TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS FEATURES * * * * * * DESCRIPTION Fully Specified for 3.3-V and 5-V Operation Wide Power Supply Compatibility 2.5 V - 5.5 V Output Power for RL = 8 - 700 mW at VDD = 5 V - 250 mW at VDD = 3.3 V Integrated Depop Circuitry Thermal and Short-Circuit Protection Surface-Mount Packaging - SOIC - PowerPADTM MSOP The TPA741 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA741 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 A during shutdown. The TPA741 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPADTM MSOP, which reduces board space by 50% and height by 40%. D OR DGN PACKAGE (TOP VIEW) SHUTDOWN BYPASS IN+ IN- 1 8 2 7 3 6 4 5 VO- GND VDD VO+ VDD 6 VDD RF VDD/2 Audio Input RI CI 4 IN- 3 IN+ 2 BYPASS CS - VO+ 5 + CB - VO- 8 + 700 mW 7 GND From System Control 1 SHUTDOWN Bias Control Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2004, Texas Instruments Incorporated TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICES TA -40C to 85C (1) (2) MSOP (2) (DGN) MSOP SYMBOLIZATION (D) TPA741D TPA741DGN AJD SMALL OUTLINE (1) In the D package, the maximum output power is thermally limited to 350 mW; 700-mW peaks can be driven, as long as the RMS value is less than 350 mW. The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA741DR). Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-F to 2.2-F capacitor when used as an audio amplifier. BYPASS 2 GND 7 IN- 4 I IN- is the inverting input. IN- is typically used as the audio input terminal. IN+ 3 I IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal for SE operations. SHUTDOWN 1 I SHUTDOWN places the entire device in shutdown mode when held high. VDD 6 VO+ 5 O VO+ is the positive BTL output. VO- 8 O VO- is the negative BTL output. GND is the ground connection. VDD is the supply voltage terminal. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT VDD Supply voltage VI Input voltage 6v -0.3 V to VDD +0.3 V Continuous total power dissipation Internally limited (see Dissipation Rating Table) TA Operating free-air temperature range -40C to 85C TJ Operating junction temperature range -40C to 150C Tstg Storage temperature range -65C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds (1) 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE (1) 2 TA 25C DERATING FACTOR TA = 70C TA = 85C D 725 mW 5.8 mW/C 464 mW 377 mW DGN 2.14 W (1) 17.1 mW/C 1.37 W 1.11 W See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD of that document. TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 RECOMMENDED OPERATING CONDITIONS VDD Supply voltage, VIH High-level voltage (SHUTDOWN) VIL Low-level voltage (SHUTDOWN) TA Operating free-air temperature MIN MAX 2.5 5.5 UNIT V 0.9VDD V 0.1VDD V 85 C MAX UNIT -40 ELECTRICAL CHARACTERISTICS at specified free-air temperature, VDD = 3.3 V, TA = 25C (unless otherwise noted) PARAMETER TEST CONDITIONS |VOS| Output offset voltage (measured differentially) SHUTDOWN = 0 V, RL = 8 , RF = 10 k PSRR Power supply rejection ratio VDD = 3.2 V to 3.4 V IDD Supply current SHUTDOWN = 0 V, RF = 10 k IDD(SD) Supply current, shutdown mode (see Figure 6) SHUTDOWN = VDD, RF = 10 k MIN TYP 20 mV 1.35 2.5 mA 7 50 A 85 dB |IIH| SHUTDOWN, VDD = 3.3 V, Vi = 3.3 V 1 A |IIL| SHUTDOWN, VDD = 3.3 V, Vi = 0 V 1 A OPERATING CONDITIONS VDD = 3.3 V, TA = 25C, RL = 8 PARAMETER See (1) TEST CONDITIONS MIN TYP MAX UNIT 250 mW PO Output power, THD = 0.5%, See Figure 9 THD + N Total harmonic distortion plus noise PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 7 BOM Maximum output power bandwidth AV = -2 V/V, THD = 2%, See Figure 7 20 kHz B1 Unity-gain bandwidth Open loop, See Figure 15 1.4 MHz kSVR Supply ripple rejection ratio f = 1 kHz, CB = 1 F, See Figure 2 79 dB Vn Noise output voltage AV = -1 V/V, CB = 0.1 F, See Figure 19 17 V(rms) (1) 0.55% Output power is measured at the output terminals of the device at f = 1 kHz. ELECTRICAL CHARACTERISTICS at specified free-air temperature, VDD = 5 V, TA = 25C (unless otherwise noted) PARAMETER |VOS| TEST CONDITIONS MIN TYP Output offset voltage (measured differentially) SHUTDOWN = 0 V, RL = 8 , RF = 10 k MAX UNIT 20 mV PSRR Power supply rejection ratio VDD = 4.9 V to 5.1 V IDD Supply current SHUTDOWN = 0 V, RF = 10 k 1.45 78 2.5 mA dB IDD(SD) Supply current, shutdown mode (see Figure 4) SHUTDOWN = VDD, RF = 10 k 50 100 A |IIH| SHUTDOWN, VDD = 5.5 V, Vi = VDD 1 A |IIL| SHUTDOWN, VDD = 5.5 V, Vi = 0 V 1 A 3 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 OPERATING CHARACTERISTICS VDD = 5 V, TA = 25C, RL = 8 PARAMETER TEST CONDITIONS MIN TYP MAX 700 (1) Output power THD = 0.5%, THD + N Total harmonic distortion plus noise PO = 250 mW, f = 200 Hz to 4 kHz, See Figure 11 BOM Maximum output power bandwidth AV = -2 V/V, THD = 2%, See Figure 11 20 kHz B1 Unity-gain bandwidth Open loop, See Figure 16 1.4 MHz kSVR Supply ripple rejection ratio f = 1 kHz, CB = 1 F, See Figure 2 80 dB Vn Noise output voltage AV = -1 V/V, CB = 0.1 F, See Figure 20 17 V(rms) (1) See Figure 13 UNIT PO mW 0.5% The DGN package, properly mounted, can conduct 700-mW RMS power continuously. The D package can only conduct 350-mW RMS power continuously with peaks to 700 mW. PARAMETER MEASUREMENT INFORMATION VDD 6 RF VDD/2 Audio Input RI CI 4 IN- 3 IN+ 2 BYPASS - VO+ 5 + RL = 8 CB - VO- 8 + 7 GND 1 SHUTDOWN Bias Control Figure 1. BTL Mode Test Circuit 4 VDD CS TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 TYPICAL CHARACTERISTICS Table of Graphs FIGURE kSVR Supply ripple rejection ratio vs Frequency IDD Supply current vs Supply voltage 3, 4 PO Output power vs Supply voltage 5 THD+N 2 vs Load resistance Total harmonic distortion plus noise 6 vs Frequency 7, 8, 11, 12 vs Output power 9, 10, 13, 14 Open-loop gain and phase vs Frequency 15, 16 Closed-loop gain and phase vs Frequency 17, 18 Vn Output noise voltage vs Frequency 19, 20 PD Power dissipation vs Output power 21, 22 SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY SUPPLY CURRENT vs SUPPLY VOLTAGE -10 1.8 RL = 8 CB = 1 F SHUTDOWN = 0 V RF = 10 k 1.6 -20 I DD - Supply Current - mA k SVR - Supply Ripple Rejection Ratio - dB 0 -30 -40 -50 -60 -70 -80 VDD = 3.3 V -100 20 100 1k f - Frequency - Hz Figure 2. 1.2 1 0.8 VDD = 5 V -90 1.4 10k 20k 0.6 2.5 3 3.5 4 4.5 5 5.5 VDD - Supply Voltage - V Figure 3. 5 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 SUPPLY CURRENT vs SUPPLY VOLTAGE OUTPUT POWER vs SUPPLY VOLTAGE 90 1000 SHUTDOWN = VDD RF = 10 k 80 THD+N 1% f = 1 kHz 800 PO - Output Power - mW I DD - Supply Current - A 70 60 50 40 30 20 600 RL = 8 RL = 32 400 200 10 0 2.5 3 3.5 4 4.5 5 0 2.5 5.5 3 3.5 VDD - Supply Voltage - V 5 5.5 Figure 5. OUTPUT POWER vs LOAD RESISTANCE TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 THD+N -Total Harmonic Distortion + Noise - % THD+N = 1% f = 1 kHz 700 PO - Output Power - mW 4.5 Figure 4. 800 600 VDD = 5 V 500 400 300 VDD = 3.3 V 200 100 0 8 16 24 32 40 48 RL - Load Resistance - Figure 6. 6 4 VDD - Supply Voltage - V 56 64 VDD = 3.3 V PO = 250 mW RL = 8 AV = -20 V/V 1 AV = -10 V/V AV = -2 V/V 0.1 0.01 20 100 1k f - Frequency - Hz Figure 7. 10k 20k TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 THD+N -Total Harmonic Distortion + Noise - % THD+N -Total Harmonic Distortion + Noise - % 10 VDD = 3.3 V RL = 8 AV = -2 V/V PO = 50 mW 1 0.1 PO = 125 mW PO = 250 mW 0.01 20 10k 0.1 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 f - Frequency - Hz PO - Output Power - W Figure 8. Figure 9. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 0.4 10 THD+N -Total Harmonic Distortion + Noise - % THD+N -Total Harmonic Distortion + Noise - % RL = 8 20k f = 20 kHz f = 10 kHz f = 1 kHz 0.1 f = 20 Hz 0.01 0.01 1 0.01 1k 100 10 1 VDD = 3.3 V f = 1 kHz AV = -2 V/V VDD = 3.3 V RL = 8 CB = 1 F AV = -2 V/V 0.1 PO - Output Power - W Figure 10. 1 VDD = 5 V PO = 700 mW RL = 8 AV = -20 V/V 1 AV = -10 V/V AV =- 2 V/V 0.1 0.01 20 100 1k 10k 20k f - Frequency - Hz Figure 11. 7 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 PO = 50 mW 1 PO = 700 mW 0.1 PO = 350 mW 0.01 20 1k 100 10k VDD = 5 V f = 1 kHz AV = -2 V/V 1 RL = 8 0.1 0.01 0.1 20k 0.2 f - Frequency - Hz 0.5 0.6 Figure 13. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER OPEN-LOOP GAIN AND PHASE vs FREQUENCY 180 VDD = 3.3 V RL = Open Open-Loop Gain - dB f = 20 kHz 1 f = 10 kHz f = 1 kHz f = 20 Hz 140 Phase 100 50 60 40 20 30 Gain 20 -20 10 -60 0 -100 VDD = 5 V RL = 8 CB = 1 F AV = -2 V/V -10 -140 -20 -30 -180 1 0.1 1 101 102 f - Frequency - kHz PO - Output Power - W Figure 14. 8 1 0.9 80 60 0.01 0.01 0.8 Figure 12. 70 0.1 0.7 PO - Output Power - W 10 THD+N -Total Harmonic Distortion + Noise - % 0.4 0.3 Phase VDD = 5 V RL = 8 AV = -2 V/V THD+N -Total Harmonic Distortion + Noise - % THD+N -Total Harmonic Distortion + Noise - % 10 Figure 15. 103 104 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 OPEN-LOOP GAIN AND PHASE vs FREQUENCY CLOSED-LOOP GAIN AND PHASE vs FREQUENCY 1 180 VDD = 5 V RL = Open 70 140 60 40 20 30 Gain -20 10 Phase Open-Loop Gain - dB 50 -60 Closed-Loop Gain - dB 100 Phase 170 0.5 60 20 180 Phase 0.75 0.25 0 160 Gain -0.25 150 -0.5 -0.75 140 -1 -1.25 0 -100 -1.5 -140 -1.75 -10 -20 -30 1 101 102 103 VDD = 3.3 V RL = 8 PO = 250 mW -2 101 -180 104 Phase 80 130 120 102 103 104 105 106 f - Frequency - Hz f - Frequency - kHz Figure 16. Figure 17. CLOSED-LOOP GAIN AND PHASE vs FREQUENCY OUTPUT NOISE VOLTAGE vs FREQUENCY 1 180 100 Phase 0.75 160 Gain 150 -0.5 -0.75 140 -1 -1.25 -1.5 -1.75 -2 101 VDD = 5 V RL = 8 PO = 700 mW 102 130 103 104 f - Frequency - Hz 105 Phase Closed-Loop Gain - dB 0 -0.25 Vn - Output Noise Voltage - V 170 0.5 0.25 VDD = 3.3 V BW = 22 Hz to 22 kHz RL = 8 or 32 AV = -1 V/V VO BTL Vo+ 10 120 106 1 20 100 1k 10k 20k f - Frequency - Hz Figure 18. Figure 19. 9 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 OUTPUT NOISE VOLTAGE vs FREQUENCY 350 VDD = 5 V BW = 22 Hz to 22 kHz RL = 8 or 32 AV = -1 V/V VDD = 3.3 V RL = 8 300 PD - Power Dissipation - mW Vn - Output Noise Voltage - V 100 POWER DISSIPATION vs OUTPUT POWER VO BTL Vo+ 10 250 200 150 100 RL = 32 50 1 20 100 1k 10k 0 20k 0 200 f - Frequency - Hz Figure 20. Figure 21. POWER DISSIPATION vs OUTPUT POWER 800 VDD = 5 V RL = 8 PD - Power Dissipation - mW 700 600 500 400 300 200 RL = 32 100 0 0 200 400 600 800 PD - Output Power - mW Figure 22. 10 400 PD - Output Power - mW 1000 600 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 APPLICATION INFORMATION BRIDGE-TIED LOAD Figure 23 shows a linear audio power amplifier (APA) in a BTL configuration. The TPA741 BTL amplifier consists of two linear amplifiers driving both ends of the load. There are several potential benefits to this differential drive configuration, but initially consider power to the load. The differential drive to the speaker means that as one side is slewing up, the other side is slewing down, and vice versa. This, in effect, doubles the voltage swing on the load as compared to a ground referenced load. Plugging 2 x VO(PP) into the power equation, where voltage is squared, yields 4x the output power from the same supply rail and load impedance (see Equation 1). V O(PP) V (rms) 2 2 2 V (rms) Power R L (1) VDD VO(PP) RL 2x VO(PP) VDD -VO(PP) Figure 23. Bridge-Tied Load Configuration In a typical portable handheld equipment sound channel operating at 3.3 V, bridging raises the power into an 8- speaker from a singled-ended (SE, ground reference) limit of 62.5 mW to 250 mW. In sound power that is a 6-dB improvement, which is loudness that can be heard. In addition to increased power, there are frequency response concerns. Consider the single-supply, SE configuration shown in Figure 24. A coupling capacitor is required to block the dc offset voltage from reaching the load. These capacitors can be quite large (approximately 33 F to 1000 F), so they tend to be expensive, heavy, occupy valuable PCB area, and have the additional drawback of limiting low-frequency performance of the system. This frequency-limiting effect is due to the high-pass filter network created with the speaker impedance and the coupling capacitance and is calculated with Equation 2. 1 fc 2 R C L C (2) For example, a 68-F capacitor with an 8- speaker would attenuate low frequencies below 293 Hz. The BTL configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency performance is then limited only by the input network and speaker response. Cost and PCB space are also minimized by eliminating the bulky coupling capacitor. 11 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 APPLICATION INFORMATION (continued) VDD -3 dB VO(PP) CC RL VO(PP) fc Figure 24. Single-Ended Configuration and Frequency Response Increasing power to the load does carry a penalty of increased internal power dissipation. The increased dissipation is understandable considering that the BTL configuration produces 4x the output power of a SE configuration. Internal dissipation versus output power is discussed further in the thermal considerations section. BTL AMPLIFIER EFFICIENCY Linear amplifiers are notoriously inefficient. The primary cause of these inefficiencies is voltage drop across the output stage transistors. There are two components of the internal voltage drop. One is the headroom or dc voltage drop that varies inversely to output power. The second component is due to the sine-wave nature of the output. The total voltage drop can be calculated by subtracting the RMS value of the output voltage from VDD. The internal voltage drop multiplied by the RMS value of the supply current, IDDrms, determines the internal power dissipation of the amplifier. An easy-to-use equation to calculate efficiency starts out being equal to the ratio of power from the power supply to the power delivered to the load. To accurately calculate the RMS values of power in the load and in the amplifier, the current and voltage waveform shapes must first be understood (see Figure 25). VO IDD IDD(RMS) VL(RMS) Figure 25. Voltage and Current Waveforms for BTL Amplifiers Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are different between SE and BTL configurations. In an SE application, the current waveform is a half-wave rectified shape, whereas in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different. Keep in mind that for most of the waveform both the push and pull transistors are not on at the same time, which supports the fact that each amplifier in the BTL device only draws current from the supply for half the waveform. The following equations are the basis for calculating amplifier efficiency. 12 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 APPLICATION INFORMATION (continued) P Efficiency where V P V L L(RMS) L SUP 2 L(RMS) R L Vp 2 2R L VP 2 P SUP V I DD(RMS) P DD I DD(RMS) V DD 2VP RL 2V P RL Efficiency of a BTL configuration (3) 2 PLR L VP 4V DD 4V DD 12 (4) Table 1 employs Equation 4 to calculate efficiencies for three different output power levels. The efficiency of the amplifier is quite low for lower power levels and rises sharply as power to the load is increased, resulting in a nearly flat internal power dissipation over the normal operating range. The internal dissipation at full output power is less than in the half power range. Calculating the efficiency for a specific system is the key to proper power supply design. Table 1. Efficiency vs Output Power in 3.3-V, 8-, BTL Systems (1) OUTPUT POWER (W) EFFICIENCY (%) PEAK VOLTAGE (V) INTERNAL DISSIPATION (W) 0.125 33.6 1.41 0.26 0.25 47.6 2.00 0.29 0.375 58.3 2.45 (1) 0.28 High-peak voltage values cause the THD to increase. A final point to remember about linear amplifiers (either SE or BTL) is how to manipulate the terms in the efficiency equation to utmost advantage when possible. In Equation 4, VDD is in the denominator. This indicates that as VDD goes down, efficiency goes up. 13 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 APPLICATION SCHEMATICS Figure 26 is a schematic diagram of a typical handheld audio application circuit, configured for a gain of -10 V/V. VDD 6 RF 50 k Audio Input RI 10 k CI 4 IN- 3 IN+ 2 BYPASS VDD CS VDD/2 1 F - VO+ 5 + CB 2.2 F - VO- 8 + 700 mW 7 GND 1 From System Control SHUTDOWN Bias Control Figure 26. TPA741 Application Circuit Figure 27 is a schematic diagram of a typical handheld audio application circuit, configured for a gain of -10 V/V with a differential input. VDD 6 RF 50 k Audio Input- RI 10 k CI RI 10 k Audio Input+ VDD/2 4 IN- 3 IN+ 1 F - VO+ 5 + RF 50 k 2 CI VDD CS BYPASS CB - 2.2 F VO- 8 + 700 mW 7 GND From System Control 1 SHUTDOWN Bias Control Figure 27. TPA741 Application Circuit With Differential Input It is important to note that using the additional RF resistor connected between IN+ and BYPASS will cause VDD/2 to shift slightly, which could influence the THD+N performance of the amplifier. Although an additional external operational amplifier could be used to buffer BYPASS from RF, tests in the laboratory have shown that the THD+N performance is only minimally affected by operating in the fully differential mode as shown in Figure 27. The following sections discuss the selection of the components used in Figure 26 and Figure 27. 14 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 COMPONENT SELECTION Gain-Setting Resistors, RF and RI The gain for each audio input of the TPA741 is set by resistors RF and RI according to Equation 5 for BTL mode. R BTL gain 2 F R I (5) BTL mode operation brings about the factor 2 in the gain equation due to the inverting amplifier mirroring the voltage swing across the load. Given that the TPA741 is an MOS amplifier, the input impedance is high; consequently, input leakage currents are not generally a concern, although noise in the circuit increases as the value of RF increases. In addition, a certain range of RF values is required for proper start-up operation of the amplifier. Taken together, it is recommended that the effective impedance seen by the inverting node of the amplifier be set between 5 k and 20 k. The effective impedance is calculated in Equation 6. R R F I Effective impedance R R F I (6) As an example, consider an input resistance of 10 k and a feedback resistor of 50 k. The BTL gain of the amplifier would be -10 V/V and the effective impedance at the inverting terminal would be 8.3 k, which is well within the recommended range. For high-performance applications, metal film resistors are recommended because they tend to have lower noise levels than carbon resistors. For values of RF above 50 k, the amplifier tends to become unstable due to a pole formed from RF and the inherent input capacitance of the MOS input structure. For this reason, a small compensation capacitor of approximately 5 pF should be placed in parallel with RF when RF is greater than 50 k. This, in effect, creates a low-pass filter network with the cutoff frequency defined in Equation 7. -3 dB fc 1 2 R C F F (7) fc (7) For example, if RF is 100 k and CF is 5 pF, then fc is 318 kHz, which is well outside of the audio range. Input Capacitor, CI In the typical application an input capacitor, CI, is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency determined in Equation 8. 15 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 -3 dB fc fc 1 2 R C I I (8) The value of CI is important to consider as it directly affects the bass (low-frequency) performance of the circuit. Consider the example where RI is 10 k and the specification calls for a flat bass response down to 40 Hz. Equation 8 is reconfigured as Equation 9. 1 C I 2 R f c I (9) In this example, CI is 0.4 F, so one would likely choose a value in the range of 0.47 F to 1 F. A further consideration for this capacitor is the leakage path from the input source through the input network (RI, CI) and the feedback resistor (RF) to the load. This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high-gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at VDD/2, which is likely higher than the source dc level. It is important to confirm the capacitor polarity in the application. Power Supply Decoupling, CS The TPA741 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 F, placed as close as possible to the device VDD lead, works best. For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 10 F or greater, placed near the audio power amplifier is recommended. Midrail Bypass Capacitor, CB The midrail bypass capacitor, CB, is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, CB determines the rate at which the amplifier starts up. The second function is to reduce noise produced by the power supply caused by coupling into the output drive signal. This noise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR and THD + N. The capacitor is fed from a 250-k source inside the amplifier. To keep the start-up pop as low as possible, the relationship shown in Equation 10 should be maintained. This ensures that the input capacitor is fully charged before the bypass capacitor is fully charged and the amplifier starts up. 10 1 CB 250 k RF RI CI (10) As an example, consider a circuit where CB is 2.2 F, CI is 0.47 F, RF is 50 k, and RI is 10 k. Inserting these values into the Equation 10 we get: 18.2 35.5 which satisfies the rule. Bypass capacitor, CB, values of 0.1-F to 2.2-F ceramic or tantalum low-ESRcapacitors are recommended for the best THD and noise performance. 16 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 USING LOW-ESR CAPACITORS Low-ESR capacitors are recommended throughout this applications section. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance, the more the real capacitor behaves like an ideal capacitor. 5-V Versus 3.3-V OPERATION The TPA741 operates over a supply range of 2.5 V to 5.5 V. This data sheet provides full specifications for 5-V and 3.3-V operation, as these are considered to be the two most common standard voltages. There are no special considerations for 3.3-V versus 5-V operation with respect to supply bypassing, gain setting, or stability. The most important consideration is that of output power. Each amplifier in TPA741 can produce a maximum voltage swing of VDD - 1 V. This means, for 3.3-V operation, clipping starts to occur when VO(PP) = 2.3 V, as opposed to VO(PP) = 4 V for 5-V operation. The reduced voltage swing subsequently reduces maximum output power into an 8- load before distortion becomes significant. Operation from 3.3-V supplies, as can be shown from the efficiency formula in Equation 4, consumes approximately two-thirds the supply power of operation from 5-V supplies for a given output-power level. HEADROOM AND THERMAL CONSIDERATIONS Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions. A typical music CD requires 12 dB to 15 dB of dynamic headroom to pass the loudest portions without distortion as compared with the average power output. From the TPA741 data sheet, one can see that when the TPA741 is operating from a 5-V supply into a 8- speaker that 700-mW peaks are available. Converting watts to dB: P P 10Log W 10Log 700 mW -1.5 dB dB P 1W ref Subtracting the headroom restriction to obtain the average listening level without distortion yields: 1.5 dB - 15 dB = -16.5 (15-dB headroom) 1.5 dB - 12 dB = -13.5 (12-dB headroom) 1.5 dB - 9 dB = -10.5 (9-dB headroom) 1.5 dB - 6 dB = -7.5 (6-dB headroom) 1.5 dB - 3 dB = -4.5 (3-dB headroom) Converting dB back into watts: P W 10PdB10 x P ref = 22 mW (15-dB headroom) = 44 mW (12-dB headroom) = 88 mW (9-dB headroom) = 175 mW (6-dB headroom) = 350 mW (3- dB headroom) This is valuable information to consider when attempting to estimate the heat dissipation requirements for the amplifier system. Comparing the absolute worst case, which is 700 mW of continuous power output with 0 dB of headroom, against 12-dB and 15-dB applications drastically affects maximum ambient temperature ratings for the system. Using the power dissipation curves for a 5-V, 8- system, the internal dissipation in the TPA741 and maximum ambient temperatures is shown in Table 2. 17 TPA741 www.ti.com SLOS316C - JUNE 2000 - REVISED JUNE 2004 Table 2. TPA741 Power Rating, 5-V, 8-, BTL PEAK OUTPUT POWER (mW) D PACKAGE (SOIC) DGN PACKAGE (MSOP) MAXIMUM AMBIENT TEMPERATURE (0 CFM) MAXIMUM AMBIENT TEMPERATURE (0 CFM) AVERAGE OUTPUT POWER POWER DISSIPATION (mW) 700 700 mW 675 34C 110C 700 350 mW (3 dB) 595 47C 115C 700 176 mW (6 dB) 475 68C 122C 700 88 mW (9 dB) 350 89C 125C 700 44 mW (12 dB) 225 111C 125C Table 2 shows that the TPA741 can be used to its full 700-mW rating without any heat sinking in still air up to 110C and 34C for the DGN package (MSOP) and D package (SOIC), respectively. 18 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA741D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DGN ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DGNG4 ACTIVE MSOPPower PAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DGNR ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DGNRG4 ACTIVE MSOPPower PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA741DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA741DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA741DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA741DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPA741DR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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