Precautions when handling our products
Cautions regarding this document
DSGD.
CHKD.
APPD. DOCUMENT No.
SYMB.
APPD.
CHKD.
DSGD.
( 1/19 )
DATASHEET
~ Revision 01 ~
1) For the export of products which are controlled items subject to foreign and domestic export laws
and regulations, you must obtain approval and/or follow the formalities of such laws and regulations.
2) Products must not be used for military and/or antisocial purposes such as terrorism, and shall not
be supplied to any party intending to use the products for such purposes.
3) Unless provided for otherwise, the products have been designed and manufactured for
application in equipment and devices which are sold to end users in the market, including audio-
visual (AV) equipment, electrical home appliances, office machines, information and communication
equipment, and amusement equipment. The products are not intended for use in, and must not be
used for, any application for nuclear equipment, driving equipment for aerospace or any other
unauthorized use.
With the exception of the abovementioned prohibited applications, please contact an Alps sales
representative and/or evaluate the total system regarding applicability for applications involving high
levels of safety and liability such as medical equipment, burglar alarm equipment, disaster
prevention equipment and undersea equipment. Please also incorporate fail-safe design, protection
and redundant circuitry, malfunction protection, and/or fire protection into the complete system to
ensure safety and reliability of the total system.
4) Before using products which were not specifically designed for use in automotive applications,
please contact an Alps sales representative.
1) The specifications herein are an overview of the specifications. Obtain official specifications
before use.
2) The external appearance, functions and other specifications herein may be discontinued without
prior notice.
DATASHEET
HGARAP001A
ALPS P/N: HGARAP001A
2015-08-21
DATE
K.SEJIMO
SBD GA-080
Y
.SUD
A
2015-08-21
T.NAKAMUR
A
2015-08-21
ALPS ELECTRIC CO.
,
LTD
.
( 2/19 )
List of Contents
1Product Description
製品説明
3
1.1 Overview
概要
3
1.2 Target Appliations
ターゲットアプリケーション
3
2Functional Description
機能説明
4
2.1 Pin Configuration
ピン配置
4
2.2 Pin Description
ピン機能
4
3Specifications
仕様
5
3.1 Absolute Maximum Ratings
絶対最大定格
5
3.2 Operating Conditions
動作条件
5
3.3 Basic Characteristics
基本特性
6
3.4 Electric Characteristics
電気特性
6
4Packa
g
e Information
パッケージ情報
10
4.1 Appearance
外観
10
4.2 Package Outline
外形図
10
4.3 Footprint
フットプリント
11
4.4 Package Marking
捺印
11
4.5 Structure
構造
12
5Packin
g
Specifications
梱包仕様
13
5.1 Packing Information
梱包情報
13
5.2 Packing Specifications
梱包仕様
14
6Reliabilit
y
Test Conditions
信頼性試験条件
16
6.1 Preconditioning for Reliability Test
信頼性試験の前処理
16
6.2 Reliability Test Items
信頼性試験項目
16
7Precautions When Handlin
g
Ma
g
netic Sensor
製品お取り扱い時の注意
17
7.1 Storage Environment
保管環境
17
7.2 Long-term Storage
長期保管
17
7.3 ESD
静電気ESD
17
7.4 External Magnetic Field
外乱磁場
17
Appendix
A1 List of Figures
図のリスト
18
A2 List of Tables
表のリスト
18
A3 Revision History
改定履歴
19
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
( 3/19 )
1Product Description
製品説明
1.1 Overview
概要
ALPS Product No. HGARAP001A
Characteristic Angle Sensor
Package type MSOP-8pin
Supply Voltage max. 5.5V
Operating Magnetic Field 20 ~ 60 mT
Operating Temperature -40 ~ 105 deg.C
Interface Analog Output
Figure 1-1 Image of HGARAP001A in the MSOP-8pin Package
1.2 Target Appliations
ターゲットアプリケーション
Automotive
Industrial
Building Automation
Office Automation
Home Appliance
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
( 4/19 )
2Functional Description
機能説明
2.1 Pin Configuration
ピン配置
Figure 2-1 Pin Configuration
2.2 Pin Description
ピン機能
Table 2-1 Pin Description
[note]
Pin 2 and pin 6(VDD) must be connected on external circuit. Disconnected internally.
Pin 4 and pin 8(GND) must be connected on external circuit. Disconnected internally.
pin-2とpin-6, 及び pin-4とpin-8はPKG外部で接続してお使い下さい。（内部ではつながっておりません）
SBD GA-080
VDD 7 -sin out
3 +sin out 6
2
VDD
Pin No.
DATASHEET
ALPS P/N: HGARAP001A
-cos out 8
4 GND 5 +cos out
GND
Function Pin No. Function
1
14
5
8
( 5/19 )
3Specifications
仕様
3.1 Absolute Maximum Ratings
絶対最大定格
Table 3-1 Absolute Maximum Rating Parameters
[note]
3.2 Operating Conditions
動作条件
Table 3-2 Operating Conditions
* the applied horizontal magnetic field rotated above the sensor
Magnetic Field Strength Hext* 20 - 60 mT
16 - 48 kA/m
Parameter Symbol
Even if it is use within the maximum rating, continuous use on a high stress (high temperature and high
superimposed voltage/large current drive, etc.) might spoil the product reliability.
最大定格内の使用であっても高負荷（高温および高電圧印加／大電流駆動etc.での連続使用は製品の信頼性を低下させる恐れがあ
ります。
SBD GA-080
Max.
The maximum rating is the value that must not be exceeded it even if it is momentary. There is a possibility of
the breakdown and/or destruction when this value is exceeded.
Magnetic Field Strength
最大定格とは、たとえ瞬間的であっても超えてはならない値であり、この値を超えた場合、故障・破壊の可能性があります。
deg.C
Note
Min. Typ.
Values Unit
Note
Operating Temperature Top -40 - 105
Storage Temperature Tstg
VDD -
Hext - - 200 mT
-5.5V
at Room Temp.
- - 160 kA/m
-40 -
Supply Voltage
DATASHEET
ALPS P/N: HGARAP001A
Min. Typ. Max.
Parameter Symbol Values Unit
105 deg.C
( 6/19 )
3.3 Basic Characteristics
基本特性
Table 3-3 Basic Characteristics
3.4 Electric Characteristics
電気特性
Table 3-4 Electric Characteristics @25deg.C
[note]
SBD GA-080
(6)
Unless otherwise specified, measurement condition is as follows.
VDD=5V, Hext=30mT, Top=25deg.C on the circuit described in Figure3-1
特に注記ない限り、測定条件は下記の通り
測定回路(Figure3-1), VDD=5V, Hext=30mT, Top=25deg.C .
Waveform Distortion Wd -
--1.0Angular Accuracy ∆α deg.
mV (5)
(3)
Phase Difference Pdiff 87.5 90 92.5 deg.
Center Voltage Vcenter 2.45 2.5 2.55
(4)
Peak to Peak Voltage Vpeak 490 550 610 mVp-p
V(2)
3.5 3.85 kOhm at Room Temp.
Bridge Resistance Rtotal 1.575 1.75 1.925 kOhm
Temperature Coefficient
of Bridge Resistance TcR - - 1600
ppm/deg.C
Parameter Symbol Values
-7
Unit Note
Typ. Max.
Tc⊿R -3900 - -
ppm/deg.C
at Room Temp.
-40 ~105deg.C
-40 ~105deg.C
Symbol Values Unit Note
DATASHEET
ALPS P/N: HGARAP001A
Min.
Rel 3.15
Min. Typ. Max.
Temperature Coefficient
of Change Rate of
Magnetoresistance
Offset Voltage Voffset -12.5 0 12.5 mV
Parameter
(1)
Each Element
Resistance
( 7/19 )
Definition of Parameter ﾊﾟﾗﾒｰﾀの定義
(1) Voffset =
* The same calculation is applied to “+cos out” and “-cos out”.
(2) Vcenter =
* The same calculation is applied to “-sin out”,“+cos out” and “-cos out”.
(3) Vpeak = (+sin out.max.) - (+sin out.min.) + (-sin out.max.) - (-sin out.min.)
* The same calculation is applied to “cos out”.
* Vpeak ratio is defined as ratio of Vpeak_sin and Vpeak_cos.
(4) Pdiff = SinPhase - CosPhase
* SinPhase: Phase of Vsin
* CosPhase: Phase of Vcos
* Vsin and Vcos are ideal curve.
(5) Wd ＝ Max. | Vmeas – Videal |
* Vmeas: measured value
* Videal: ideal curve
(6) ∆α:= Max.| αmeas – αideal |
* αmeas ： caluculated angle from measured value
* αideal: ideal angle caluculated from Vsin and Vcos
* Vsin and Vcos are ideal curve.
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
2
.)minsin(.)maxsin(
2
.)minsin(.)maxsin(outoutoutout
−
+
−
−
+++
2
.)minsin(.)maxsin(outout
+
+
+
( 8/19 )
+ Direction
- Direction
Figure 3-1 Evaluation Circuit and Definition of Magnetic Field Direction
Figure 3-2 Equivalent Circuit
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
GN
D
VDD
0deg.
VDD
( 9/19 )
a) Definition of Vsin
b) Definition of Vcos
c) Definition of Pdiff
Figure 3-3 Definition of Vsin, Vcos, and Pdiff
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
-0.6
-0.4
-0.2
-1E-15
0.2
0.4
0.6
2.35
2.4
2.45
2.5
2.55
2.6
2.65
0
45
90
135
180
225
270
315
360
Vsin [V]
Output Voltage [V]
Rotation Angle [deg.]
+sin -sin Vsin
-0.6
-0.4
-0.2
-1E-15
0.2
0.4
0.6
2.35
2.4
2.45
2.5
2.55
2.6
2.65
0
45
90
135
180
225
270
315
360
Vcos [V]
Output Voltage [V]
Rotation Angle [deg.]
+cos -cos Vcos
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0
45
90
135
180
225
270
315
360
Vsin, Vcos [V]
Rotation Angle [deg.]
Vsin Vcos
Pdiff
( 10/19 )
4Packa
g
e Information
パッケージ情報
4.1 Appearance
外観
各部の仕上げは良好で機能上有害な錆、傷、割れが有ってはならない。
4.2 Package Outline
外形図
Figure 4-1 Package Outline (All dimensions in mm)
The sensor shall be in good appearance, and have no functional failure or excessive damage such
as rust, cracks, and split in any part.
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
Center of Sensitivity
(0.46)
Center of Sensitivity
1.475±0.2
1.4 ±0.2
( 11/19 )
4.3 Footprint
フットプリント
Figure 4-2 Recommended Footprint (Reference)
4.4 Package Marking
捺印
①②③④⑤: Wafer No.
⑥: Product ID
Figure 4-3 Marking of HGARAP001A
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
Combination of numbers, 1 to 9, and
alphabets, A to Z.
”Y" for HGARAP001A
( 12/19 )
4.4 Structure
構造
Figure 4-4 Internal Structure
Table 4-1 Components
DATASHEET
SBD GA-080
Au
Molding Mold Resin Epoxy Resin
ALPS P/N: HGARAP001A
Si
Process Parts Name Materials
Lead Frame Cu, Ag-Plating
Wire Bonding Wire
Die Mount
Sensor Chip
Adhesive for Die Bonding Silver Paste
Terminal Plating Outer Terminal Plating Sn-Bi
Wire
Lead Frame
Adhesive
Senso
r
Chi
p
Mold Resin
Outer Terminal Platin
g
( 13/19 )
5Packin
g
Specifications
梱包仕様
5.1 Packing Information
梱包情報
Figure 5-1 Emboss Tape Dimensions
Figure 5-2 Reel Dimensions
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
Table Side Cross Section
Enlarged Picture
of Center Part
( 14/19 )
5.2 Packing Specifications
梱包仕様
Figure 5-3 Orientation of Product Storing
Figure 5-4 Feeding Direction
Figure 5-5 Taping Specification
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
Emboss Tape
Product
Feeding Direction
Bar Code Label
Feeding Direction
160～200mm 160～200mm 600～800mm
3,000PCS
( 15/19 )
Peel strength of cover tape shall be 0.1N(10g)～0.7N(70g) for 300mm/min.
エンボステープとトップカバーテープの剥離強度は、300mm/min において、0.1N(10g)～0.7N(70g)とする。
Figure 5-6 Peel Strength
A = MAX 1/2φB = MAX 0.5mm
Figure 5-7 Top cover Tape Offset
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
Theembosstapeisfixed.
Emboss ta
p
e Emboss ta
p
e
To
p
cover ta
p
e
φ
( 16/19 )
6Reliabilit
y
Test Conditions
信頼性試験条件
6.1 Preconditioning for Reliability Test
信頼性試験の前処理
Baking 【125℃×24Hr】 ＋ Moisture Absorption【85±5℃85±5%×168Hr】 + Reflow 2times
Figure 6-1 Reflow Profile for Pre-Conditioning
6.2 Reliability Test Items
信頼性試験項目
Table 6-1 Package Reliability Test Items
Thermal Cycle Applied
Low Temp.
Storage N/A
High Temp. High
Humidity Bias
-40±5deg.C
+85±5deg.C, 85±5%RH, VDD=5±0.5V Bias
+125±5degC, VDD=5±0.5V Bias
1cycle: -40±3degC(30min)→+125±3degC(30min)
±350V, 150pF, 330Ω, interval 10sec.ESD N/A
3 times
per each
terminal
Pre-
Conditioning
Applied
Testing Time
500Hr
500Hr
500Hr
300cycle
High Temp. Bias Applied
SBD GA-080
DATASHEET
ALPS P/N: HGARAP001A
Test Items Testing Methods / Conditions
60～180s
150℃
200℃
60～150s
220℃
260℃max
time (s)
Temperature
Heating
Pre-Heat
( 17/19 )
7Precautions When Handlin
g
Ma
g
netic Sensor
製品お取り扱い時の注意
7.1 Storage Environment
保管環境
7.2 Long-term Storage
長期保管
7.3 ESD
静電気ESD
7.4 External Magnetic Field
外乱磁場
Figure 7-1 Influence on Detection Angle by External Magnetic Field
Long-term storage may result in poor lead solder ability and degraded electrical performance even
under proper conditions. For those part that stored more than 1 year, solder ability should be
checked before use. For storage longer than 1 year, it is recommended to store in nitrogen
atmosphere. Oxygen in atmosphere oxidant leads of products and lead solder ability get worse.
適切な保管環境でも長期に保管した場合は、リ－ド端子の半田付け性が悪くなったり、電気特性が不良になる場合が
ありますので、長期保管した場合は、半田付け性や電気特性をご確認の上、ご使用下さい。保管が長期（1年以上）に
及ぶ場合は、窒素雰囲気中での保管をお勧めします。大気中で保管されますと、大気中の酸素により素子のリ－ド部
分が酸化され、リ－ド端子の半田付け性が悪くなります。
This products does NOT have built in ESD protect circuit, so it may break if over ESD applied to this
circuit. Please take measure for ESD when handle the products. Conducted container is
recommended for product conveyance and packing instead of plastic container. Please connect
ground line and use non high voltage leakage, when using soldering iron or external measurement
circuit.
本製品は静電気保護回路を内蔵していません。その能力を超える静電気が加わった場合には破壊されることがありま
すので、製品を取り扱う場合には充分な静電気対策を実施してください。包装・運搬容器はプラスチック製を極力避け、
導電容器をご使用ください。また製品のハンドリングについても充分に考慮してください。（リストストラップの使用等）は
んだごてや測定回路などは高電圧リークのないものを、必ずアースを取ってご使用ください。
This sensor has detects the direction of the magnetic field that the installed magnet on the
measurement device makes. Therefore, please note that an external magnetic field in the system
environment influences the angle detection of the sensor. (see Figure 7-1)
本製品は、被測定物に取付けた磁石が作る磁界の方向を検出しています。従って、使用環境における外部磁界が、セ
ンサの角度検出に影響を及ぼしますので、ご注意下さい。(Figure 7-1参照)
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
Products should be stored at an appropriate temperature and humidity (Recommended storage
condition). Keep products away from chlorine and corrosive gas. There is a thing that influences
product features when keeping it in an improper environment.
適切な温度・湿度環境（推奨保管条件）で保管していただけるようお願いします。また、塩素や腐食性のあるガスも避け
るようお願いします。不適切な環境で保管した場合は、製品特性に影響する事があります。
Magnetic field with magnet
installed on measurement device:v
External magnetic field:u
Direction of magnetic field
that sensor detects:w
Angle error：θ
( 18/19 )
Appendix
A1 List of Figures
図のリスト
Figure 1-1 Image of HGARAP001A in the MSOP-8pin Package 3
Figure 2-1 Pin Configuration 4
Figure 3-1 Evaluation Circuit and Definition of Magnetic Field Direction 8
Figure 3-2 Equivalent Circuit 8
Figure 3-3 Definition of Vsin, Vcos, and Pdiff 9
Figure 4-1 Package Outline (All dimensions in mm) 10
Figure 4-2 Recommended Footprint (Reference) 11
Figure 4-3 Marking of HGARAP001A 11
Figure 4-4 Internal Structure 12
Figure 5-1 Emboss Tape Dimensions 13
Figure 5-2 Reel Dimensions 13
Figure 5-3 Orientation of Product Storing 14
Figure 5-4 Feeding Direction 14
Figure 5-5 Taping Specification 14
Figure 5-6 Peel Strength 15
Figure 5-7 Top cover Tape Offset 15
Figure 6-1 Reflow Profile for Pre-Conditioning 16
Figure 7-1 Influence on Detection Angle by External Magnetic Field 17
A2 List of Tables
表のリスト
Table 2-1 Pin Description 4
Table 3-1 Absolute Maximum Rating Parameters 5
Table 3-2 Operating Conditions 5
Table 3-3 Basic Characteristics 6
Table 3-4 Electric Characteristics @25deg.C 6
Table 4-1 Components 12
Table 6-1 Package Reliability Test Items 16
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
( 19/19 )
Appendix
A3 Document Revision History
改定履歴
Description
First release
DATASHEET
ALPS P/N: HGARAP001A
SBD GA-080
Revision Date
Aug.21, 201501
