the following statement in remark *2. 2. Recommended Operating Conditions The bypass capacitor for the VCC pin must have a capacitance larger than CS. The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. 71 4. AC Characteristics (1) Clock Timing 110 Corrected the following statement. The bypass capacitor for the VCC pin must have a capacitance larger than CS. The decoupling capacitor for the VCC pin must have a capacitance equal to or larger than the capacitance of CS. Corrected the pin names of the parameter "Input clock rising time and falling time". X0 X0, X0A X0, X1 X0, X1, X0A, X1A DS702-00009-3v0-E MB95630H Series MEMO DS702-00009-3v0-E 111 MB95630H Series FUJITSU SEMICONDUCTOR LIMITED Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome, Kohoku-ku Yokohama Kanagawa 222-0033, Japan Tel: +81-45-415-5858 http://jp.fujitsu.com/fsl/en/ For further information please contact: North and South America FUJITSU SEMICONDUCTOR AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://us.fujitsu.com/micro/ Asia Pacific FUJITSU SEMICONDUCTOR ASIA PTE. LTD. 151 Lorong Chuan, #05-08 New Tech Park 556741 Singapore Tel : +65-6281-0770 Fax : +65-6281-0220 http://sg.fujitsu.com/semiconductor/ Europe FUJITSU SEMICONDUCTOR EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/semiconductor/ FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD. 30F, Kerry Parkside, 1155 Fang Dian Road, Pudong District, Shanghai 201204, China Tel : +86-21-6146-3688 Fax : +86-21-6146-3660 http://cn.fujitsu.com/fss/ Korea FUJITSU SEMICONDUCTOR KOREA LTD. 902 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fujitsu.com/kr/fsk/ FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD. 2/F, Green 18 Building, Hong Kong Science Park, Shatin, N.T., Hong Kong Tel : +852-2736-3232 Fax : +852-2314-4207 http://cn.fujitsu.com/fsp/ All Rights Reserved. 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Edited: Sales Promotion Department Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Spansion Inc.: MB95F632HP-G-SH-SNE2 MB95F634KWQN-G-SNE1 MB95F636HPMC-G-SNE2 MB95F636HP-G-SH-SNE2 MB95F633KP-G-SH-SNE2 MB95F632KP-G-SH-SNE2 MB95F634HPMC-G-SNE2 MB95F634KPMC-G-SNE2 MB95F632KWQN-G-SNE1 MB95F634HP-G-SH-SNE2 MB95F633HWQN-G-SNE1 MB95F633KPMC-G-SNE2 MB95F636KPMC-G-SNE2 MB95F632HWQN-G-SNE1 MB95F632HPMC-G-SNE2 MB95F633HP-G-SH-SNE2 MB95F633HPMC-G-SNE2 MB95F634KP-G-SH-SNE2 MB95F634HWQN-G-SNE1 MB95F632KPMC-G-SNE2 MB95F636KP-G-SH-SNE2 MB95F633KWQN-G-SNE1 MB95F636HWQN-G-SNE1