Standard range - 10Vdc to 6kVdc
IECQ-CECC range
AEC-Q200 range
S02A Space grade range
Safety Certied capacitors
Open Mode and Tandem capacitors
X8R High Temperature capacitors
LCD Inverter chip range
Copper Barrier capacitors
High Q capacitors
250Vac Non Safety rated AC capacitors
E01 & E07 feedthrough chip capacitors
X2Y Integrated Passive Components
Radial Leaded capacitors
TCC/VCC capacitors
115Vac 400Hz & DWV ranges
Introduction to Syfer Technology
First in the market with exible polymer
terminations - the revolutionary FlexiCap™
capacitors - our capacitor range also includes X8R
high temperature types, High Q capacitors and
other application specic types. Our renowned high
voltage MLCC expertise has led to the development
of an impressive range with working voltage
capability up to 10kV. This includes surface mount
Class ‘X’ and ‘Y’ approved Safety Certied capacitors,
0603 chips with working voltages up to 500V, and
0805 types up to 1kV.
As part of the Dover Ceramic & Microwave Products
group (CMP), we are able to offer unrivalled product
quality with short lead-times, backed up by excellent
sales and technical support. With a commitment
to product innovation, new ranges are continually
being developed.
Our experienced applications engineers are also
available to provide custom solutions for specic
applications. This catalogue details the standard
ranges but we can provide items such as tight
tolerance, low prole and non standard sizes on
request. Flexibility is key, not only in design but in
all aspects of customer service and support.
Our quality management systems meet
international requirements, with approval to
IS0 9001, environmental approval to IS0 14001
and Occupational Health and Safety approval to
OHSAS 18001. Product approvals include, IECQ-
CECC, UL, TÜV and qualication to AEC-Q200.
SPC is used extensively, supported by Continuous
Improvement Programmes, 6 Sigma projects and
Lean Manufacturing initiatives.
Products
Syfer’s excellence in ceramic materials technology,
has enabled us to offer an unrivalled range of
multilayer ceramic products including:
l Multilayer ceramic chip capacitors
l High voltage MLCCs
l FlexiCap™ capacitors with exible terminations
l Class ‘X’ and ‘Y’ SMD Safety Certied capacitors
l Radial leaded capacitors
l AEC-Q200 qualied capacitors
l IECQ CECC approved capacitors and radials
l Capacitors for space applications
l High Q capacitors
l Non Magnetic capacitors
l 3 terminal EMI chips
l X2Y Integrated Passive Components
l Capacitors for medical applications
Benets
l High quality and reliability
l World-leading high voltage expertise
l Suitable for the most demanding applications
including: automotive, aerospace, military,
space and medical
l Approvals to international specications
l Continual product improvement and innovation
l Tight tolerances available
l Large case sizes, up to 8060
l Custom product capability
l Strong technical support
l Short lead-times
l Environmentally responsible
Sufx code controlled items such as Low prole, dened
thickness and custom lead forms available by special request.
Other Syfer products
l Surface mount Pi lters
l Panel mount threaded lters
l Panel mount solder-in lters
l Custom lter assembly capability
l Varistor lters
l Discoidal capacitors
l Planar capacitor and planar varistor arrays
l EMI Power Filters
l Hermetically sealed EMI lters
Contents
Syfer -
Innovative, World-Class
Ceramic Capacitors
General introduction
Denitions of Ultra-Stable and Stable
Dielectric characteristics
Capacitance, Impedance and E.S.R. vs Frequency
Ageing, capacitance measurements and tight tolerance capacitors
Production processes and reliability
FlexiCap™ overview
Testing and termination types
Documentation and compliance
IECQ-CECC and AEC-Q200 periodic tests
Handling notes
Soldering information
Chip dimensions
Product Selector
2
3
4
5
6
7
8
9
10
11
12
13
14-15
Ceramic Chip capacitors
Standard MLCC ranges - 10Vdc to 6kVdc - C0G/NP0 & X7R
X8R High Temperature capacitors
TCC/VCC range
High Q capacitors - MS range
Copper Barrier capacitors
Open Mode & Tandem capacitors
IECQ-CECC ranges
AEC-Q200 ranges
S02A Space grade ranges
Safety Certied capacitors
250Vac Non Safety Rated AC capacitors
115Vac 400Hz & DWV ranges
LCD Inverter chip range
16-18
19
20-21
22-23
24-25
26
27
28
29
30-32
33
34
35
Surface Mount EMI lters
E01 & E07 feedthrough capacitors
X2Y Integrated Passive Components 36-37
38-39
Packaging information - Ceramic chip capacitors 40-41
Radial Leaded capacitors
Packaging information - Radial leaded capacitors
42-47
48-49
Contents
Syfer -
Innovative, World-Class
Ceramic Capacitors
General introduction
Denitions of Ultra-Stable and Stable
Dielectric characteristics
Capacitance, Impedance and E.S.R. vs Frequency
Ageing, capacitance measurements and tight tolerance capacitors
Production processes and reliability
FlexiCap™ overview
Testing and termination types
Documentation and compliance
IECQ-CECC and AEC-Q200 periodic tests
Handling notes
Soldering information
Chip dimensions
Product Selector
2
3
4
5
6
7
8
9
10
11
12
13
14-15
Ceramic Chip capacitors
Standard MLCC ranges - 10Vdc to 6kVdc - C0G/NP0 & X7R
X8R High Temperature capacitors
TCC/VCC range
High Q capacitors - MS range
Copper Barrier capacitors
Open Mode & Tandem capacitors
IECQ-CECC ranges
AEC-Q200 ranges
S02A Space grade ranges
Safety Certied capacitors
250Vac Non Safety Rated AC capacitors
115Vac 400Hz & DWV ranges
LCD Inverter chip range
16-18
19
20-21
22-23
24-25
26
27
28
29
30-32
33
34
35
Surface Mount EMI lters
E01 & E07 feedthrough capacitors
X2Y Integrated Passive Components 36-37
38-39
Packaging information - Ceramic chip capacitors 40-41
Radial Leaded capacitors
Packaging information - Radial leaded capacitors 42-47
48-49
10V 16V 25V 50/63V 100v 200/
250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV
C0G/
NP0 X7R X5R C0G/
NP0 X7R X5R C0G/
NP0 X7R X5R C0G/
NP0 X7R X5R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R C0G/
NP0 X7R
0603 0.47p
-
3.9n
100p
-
100n
120n
-
150n
0.47p
-
2.7n
100p
-
100n 120n 0.47p
-
2.2n
100p
-
100n —0.47p
-
1.5n
100p
-
47n
56n
-
68n
0.47p
-
470p
100p
-
33n
0.47p
-
220p
100p
-
10n
0.47p
-
150p*
100p
-
1.5n* ————————————————————0603
0805 1.0p
-
15n
100p
-
330n
390n
-
680n
1.0p
-
12n
100p
-
330n
390n
-
470n
1.0p
-
10n
100p
-
220n
270n
-
390n
1.0p
-
5.6n
100p
-
220n
270n
-
330n
1.0p
-
2.2n
100p
-
100n
1.0p
-
1n
100p
-
56n
1.0p
-
680p
100p
-
10n
1.0p
-
560p
100p
-
6.8n
1.0p
-
180p
100p
-
4.7n
1.0p
-
120p —1.0p
-
82p —1.0p
-
39p ———————————0805
1206 1.0p
-
47n
100p
-
1.0µ
1.2µ
-
1.5µ
1.0p
-
33n
100p
-
1.0µ 1.2µ 1.0p
-
27n
100p
-
820n 1.0µ 1.0p
-
22n
100p
-
470n
560n
-
680n
1.0p
-
8.2n
100p
-
330n
1.0p
-
3.3n
100p
-
150n
1.0p
-
2.2n
100p
-
47n
1.0p
-
1.5n
100p
-
33n
1.0p
-
1.0n
100p
-
27n
1.0p
-
680p
100p
-
15n
1.0p
-
330p
100p
-
10n
1.0p
-
220p
100p
-
2.2n
1.0p
-
100p —1.0p
-
68p ———————1206
1210 3.9p
-
100n
330p
-
1.5µ
1.8µ
-
3.3µ
3.9p
-
68n
330p
-
1.5µ
1.8µ
-
2.7µ
3.9p
-
56n
330p
-
1.2µ
1.5µ
-
2.2µ
3.9p
-
33n
330p
-
1.0µ
1.2µ
-
1.5µ
3.9p
-
18n
330p
-
680n
3.9p
-
8.2n
330p
-
330n
3.9p
-
6.8n
330p
-
120n
3.9p
-
3.9n
330p
-
47n
3.9p
-
2.2n
330p
-
33n
3.9p
-
1.5n
330p
-
10n
3.9p
-
820p
330p
-
6.8n
3.9p
-
390p
330p
-
4.7n
3.9p
-
220p —3.9p
-
150p ———————1210
1808 4.7p
-
100n
100p
-
1.5µ
1.8µ
-
2.7µ
4.7p
-
68n
100p
-
1.5µ
1.8µ
-
2.2µ
4.7p
-
47n
100p
-
1.2µ 1.5µ 4.7p
-
33n
100p
-
680n
820n
-
1.0µ
4.7p
-
18n
100p
-
560n
4.7p
-
8.2n
100p
-
270n
4.7p
-
5.6n
100p
-
120n
4.7p
-
3.9n
100p
-
68n
4.7p
-
2.2n
100p
-
47n
4.7p
-
1.5n
100p
-
10n
4.7p
-
1.0n
100p
-
6.8n
4.7p
-
470p
100p
-
4.7n
4.7p
-
270p
100p
-
1.5n
4.7p
-
180p
100p
-
1.2n
4.7p
-
120p*
100p
-
1.0n*
4.7p
-
68p*
100p
-
680p*
4.7p
-
47p*
100p
-
390p*
1808
1812
T=2.5mm
10p
-
220n
150p
-
3.3µ
3.9µ
-
10µ
10p
-
180n
150p
-
3.3µ
3.9µ
-
6.8µ
10p
-
150n
150p
-
2.2µ
2.7µ
-
4.7µ
10p
-
100n
150p
-
2.2µ
2.7µ
-
3.3µ
10p
-
47n
150p
-
1.5µ
10p
-
22n
150p
-
680n
10p
-
15n
150p
-
330n
10p
-
10n
150p
-
180n
10p
-
6.8n
150p
-
100n
10p
-
4.7n
150p
-
33n
10p
-
2.7n
150p
-
22n
10p
-
1.5n
150p
-
10n
10p
-
820p
150p
-
3.3n
10p
-
560p
150p
-
2.7n
10p
-
270p*
150p
-
2.2n*
10p
-
180p*
150p
-
1.2n*
10p
-
120p*
150p
-
1.0n*
1812
(T=2.5mm)
1812
T=3.2mm ——————————————27n —18n
-
22n —12n —8.2n —5.6n
-
6.8n —3.3n —1.8n —1.0n —680p —330p
-
390p*
—220p
-
270p*
—150p
-
180p*
—1812
(T=3.2mm)
1825
T=2.5mm
10p
-
470n
220p
-
4.7µ
5.6µ
-
15µ
10p
-
330n
220p
-
4.7µ
5.6µ
-
12µ
10p
-
220n
220p
-
3.9µ
4.7µ
-
10µ
10p
-
150n
220p
-
1.8µ
2.2µ
-
6.8µ
10p
-
68n
220p
-
1.5µ
10p
-
33n
220p
-
1.0µ
10p
-
27n
220p
-
560n
10p
-
22n
220p
-
180n
10p
-
12n
220p
-
120n
10p
-
6.8n
220p
-
68n
10p
-
4.7n
220p
-
47n
10p
-
3.3n
220p
-
10n
10p
-
1.5n
220p
-
6.8n
10p
-
1.2n
220p
-
3.9n
10p
-
560p*
220p
-
2.2n*
10p
-
390p*
220p
-
1.8n*
10p
-
270p*
220p
-
1.5n*
1825
(T=2.5mm)
1825
T=3.2mm ——————————————39n
-
47n —33n —27n —15n —8.2n
-
10n —5.6n
-
6.8n —3.9n —1.8n
-
2.2n —1.5n —
680p*
—
470p*
—
330p*
—1825
(T=3.2mm)
2220
T=2.5mm
10p
-
470n
220p
-
5.6µ
6.8µ
-
18µ
10p
-
330n
220p
-
5.6µ
6.8µ
-
12µ
10p
-
220n
220p
-
4.7µ
5.6µ
-
10µ
10p
-
150n
220p
-
3.3µ
3.9µ
-
6.8µ
10p
-
68n
220p
-
2.2µ
10p
-
33n
220p
-
1.0µ
10p
-
22n
220p
-
560n
10p
-
18n
220p
-
330n
10p
-
15n
220p
-
120n
10p
-
10n
220p
-
82n
10p
-
5.6n
220p
-
47n
10p
-
3.3n
220p
-
27n
10p
-
1.8n
220p
-
8.2n
10p
-
1.5n
220p
-
6.8n
10p
-
680p*
220p
-
4.7n*
10p
-
470p*
220p
-
3.9n*
10p
-
330p*
220p
-
2.2n*
2220
(T=2.5mm)
2220
T=4.0mm ——————————————39n
-
56n —27n
-
39n —22n
-
33n —18n
-
22n —12n
-
15n —6.8n
-
10n —3.9n
-
5.6n —2.2n
-
3.3n —1.8n
-
2.2n —820p
-
1.2n* —560p
-
820p*
—390p
-
560p*
—2220
(T=4.0mm)
2225
T=2.5mm
10p
-
560n
330p
-
6.8µ
8.2µ
-
22µ
10p
-
470n
330p
-
6.8µ
8.2µ
-
15µ
10p
-
330n
330p
-
5.6µ
6.8µ
-
12µ
10p
-
220n
330p
-
3.3µ
3.9µ
-
10µ
10p
-
82n
330p
-
2.7µ
10p
-
47n
330p
-
1.5µ
10p
-
33n
330p
-
820n
10p
-
22n
330p
-
390n
10p
-
18n
330p
-
150n
10p
-
12n
330p
-
100n
10p
-
6.8n
330p
-
68n
10p
-
4.7n
330p
-
33n
10p
-
2.2n
330p
-
12n
10p
-
1.8n
330p
-
8.2n
10p
-
820p*
330p
-
5.6n*
10p
-
560p*
330p
-
4.7n*
10p
-
390p*
330p
-
2.7n*
2225
(T=2.5mm)
2225
T=4.0mm ——————————————56n
-
68n —39n
-
47n —27n
-
39n —22n
-
27n —15n
-
22n —8.2n
-
12n —5.6n
-
6.8n —2.7n
-
3.9n —2.2n
-
2.7n —1.0n
-
1.5n* —680p
-
1.0n* —470p
-
680p*
—2225
(T=4.0mm)
3640
T=2.5mm ———————— — 10p
-
330n
470p
-
10µ —10p
-
270n
470p
-
5.6µ
10p
-
120n
470p
-
3.3µ
10p
-
82n
470p
-
1.0µ
10p
-
68n
470p
-
680n
10p
-
47n
470p
-
180n
10p
-
33n
470p
-
150n
10p
-
22n
470p
-
100n
10p
-
10n
470p
-
47n
10p
-
6.8n
470p
-
33n
10p
-
4.7n
470p
-
22n
10p
-
1.8n
470p
-
6.8n
10p
-
1.5n —10p
-
1.0n —3640
(T=2.5mm)
3640
T=4.0mm ——————————————150n
-
180n —100n
-
120n —82n
-
100n —56n
-
82n —39n
-
56n —27n
-
39n —12n
-
18n —8.2n
-
12n —5.6n
-
8.2n —2.2n
-
3.3n —1.8n
-
2.2n —1.2n
-
1.5n —3640
(T=4.0mm)
5550
T=2.5mm ———————— — 390p
-
680n
1.0n
-
15µ —390p
-
470n
1.0n
-
10µ
390p
-
270n
1.0n
-
5.6µ
390p
-
180n
1.0n
-
1.8µ
390p
-
120n
1.0n
-
1.2µ
390p
-
82n
1.0n
-
390n
390p
-
68n
1.0n
-
220n
390p
-
39n
1.0n
-
150n
390p
-
22n
1.0n
-
82n
390p
-
12n
1.0n
-
68n
390p
-
10n
1.0n
-
47n
390p
-
4.7n
1.0n
-
15n
390p
-
2.7n
1.0n
-
10n
390p
-
1.8n —5550
(T=2.5mm)
5550
T=4.0mm ——————————————330n —220n
-
270n —150n
-
180n —100n
-
150n —82n
-
100n —47n
-
68n —27n
-
39n —15n
-
22n —12n
-
18n —5.6n
-
6.8n —3.3n
-
4.7n —2.2n
-
3.3n —5550
(T=4.0mm)
8060
T=2.5mm ———————— — 680p
-
1.0µ
2.2n
-
22µ —680p
-
680n
2.2n
-
15µ
680p
-
390n
2.2n
-
10µ
680p
-
270n
2.2n
-
3.3µ
680p
-
220n
2.2n
-
2.2µ
680p
-
150n
2.2n
-
1.0µ
680p
-
100n
2.2n
-
470n
680p
-
68n
2.2n
-
330n
680p
-
39n
2.2n
-
150n
680p
-
22n
2.2n
-
100n
680p
-
15n
2.2n
-
82n
680p
-
8.2n
2.2n
-
33n
680p
-
5.6n
2.2n
-
22n
680p
-
3.9n —8060
(T=2.5mm)
8060
T=4.0mm ——————————————470n
-
560n —330n
-
470n —270n
-
390n —180n
-
270n —120n
-
180n —82n
-
120n —47n
-
68n —27n
-
39n —18n
-
27n —10n
-
15n —6.8n
-
10n —4.7n
-
6.8n —8060
(T=4.0mm)
10V 16V 25V 50/63V 100v 200/
250V 500V 630V 1kV 1.2kV 1.5kV 2kV 2.5kV 3kV 4kV 5kV 6kV
MLCC standard range 10V - 6kVdc
Notes: 1) Capacitance in F. 2) *These parts may require conformal coating post soldering. 3) T = Maximum thickness.
Note: 0402, 0505, 1111 & 2211 case sizes
are available in our speciality ranges.
Please refer to the relevant sections of
this catalogue for more details.
C0G/NP0 capacitance vs
temperature
LOWER LIMIT
-50
-25
0
25
50
-55-25 025 12550 75 100
UPPER LIMIT
TYPICAL LIMIT
∆C ppm/°C
Temperature (°C)
X7R capacitance vs
temperature
-20
-10
-15
0
10
15
5
-5
20
-35-55-15 525 105 12545 65 85
Typical capacitance change curves
will lie within the shown limits
Temperature (°C)
% Capacitance Change
Power (mW)
Operating Temperature (°C)
C0G/NP0 and X7R
Dielectric characteristicsTechnical Summary
Multilayer Ceramic Capacitors are generally divided into classes which are dened by the capacitance temperature characteristics
over specied temperature ranges. These are designated by alpha numeric codes. Code denitions are summarised below and
are also available in the relevant national and international specications.
Capacitors within this class have a dielectric constant
range from 10 to 100. They are used in applications which
require ultra stable dielectric characteristics with negligible
dependence of capacitance and dissipation factor with
time, voltage and frequency. They exhibit the following
characteristics:-
a) Time does not signicantly affect capacitance and
dissipation factor (Tan δ) – no ageing.
b) Capacitance and dissipation factor are not affected by
voltage.
c) Linear temperature coefcient.
Denitions of Ultra-Stable and Stable Technical Summary
The table above highlights the difference in coding for IECQ-CECC, EIA
and MIL standards when dening the temperature coefecient and the
voltage coefcient.
C0G/NP0 - Ultra Stable Class 1 Ceramic (EIA Class 1)
Spec. Classication Temperature
range °C
Maximum
capacitance change
@ rated DC volts
Syfer
dielectric code
CECC 1B/CG -55 +125 0 ± 30ppm/°C C
EIA C0G/NP0 -55 +125 0 ± 30ppm/°C C
MIL CG (BP) -55 +125 0 ± 30ppm/°C C
Capacitors of this type have a dielectric constant range
of 1000-4000, and also have a non-linear temperature
characteristic which exhibits a dielectric constant variation
of less than ±15% (2R1) from its room temperature value,
over the specied temperature range. Generally used for
by-passing (decoupling), coupling, ltering, frequency
discrimination, DC blocking and voltage transient suppression
with greater volumetric efciency than Class l units, whilst
maintaining stability within dened limits.
Capacitance and dissipation factor are affected by:-
Time (Ageing)
Voltage (AC or DC)
Frequency
X8R, X7R and X5R - Stable Class II Ceramic (EIA Class II)
Spec. Classication Temperature
range °C
Maximum capacitance change %
over temperature range Syfer
dielectric
code
No DC volt
applied Rated DC Volt
CECC 2C1
2R1
2X1
-55 +125
-55 +125
-55 +125
±20
±15
±15
+20 -30
- -
+15 -25
R
X
B
EIA X8R
X7R
X5R
-55 +150
-55 +125
-55 +85
±15
±15
±15
- -
- -
- -
N
X
P
MIL BX
BZ -55 +125
-55 +125 ±15
±20 +15 -25
+20 -30 B
R
Technical Summary
C0G/NP0 X5R X7R X8R
Dielectric
characteristics Ultra stable Stable Stable Stable
IECQ-
CECC
EIA
MIL
1B/CG - - - 2C1 2R1 2X1 -
-C0G/
NP0 - X5R - X7R - X8R
- - CG (BP) - BZ - BX -
Rated temperature
range -55ºC to +125ºC -55ºC to +85ºC -55ºC to +125ºC -55ºC to +150ºC
Maximum capacitance
change over
temperature range
No DC voltage applied 0 ± 30 ppm/ºC ± 15% ± 20% ± 15% ± 15% ± 15%
Rated DC voltage applied -+20
-30% -+15
-25% -
Syfer dielectric
ordering code C P R X B N
Tangent of loss angle
(tan δ) Cr > 50pF ≤ 0.0015
Cr ≤ 50pF = 0.0015 (15 + 0.7)
Cr ≤ 0.025 ≤ 0.025 ≤ 0.025
Insulation
resistance (Ri)
Time constant (Ri x
Cr) (whichever is the
least)
100G Ω or
1000s 100G Ω or
1000s 100G Ω or
1000s 100G Ω or
1000s
Capacitance
tolerance
Cr < 10pF
Cr
>
10pF
± 0.05pF (H)
± 0.10pF (B)
± 0.25pF (C)
± 0.50pF (D)
± 1.0pF (F)
± 1% (F)
± 2% (G)
± 5% (J)
± 10% (K)
± 5% (J)
± 10% (K)
± 20% (M)
± 5% (J)
± 10% (K)
± 20% (M)
± 5% (J)
± 10% (K)
± 20% (M)
Dielectric strength Voltage applied for 5 seconds.
Charging current limited to 50mA maximum.
<200V
>200V to <500V
500V to <1000V
500V to <1000V
>1kV to <1200V
>1200V
>1000V
2.5 times
Rated voltage + 250V
1.5 times
-
1.25 times
1.2 times
-
2.5 times
-
-
-
-
-
-
2.5 times
Rated voltage + 250V
-
1.5 times
-
-
1.2 times
2.5 times
-
-
-
-
-
-
Climatic
category (IEC)
Chip 55/125/56 55/85/56 55/125/56 55/150/56
Dipped 55/125/21 - 55/125/21 -
Discoidal 55/125/56 - 55/125/56 -
Ageing
characteristic
(Typical) Zero <2% per time decade <2% per time decade <2% per time decade
Typical dielectric temperature characteristics Power ratings
Approvals
Chip QC-32100 -QC-32100 -
Dipped radial IECQ-CECC 30601-008 -IECQ-CECC 30701-013 -
Ageing of ceramic capacitors
Ageing
Capacitor ageing is a term used to describe the negative,
logarithmic capacitance change which takes place in ceramic
capacitors with time. The crystalline structure for barium
titanate based ceramics changes on passing through its Curie
temperature (known as the Curie Point) at about 125°C.
This domain structure relaxes with time and in doing so, the
dielectric constant reduces logarithmically; this is known as
the ageing mechanism of the dielectric constant. The more
stable dielectrics have the lowest ageing rates.
The ageing process is reversible and repeatable. Whenever
the capacitor is heated to a temperature above the Curie Point
the ageing process starts again from zero.
The ageing constant, or ageing rate, is dened as the
percentage loss of capacitance due to the ageing process of
the dielectric which occurs during a decade of time (a tenfold
increase in age) and is expressed as percent per logarithmic
decade of hours. As the law of decrease of capacitance is
logarithmic, this means that in a capacitor with an ageing rate
of 1% per decade of time, the capacitance will decrease at a
rate of:
a) 1% between 1 and 10 hours
b) An additional 1% between the following 10 and 100
hours
c) An additional 1% between the following 100 and 1000
hours
d) An additional 1% between the following 1000 and 10000
hours etc
e) The ageing rate continues in this manner throughout the
capacitor’s life.
Typical values of the ageing constant for our Multilayer
Ceramic Capacitors are:
Capacitance measurements
Because of ageing it is necessary to specify an age for
reference measurements at which the capacitance shall be
within the prescribed tolerance. This is xed at 1000 hours,
since for practical purposes there is not much further loss of
capacitance after this time.
All capacitors shipped are within their specied tolerance at
the standard reference age of 1000 hours after having cooled
through their Curie temperature.
The ageing curve for any ceramic dielectric is a straight line
when plotted on semi-log paper.
Dielectric class Typical values
Ultra Stable C0G/NP0 Negligible capacitance loss
through ageing
Stable X7R <2 % per decade of time
Capacitance vs time
(Ageing X7R @ 1% per decade)
∆c %
Age (Hours)
110 100 100001000
C0G/NP0
Technical SummaryCapacitance, Impedance and E.S.R. vs Frequency
Impedance vs Frequency - chips
Ultra Stable C0G/NP0 dielectric
Impedance vs Frequency - 10nF chips
Stable X7R dielectric
ESR vs Frequency - chips
Ultra Stable C0G/NP0 dielectric
Stable X7R dielectric Stable X7R dielectric
Technical Summary
Tight tolerance
One of the advantages of Syfer’s unique ‘wet process’ of
manufacture is the ability to offer capacitors with exceptionally
tight capacitance tolerances.
The accuracy of the printing screens used in the fully
automated, computer controlled manufacturing process allows
for tolerance as close as +/-1% on C0G/NP0 parts greater
than or equal to 10pF. For capacitance values below 10pF,
tolerances can be as tight as +/-0.05pF.
100000000
10000000
1000000
100000
10000
1000
100
10
1
0.1
0.01
0.001 0.01 0.1 110 100 1000 10000
Impedance (Ohms)
Frequency (MHz)
Ultra Stable C0G/NP0 dielectric
10pF 100pF
1nF 10nF
ESR / Ohms
Frequenc
y
(MHz)
Ultra Stable C0G/NP0 dielectric
0.1
0.01
0.001
1
10
100
1000
100pF
1nF
10nF
0.001 0.01 0.1 110 100 1000 10000
1000000
100000
1000
10000
100
10
1
0.1
0.01
0.001 0.01 0.1 110 100 1000 10000
Impedance (Ohms)
Frequency (MHz)
Stable X7R dielectric
10nF1nF
100nF 1000nF
ESR (Ohms)
Frequenc
y
(MHz)
Stable X7R dielectric
0.1
0.01
0.001
0.0001
1
10
100
1000
10000
1nF
10nF
100nF
1µF
0.001 0.01 0.1 110 100 1000 10000
100000
1000
10000
100
10
1
0.1
0.01
0.001 0.01 0.1 110 100 1000 10000
Impedance (Ohms)
Frequency (MHz)
Stable X7R dielectric 10nF
1808 0805
1206 1210
Impedance (Ohms)
Frequency (MHz)
FlexiCap™ overviewTechnical SummaryProduction processes and reliability Technical Summary
Production process owchart Syfer reliability grades
Internal inspection
Rumble
Multilayer build
(wet process)
Fire
Ceramic powder
preparation Electrode ink
material
Termination
Electrical test
Test verification
Packaging
Finished goods store
Plating
(if specified)
QC inspection
Additional Hi Rel
activities
(S02A 100% burn-in, QC insp)
Additional sample
Rel tests
(if specified)
Printing
(if specified)
Standard components
MIL Grade(2)
IECQ-CECC(3)
AEC-Q200(4)
Space
Grade
ESCC 3009(1)
Standard
reliability
High reliability
(space quality)
Syfer reliability surface mount product
groups
Standard FlexiCap
TM
capacitors(3)
Open Mode
FlexiCap
TM
capacitors(2)
Tandem
FlexiCap
TM
capacitors(1)
Standard
reliability
High reliability
Standard MLC capacitors(4)
Notes:
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualied to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCapTM termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualied to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCapTM termination. By using
FlexiCapTM termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin nish over nickel,
but no FlexiCapTM.
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specication S02A 0100.
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certication which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualication
For Passive Components. Refer to Syfer application note reference
AN0009.
FlexiCap™ termination
MLCCs are widely used in electronic circuit design for a
multitude of applications. Their small package size, technical
performance and suitability for automated assembly makes
them the component of choice for the specier.
However, despite the technical benets, ceramic components
are brittle and need careful handling on the production oor.
In some circumstances they may be prone to mechanical
stress damage if not used in an appropriate manner. Board
exing, depanelisation, mounting through hole components,
poor storage and automatic testing may all result in cracking.
Careful process control is important at all stages of circuit
board assembly and transportation - from component
placement to test and packaging. Any signicant board exing
may result in stress fractures in ceramic devices that may
not always be evident during the board assembly process.
Sometimes it may be the end customer who nds out - when
equipment fails!
Syfer has the solution - FlexiCap™
FlexiCapTM has been developed as a result of listening to
customers’ experiences of stress damage to MLCCs from
many manufacturers, often caused by variations in production
processes.
Our answer is a proprietary exible epoxy polymer termination
material, that is applied to the device under the usual nickel
barrier nish. FlexiCapTM will accommodate a greater degree
of board bending than conventional capacitors.
Syfer FlexiCap™ termination
All ranges are available with FlexiCap™ termination material
offering increased reliability and superior mechanical
performance (board ex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap™ capacitors
enable the board to be bent almost twice as much before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap™ is also suitable for Space applications having
passed thermal vacuum outgassing tests. Refer to Syfer
application note reference AN0026.
Fired ceramic
dielectric
FlexiCap
TM
termination
base
Intermediate
nickel layer
Tin outer
layer
Metal
electrodes
FlexiCap
TM
MLCC cross section
Application notes
FlexiCapTM may be handled, stored and transported in
the same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCapTM are the
same as for standard SMD capacitors.
For customers currently using standard terminated capacitors
there should be no requirement to change the assembly
process when converting to FlexiCapTM.
Based upon board bend tests in accordance with IEC 60384-1
the amount of board bending required to mechanically crack
a FlexiCapTM terminated capacitor is signicantly increased
compared with standard terminated capacitors.
It must be stressed however, that capacitor users must not
assume that the use of FlexiCapTM terminated capacitors will
totally eliminate mechanical cracking. Good process controls
are still required for this objective to be achieved.
● Picture taken at
1,000x magnification
using a SEM
to demonstrate the
fibrous nature of the
FlexiCapTM termination
that absorbs increased
levels of mechanical
stress.
Available on the following ranges:
● All High Reliability ranges
● Standard and High Voltage chips
● Safety Certied capacitor chips
● 3 terminal EMI chips
● X2Y Integrated Passive Components
● X8R High Temperature capacitors
Summary of PCB bend test results
The bend tests conducted on X7R have proven that
the FlexiCapTM termination withstands a greater level of
mechanical stress before mechanical cracking occurs.
The AEC-Q200 test for X7R requires a bend level of 2mm
minimum and a cap change of less than 10%.
Product
X7R Typical bend performance under
AEC-Q200 test conditions
Standard termination 2mm to 3mm
FlexiCap™ Typically 8mm to 10mm
FlexiCap™ benets
With traditional termination materials and assembly, the chain
of materials from bare PCB to soldered termination, provides
no exibility. In circumstances where excessive stress is
applied - the weakest link fails. This means the ceramic itself,
which may fail short circuit.
The benet to the user is to facilitate a wider process window
- giving a greater safety margin and substantially reducing the
typical root causes of mechanical stress cracking.
FlexiCapTM may be soldered using your traditional wave
or reow solder techniques and needs no adjustment to
equipment or current processes.
Syfer has delivered millions of FlexiCapTM components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benet of FlexiCap™ is that MLCCs can
withstand temperature cycling -55ºC to 125ºC in excess of
1,000 times without cracking.
FlexiCap™ termination has no adverse effect on any electrical
parameters, nor affects the operation of the MLCC in any way.
● Release documentation supplied as standard.
m Original documentation.
Syfer reliability SM product group
Standard SM
capacitors IECQ-CECC AEC-Q200
MIL grade S (Space grade)
High Rel S02A
Certicate of conformance ●-● ●
IECQ-CECC Release certicate of conformity -●- -
Batch electrical test report mmmIncluded in data
pack
S (space grade) data documentation package ---●
Release documentation
Standard Surface Mount c apacitors
Components are randomly selected on a sample basis and the
following routine tests are conducted:
● Load Test. 1,000 hours @125ºC (150ºC for X8R). Applied
voltage depends on components tested.
● Humidity Test. 168 hours @ 85ºC/85%RH.
● Board Deection (bend test).
Test results are available on request.
Component type: 0805 (C0G/NP0 and X7R).
Testing location: Syfer reliability test department.
Results based on: 16,622,000 component test hours.
From To Operation
FITS MTBF (hours) 109 ÷ FITS
FITS MTBF (years) 109 ÷ (FITS x 8760)
FITS = Failures in 109 hours.
MTBF = Mean time between failures.
Conversion factors
25ºC 50ºC 75ºC 100ºC 125ºC
10000
0.01
10
0.00001
FIT
50% of RVRV
25% of RV 10% of RV
Example of FIT (Failure In Time) data available:
Periodic tests conducted and reliability data availability
Documentation and compliance
REACH (Registration, Evaluation, Authorisation
and restriction of Chemicals) statement
The main purpose of REACH is to improve the protection of
human health and the environment from the risks arising from
the use of chemicals.
Syfer Technology Ltd maintains both ISO14001, Environmental
Management System and OHSAS 18001 Health and Safety
Management System approvals that require and ensure
compliance with corresponding legislation such as REACH.
For further information, please contact Syfer at
sales@syfer.co.uk
Technical SummaryTesting and termination types Technical Summary
Syfer reliability SM product group
Standard SM
capacitors IECQ-CECC /
MIL grade AEC-Q200 S (Space grade)
High Rel S02A
Solderability ● ● ● ●
Resistance to soldering heat ● ● ● ●
Plating thickness verication (if plated) ● ● ● ●
DPA (Destructive Physical Analysis) ● ● ● ●
Voltage proof test (DWV / Flash) ● ● ● ●
Insulation resistance ● ● ● ●
Capacitance test ● ● ● ●
Dissipation factor test ● ● ● ●
100% visual inspection m m ● ●
100% burn-in. (2xRV @125ºC for 168 hours) m m m ●
Load sample test @ 125ºC mmmLAT1 & LAT2
(1000 hours)
Humidity sample test. 85ºC/85%RH mmm240 hours
Hot IR sample test m m m m
Axial pull sample test (MIL-STD-123) m m m m
Breakdown voltage sample test m m m m
Deection (bend) sample test m m m m
SAM (Scanning Acoustic Microscopy) m m m m
LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and LAT3) ---m
LAT2 (20 x 1000 hour life test + LAT3) ---m
LAT3 (6 x TC and 4 x solderability) ---m
● Test conducted as standard.
m Optional test. Please discuss with Syfer Sales.
Syfer reliability SM product group
Standard SM
capacitors IECQ-CECC /
MIL grade AEC-Q200 S (space grade)
High Rel S02A
F: Silver Palladium ● ● -●
J: Silver base with nickel barrier (100% matte tin plating) ● ● C0G/NP0
dielectric only m
A: Silver base with nickel barrier (tin/lead plating with min 10%
lead) ● ● -●
Y: FlexiCap™ with nickel barrier (100% matte tin plating) ● ● ● m
H: FlexiCap™ with nickel barrier (tin/lead plating with min 10%
lead) ● ● -m
2: Silver base with Copper Barrier (100% matte tin plating) ●(1) ---
3: FlexiCap™ with Copper Barrier (100% matte tin plating) ●(2) ---
Notes:
(1) Available on C0G/NP0 and High Q only.
(2) Available on all dielectrics.
● Termination available.
m Termination available but generally not requested for space grade components.
Please discuss with Syfer Sales.
Termination types available
Tests conducted during batch
manufacture
Export controls and dual-use regulations
Certain Syfer catalogue components are dened as ‘dual-use’
items under international export controls - those that can be
used for civil or military purposes which meet certain specied
technical standards.
The dening criteria for a dual-use component with respect
to Syfer products is one with a voltage rating of >750V and a
capacitance value >250nF and a series inductance <10nH.
Components dened as ‘dual-use’ under the above criteria
automatically require a licence for export outside the EU, and
may require a licence for export within the EU.
The application for a licence is routine, but customers for
these products will be asked to supply further information.
Please refer to sales if you require any further information on
export restrictions.
Other special components may additionally need to comply
with export regulations.
RoHS compliance
Syfer routinely monitors world wide material restrictions (e.g.
EU / China & Korea RoHS mandates) and is actively involved
in shaping future legislation.
All standard Syfer MLCC products are compliant with the EU
RoHS directive 2002/95/EC (see below for special exceptions)
and those with plated terminations are suitable for soldering
using common Pb free solder alloys (refer to ‘Soldering
Information’ for more details on soldering limitations).
Compliance with EU 2002/95/EC automatically signies
compliance with some other legislation (e.g. Korea RoHS).
Please refer to Syfer for details of compliance with other
materials legislation
Breakdown of material content, SGS analysis reports and tin
whisker test results are available on request.
Most Syfer MLCC components are available with non RoHS
compliant tin lead (SnPb) solderable termination nish by
special request for exempt applications and where pure tin is
not acceptable. Other tin free termination nishes may also be
available – please refer to Syfer for further details.
Radial components have tin plated leads as standard, but tin/
lead is available as a special option. Please refer to the radial
section of the catalogue for further details.
Detailed application notes intended to guide and assist our
customers in using multilayer ceramic capacitors in surface
mount technology are available on the Syfer website www.
syfer.com
The information concentrates on the handling, mounting,
connection, cleaning, test and re-work requirements particular
to MLC’s for SMD technology, to ensure a suitable match
between component capability and user expectation. Some
extracts are given below.
Handling
Ceramics are dense, hard, brittle and abrasive materials. They
are liable to suffer mechanical damage, in the form of chips or
cracks, if improperly handled.
Terminations may be abraded onto chip surfaces if loose chips
are tumbled in bulk. Metallic tracks may be left on the chip
surfaces which might pose a reliability hazard.
Components should never be handled with ngers;
perspiration and skin oils can inhibit solderability and will
aggravate cleaning.
Chip capacitors should never be handled with metallic
instruments. Metal tweezers should never be used as these
can chip the product and may leave abraded metal tracks on
the product surface. Plastic or plastic coated metal types are
readily available and recommended - these should be used
with an absolute minimum of applied pressure.
Counting or visual inspection of chip capacitors is best
performed on a clean glass or hard plastic surface.
If chips are dropped or subjected to rough handling, they
should be visually inspected before use. Electrical inspection
may also reveal gross damage via a change in capacitance, an
increase in dissipation factor or a decrease either in insulation
resistance or electrical strength.
Transportation
Where possible, any transportation should be carried out with
the product in its unopened original packaging. If already
opened, any environmental control agents supplied should be
returned to packaging and the packaging re-sealed.
Avoid paper and card as a primary means of handling,
packing, transportation and storage of loose components.
Many grades have a sulphur content which will adversely
affect termination solderability.
Loose chips should always be packed with sulphur-free
wadding to prevent impact or abrasion damage during
transportation.
Storage
Incorrect storage of components can lead to problems for the
user. Rapid tarnishing of the terminations, with an associated
degradation of solderability, will occur if the product comes
into contact with industrial gases such as sulphur dioxide and
chlorine. Storage in free air, particularly moist or polluted air,
can result in termination oxidation.
Packaging should not be opened until the MLC’s are required
for use. If opened, the pack should be re-sealed as soon as
is practicable. Alternatively, the contents could be kept in a
sealed container with an environmental control agent.
Long term storage conditions, ideally, should be temperature
controlled between -5 and +40°C and humidity controlled
between 40 and 60% R.H.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape or adhesive performance.
Product, stored under the conditions recommended above,
in its “as received” packaging, has a minimum shelf life of 2
years.
Handling notesTechnical SummaryIECQ-CECC and AEC-Q200
Periodic tests conducted for IECQ-CECC and AEC-Q200
Test
ref Test Termination
type Additional requirements
Sample
acceptance Reference
P n c
P1
High
temperature
exposure
(storage)
All types Un-powered. 1,000 hours @ T=150ºC.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 108
P2 Temperature
cycling
C0G/NP0: All
types X7R: Y
and H only
1,000 cycles -55ºC to +125ºC
Measurement at 24 ± 2 hours after test conclusion 12 77 0 JESD22
Method JA-104
P3 Moisture
resistance All types
T = 24 hours/cycle. Note: Steps 7a and 7b not required.
Un-powered.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 106
P4 Biased
humidity All types
1,000 hours 85ºC/85%RH. Rated voltage or 50V
whichever is the least and 1.5V.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 103
P5 Operational
life All types Condition D steady state TA=125ºC at full rated.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 108
P6 Resistance
to solvents All types Note: Add aqueous wash chemical.
Do not use banned solvents 12 5 0 MIL-STD-202
Method 215
P7 Mechanical
shock
C0G/NP0: All
types X7R: Y
and H only
Figure 1 of Method 213. Condition F 12 30 0 MIL-STD-202
Method 213
P8 Vibration
C0G/NP0: All
types X7R: Y
and H only
5
g’s
for 20 minutes, 12 cycles each of 3 orientations.
Note: Use 8” x 5” PCB 0.031” thick 7 secure points on one
long side and 2 secure points at corners of opposite sides.
Parts mounted within 2” from any secure point.
Test from 10-2,000Hz
12 30 0 MIL-STD-202
Method 204
P9 Resistance
to soldering
heat All types Condition B, no pre-heat of samples:
Single wave solder - Procedure 2 3 12 0 MIL-STD-202
Method 210
P10 Thermal
shock
C0G/NP0: All
types X7R: Y
and H only
-55ºC/+125ºC. Number of cycles 300.
Maximum transfer time - 20 seconds,
dwell time - 15 minutes. Air-Air 12 30 0 MIL-STD-202
Method 107
P11
Adhesion,
rapid temp
change and
climatic
sequence
X7R: A, F and
J only 5N force applied for 10s, -55ºC/ +125ºC for 5 cycles,
damp heat cycles 12 27 0 BS EN132100
Clause 4.8, 4.12
and 4.13
P12
Board ex
C0G/NP0: All
types X7R: Y
and H only
3mm deection Class I
2mm deection Class II 12 30 0 AEC-Q200-005
P13 X7R: A, F and
J only 1mm deection. 12 12 0 BS EN132100
Clause 4.9
P14 Terminal
strength All types Force of 1.8kg for 60 seconds 12 30 0 AEC-Q200-006
P15 Beam load
test All types - 12 30 0 AEC-Q200-003
P16 Damp heat
steady state All types 56 days, 40ºC / 93% RH 15x no volts, 15x 5Vdc,
15x rated voltage or 50V whichever is the least. 12 45 0 BS EN132100
Clause 4.14
Test results are available on request.
P = Period in months.
N = Sample size.
C = Acceptance criteria.
Periodic tests
Mechanical considerations for mounted ceramic
chip capacitors
Due to their brittle nature, ceramic chip capacitors are
more prone to excesses of mechanical stress than other
components used in surface mounting.
One of the most common causes of failure is directly
attributable to bending the printed circuit board after solder
attachment. The excessive or sudden movement of the
exible circuit board stresses the inexible ceramic block
causing a crack to appear at the weakest point, usually the
ceramic/termination interface. The crack may initially be quite
small and not penetrate into the inner electrodes; however,
subsequent handling and rapid changes in temperature may
cause the crack to enlarge.
This mode of failure is often invisible to normal inspection
techniques as the resultant cracks usually lie under the
capacitor terminations but if left, can lead to catastrophic
failure. More importantly, mechanical cracks, unless they are
severe may not be detected by normal electrical testing of the
completed circuit, failure only occurring at some later stage
after moisture ingression.
The degree of mechanical stress generated on the printed
circuit board is dependent upon several factors including the
board material and thickness; the amount of solder and land
pattern. The amount of solder applied is important, as an
excessive amount reduces the chip’s resistance to cracking.
It is Syfer’s experience that more than 90% are due to
board depanelisation, a process where two or more circuit
boards are separated after soldering is complete. Other
manufacturing stages that should be reviewed include:
1) Attaching rigid components such as connectors, relays,
display panels, heat sinks etc.
2) Fitting conventional leaded components. Special care
must be exercised when rigid terminals, as found on large
can electrolytic capacitors, are inserted.
3) Storage of boards in such a manner which allows warping.
4) Automatic test equipment, particularly the type employing
“bed of nails” and support pillars.
5) Positioning the circuit board in its enclosure especially
where this is a “snap-t”.
Syfer were the rst MLCC manufacturer to launch a exible
termination to signicantly reduce the instances of mechanical
cracking. Flexicap™ termination introduces a certain amount
of give into the termination layer absorbing damaging stress.
Unlike similar systems, Flexicap™ does not tear under tension,
but absorbs the stress, so maintaining the characteristics of
the MLCC.
SM Pad Design
Syfer conventional 2-terminal chip capacitors can generally
be mounted using pad designs in accordance with IPC-7351,
Generic Requirements for Surface Mount Design and Land
Pattern Standards, but there are some other factors that have
been shown to reduce mechanical stress, such as reducing the
pad width to less than the chip width. In addition, the position
of the chip on the board should also be considered.
3-Terminal components are not specically covered by
IPC-7351, but recommended pad dimensions are included in
the Syfer catalogue / website for these components.
Chip dimensions
Dimensions
Size Length
(L1)
mm
inches
Width
(W)
mm
inches
Max. Thickness
(T)
mm
inches
Termination Band
L2
mm
inches
min max
0402 1.0 ± 0.10
0.04 ± 0.0060.50 ± 0.10
0.02 ± 0.0030.60
0.031
0.10
0.004
0.40
0.015
0505 1.4 ± 0.38
0.055 ± 0.015 1.4 ± 0.25
0.055 ± 0.010 1.27
0.050 0.13
0.0050.5
0.020
0603 1.6 ± 0.2
0.063 ± 0.008
0.8 ± 0.2
0.031 ± 0.008
0.8
0.031
0.10
0.004
0.40
0.015
0805 2.0 ± 0.3
0.08 ± 0.012
1.25 ± 0.2
0.05 ± 0.008
1.3
0.051
0.13
0.005
0.75
0.03
1111 2.79 + 0.51 - 0.25
0.110 + 0.020 - 0.010
2.79 ± 0.38
0.110 ± 0.015 2.54
0.100 0.13
0.005
0.63
0.025
1206 3.2 ± 0.3
0.126 ± 0.012
1.6 ± 0.2
0.063 ± 0.008
1.6
0.063
0.25
0.01
0.75
0.03
1210 3.2 ± 0.3
0.126 ± 0.012
2.5 ± 0.3
0.10 ± 0.012
2.0
0.08
0.25
0.01
0.75
0.03
1410 3.6 ± 0.3
0.14 ± 0.012
2.5 ± 0.3
0.10 ± 0.012
2.0
0.08
0.25
0.01
0.75
0.03
1806 4.5 ± 0.35
0.177 ± 0.012
1.6 ± 0.2
0.063 ± 0.008
1.3
0.051
0.25
0.01
0.75
0.03
1808 4.5 ± 0.35
0.18 ± 0.014
2.0 ± 0.3
0.08 ± 0.012
2.0
0.08
0.25
0.01
1.0
0.04
1812 4.5 ± 0.35
0.18 ± 0.014
3.2 ± 0.3
0.126 ± 0.012
3.2
0.126
0.25
0.01
1.0
0.04
1825 4.5 ± 0.35
0.18 ± 0.014
6.30 ± 0.4
0.25 ± 0.016
4.2
0.16
0.25
0.01
1.0
0.04
2211 5.7 ± 0.4
0.225 ± 0.016
2.79 ± 0.3
0.11 ± 0.012
2.5
0.1
0.25
0.01
0.8
0.03
2215 5.7 ± 0.4
0.225 ± 0.016
3.31 ± 0.35
0.15 ± 0.014
2.5
0.1
0.25
0.01
0.8
0.03
2220 5.7 ± 0.4
0.225 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
4.2
0.16 0.25
0.01
1.0
0.04
2225 5.7 ± 0.4
0.225 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
4.2
0.16 0.25
0.01
1.0
0.04
2520 6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
4.2
0.16 0.25
0.01
1.0
0.04
3640 9.2 ± 0.5
0.36 ± 0.02
10.16 ± 0.5
0.40 ± 0.02
4.2
0.16
0.5
0.02
1.5
0.06
3820 9.65 ± 0.5
0.37 ± 0.02
5.0 ± 0.4
0.197 ± 0.016
4.2
0.16 0.5
0.02
1.5
0.06
3035 7.62 ± 0.4
0.30 ± 0.016 8.90 ± 0.5
0.35 ± 0.024.2
0.16 0.5
0.02
1.5
0.06
4045 10.2 ± 0.5
0.40 ± 0.0211.5 ± 0.5
0.45 ± 0.024.2
0.16 0.5
0.02
1.5
0.06
4545 11.5 ± 0.5
0.45 ± 0.0211.5 ± 0.5
0.45 ± 0.024.2
0.16 0.5
0.02
1.5
0.06
5550 14.0 ± 0.5
0.55 ± 0.02
12.7 ± 0.5
0.50 ± 0.02
4.2
0.16 0.5
0.02
1.5
0.06
5868 14.8 ± 0.5
0.58 ± 0.02
17.3 ± 0.5
0.68 ± 0.02
4.2
0.16 0.5
0.02
1.5
0.06
8040 20.3 ± 0.5
0.80 ± 0.02
10.16 ± 0.5
0.40 ± 0.02
4.2
0.16 0.5
0.02
1.5
0.06
8060 20.3 ± 0.5
0.80 ± 0.02
15.24 ± 0.5
0.60 ± 0.02
4.2
0.16 0.5
0.02
1.5
0.06
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specic requests direct to Syfer.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be
considered by request – please refer requests to the Sales Ofce.
T
L2
L1
W
Technical SummarySoldering information Technical Summary
Multilayer ceramic chip - with nickel barrier
termination
Fired ceramic
dielectric
Intermediate
nickel layer
Tin or tin/lead
outer layer
(as specified by
customer)
Metal
electrodes
Silver
termination
Soldering information
Syfer MLCC’s are compatible with all recognised soldering/
mounting methods for chip capacitors. A detailed application
note is available on-line at www.syfer.com
Reow soldering surface mount chip capacitors
Syfer recommend reow soldering as the preferred method for
mounting MLCC’s. Syfer MLCC’s can be reow soldered using a
reow prole generally as dened in IPC / JEDEC J-STD-020.
Sn plated termination chip capacitors are compatible with both
conventional and lead free soldering, with peak temperatures
of 260ºC to 270ºC acceptable.
The heating ramp rate should be such that components see
a temperature rise of 1.5ºC to 4ºC per seconds to maintain
temperature uniformity through the MLCC.
The time for which the solder is molten should be maintained
at a minimum, so as to prevent solder leaching. Extended
times above 230ºC can cause problems with oxidisation of
Sn plating. Use of inert atmosphere can help if this problem
is encountered. PdAg terminations can be particularly
susceptible to leaching with lead free, tin rich solders and
trials are recommended for this combination.
Cooling to ambient temperature should be allowed to occur
naturally, particularly if larger chip sizes are being soldered.
Natural cooling allows a gradual relaxation of thermal
mismatch stresses in the solder joints. Forced cooling should
be avoided as this can induce thermal breakage.
Wave soldering Chip and Radial Leaded
capacitors
Wave soldering is generally acceptable, but the thermal
stresses caused by the wave have been shown to lead to
potential problems with larger or thicker chips. Particular care
should be taken when soldering SM chips larger than size
1210 and with a thickness greater than 1.0mm for this reason.
Maximum permissible wave temperature is 270ºC for SM chips
and 260ºC for Radial Leaded capacitors.
The total immersion time in the solder should be kept to
a minimum. It is strongly recommended that Sn/Ni plated
terminations are specied for wave soldering applications.
PdAg termination is particularly susceptible to leaching when
subjected to lead free wave soldering and is not generally
recommended for this application.
Total immersion exposure time for Sn/Ni terminations is
30s at a wave temperature of 260ºC. Note that for multiple
soldering operations, including the rework, the soldering time
is cumulative.
The pre-heat ramp should be such that the components see
a temperature rise of 1.5ºC to 4ºC per second as for reow
soldering. This is to maintain temperature uniformity through
the MLCC and prevent the formation of thermal gradients
within the ceramic. The preheat temperature should be within
120ºC maximum (100ºC preferred) of the maximum solder
temperature to minimise thermal shock.
Cooling to ambient temperature should be allowed to occur
naturally, particularly if larger chip sizes are being soldered.
Natural cooling allows a gradual relaxation of thermal
mismatch stresses in the solder joints. Forced cooling should
be avoided as this can induce thermal breakage.
Rework of Chip capacitors
Syfer recommend hot air/ gas as the preferred method for
applying heat for rework. Apply even heat surrounding the
component to minimise internal thermal gradients. Soldering
irons or other techniques that apply direct heat to the chip or
surrounding area, should not be used as these can result in
micro cracks being generated.
Minimise the rework heat duration and allow components to
cool naturally after soldering.
Hand soldering Radial Leaded capacitors
Radial capacitors can be hand soldered into boards using
soldering irons, provided care is taken not to touch the
body of the capacitor with the iron tip. Soldering should be
carried out from the opposite side of the board to the radial
to minimise the risk of damage to the capacitor body. Where
possible, a heat sink should be used between the solder joint
and the body, especially if longer dwell times are required.
Use of silver loaded epoxy adhesives
Chip capacitors can be mounted to circuit boards using silver
loaded adhesive provided the termination material of the
capacitor is selected to be compatible with the silver loaded
adhesive. This is normally PdAg. Standard tin nishes are
often not recommended for use with silver loaded epoxies as
there can be electrical and mechanical issues with the joint
integrity due to material mismatch.
Solder leaching
Leaching is the term for the dissolution of silver into the
solder causing a failure of the termination system which
causes increased ESR, tan δ and open circuit faults, including
ultimately the possibility of the chip becoming detached.
Leaching occurs more readily with higher temperature solders
and solders with a high tin content. Pb free solders can
be very prone to leaching certain termination systems. To
prevent leaching, exercise care when choosing solder alloys
and minimize both maximum temperature and dwell time with
the solder molten.
Plated terminations with nickel or copper anti leaching
barrier layers are available in a range of top coat nishes to
prevent leaching occurring. These nishes also include Syfer
FlexiCap™ for improved stress resistance post soldering.
Product Selector Applications for MLC capacitors
Frequency
Control/Tuning,
Impedance Matching
Frequency
Control/Tuning,
Impedance Matching
AC Noise RemovalAC Noise Removal
LCD Backlight InverterLCD Backlight Inverter
Decoupling/SmoothingDecoupling/Smoothing
Feedthrough FilteringFeedthrough Filtering
Mil/AeroMil/Aero
Harsh
Environments
Harsh
Environments
AutomotiveAutomotive
High Speed DecouplingHigh Speed Decoupling
MedicalMedical
High Frequency
Snubber
High Frequency
Snubber
Modem/Tip and RingModem/Tip and Ring
Safety CertiedSafety Certied
Class 1 DielectricsClass 1 Dielectrics
Balanced Line CapacitorsBalanced Line Capacitors
Safety CertiedSafety Certied
High CapacitanceHigh Capacitance
Low Inductance CapacitorsLow Inductance Capacitors
CapacitiveCapacitive
MLCCMLCC
Medical ImplantableMedical Implantable
250Vac range250Vac range
Low Capacitance
High Voltage, Anti Flashover
Low Capacitance
High Voltage, Anti Flashover
Class 1 Dielectrics
Low DF/ESR
Class 1 Dielectrics
Low DF/ESR
FilteringFiltering
Hi Reliability
Capacitors and Filters
Hi Reliability
Capacitors and Filters
Dipped Radial Leaded
Capacitors
Dipped Radial Leaded
Capacitors
High CapacitanceHigh Capacitance
Capacitive/Inductive PiCapacitive/Inductive Pi
MRI/Non MagneticMRI/Non Magnetic
X7R, C0G/NP0 Ranges
Non Safety Capacitors
designed for use at mains voltages
X7R, C0G/NP0 Ranges
Non Safety Capacitors
designed for use at mains voltages
X7R, C0G/NP0 Y2/X1, Y3/X2, X2
Safety Certied Ranges UL/TÜV
1808/1812/2211/2215/2220
X7R, C0G/NP0 Y2/X1, Y3/X2, X2
Safety Certied Ranges UL/TÜV
1808/1812/2211/2215/2220
SBSP/SBSG/SBSM
X7R, C0G/NP0 1206 to 2220
22pF to 470nF - 1A to 10A
SBSP/SBSG/SBSM
X7R, C0G/NP0 1206 to 2220
22pF to 470nF - 1A to 10A
X7R, X2Y IPCs
0603 to 2220
150pF to 1.2µF - 25V to 1kV
X7R, X2Y IPCs
0603 to 2220
150pF to 1.2µF - 25V to 1kV
X7R, C0G/NP0, Y2/X1, Y3/X2, X2
Safety Certied Ranges UL/TÜV
1808/1812/2211/2215/2220
X7R, C0G/NP0, Y2/X1, Y3/X2, X2
Safety Certied Ranges UL/TÜV
1808/1812/2211/2215/2220
X7R/X5R Range
0402 to 8060
100pF to 22µF - 10V to 12kV
X7R/X5R Range
0402 to 8060
100pF to 22µF - 10V to 12kV
C0G/NP0 Range
0402 to 8060
0.47pF to 1µF - 10V to 12kV
C0G/NP0 Range
0402 to 8060
0.47pF to 1µF - 10V to 12kV
AEC-Q200 X2Y IPCs
X7R and C0G/NP0 AEC-Q200 E01/E07
Feedthrough Capacitors
AEC-Q200 X2Y IPCs
X7R and C0G/NP0 AEC-Q200 E01/E07
Feedthrough Capacitors
FB9 LCD Inverter Range
1808/1812
1.5pF to 68pF - 5kV/6kV
FB9 LCD Inverter Range
1808/1812
1.5pF to 68pF - 5kV/6kV
X7R and C0G/NP0, X2Y IPCs
0603 to 2220
10pF to 1.2µF
X7R and C0G/NP0, X2Y IPCs
0603 to 2220
10pF to 1.2µF
High Reliability
Special Testing/burn in MLCC and X2Y
X7R, C0G/NP0
High Reliability
Special Testing/burn in MLCC and X2Y
X7R, C0G/NP0
AEC-Q200 Ranges
X7R, C0G/NP0
AEC-Q200 Ranges
X7R, C0G/NP0
Tandem and Open Mode
FlexiCap™ Capacitors
with extra safe electrode design
Tandem and Open Mode
FlexiCap™ Capacitors
with extra safe electrode design
115Vac 400Hz range
S02A/IECQ-CECC/MIL-PRF/Burn in
Hi Rel X2Y IPCs
115Vac 400Hz range
S02A/IECQ-CECC/MIL-PRF/Burn in
Hi Rel X2Y IPCs
X7R, C0G/NP0
4.7pF to 15µF - 10V to 10kV
X7R, C0G/NP0
4.7pF to 15µF - 10V to 10kV
E01/E07/SBSGC/SBSMC
X7R, C0G/NP0
0805 to 2220 - 1A to 20A
E01/E07/SBSGC/SBSMC
X7R, C0G/NP0
0805 to 2220 - 1A to 20A
X8R Range
Operational temperature up to 150°C
X8R Range
Operational temperature up to 150°C
X7R
1812/2220/2225
100nF to 1µF - 250Vdc
X7R
1812/2220/2225
100nF to 1µF - 250Vdc
0505/1111/1825 Ranges
X7R, C0G/NP0, High Q
0505/1111/1825 Ranges
X7R, C0G/NP0, High Q
X7R, C0G/NP0, High Q
0402 to 4040 Copper Barrier Termination
0.1pF to 6.8µF - 16V to 3kV
X7R, C0G/NP0, High Q
0402 to 4040 Copper Barrier Termination
0.1pF to 6.8µF - 16V to 3kV
C0G/NP0 Range
0402 to 8060
0.47pF to 1µF - 10V to 12kV
C0G/NP0 Range
0402 to 8060
0.47pF to 1µF - 10V to 12kV
Capacitors
and
Filters
SM and
Leaded
● FlexiCap™ is particularly recommended for these
applications where possible.
Standard MLCC range dimensions
Size Length
(L1)
mm
inches
Width
(W)
mm
inches
Max. Thickness
(T)
mm
inches
Termination Band
(L2)
mm
inches
min max
0603 1.6 ± 0.2
0.063 ± 0.008 0.8 ± 0.2
0.031 ± 0.008 0.8
0.031 0.10
0.004 0.40
0.015
0805 2.0 ± 0.3
0.08 ± 0.012 1.25 ± 0.2
0.05 ± 0.008 1.3
0.051 0.13
0.005 0.75
0.03
1206 3.2 ± 0.3
0.126 ± 0.012 1.6 ± 0.2
0.063 ± 0.008 1.6
0.063 0.25
0.01 0.75
0.03
1210 3.2 ± 0.3
0.126 ± 0.012 2.5 ± 0.3
0.1 ± 0.012 2.0
0.08 0.25
0.01 0.75
0.03
1808 4.5 ± 0.35
0.18 ± 0.014 2.0 ± 0.3
0.08 ± 0.012 2.0
0.08 0.25
0.01 1.0
0.04
1812 4.5 ± 0.35
0.18 ± 0.014 3.2 ± 0.3
0.126 ± 0.012 2.5
0.1 0.25
0.01 1.0
0.04
1825 4.5 ± 0.35
0.18 ± 0.014 6.30 ± 0.4
0.25 ± 0.016 2.5
0.1 0.25
0.01 1.0
0.04
2220 5.7 ± 0.4
0.225 ± 0.016 5.0 ± 0.4
0.197 ± 0.016 4.2
0.16 0.25
0.01 1.0
0.04
2225 5.7 ± 0.4
0.225 ± 0.016 6.3 ± 0.4
0.25 ± 0.016 4.2
0.16 0.25
0.01 1.0
0.04
3640 9.2 ± 0.5
0.36 ± 0.02 10.16 ± 0.5
0.4 ± 0.02 2.5
0.1 0.5
0.02 1.5
0.06
5550 14.0 ± 0.5
0.55 ± 0.02 12.7 ± 0.5
0.5 ± 0.02 4.2
0.16 0.5
0.02 1.5
0.06
8060 20.3 ± 0.5
0.8 ± 0.02 15.24 ± 0.5
0.6 ± 0.02 2.5
0.1 0.5
0.02 1.5
0.06
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specic requests direct to Syfer.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be
considered by request – please refer requests to the factory.
T
L2
L1
W
Standard MLCC ranges 10Vdc to 6kVdc
A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where
package size and reliability are important. All are
manufactured using Syfer’s unique wet process and
incorporate precious metal electrodes.
Ordering information - Standard MLCC ranges
1210 Y 100 0103 J X T _ _ _
Chip
size Termination Voltage Capacitance in picofarads
(pF) Capacitance
tolerance Dielectric Packaging Sufx
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Y = FlexiCapTM
termination base with
nickel barrier (100%
matte tin plating).
RoHS compliant.
H = FlexiCapTM
termination base with
nickel barrier (Tin/lead
plating with min. 10%
lead).
F = Silver Palladium.
RoHS compliant.
J = Silver base with nickel
barrier (100% matte tin
plating).
RoHS compliant.
A = Silver base with nickel
barrier (Tin/lead plating
with min. 10% lead).
010 = 10V
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
1K2 = 1.2kV
1K5 = 1.5kV
2K0 = 2kV
2K5 = 2.5kV
3K0 = 3kV
4K0 = 4kV
5K0 = 5kV
6K0 = 6kV
<1.0pF
Insert a P for the decimal
point as the
first character.
eg. P300 = 0.3pF
Values in 0.1pF steps
≥1.0pF & <10pF
Insert a P for the decimal
point as the second character.
eg. 8P20 = 8.2pF
Values are E24 series
≥10pF
First digit is 0. Second and
third digits are significant
figures of capacitance code.
Fourth digit is number of
zeros
eg. 0101 = 100pF
Values are E24 series
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
(1B)
X = X7R
(2R1)
P = X5R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specic
customer
require-
ments
1716
0.47pF p47 0.47pF p47
1.0 1p0 1.0 1p0
1.2 1p2 1.2 1p2
1.5 1p5 1.5 1p5
1.8 1p8 1.8 1p8
2.2 2p2 2.2 2p2
2.7 2p7 2.7 2p7
3.3 3p3 3.3 3p3
3.9 3p9 3.9 3p9
4.7 4p7 4.7 4p7
5.6 5p6 5.6 5p6
6.8 6p8 6.8 6p8
8.2 8p2 8.2 8p2
10pF 100 10pF 100
12 120 12 120
15 150 15 150
18 180 18 180
22 220 22 220
27 270 27 270
33 330 33 330
39 390 39 390
47 470 47 470
56 560 56 560
68 680 68 680
82 820 82 820
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10nF 103 10nF 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100nF 104 100nF 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µF 105 1.0µF 105
C0G/NP0
C0G/NP0
16V
25V
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
10V
1.5kV
2kV
2.5kV
3kV
16V
25V
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
10V
2kV
2.5kV
3kV
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
3.2mm
3.2
3.2mm
3.2mm
3.2mm
3.2
3.2
3.2
3.2
3.2mm
3.2
3.2
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
50/63V
100V
200/250V
25V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
50/63V
100V
200/250V
25V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
0603 0805 1206 1210 1808 1812 1825 2220 2225 3640
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV
5kV
6kV
5550 8060
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV 4mm
6kV 4mm
5kV 4mm
100V
50/63V
25V
16V
200/250V
10V
500V*
Capacitance
Code
Capacitance
Code
Standard MLCC - C0G/NP0 rangesStandard MLCC - C0G/NP0 ranges
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4mm
6kV
5kV 4mm
4kV 4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
4mm
3.2mm
3.2
4mm
3.2
3.2
3.2
50/63V
100V
200/250V
25V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
3.2
3.2mm
3.2
3.2
3.2
3.2mm
3.2
25V
50/63V
16V
100V
200/250V
500V
630V
10V
1kV
1.2kV
1.5kV
2kV
Note: X7R ranges on reverse Note: X7R ranges on reverse Note: X7R ranges on reverse
Note: The highlighted parts are dened as ‘dual-use’ under export
control legislation and as such are subject to export licence
restrictions. Please refer to page 9 for further details.
4mm
Note:
1) *These parts may require conformal coating post soldering.
2) Standard chip thickness = 2.5mm maximum unless specied
as 3.2 or 4.0mm..
18
X8R High Temperature capacitors
The X8R dielectric will operate from -55°C to +150°C,
with a maximum capacitance change ±15% (without
applied voltage).
The devices are available in sizes 0805 to 2225, with
voltage ranges from 25V to 250V and capacitance
values from 1nF to 1.8µF.
The capacitors have been developed by Syfer to meet
demand from various applications in the automotive
and industrial markets and in other electronic
equipment exposed to high temperatures. The
increased use of electronics in automotive “under
the hood” applications has created demand for this
product range.
The X8R range incorporates a specially formulated
termination with a nickel barrier nish that has been
designed to enhance the mechanical performance
of these SMD chip capacitors in harsh environments
typically present in automotive applications.
Capacitance Range
1.0nF to 1.8µF
Temperature Coefcient of Capacitance (TCC)
± 15% from -55°C to +150°C
Dissipation Factor (DF)
< 0.025
Insulation Resistance (IR)
100G Ω or 1000secs (whichever is the less).
Dielectric Withstand Voltage (DWV)
2.5 x rated voltage for 5±1 seconds,
50mA charging current maximum.
Ageing Rate
1% per decade (typical)
Ordering information - X8R High Temperature capacitors
1206 Y 100 0473 K N T
Chip size Termination Voltage d.c. Capacitance in picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging
0805
1206
1210
1812
2220
2225
Y = Nickel barrier
with polymeric silver
termination
025 = 25V
050 = 50V
100 = 100V
200 = 200V
250 = 250V
First digit is 0. Second and third
digits are signicant gures of
capacitance code.
The fourth digit is number of zeros
following.
Example:
0473 = 47000pF = 47nF
J = ±5%
K = ±10%
M = ±20%
N = X8R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Max cap. values according to the rated d.c. voltage
0805 1206 1210 1812 2220 2225
Min Cap. value
1.0nF 2.2nF 4.7nF 6.8nF 10nF 10nF
Max. cap value
according to the
rated dc voltage
25V 56nF 180nF 330nF 680nF 1.5µF 1.8µF
50V 33nF 120nF 220nF 470nF 680nF 1.0µF
100V
15nF 56nF 120nF 220nF 470nF 560nF
200/250V
10nF 33nF 68nF 120nF 220nF 330nF
19
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10nF 103 10nF 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100nF 104 100nF 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µF 105 1.0µF 105
1.2 125 1.2 125
1.5 155 1.5 155
1.8 185 1.8 185
2.2 225 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 3.9 395
4.7 475 4.7 475
5.6 565 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 12 126
15 156 15 156
22µF 226 22µF 226
X7R
X7R
X7R
25V
50/63V
16V
100V
200/250V
500V
630V
10V
1kV
16V
25V
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
10V
1.5kV
2kV
16V
25V
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
10V
2kV
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060
100V
50/63V
25V
16V
200/250V
10V
500V*
Capacitance
Code
Capacitance
Code
Standard MLCC - X7R rangesStandard MLCC - X7R ranges
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
25V
50/63V
100V
200/250V
16V
10V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV*
5kV*
6kV*
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
1kV
2kV
2.5kV
3kV
4kV
50/63V
100V
200/250V
500V
630V
2kV
2.5kV
3kV
4kV
5kV
1kV
1.2kV
1.5kV
Note: The highlighted parts are dened as ‘dual-use’ under export
control legislation and as such are subject to export licence
restrictions. Please refer to page 9 for further details.
50/63V
100V
200/250V
500V
1.2kV
1.5kV
630V
2kV
2.5kV
3kV
4kV
5kV
1kV
Note: C0G/NP0 ranges on reverse Note: C0G/NP0 ranges on reverse Note: C0G/NP0 ranges on reverse
Note:
1) *These parts may require conformal coating post soldering.
TCC/VCC range 2C1 (BZ) and 2X1 (BX)
TCC/VCC range
X7R capacitors are available from Syfer with a
defined capacitance variation under applied dc
voltage, across the full operating temperature
range. Whilst the capacitance of C0G/NP0 chips
does not vary with applied voltage, standard X7R
capacitors exhibit capacitance fluctuation, but with
no specified limit. For applications where a limit
is required, Syfer is able to offer either a “B” code
dielectric (conforms to MIL “BX” dielectric and IECQ-
CECC “2X1”) or “R” code dielectric (conforms to MIL
“BZ” dielectric and IECQ-CECC “2C1”).
X7R
Dielectric characteristics Stable
IECQ-CECC
EIA
MIL
2C1 2R1 2X1
- X7R -
BZ - BX
Rated temperature range -55ºC to +125ºC
Maximum capacitance charge over temperature range
No DC voltage applied ±20% ±15% ±15%
Rated DC voltage applied +20-30% -+15-25%
Syfer dielectric ordering code R X B
For part numbering, the “X” denoting the X7R dielectric code needs to be replaced by either “B” or “R”.
Please contact the Sales Office for full range information.
TCC/VCC range2C1 (BZ) and 2X1 (BX)
2X1 (BX) capacitor range
0603
0805
1206
1210
1808
1812
2220
2225
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10 103 10 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100 104 100 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µ 105 1.0µ 105
1.2µ 115 1.2µ 115
1.5µ 155 1.5µ 155
= FlexiCap™ termination only. Other values available in J, Y and F terminations.
Capacitance
Code
100V
50V
100V
200V
100V
50V
200V
100V
200V
100V
200V
100V
50V
200V
100V
200V
100V
200V
50V
50V
50V
50V
50V
Capacitance
Code
0603
0805
1206
1210
1808
1812
2220
2225
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10 103 10 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100 104 100 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µ 105 1.0µ 105
1.2µ 115 1.2µ 115
1.5µ 155 1.5µ 155
= FlexiCap™ termination only. Other values available in J, Y and F terminations.
Capacitance
Code
100V
50V
100V
50V
200V
100V
50V
200V
100V
50V
200V
100V
50V
200V
100V
50V
200V
100V
200V
100V
200V
2C1 (BZ) capacitor range
50V
50V
Capacitance
Code
High Q capacitors MS range
The Syfer MS range offers a very stable, High Q
material system that provides excellent, low loss
performance in systems below 3GHz. Available in 0402
to 3640 case sizes with various termination options
including FlexiCap™, this range of high frequency
capacitors is suitable for many applications where
economical, high performance is required.
Ordering information - High Q capacitors - MS range
0505 J 250 4P70 B Q T
Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance
tolerance Dielectric Packaging
0402
0603
0505
0805
1206
1111
1210
1812
2220
2225
3640
Y = FlexiCap™
termination base with nickel
barrier (100% matte tin plating).
RoHS compliant. Lead free.
H = FlexiCap™
termination base with nickel
barrier (Tin/lead plating with
min. 10% lead).
J = Silver base with nickel barrier
(100% matte tin plating). RoHS
compliant. Lead free.
A = Silver base with nickel
barrier (Tin/lead plating with
min. 10% lead).
050 = 50V
063 = 63V
100 = 100V
150 = 150V
200 = 200V
250 = 250V
300 = 300V
500 = 500V
630 = 630V
1K0 = 1000V
2K0 = 2000V
3K0 = 3000V
<1.0pF
Insert a P for the decimal point as the
first character.
eg. P300 = 0.3pF
Values in 0.1pF steps
≥1.0pF & <10pF
Insert a P for the decimal point as the
second character.
eg. 8P20 = 8.2pF
Values are E24 series
≥10pF
First digit is 0. Second and third digits
are significant figures of capacitance
code. Fourth digit is number of zeros
eg. 0101 = 100pF
Values are E24 series
<4.7pF
H = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
≥10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
Q = High Q
Ceramic
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
High Q capacitors - capacitance values
Chip Size 0402 0603 0505 0805 1206 1111 1210 1812 2220 2225 3640
Min Cap
0.1pF 0.1pF 0.2pF 0.2pF 0.5pF 0.3pF 0.3pF 1.0pF 2.0pF 2.0pF 4.0pF
50V 63V
33pF 220pF 330pF 680pF 2.2nF
100V
22pF 150pF 220pF 470pF 1.5nF 3.3nF 3.3nF 6.8nF 15nF 18nF
150V
18pF 120pF 180pF 390pF 1.2nF 2.7nF 2.7nF 4.7nF 12nF 15nF
200V250V
15pF 100pF 150pF 330pF 1.0nF 2.2nF 2.2nF 3.9nF 10nF 10nF
300V
56pF 100pF 220pF 680pF 1.5nF 1.5nF 3.3nF 6.8nF 8.2nF
500V
100pF 330pF 820pF 820pF 2.2nF 4.7nF 5.6nF 15nF
630V
150pF 390pF 390pF 1.0nF 2.2nF 3.3nF 6.8nF
1000V
82pF 220pF 220pF 680pF 1.5nF 2.2nF 4.7nF
2000V
18pF 68pF 68pF 150pF 470pF 560pF 1.5nF
3000V
68pF 150pF 220pF 470pF
Tape quantities
7” reel
5000 7” reel
4000 7” reel
2500 7” reel
3000 7” reel
2500 7” reel
1000 7” reel
2000
7” reel
500
13” reel
2000
7” reel
500
13” reel 2000
7” reel
500
13” reel 2000
7” reel
n/a
13” reel
n/a
13” reel quantities available on request
Below 1pF capacitance values are available in 0.1pF steps.
Above 1pF capacitance values are available in E24 series values.
Other values and taping quantities may be available on request, consult the sales office for details.
Operating Temperature
-55°C to +125°C
Temperature Coefcient (Typical)
0 ± 30 ppm/°C
Insulation resistance at +25°C
>100GΩ
Insulation resistance at +125°C
>10GΩ
* Refer to the Sales Ofce for other chip size electrical data.
High Q capacitorsMS range
Typical performance data - 0805 chip size*
0.01
0.1
1
100 1000
ESR (Ohms)
Frequenc
y
(MHz)
ESR vs Frequency
1111 case size
1pF 4.7pF 10pF 100pF
Q
Capacitance (pF)
Q vs Capacitance
1111 case size
1
10
100
1000
10000
100000
0.1 110 100 1000
150 MHz 500 MHz 1 GHz
Frequency (Mhz)
Capacitance (pF)
Resonant Frequency vs Capacitance
0805 case size
100
1000
10000
100000
0.1 110 100 1000
Series Parallel
0.01
0.1
1
100 1000
ESR (Ohms)
Frequency (MHz)
ESR vs Frequency
0805 case size
1pF 4.7pF 10pF 100pF
Typical performance data - 1111 chip size*
Frequency (Mhz)
Capacitance (pF)
Resonant Frequency vs Capacitance
1111 case size
0.1 110 100 1000
Series Parallel
100
1000
10000
100000
Q
Capacitance (pF)
Q vs Capacitance
0805 case size
1
10
100
1000
10000
100000
0.1 110 100 1000
150 MHz 500 MHz 1 GHz
Copper Barrier capacitors
Multilayer ceramic capacitors with silver/palladium
(Ag/Pd) terminations have often been used in medical
applications where non-magnetic components are
required, for example in MRI equipment. The use of
conventional nickel barrier terminations is not suitable
due to nickel exhibiting magnetic properties.
However, RoHS requirements have dictated the use of
lead-free solders, and the composition of these solders
has resulted in an increase in soldering temperatures.
This has caused solder leaching problems for the Ag/
Pd termination, and meant alternative terminations
have had to be found.
As copper is non-magnetic, one solution is to use
a copper barrier instead of a nickel barrier, with a
tin nish on top, and this is the solution Syfer has
developed.
This copper barrier termination is offered with
selected non-magnetic C0G/NP0, High Q and X7R
dielectrics, providing a fully non-magnetic component.
To meet high temperature 260ºC soldering reow
Ordering information - Copper Barrier capacitors
1210 3 100 0103 J X T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
2 = Sintered silver base
with copper barrier (100%
matte tin plating). RoHS
compliant.
(available on C0G/NP0 &
High Q only).
3 = FlexiCap™ base with
copper barrier (100%
matte
tin plating). RoHS
compliant.
4 = Sintered silver base
with copper barrier (tin/
lead plating). Non RoHS
compliant.
(available on C0G/NP0 &
High Q only).
5 = FlexiCap™ base
with copper barrier (tin/
lead plating). Non RoHS
compliant.
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
150 = 150V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1000V
1K2 = 1200V
1K5 = 1500V
2K0 = 2000V
3K0 = 3000V
<10pF Insert a P for the
decimal point,
eg P300 = 0.3pF, 8P20 =
8.2pF.
10pF 1st digit is 0. 2nd
and 3rd digits are significant
figures of capacitance code.
The 4th digit is number of
0’s following
eg. 0103 = 10000pF
Values <1pF in 0.1pF steps,
above this values are E24
series
<4.7pF
H = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
4.7pF &
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
C = C0G/NP0 (1B)
X = X7R (2R1)
Q = High Q
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Used for specific
customer
requirements
C0G/NP0, High Q, X7R
proles as detailed in J-STD-020, C0G/NP0 dielectrics
are supplied with sintered termination and X7R
dielectrics are supplied with Syfer’s award winning
FlexiCap™ termination.
Chip Size 0402 0603 0505 0805 1206 1111
1210 1808 1812 2220 2225
Min Cap 0.1pF 0.1pF 0.2pF 0.2pF 0.5pF 0.3pF 1.0pF 1.0pF 2.0pF 2.0pF
Min Cap Tolerance
±0.05pF (<4.7pF), 0.1pF (>4.7pF & <10pF) and ±1% (>10pF)
50V 63V 22pF 100pF 220pF 470pF 1.5nF - - - - -
100V 15pF 68pF 150pF 330pF 1.0nF 2.2nF 2.2nF 4.7nF 10nF 15nF
150V 10pF 47pF 100pF 220pF 680pF 1.5nF 1.5nF 3.3nF 6.8nF 10nF
200V250V 6.8pF 33pF 56pF 150pF 470pF 1.0nF 1.0nF 2.2nF 4.7nF 6.8nF
300V - 27pF 47pF 120pF 390pF 820pF 820pF 1.8nF 3.9nF 5.6nF
500V - - - 68pF 270pF 680pF 680pF 1.5nF 3.3nF 4.7nF
630V - - - - 150pF 390pF 390pF 1.0nF 2.2nF 3.3nF
1000V - - - - 82pF 220pF 220pF 680pF 1.5nF 2.2nF
2000V - - - - 18pF 68pF 68pF 150pF 470pF 560pF
3000V - - - - - - - 68pF 150pF 220pF
C0G/NP0 & High Q - maximum capacitance values
Chip Size
0402 0603 0805 1206 1210 1808 1812 2220 2225
Min Cap 47pF 100pF 330pF 680pF 1.5nF 2.2nF 3.3nF 6.8nF 10nF
Min Cap
Tolerance ±5%
16V 10nF 100nF 330nF 1.0µF 1.5µF 1.5µF 3.3µF 5.6µF 6.8µF
25V 6.8nF 68nF 220nF 820nF 1.2µF 1.2µF 2.2µF 4.7µF 5.6µF
50V 63V 4.7nF 47nF 150nF 470nF 1.0µF 680nF 1.5µF 3.3µF 3.3µF
100V 1.5nF 10nF 47nF 150nF 470nF 330nF 1.0µF 1.5µF 1.5µF
200V250V 680pF 5.6nF 27nF 100nF 220nF 180nF 470nF 1.0µF 1.0µF
500V - 1.5nF 8.2nF 33nF 100nF 100nF 270nF 560nF 680nF
630V - - 4.7nF 10nF 27nF 33nF 150nF 330nF 390nF
1000V - - 3.3nF 4.7nF 15nF 18nF 56nF 120nF 150nF
1200V - - - 3.3nF 10nF 10nF 33nF 82nF 100nF
1500V - - - 2.7nF 6.8nF 6.8nF 22nF 47nF 68nF
2000V - - - 2.2nF 4.7nF 4.7nF 10nF 27nF 33nF
X7R - maximum capacitance values
Copper Barrier capacitorsC0G/NP0, High Q, X7R
Note: Other capacitance values may become available, please contact our Sales Office if you need values other than those shown in the above tables.
For dimensions and soldering information, please go to our website (www.syfer.com) or see our MLC Catalogue.
Reeled Quantities
7” Reel 5000 4000 2500 3000 2500 10002000 2000 500 500 500
13” Reel 13” reel quantities available on request 8000 2000 2000 2000
Tandem max capacitance (X7R only)
0603 0805 1206 1210 1812 2220 2225
16V 12nF 47nF 150nF 270nF 560nF 1.2µF 1.5µF
25V
10nF 39nF 120nF 220nF 470nF 1.0µF 1.2µF
50/63V
6.8nF 33nF 100nF 180nF 390nF 680nF 1.0µF
100V 2.2nF 10nF 47nF 82nF 220nF 470nF 680nF
200/
250V 1.0nF 4.7nF 22nF 47nF 100nF 220nF 330nF
Tandem Capacitors have been designed as a fail
safe range using a series section internal design, for
use in any application where short circuits would be
unacceptable.
When combined with Syfer’s FlexiCap™ termination, Syfer
Tandem capacitors provide an ultra robust and reliable
component, for use in the most demanding applications.
Qualication included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no f ailur es evident due to short ci rcuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 50%.
Open Mode and Tandem capacitors
Qualication included cracking the components by severe bend tests.
Following the bend tests cracked components were subjected to
endurance / humidity tests, with no f ailur es evident due to short ci rcuits.
Note: Depending on the severity of the crack, capacitance loss was
between 0% and 70%.
Open Mode capacitor -
Open Mode max capacitance (X7R only)
0603 0805 1206 1210 1812 2220 2225
16V 39nF 150nF 470nF 680nF 1.5µF 3.3µF 4.7µF
25V
33nF 120nF 330nF 560nF 1.2µF 2.2µF 3.9µF
50/63V
22nF 100nF 220nF 470nF 1.0µF 1.5µF 2.7µF
100V 6.8nF 27nF 100nF 220nF 680nF 1.0µF 1.8µF
200/
250V 2.7nF 15nF 68nF 100nF 330nF 680nF 1.0µF
Ordering information - Open Mode and Tandem capacitors
1206 Y 050 0224 K X T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
0603
0805
1206
1210
1812
2220
2225
Y = Polymer
Termination
FlexiCap™
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
First digit is 0. Second
and third digits are
signicant gures of
capacitance code.
The fourth digit is
number of zeros
following.
Example:
0224 = 220000pF
K = ±10% X = X7R
E = X7R
(AEC-Q200
product)
T = 178mm
(7”) reel
R = 330mm
(13”) reel
M01 =
Syfer
Open Mode
capacitor
T01 =
Syfer
Tandem
capacitor
X7R
Open Mode capacitors have been designed specically
for use in applications where mechanical cracking is a
severe problem and short circuits due to cracking are
unacceptable.
Open Mode capacitors use inset electrode margins,
which prevent any mechanical cracks which may form
during board assembly from connecting to the internal
electrodes.
When combined with Syfer’s FlexiCap™ termination, Syfer
Open Mode capacitors provide a robust component with the
assurance that if a part becomes cracked, the crack will be
unlikely to result in short circuit failure.
Tandem capacitor -
Speciality High Rel. and approved parts
IECQ-CECC - maximum capacitance values
0603 0805 1206 1210 1808 1812 2220 2225
16V
C0G/NP0
1.5nF 6.8nF 22nF 33nF 33nF 100nF 150nF 220nF
X7R
100nF 330nF 1.0µF 1.5µF 1.5µF 3.3µF 5.6µF 6.8µF
25V
C0G/NP0
1.0nF 4.7nF 15nF 22nF 27nF 68nF 100nF 150nF
X7R
56nF 220nF 820nF 1.2µF 1.2µF 2.2µF 4.7µF 5.6µF
50/63V
C0G/NP0
470pF 2.7nF 10nF 18nF 18nF 33nF 68nF 100nF
X7R
47nF 220nF 470nF 1.0µF 680nF 1.5µF 2.2µF 3.3µF
100V
C0G/NP0
330pF 1.8nF 6.8nF 12nF 12nF 27nF 47nF 68nF
X7R
10nF 47nF 150nF 470nF 330nF 1.0µF 1.5µF 1.5µF
200V
C0G/NP0
100pF 680pF 2.2nF 4.7nF 4.7nF 12nF 22nF 27nF
X7R
5.6nF 27nF 100nF 220nF 180nF 470nF 1.0µF 1.0µF
500V
C0G/NP0
n/a 330pF 1.5nF 3.3nF 3.3nF 10nF 15nF 22nF
X7R
n/a 8.2nF 33nF 100nF 100nF 270nF 560nF 820nF
1kV
C0G/NP0
n/a n/a 470pF 1.0nF 1.2nF 3.3nF 8.2nF 10nF
X7R
n/a n/a 4.7nF 15nF 18nF 56nF 120nF 150nF
Ordering information - IECQ-CECC ranges
1210 Y 100 0103 J D T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
Release codes Packaging Sufx
code
Y = FlexiCapTM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
H = FlexiCapTM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F = Silver Palladium. RoHS
compliant.
J = Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A = Silver base with nickel
barrier (Tin/lead plating
with min. 10% lead).
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
First digit is 0.
Second and third
digits are signicant
gures of capacitance
code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
D = X7R
(2R1) with IECQ-
CECC release
F = C0G/NP0
(1B/NP0) with IECQ-
CECC release
B = 2X1/
BX released in
accordance with
IECQ-CECC
R = 2C1/
BZ released in
accordance with
IECQ-CECC
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specic
customer
require-
ments
A range of specialist high reliability MLCC’s for use in
critical or high reliability environments. All fully tested
/ approved and available with a range of suitable
termination options, including tin/lead plating and
Syfer Flexicap™.
Ranges include :-
1. Range tested and approved in accordance with
IECQ-CECC QC32100.
2. Range qualied to the requirements of AEC-Q200.
3. Range qualied to the requirements of ESCC 3009
European Space Specication.
IECQ-CECC ranges
Speciality High Rel. and approved parts
S02A Space ranges
Maximum capacitance values
0603 0805 1206 1210 1812 2220 2225
16V
C0G/
NP0 390pF - 1.5nF 1pF - 6.8nF 1pF - 22nF 10pF - 33nF 220pF - 100nF 470pF - 150nF 560pF - 220nF
X7R 330pF - 100nF 100pF - 330nF 680pF - 1.0µF 1.0nF - 1.5µF 3.9nF - 3.3µF 10nF - 5.6µF 18nF - 6.8µF
25V
C0G/
NP0 390pF - 1.0nF 1pF - 4.7nF 1pF - 15nF 10pF - 22nF 220pF - 68nF 470pF - 100nF 560pF - 150nF
X7R 330pF - 56nF 100pF - 220nF 680pF - 820nF 1.0nF - 1.2µF 3.9nF - 2.2µF 10nF - 4.7µF 18nF - 5.6µF
50/63V
C0G/
NP0 0.5pF - 470pF 1pF - 2.7nF 1pF - 10nF 10pF - 18nF 220pF - 39nF 470pF - 68nF 560pF - 100nF
X7R 330pF - 47nF 100pF - 220nF 680pF - 470nF 1.0nF - 1.0µF 3.9nF - 2.2µF 10nF - 3.3µF 18nF - 3.3µF
100V
C0G/
NP0 1pF - 330pF 1pF - 1.8nF 1pF - 6.8nF 10pF - 12nF 220pF - 27nF 470pF - 47nF 560pF - 68nF
X7R 100pF - 10nF 100pF - 47nF 100pF - 150nF 1.0nF - 470nF 3.9nF - 1.0µF 10nF - 1.5µF 18nF - 1.5µF
200V
C0G/
NP0 1pF - 100pF 1pF - 680pF 1pF - 2.2nF 10pF - 4.7nF 220pF - 12nF 470pF - 22nF 560pF - 27nF
X7R 100pF - 5.6nF 100pF - 27nF 100pF - 100nF 1.0nF - 220nF 3.9nF - 470nF 10nF - 1.0µF 18nF - 1.0µF
500V
C0G/
NP0 - 1pF - 270pF 1pF - 1.2nF 10pF - 2.7nF 180pF - 6.8nF 390pF - 15nF 4.7nF - 18nF
X7R - 10pF - 8.2nF 180pF - 33nF 390pF - 100nF 390pF - 270nF 1nF - 560nF 15nF - 820nF
Note: In accordance with ESCC 3009.
Ordering information - S02A Space ranges product code construction
1210 A 100 0103 J X T _ _ _
Chip
size Termination(1) Voltage Capacitance in
picofarads (pF) Capacitance
tolerance
Dielectric
Rel
Release codes Packaging Sufx code
A = Silver base with
nickel barrier (Tin/
lead plating with min.
10% lead).
F = Silver Palladium.
RoHS compliant.
H = FlexiCapTM
termination base
with Ni barrier (Tin/
lead plating with min.
10% lead).
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
500 = 500V
First digit is 0.
Second and third digits
are signicant gures of
capacitance code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
(1B)
X = X7R
(2R1)
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Q = Wafe
pack
Used for
specic
customer
requirements
S02A =
S (Space
Grade) High
Rel
Notes:
(1) Termination A, H & F available for Space applications. If another termination type is required then contact Syfer Sales.
(2) Please include Lot Acceptance Test requirement (LAT1, LAT2 or LAT3) on purchase order against each line item.
Tests conducted after 100% Burn-In (2xRV @125ºC for 168 hours):
LAT1: 4 x adhesion, 8 x rapid temp change + LAT2 and LAT3.
LAT2: 20 x 1000 hour life test + LAT3.
LAT3: 6 x TC and 4 x solderability.
AEC-Q200 ranges
AEC-Q200 ranges
0603 0805 1206 1210 1812
50/63V
C0G/NP0 470pF 2.7nF 10nF 18nF 39nF
X7R 33nF 150nF 330nF 680nF 1.5µF
100V C0G/NP0 330pF 1.8nF 6.8nF 12nF 27nF
X7R 10nF 47nF 150nF 470nF 1µF
200V C0G/NP0 100pF 680pF 2.2nF 4.7nF 12nF
X7R 5.6nF 27nF 100nF 220nF 470nF
500V C0G/NP0 n/a 330pF 1.5nF 3.9nF 10nF
X7R n/a 8.2nF 33nF 100nF 270nF
630V C0G/NP0 n/a n/a 1.0nF 1.8nF 5.6nF
X7R n/a n/a 10nF 27nF 150nF
1kV C0G/NP0 n/a n/a 470pF 1nF 3.3nF
X7R n/a n/a 4.7nF 15nF 56nF
3 Terminal EMI Components (E01) - AEC-Q200 ranges
0805 1206 1806
50V C0G/NP0
820pF 1.0nF 2.2nF
X7R 47nF 100nF 200nF
100V C0G/NP0 560pF 1.0nF 2.2nF
X7R 15nF 15nF 68nF
Note: For some lower capacitance parts, higher voltage rated parts may be supplied.
Refer to page 36.
X2Y Integrated Passive Components (E03) - AEC-Q200 ranges
0805 1206 1410 1812
50V C0G/NP0
470pF 1.5nF 5.6nF 10nF
X7R 33nF 150nF 330nF 560nF
100V C0G/NP0 330pF 1.0nF 3.9nF 6.8nF
X7R 15nF 47nF 150nF 330nF
Note: For some lower capacitance parts, higher voltage rated parts may be supplied.
Refer to page 38.
Maximum capacitance values
Ordering information - AEC-Q200
1210 Y 100 0103 J E T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
Release codes Packaging Sufx
code
Y = FlexiCapTM
termination base with Ni barrier
(100% matte tin plating). RoHS
compliant.
H = FlexiCapTM
termination base with Ni barrier
(Tin/lead plating with min. 10%
lead).
F = Silver Palladium. RoHS
compliant.
J = Silver base with nickel barrier
(100% matte tin plating). RoHS
compliant.
A = Silver base with nickel barrier
(Tin/lead plating with min. 10%
lead).
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
First digit is 0.
Second and third
digits are signicant
gures of
capacitance code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
E = X7R
(2R1) AEC-Q200
A = C0G/NP0
(1B/NP0) AEC-Q200
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specic
customer
require-
ments
Speciality High Rel. and approved parts S02A Space ranges
Maximum capacitance values
Maximum capacitance values
Safety Certified
capacitors
Syfer Technology’s Safety Certied capacitors comply
with international UL and TÜV specications to
offer designers the option of using a surface mount
ceramic multilayer capacitor to replace leaded lm
types. Offering the benets of simple pick-and-place
assembly, reduced board space required and lower
prole, they are also available in a FlexiCap™ version
to reduce the risk of mechanical cracking.
Syfer’s high voltage capacitor expertise means the
range offers among the highest range available of
capacitance values in certain case sizes. Applications
include: modems, AC-DC power supplies and where
lightning strike or other voltage transients represent a
threat to electronic equipment.
Safety Certied capacitors
Surface mount multilayer ceramic capacitors
Meet Class Y2/X1, Y3/X2 and X2 requirements
Approved for mains ac voltages, up to 250Vac
Approved by UL and TÜV
Sizes 1808, 1812, 2211, 2215 and 2220
Smaller sizes suitable for use in equipment certified to
EN60950
Class Rated voltage Impulse voltage Insulation bridging May be used in primary circuit
Y1 250Vac 8000V Double or reinforced Line to protective earth
Y2 250Vac 5000V Basic or supplementary* Line to protective earth
Y3 250Vac None Basic or supplementary -
Y4 150Vac 2500V Basic or supplementary* Line to protective earth
X1 250Vac 4000V - Line to line
X2 250Vac 2500V - Line to line
X3 250Vac None - Line to line
* 2 x Y2 or Y4 rated may bridge double or reinforced insulation when used in series.
Certification specifications for larger sizes include IEC/
EN60384, UL/CSA60950 and UL1414
Surface mount package
Reduces board area and height restrictions
Reduced assembly costs over conventional through hole
components
FlexiCap™ option available on all sizes.
Safety Certied capacitorsCertication Chart
Safety Certied capacitors classication and approval specication.
Rheinland
Product Safety
BAUART
GEPRÜFT
TYPE
APPROVED
CHIP SIZE DIELECTRIC CAP RANGE SYFER FAMILY
CODE CLASSIFICATION APPROVAL SPECIFICATION APPROVAL
BODY
1808 C0G/NP0
4.7pF
to
1.5nF
SP(1) Y3/X2
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
1808 X7R
150pF
to
2.2nF
SP(1) Y3/X2
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
1808 C0G/NP0
4.7pF
to
390pF
PY2(1) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
1808 X7R
150pF
to
1nF
PY2(1) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
1812 C0G/NP0
4.7pF
to
390pF
PY2(1) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
1812 X7R
150pF
to
1.0nF
PY2(1) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
2211 C0G/NP0
4.7pF
to
1nF
SP(2) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
2211 X7R
100pF
to
2.2nF
SP(2) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
2215 C0G/NP0
820pF
to
1.0nF
SP(2) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
2215 X7R
2.7nF
to
3.3nF
SP(2) Y2/X1
NWGQ2, NWGQ8
IEC60384-14:2005
EN60384-14:2005
UL-60950-1, 2nd Ed
CSA 60950-1-07 2nd Ed
TÜV
UL
2220 X7R
150pF
to
4.7nF
B16
Y2/X1(2)
Y2/X1,(1)FOWX2
IEC60384-14:2005
EN60384-14:2005
UL1414: 6th Edition
TÜV
UL
2220 X7R
150pF
to
10nF
B17(2) X2 IEC60384-14:2005
EN60384:2005 TÜV
Notes Termination Availability
(1), (2) J: Silver base with Nickel Barrier (100% Matte Tin Plating). RoHS compliant.
(1), (2) Y: FlexiCap™ termination base with Nickel Barrier (100% Tin Plating). RoHS compliant.
(2) H: FlexiCap™ termination base with Nickel Barrier (Tin/ Lead plating with min 10% Lead).
(2) A: Silver base with Nickel Barrier (Tin/ Lead Plating with min 10% Lead).
PY2 Unmarked capacitors also available as released in accordance with approval specifications. Family code SY2 applies.
SP Unmarked capacitors also available as released in accordance with approval specifications. Family code SPU applies.
Ordering information - Safety Certied capacitors - Class SPU/SP ranges
1808 J A25 0102 J C T SP
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
1808
2211
2215
J = Nickel barrier
Y = FlexiCapTM
termination base
with nickel barrier
(100% matte tin
plating). RoHS
compliant.
2211/2215 only
A = Silver base
with nickel barrier
(Tin/lead plating
with min. 10%
lead).
H = FlexiCapTM
termination base
with Ni barrier
(Tin/lead plating
with min. 10%
lead).
A25 = 250Vac First digit is 0.
Second and
third digits are
signicant gures of
capacitance code.
The fourth digit is
number of zeros
following.
Example:
0102 = 1.0nF
<10pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
SP = Surge Protection
capacitors (marked and
approved)
SPU = Surge Protection
capacitors (un-marked parts
are in accordance with, but
not certied)
Safety Certied capacitors
Ordering information - Safety Certied capacitors - Class PY2/SY2
1808 J A25 0102 J X T PY2
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
1808
1812 J = Nickel barrier
Y = FlexiCapTM
termination base
with nickel barrier
(100% matte tin
plating). RoHS
compliant.
A25 = 250Vac First digit is 0.
Second and third
digits are signicant
gures of capacitance
code.
The fourth digit is
number of zeros
following.
Example:
0102 = 1.0nF
<10pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
PY2 = Safety tested
Surge Protection capacitors
(marked and approved)
SY2 = Surge Protection
capacitors (un-marked parts
are in accordance with, but
not certied)
Ordering information - Safety Certied capacitors - Class B16/B17 ranges
2220 J A25 0102 J X T B16
Chip
size Termination Voltage Capacitance in
picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
2220 J = Nickel barrier
Y = FlexiCapTM
termination base
with nickel barrier
(100% matte tin
plating). RoHS
compliant.
A = Silver base
with nickel barrier
(Tin/lead plating
with min. 10%
lead).
H = FlexiCapTM
termination base
with Ni barrier (Tin/
lead plating with
min. 10% lead).
A25 = 250Vac First digit is 0. Second
and third digits are
signicant gures of
capacitance code.
The fourth digit is
number of zeros
following.
Example:
0471 = 470pF
J = ±5%
K = ±10%
M = ±20%
X = X7R
T = 178mm
(7”) reel
1000 pieces
R = 330mm
(13”) reel
4000 pieces
B = Bulk
B16 = Type A: X1/Y2
B17 = Type B: X2
Ordering information 250Vac Non Safety Rated AC capacitors
Industry wide standard multilayer ceramic capacitors
are supplied with a DC rating only. For AC use, Surge
and Safety capacitors with an AC rating of 250Vac
have been available but the capacitance range
is limited as a result of the strict impulse and VP
requirements in the international standards. Syfer
Technology have developed a range which provides a
solution for use at up to 250Vac 60Hz continuous use
and provides for non safety-critical applications where
extended capacitance ranges are required.
Capacitance range
Case sizes 0805 to 2220 are available in both X7R
and C0G/NP0 dielectrics with capacitances of up to
120nF. The capacitance ranges are divided into four
groups which are based on the voltage coefcient
of capacitance, C0G/NP0 which has negligible
capacitance shift with applied voltage and three
subgroups of X7R. Type A with ±30% maximum
capacitance shift 0V-240V, Type B with +30% to
Ordering information - 250Vac Non Safety Rated AC capacitors
1812 Y A25 0103 K X T
Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging
0805
1206
1210
1808
1812
2220
Y = FlexiCap™
J = Nickel Barrier
250Vac
60Hz
<10pF Insert a P for the decimal point,
eg P300 = 0.3pF, 8P20 = 8.2pF.
10pF 1st digit is 0. 2nd and 3rd digits
are significant figures of capacitance
code. The 4th digit is number of 0’s
following
eg. 0103 = 10000pF
Values <1pF in 0.1pF steps, above this
values are E24 series
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
C = C0G/NP0
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack - tubs
Chip size 0805 1206 1210 1808 1812 2220
C0G/NP0 1.0pF - 470pF 1.0pF - 1.2nF 4.7pF - 2.2nF 4.7pF - 2.2nF 10pF - 5.6nF 10pF - 10nF
X7R A
‡30% 560pF - 1.5nF 1.5nF - 10nF 2.7nF - 22nF 2.7nF - 22nF 6.8nF - 56nF 12nF - 120nF
X7R B
+30% -50% 1.8nF - 3.3nF 12nF 27nF 27nF 68nF - 82nF -
X7R C
+30% -80% 3.9nF - 10nF 15nF - 47nF 33nF - 100nF 33nF - 100nF 100nF - 120nF -
NOTE: X7R A) has a VCC of
± 30% over 0 to 240Vac 50Hz
X7R B)
has a VCC of
+30% to -50% over 0 to 240Vac 50Hz
X7R C)
has a VCC of
+30% to -80% over 0 to 240Vac 50Hz
Measurement conditions described in Syfer Application Notes AN0033
-50% maximum capacitance shift 0V-240V and Type
C with +30 to -80% maximum capacitance shift 0V to
240V.
115Vac 400Hz & DWV ranges
Syfer Technology has conducted reliability testing on
standard surface mount ceramic capacitors in order
to ensure their performance at 115Vac 400Hz and the
associated voltage and frequency transients required
by MIL-STD-704. Self heating will occur due to losses
in the capacitor but has been measured at less than
25°C rise with neutral mounting conditions at room
temperature.
115Vac 400Hz Capable capacitor range
0805 1206 1210 1808 1812 2220
Dielectric Capacitance values
C0G/NP0 330pF 1.5nF 3.9nF 3.9nF
10nF 15nF
X7R 4.7nF 18nF 39nF 39nF
82nF 100nF
Ordering information -
115Vac 400Hz Capable
capacitors
1206 Y A12 0103 J X T
Chip size Termination Voltage Capacitance in picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging
0805
1206
1210
1808
1812
2220
J = Nickel barrier
Y = FlexiCap™
A = (Tin/lead)
H = FlexiCap™
(Tin/lead)
A12 = 115Vac First digit is 0.
Second and third digits are signicant
gures of capacitance code.
The fourth digit is number of zeros
following.
Example:
0103 = 10nF
<4.7pF
H = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
4.7pF &
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
C = C0G/NP0
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
The Syfer DWV range is specifically designed
for use in applications where a high Dielectric
Withstand Voltage (DWV) is required.
These parts have a continuous rated voltage of
500Vdc minimum and are 100% DWV tested at
the specified voltages to ensure Flashover (arcing)
across the surface does not occur.
High Dielectric Withstand
Voltage capacitors
(DWV range)
High dielectric withstand voltages (DWV) of 1.5kV and 2.5kV
These ratings are based on an application of the DWV
voltage for a period of up to 60 seconds (where the charging
current is limited to 50mA)
Case sizes 1206 to 2225
C0G/NP0 and X7R dielectrics
Ordering information - DWV capacitors
1812 J 1K5 0820 K C T DWV
Chip
size Termination Dielectric
Withstand
Voltage Capacitance in picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
1206
1210
1808
1812
2220
2225
J = Nickel
barrier
Y = FlexiCap™
1K5 = 1500V
2K5 = 2500V First digit is 0. Second and third
digits are signicant gures of
capacitance code.
The fourth digit is number of zeros
following.
Example:
0820 = 82pF
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Dielectric
Withstand
Voltage
Capacitance values from 4.7pF to 120nF
For full range information please see Syfer web site, or
contact our Sales Office.
LCD Inverter chip rangeC0G/NP0
Syfer Technology has developed a range of surface
mount multilayer ceramic capacitors aimed specically
at the LCD inverter market. The advantage gained over
standard product is a reduced susceptibility to surface
arcing which allows for the replacement of leaded
components. The improved properties are achieved
by the utililisation of a unique C0G/NP0 dielectric
material.
Parts for these applications are identied with the
sufx code FB9.
Users should carefully consider solder pad design as
this can inuence arcing voltage.
Ordering information - LCD Inverter range
1808 Y 5K0 0220 J C T FB9
Chip
size Termination Voltage d.c. Capacitance in picofarads (pF) Capacitance
tolerance Dielectric
codes Packaging Sufx
1808
1812 Y = FlexiCap™
termination base
with Nickel barrier
(100% matte tin
plating).
RoHS compliant.
J = Nickel barrier.
5K0 = 5kV
6K0 = 6kV
<1.0pF
Insert a P for the decimal point
as the
first character.
eg. P300 = 0.3pF
Values in 0.1pF steps
≥1.0pF & <10pF
Insert a P for the decimal point as
the second character.
eg. 8P20 = 8.2pF
Values are E24 series
≥10pF
First digit is 0. Second and third
digits are significant figures of
capacitance code. Fourth digit is
number of zeros
eg. 0101 = 100pF
Values are E24 series
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
C = C0G/NP0
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
LCD Inverter
range
Capacitance range
1808 1812
5kV 1.5pF - 22pF 3.9pF - 68pF
6kV 1.5pF - 12pF 3.9pF - 33pF
115Vac 400Hz Capable capacitors for
aerospace applications
Surface mount EMI Filters
Dimensions
0603 0805 1206 1806
L
1.6 ± 0.2
(0.063 ± 0.008) 2.0 ± 0.3
(0.079 ± 0.012) 3.2 ± 0.3
(0.126 ± 0.012) 4.5 ± 0.35
(0.177 ± 0.014)
W
0.8 ± 0.2
(0.003 ± 0.008) 1.25 ± 0.2
(0.049 ± 0.008) 1.6 ± 0.2
(0.063 ± 0.008) 1.6 ± 0.2
(0.063 ± 0.008)
T
0.5 ± 0.15
(0.02 ± 0.006) 1.0 ± 0.15
(0.039 ± 0.006) 1.1 ± 0.2
(0.043 ± 0.008) 1.1 ± 0.2
(0.043 ± 0.008)
B1
0.3 ± 0.2
(0.012 ± 0.008) 0.60 ± 0.2
(0.024 ± 0.008) 0.95 ± 0.3
(0.037 ± 0.012) 1.4 ± 0.3
(0.055 ± 0.012)
B2
0.2 ± 0.1
(0.008 ± 0.004) 0.3 ± 0.15
(0.012 ± 0.006) 0.5 ± 0.25
(0.02 ± 0.01) 0.5 ± 0.25
(0.02 ± 0.01)
0603 0805 1206 1806
A0.6 (0.024) 0.95 (0.037) 1.2 (0.047) 1.2 (0.047)
B0.6 (0.024) 0.9 (0.035) 0.9 (0.035) 1.4 (0.055)
C0.4 (0.016) 0.3 (0.012) 0.6 (0.024) 0.8 (0.031)
D0.2 (0.008) 0.4 (0.016) 0.8 (0.031) 1.4 (0.055)
E0.4 (0.016) 0.75 (0.030) 1.0 (0.039) 1.4 (0.055)
Notes: 1) All dimensions mm (inches).
2) Pad widths less than chip width gives improved mechanical performance.
3) The solder stencil should place 4 discrete solder pads. The unprinted distance between ground pads is shown as dim E.
4) Insulating the earth track underneath the lters is acceptable and can help avoid displacement of lter during soldering but can result in residue entrapment under
the chip.
Recommended
solder lands
C
B
A
D
E
E01 & E07 feedthrough capacitors
Type E01 E07
Chip Size 0603 0805 1206 1806 0603 0805 1206 1806
Max Current 300mA 300mA 300mA 300mA 1A 2A 2A 2A
Rated Voltage Dielectric Minimum and maximum capacitance values
25Vdc C0G/NP0 150pF-390pF 180pF-1.5nF 560pF-3.9nF 820pF-4.7nF 150pF-390pF 180pF-1.5nF 560pF-3.9nF 820pF-4.7nF
X7R 6.8nF-18nF 470pF-100nF 5.6nF-330nF 3.9nF-560nF 6.8nF-18nF 820pF-100nF 10nF-330nF 22nF-560nF
50Vdc C0G/NP0 10pF-56pF 22pF-820pF 22pF-3.3nF 22pF-3.9nF 12pF-56pF 10pF-220pF 22pF-1nF 100pF-2.2nF
X7R 2.7nF-12nF 560pF-68nF 4.7nF-220nF 3.3nF-330nF 2.7nF-12nF 1nF-68nF 10nF-220nF 22nF-330nF
100Vdc C0G/NP0 -22pF-560pF 22pF-2.2nF 22pF-3.3nF - 10pF-120pF 22pF-560pF 100pF-680pF
X7R - 560pF-27nF 1.8nF-100nF 3.3nF-180nF - 1nF-27nF 10nF-100nF 22nF-180nF
200Vdc C0G/NP0 - - 560pF-1.2nF 56pF-1nF - - 15pF-180pF 56pF-470pF
X7R - - 2.7nF-56nF 3.9nF-100nF - - 12nF-56nF 22nF-100nF
Notes: 1) E01 ranges in red available as qualied AEC-Q200.
2) E07 25Vdc C0G/NP0 0805 to 1806 ranges in green, have maximum current of 1A.
E01 300mA, E07 1A/2A
W
T
B2
L
B1
C
The Syfer E01 and E07 ranges of feedthrough MLCC
chip ‘C’ lters are 3 terminal chip devices designed to
offer reduced inductance compared to conventional
MLCC’s when used in signal line ltering.
The ltered signal passes through the chip internal
electrodes and the noise is ltered to the grounded
side contacts, resulting in reduced length noise
transmission paths.
Available in C0G/NP0 and X7R dielectrics, with current
ratings of 300mA, 1A, 2A and voltage ratings of 25Vdc
to 200Vdc. Also available with FlexiCap™ termination
which is strongly recommended for new designs.
Commonly used in automotive applications, a range
qualied to AECQ-200 is also available.
Signal track
Earth track
E01/E07
E01 / E07
Ordering Information - E01 & E07 feedthrough capacitors
1206 Y 100 0103 M X T E07
Chip Size Termination Voltage Capacitance in picofarads (pF) Tolerance Dielectric Packaging Type
0603
0805
1206
1806
J = Nickel Barrier
(Tin)
Y = FlexiCap™ (Tin)
A = (Tin/Lead)
H = FlexiCap™
(Tin/Lead)
025 = 25Vdc
050 = 50Vdc
100 = 100Vdc
200 = 200Vdc
First digit is 0. Second and third
digits are signicant gures of
capacitance code. The fourth digit
is number of zeros following
Example: 0103=10000pF.
M = ±20% A = C0G/NP0
AEC-Q200
C = C0G/NP0
E = X7R
AEC-Q200
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
E01
E07
178mm (7”) reel
0805 1206 1806
3000 2500 2500 330mm (13”) reel
0805 1206 1806
12000 10000 10000
Reeled
quantities
Surface mount EMI FiltersE01 & E07 feedthrough capacitors
Open board insertion loss performance in 50W system
Open Board Performance
Capacitance 0.1MHz 1MHz 10MHz 100MHz 1GHz
Resonance Freq (MHz) approx.
10pF 0 0 0 0 7.5 2200
22pF 0 0 0 0 16 1600
33pF 0 0 0 1 22 1350
47pF 0 0 0 2 28 1150
68pF 0 0 0 3 41 900
100pF 0 0 0 5 28 800
150pF 0 0 0 8 24 700
220pF 0 0 0 12 20 600
330pF 0 0 1 15 20 500
470pF 0 0 2 18 20 425
560pF 0 0 3 20 20 350
680pF 0 0 4 22 20 300
820pF 0 0 5 24 20 260
1nF 0 0 7 27 20 220
1.5nF 0 0 9 31 20 200
2.2nF 0 0 12 34 20 170
3.3nF 0 1 14 39 20 135
4.7nF 0 2 18 46 20 110
6.8nF 0 3 21 50 20 90
10nF 0 5 24 48 20 80
15nF 0 8 27 45 20 65
22nF 0 12 31 43 20 56
33nF 1 14 34 40 20 40
47nF 2 17 38 40 20 34
68nF 4 20 41 40 20 30
100nF 6 24 45 40 20 28
150nF 8 26 48 40 20 24
220nF 10 30 52 40 20 17
330nF 13 33 55 40 20 15.5
470nF 16 36 60 40 20 14
560nF 18 39 65 40 20 12
-70
-80
-60
-50
-40
-30
-20
0
10
-10
0.00 0.01 0.10 1.0 10.0 1000.0 1000.0100.0 10000.0
Loss (db)
Frequency (MHz)
10pF - C0G
22pF - C0G
47pF - C0G
100pF - C0G
470pF - C0G
2.2nF - C0G
2.2nF - X7R
4.7nF - X7R
10nF - X7R
22nF - X7R
100nF - X7R
200nF - X7R
Loss (db)
Frequency (MHz)
W
T
B2
L
B1
0603 0805 1206 1410 1812 2220
L
1.6±0.2
(0.063±0.008) 2.0±0.3
(0.08±0.012) 3.2±0.3
(0.126±0.012) 3.6±0.3
(0.14±0.012) 4.5±0.35
(0.18±0.014) 5.7±0.4
(0.22±0.016)
W
0.8±0.2
(0.03±0.008) 1.25±0.2
(0.05±0.008) 1.60±0.2
(0.063±0.008) 2.5±0.3
(0.1±0.012) 3.2±0.3
(0.126±0.012) 5.0±0.4
(0.2±0.016)
T
0.5±0.15
(0.02±0.006) 1.0±0.15
(0.04±0.006) 1.1±0.2
(0.043±0.008) 2.0 max.
(0.08 max.) 2.1 max.
(0.08 max.) 2.5 max.
(0.1 max.)
B1
0.4±0.15
(0.016±0.006) 0.5±0.25
(0.02±0.01) 0.95±0.3
(0.037±0.012) 1.20±0.3
(0.047±0.012) 1.4±0.35
(0.06±0.014) 2.25±0.4
(0.09±0.016)
B2
0.25±0.15
(0.010±0.006) 0.3±0.15
(0.012±0.006) 0.5±0.25
(0.02±0.01) 0.5±0.25
(0.02±0.01) 0.75±0.25
(0.03±0.01) 0.75±0.25
(0.03±0.01)
X2Y
The Syfer X2Y Integrated Passive Component is a 3
terminal EMI chip device.
When used in balanced line applications, the
revolutionary design provides simultaneous line-to-
line and line-to-ground ltering, using a single ceramic
chip. In this way, differential and common mode
ltering are provided in one device.
For unbalanced applications, it provides ultra low ESL
(equivalent series inductance). Capable of replacing 2
or more conventional devices, it is ideal for balanced
and unbalanced lines, twisted pairs and dc motors, in
automotive, audio, sensor and other applications.
Available in sizes from 0603 to 2220, these lters can
prove invaluable in meeting stringent EMC demands.
Manufactured in the UK by Syfer Technology Limited under licence from X2Y at tenuators LLC.
Dielectric
X7R or C0G/NP0
Electrical conguration
Multiple capacitance
Capacitance measurement
At 1000hr point
Surface mount EMI lters
Type E03
Chip size 0603 0805 1206 1410 1812 2220
Rated
voltage Dielectric Minimum and maximum capacitance values
16Vdc C0G/NP0 150pF - - - - -
X7R 15nF - - - - -
25Vdc C0G/NP0 120pF 560pF - 820pF 1.8nF - 3.3nF 6.8nF - 8.2nF 12nF - 15nF 22nF - 33nF
X7R 12nF 56nF - 68nF - 470nF 820nF 1.2µF
50Vdc C0G/NP0 10pF - 100pF 390pF - 470pF 1.2nF - 1.5nF 4.7nF - 5.6nF 8.2nF - 10nF 18nF
X7R 150pF - 10nF 18nF - 47nF 56nF - 220nF 180nF - 400nF 390nF - 680nF 560nF - 1.0µF
100Vdc C0G/NP0 - 10pF - 330pF 22pF - 1.0nF 100pF - 3.9nF 820pF - 6.8nF 1.0nF - 15nF
X7R - 470pF - 15nF 1.5nF - 47nF 4.7nF - 150nF 8.2nF - 330nF 10nF - 470nF
200Vdc C0G/NP0 - - 22pF - 1.0nF 100pF - 3.3nF 820pF - 5.6nF 1.0nF - 15nF
X7R - - 820pF - 33nF 1.2nF - 120nF 2.7nF - 180nF 4.7nF - 470nF
500Vdc C0G/NP0 - - - - 820pF - 3.9nF 1.0nF - 10nF
X7R - - - - 2.7nF - 100nF 4.7nF - 180nF
Notes: 1) For some lower capacitance parts, higher voltage
rated parts may be supplied.
X2Y Integrated Passive Components
Typical capacitance matching
Better than 5%
Temperature rating
-55°C to 125°C
Insulation resistance
100Gohms or 1000s (whichever is the less)
Dielectric withstand voltage
<200V 2.5 times rated Volts for 5 secs
500V 1.5 times rated Volts for 5 secs
Charging current limited to 50mA Max.
Recommended solder lands 0603 0805 1206 1410 1812 2220
A0.6 (0.024) 0.95 (0.037) 1.2 (0.047) 2.05 (0.08) 2.65 (0.104) 4.15 (0.163)
B0.6 (0.024) 0.9 (0.035) 0.9 (0.035) 1.0 (0.040) 1.4 (0.055) 1.4 (0.055)
C0.4 (0.016) 0.3 (0.012) 0.6 (0.024) 0.7 (0.028) 0.8 (0.031) 1.2 (0.047)
D0.2 (0.008) 0.4 (0.016) 0.8 (0.031 ) 0.9 (0.035) 1.4 (0.055) 1.8 (0.071)
E0.4 (0.016) 0.75 (0.030) 1.0 (0.039) 1.85 (0.071) 2.05 (0.080) 3.95 (0.156)
C
B
A
D
E
Notes: 1) All dimensions mm (inches).
2) Pad widths less than chip width gives improved mechanical performance.
3) The solder stencil should place 4 discrete solder pads. The un-printed distance between
ground pads is shown as dim E.
4) Insulating the earth track underneath the lters is acceptable and can help avoid
displacement of lter during soldering but can result in residue entrapment under the chip.
Component Advantages Disadvantages Applications
Chip capacitor Industry standard Requires 1 per line
High inductance
Capacitance matching problems
By-pass
Low frequency
3 terminal
feedthrough Feedthrough
Lower inductance Current limited Feedthrough
Unbalanced lines
High frequency
Syfer X2Y
Integrated
Passive
Component
Very low inductance
Replaces 2 (or 3) components
Negates the effects of temperature, voltage
and ageing
Provides both common mode and differential
mode attenuation
Can be used on balanced & unbalanced lines
Care must be taken to
optimise circuit design
By-pass
Balanced lines
High frequency
dc electric motors
Unbalanced lines
Audio ampliers
CANBUS
INPUT 1
INPUT 2
GROUND
AA
BB
C1
C1
C2
SIGNAL
RETURN
C1
C1
-10
0
-30
-20
-70
-40
-50
-60
0.1 110 100 1000 5000
680nF
400nF
220nF
100nF
47nF
10nF
1nF
470pF
100pF
27pF
-10
0
-30
-20
-70
-40
-50
-60
110 100 1000 5000
100nF
10nF
47nF
1nF
470pF
Insertion loss (dB)
Insertion loss (dB)
Frequency (MHz) Frequency (MHz)
Filtering application Decoupling application
Surface mount EMI lters
Ordering information
1812 Y 100 0334 M X T E03
Chip Size Termination Voltage Capacitance in picofarads (pF) C1Tolerance Dielectric Packaging Type
0603
0805
1206
1410
1812
2220
J = Nickel
barrier
Y = FlexiCap™
A = (Tin/lead)
H = FlexiCap™
(Tin/lead)
016 = 16Vdc
025 = 25Vdc
050 = 50Vdc
100 = 100Vdc
200 = 200Vdc
500 = 500Vdc
First digit is 0. Second and third digits
are signicant gures of capacitance
code.
The fourth digit is number of zeros
following
Example: 0334=330nF.
Note: C1 = 2C2
M = ±20%
(Tighter
tolerances
may be
available on
request).
A = C0G/NP0
AEC-Q200
C = C0G/NP0
E = X7R
AEC-Q200
X = X7R
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
Syfer X2Y
Integrated
Passive
Component
178mm
(7”) reel
0603 0805 1206 1410 1812 2220
4000 3000 2500 2000 1000 1000 330mm
(13”) reel
0603 0805 1206 1410 1812 2220
16000 12000 10000 8000 4000 4000
Reeled
quantities
AEC-Q200 range (E03) - capacitance values
Chip size 0805 1206 1410 1812
50Vdc C0G/NP0 390pF - 470pF 1.2nF - 1.5nF 4.7nF - 5.6nF 8.2nF - 10nF
X7R 18nF - 33nF 56nF - 150nF 180nF - 330nF 390nF- 560nF
100Vdc C0G/NP0 10pF - 330pF 22pF - 1.0nF 100pF - 3.9nF 820pF - 6.8nF
X7R 470pF - 15nF 1.5nF - 47nF 4.7nF - 150nF 8.2nF - 330nF
X2Y Integrated Passive Components
Ceramic chip capacitors
Leader and TrailerMissing components
The number of missing components in the tape may not
exceed 0.25% of the total quantity with not more than three
consecutive components missing. This must be followed by at
least six properly placed components.
Identication
Each reel is labelled with the following information:
manufacturer, chip size, capacitance, tolerance, rated voltage,
dielectric type, batch number, date code and quantity of
components.
40 empty sealed
embossments minimum
TRAILER
END START
COMPONENTS LEADER 400mm min.
length is
quantity dependent 20 sealed
embossments minimum
Product
identifying
label
W
L
T
Note: Labelling of box and
reel with bar codes (Code 39)
available by arrangement.
Orientation of 1825 & 2225 components
Component orientation
Tape and reeling is in accordance with IEC 60286 part
3, which denes the packaging specications of leadless
components on continuous tapes.
NOTES: 1) IED60286 stats Ao < Bo (see Tape Dimensions
above).
2) Regarding the orientation of 1825 & 2225
components, the termination bands are right to left,
NOT front to back. Please see diagram.
Packaging information
Outer Packaging
Outer Carton Dimensions mm (inches) max.
Reel Size No. of reels L W T
178 (7.0) 1 185 (7.28) 185 (7.28) 25 (0.98)
178 (7.0) 4 190 (7.48) 195 (7.76) 75 (2.95)
330 (13.0) 1 335 (13.19) 335 (13.19) 25 (0.98)
HCaution label
Product
identifying
label
D
Bulk packing - tubs
Chips are supplied in rigid re-sealable plastic tubs together
with impact cushioning wadding. Tubs are labelled with the
details: chip size, capacitance, tolerance, rated voltage,
dielectric type, batch number, date code and quantity of
components.
Dimensions mm (inches)
H 60 (2.36)
D 50 (1.97)
Reel quantities
Chip size 0402 0505 0603 0805 1111 1206 1210 1410 1808 1812 1825 2211 2215 2220 2225
Max. chip
thickness
0.5mm 1.3mm 0.8mm 1.3mm 2.0mm 1.6mm 2.0mm 2.0mm 2.0mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm 2.5mm
0.02” 0.05” 0.03” 0.05” 0.08” 0.06” 0.08” 0.08” 0.08” 0.1” 0.1” 0.1” 0.1” 0.1” 0.1”
Reel
quantities
178mm
(7”) 5000 2500 4000 3000 1000 2500 2000 2000 1500 500/
1000 500 750 500 500/
1000 500/
1000
330mm
(13”) - - 16000 12000 - 10000 8000 8000 6000 2000/
4000 2000 - 4000 2000/
4000 2000/
4000
Notes:
(1) The above quantities per reel are for the maximum manufactured chip thickness. Thinner chips can be taped in larger quantities per reel.
(2) Where two different quantities are shown for the same case size, please contact the Sales Ofce to determine the exact quantity for any specic part number.
Plastic carrier tape
Product
identifying label
Embossment
Top tape 8 or 12mm
nominal 178mm (7”) or
330mm (13”)
dia. reel
Tape and reel packing of surface mounting chip capacitors for
automatic placement are in accordance with IEC60286-3.
Peel force
The peel force of the top sealing tape is between 0.2 and 1.0
Newton at 180°. The breaking force of the carrier and sealing
tape in the direction of unreeling is greater than 10 Newtons.
Reel dimensions mm (inches)
TD
0
P
0
P
2
P
1
D
1
A
0
t
1
K
0
B
0
F
E
W
Sealing tape
Embossment Cavity centre lines
Feed direction
Tape dimensions
1.5(.06) min
60(2.36) min
20.2(0.795) min
13(0.512)
± 0.5(0.02)
T
G
A
Ceramic chip capacitors Packaging information
Dimensions mm (inches)
Symbol Description 8mm tape 12mm tape
A0
B0
K0
Width of cavity
Length of cavity
Depth of cavity Dependent on chip size to minimize rotation
W Width of tape 8.0 (0.315) 12.0 (0.472)
F Distance between drive hole centres and cavity centres 3.5 (0.138) 5.5 (0.213)
E Distance between drive hole centres and tape edge 1.75 (0.069)
P1Distance between cavity centres 4.0 (0.156) 8.0 (0.315)
P2Axial distance between drive hole centres and cavity centres 2.0 (0.079)
P0Axial distance between drive hole centres 4.0 (0.156)
D0Drive hole diameter 1.5 (0.059)
D1Diameter of cavity piercing 1.0 (0.039) 1.5 (0.059)
XT Carrier tape thickness 0.3 (0.012) ±0.1 (0.004) 0.4 (0.016) ±0.1 (0.004)
Xt1Top tape thickness 0.1 (0.004) max
Symbol Description 178mm reel 330mm reel
A Reel diameter 178 (7) 330 (13)
G Reel inside width 8.4 (0.33) 12.4 (0.49)
T Reel outside
width 14.4 (0.56)
max 18.4 (0.72)
max
Ordering information - Radial Leaded capacitors
8111M 100 0102 J C
Type No./
Size ref Voltage d.c.
(marking code) Capacitance in
picofarads (pF) Capacitance
tolerance
Dielectric
Rel Release
codes Sufx Sufx
8111M
8111N
8121M
8121N
8121T
8131M
8131T
8141M
8151M
8161M
8165M
8171M
050 =
063 =
100 =
200 =
500 =
1K0 =
1K2 =
1K5 =
2K0 =
2K5 =
3K0 =
4K0 =
5K0 =
6K0 =
50V
63V
100V
200V
500V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
(A)
(D)
(B)
(C)
(Q)
(Z)
(0)
(T)
(M)
(P)
(S)
(2)
First digit is 0. Second and
third digits are signicant
gures of capacitance
code.
The fourth digit is number
of zeros following.
Example:
8P20 = 8.2pF
<10pF
D: ± 0.5pF
F: ± 1.0pF
>10pF
J: ± 5%
K: ± 10%
M: ± 20%
>27pF
G: ± 2%
(C0G/NP0 only).
C = C0G/NP0
(1B/CG; CG/BP)
X = X7R
(2R1)
To Special Order
B = 2X1 (BX)
R = 2C1 (BZ)
Used for specic
customer
requirements.
“C42” denotes
RoHS compliant.
A31 or A97 denote
non-RoHS tin/lead
wires.
Sufx A97 for 8111
to 8141 & A31 for
8151, 8161, 8171.
Radial Leaded capacitors
Pattern A
XZ
Sd
Y
5.0 (0.2)
min. 1.5 (0.6)
max.
Seating
Plane
XZ
Sd
YSeating
Plane
5.0 (0.2)
min.
Pattern B
Dimensions - Dipped Radial
CECC Width Height Thickness Lead Space
Lead Diameter
Case
reference Pattern (X) max. mm
inches (Y) max. mm
inches (Z) max. mm
inches (S) mm
inches (d) mm
inches
8111M A A 3.81
0.15 5.31
0.21 2.54
0.10 2.54±0.4
0.1±.0.016 0.5±0.05
0.02±0.002
8111N F B 3.81
0.15 5.31
0.21 2.54
0.10 5.08±0.4
0.2±0.016 0.5±0.05
0.02±0.002
8121M B A 5.08
0.20 6.58
0.26 3.18
0.125 2.54±0.4
0.1±0.016 0.5±0.05
0.02±0.002
8121N C B 5.08
0.20 6.58
0.26 3.18
0.125 5.08±0.4
0.2±0.016 0.5±0.05
0.02±0.002
8121T B10.16
0.40 5.80
0.23 4.50
0.18 7.62±0.4
0.30±0.016 0.5±0.05
0.02±0.002
8131M D A 7.62
0.30 9.12
0.36 3.81/6.30
0.15/0.25 5.08±0.4
0.2±0.016 0.5±0.05
0.02±0.002
8131T B10.16
0.40 9.12
0.36 4.50
0.18 7.62±0.4
0.30±0.016 0.5±0.05
0.02±0.002
8141M A10.16
0.40 11.66
0.46 3.81
0.15 5.08±0.4
0.2±0.016 0.5±0.05
0.02±0.002
8151M A12.70
0.50 14.20
0.56 5.08/6.30
0.20/0.25 10.1±0.4
0.4±0.016 0.6±0.05
0.025±0.002
8161M A18.50
0.73 16.50
0.65 6.00/7.00
0.24/0.28 14.5±0.5
0.57±0.02 0.6±0.05
0.025±0.002
8165M A19.00
0.75 19.00
0.75 6.00
0.24 17.15±0.5
0.67±0.02 0.6±0.05
0.025±0.002
8171M A25.00
0.98 20.00
0.79 6.00/7.00
0.24/0.28 20.5±0.5
0.81±0.02 0.6±0.05
0.025±0.002
Syfer Technology produces a wide range of dipped
radial leaded capacitors. These are available in
rated voltages of 50V up to 6kV. Although our
catalogue range extends to 6kV, we are able to offer
a capability for specials up to 10kV. Our larger case
sizes and high voltage versions are particularly in
demand, especially for mil/aero and medical power
supply applications. Please contact our Sales Office
to discuss any special requirements. IECQ-CECC
approved parts are also included within the ranges.
High working voltage - up to 10kVdc
Large case sizes
RoHS compliant versions
Tin-lead plated wire option to reduce tin whiskers (quote
suffix A97 for 8111 to 8141 & A31 for 8151, 8161, 8171).
Radial Leaded capacitors
Fixed Multilayer Ceramic Radial capacitor
IECQ-CECC approvals
Dipped
Climatic category: 55/125/21
Capacitance tolerances: C0G/NP0 - 5%, 10% & 20%
X7R - 10% & 20%
Approved rated voltages: 50V/63V, 100V & 200V
Dipped product approval range
CECC case size Syfer product code
A 8111M
F 8111N
B 8121M
C 8121N
D 8131M
Dielectric Capacitance range CECC specication
C0G/NP0 3.9pF to 27nF CECC 30 601 008
X7R 100pF to 1.0uF CECC 30 701 013
8111M 8111N 8121M 8121N 8121T 8131M 8131M
T =
6.3mm
8131T 8141M 8151M 8151M
T =
6.3mm
8161M 8161M
T =
7.0mm
8171M 8171M
T =
7.0mm
Min.
cap
values
C0G/NP0
4.7pF 4.7pF 4.7pF 4.7pF 4.7pF 4.7pF - 10pF 4.7pF 10pF - 39pF - 68pF -
X7R
100pF 100pF 100pF 100pF 330pF 100pF - 150pF 100pF 470pF - 1.0nF - 2.2nF -
50/63V
C0G/NP0
5.6nF 5.6nF 18nF 18nF 18nF 100nF - 47nF 150nF 220nF - 390nF - 680nF -
X7R
220nF 220nF 1.0
µ
F 1.0
µ
F 1.0
µ
F 3.3
µ
F - 2.2
µ
F4.7
µ
F 8.2
µ
F - 10
µ
F - 15
µ
F -
100V
C0G/NP0
2.7nF 2.7nF 12nF 12nF 12nF 68nF - 27nF 100nF 180nF - 330nF - 560nF -
X7R
100nF 100nF 470nF 470nF 470nF 1.5
µ
F - 1.0
µ
F 2.2
µ
F 8.2
µ
F - 10
µ
F - 15
µ
F -
200/
250V
C0G/NP0
1.0nF 1.0nF 4.7nF 4.7nF 4.7nF 27nF 68nF 12nF 47nF 82nF 180nF 120nF
330nF
270nF 560nF
X7R
56nF 56nF 220nF 220nF 220nF 1.0
µ
F - 470nF 1.0
µ
F 1.5
µ
F - 3.9
µ
F - 8.2
µ
F -
500V
C0G/NP0
470pF 470pF 3.9nF 3.9nF 3.9nF 22nF 47nF 10nF 33nF 56nF 120nF 100nF 270nF 180nF 470nF
X7R
8.2nF 8.2nF 100nF 100nF 100nF 820nF - 270nF 680nF 1.0
µ
F - 1.8
µ
F - 3.3
µ
F -
630V
C0G/NP0
270pF 270pF 1.8nF 1.8nF 1.8nF 15nF 39nF 5.6nF 22nF 39nF 100nF 68nF 180nF 150nF 390nF
X7R
4.7nF 4.7nF 27nF 27nF 27nF 390nF - 150nF 470nF 680nF - 1.2
µ
F - 2.2
µ
F -
1kV
C0G/NP0
100pF 100pF 1.0nF 1.0nF 1.0nF 10nF 27nF 3.3nF 15nF 22nF 82nF 39nF 150nF 68nF 270nF
X7R
3.3nF 3.3nF 15nF 15nF 15nF 150nF - 56nF 150nF 180nF - 390nF - 1.0
µ
F -
1.2kV
C0G/NP0
- - 680pF 680pF 680pF 6.8nF 22nF 2.2nF 6.8nF 18nF 56nF 33nF 100nF 47nF 180nF
X7R
- - 10nF 10nF 10nF 100nF - 33nF 100nF 150nF - 220nF - 470nF -
1.5kV
C0G/NP0
- - 470pF 470pF 470pF 4.7nF 12nF 1.5nF 4.7nF 12nF 39nF 22nF 68nF 33nF 120nF
X7R
- - 6.8nF 6.8nF 6.8nF 68nF - 22nF 68nF 100nF - 150nF - 330nF -
2kV
C0G/NP0
- - 220pF 220pF 220pF 2.2nF 6.8nF 820pF 3.3nF 5.6nF 18nF 10nF 39nF 18nF 68nF
X7R
- - 4.7nF 4.7nF 4.7nF 33nF - 10nF 47nF 47nF - 82nF - 150nF -
2.5kV
C0G/NP0
- - - - - 1.8nF 3.9nF 680pF 1.8nF 4.7nF 12nF 6.8nF 22nF 12nF 39nF
X7R
- - - - - 12nF - 3.3nF 12nF 33nF - 68nF - 100nF -
3kV
C0G/NP0
- - - - - 1.5nF 2.7nF 470pF 1.0nF 2.2nF 8.2nF 4.7nF 18nF 8.2nF 27nF
X7R
- - - - - 6.8nF - 2.7nF 10nF 18nF - 39nF - 68nF -
4kV
C0G/NP0
- - - - - 820pF 1.5nF 270pF 680pF 1.0nF 3.3nF 2.2nF 6.8nF 4.7nF 15nF
X7R
- - - - - 5.6nF - 2.2nF 5.6nF 6.8nF - 15nF - 33nF -
5kV
C0G/NP0
- - - - - 560pF 1.0nF 180pF 470pF 560pF 2.2nF 1.5nF 4.7nF 3.3nF 10nF
X7R
- - - - - 4.7nF
-
1.2nF 3.3nF 3.9nF - 8.2nF - 18nF -
6kV
C0G/NP0
- - - - - 390pF 680pF 120pF - 1.0nF 1.5nF - 3.3nF - 6.8nF
X7R
- - - - - 2.7nF - 1.0nF 1.0nF 2.7nF - - - - -
8111M 8111N 8121M 8121N 8121T 8131M 8131M
T =
6.3mm
8131T 8141M 8151M 8151M
T =
6.3mm
8161M 8161M
T =
7.0mm
8171M 8171M
T =
7.0mm
Note: T = Maximum thickness.
Marking information
All encapsulated capacitors are marked with:- Capacitance
value, tolerance, rated d.c. voltage, dielectric, and where size
permits the Syfer Technology ‘S’ logo.
Example: 1000pF ±10% 50V 2X1 dielectric
Capacitance
Logo
Dielectric code
Voltage code
Capacitance tolerance code
Note: Pattern A may be substituted with Pattern B at Syfer’s discretion.
Notes: The voltage code may be replaced with the complete voltage (e.g. 1500V = 1K5V) at Syfer’s discretion.
Marking may be over both sides of the component as necessary.
4.7pF 4p7 4.7pF 4p7
5.6 5p6 5.6 5p6
6.8 6p8 6.8 6p8
8.2 8p2 8.2 8p2
10pF 100 10pF 100
12 120 12 120
15 150 15 150
18 180 18 180
22 220 22 220
27 270 27 270
33 330 33 330
39 390 39 390
47 470 47 470
56 560 56 560
68 680 68 680
82 820 82 820
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10nF 103 10nF 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100nF 104 100nF 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µF 105 1.0µF 105
1.2 125 1.2 125
1.5 155 1.5 155
1.8 185 1.8 185
2.2 225 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 3.9 395
4.7 475 4.7 475
5.6 565 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 12 126
15µF 156 15µF 156
Capacitance
Code
8111M / 8111N 8121M / 8121N 8131M
Capacitance
Code
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
100V
50/63V
200/250V
500V
630V
1kV
100V
50/63V
200/250V
500V
630V
1kV
C0G/NP0 X7R C0G/NP0 X7R
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
8121T
C0G/NP0 X7R
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
C0G/NP0 X7R
8131T
C0G/NP0 X7R
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
Capacitance
Code
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
50/63V
100V
200/250V 6.3mm
500V 6.3mm
630V 6.3mm
1kV 6.3mm
1.2kV 6.3mm
1.5kV 6.3mm
2kV 6.3mm
2.5kV 6.3mm
3kV 6.3mm
4kV 6.3mm
6.3mm
6kV
6.3mm
5kV
6.3mm
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
C0G/NP0 & X7R rangesRadial Leaded capacitors
4.7pF 4p7 4.7pF 4p7
5.6 5p6 5.6 5p6
6.8 6p8 6.8 6p8
8.2 8p2 8.2 8p2
10pF 100 10pF 100
12 120 12 120
15 150 15 150
18 180 18 180
22 220 22 220
27 270 27 270
33 330 33 330
39 390 39 390
47 470 47 470
56 560 56 560
68 680 68 680
82 820 82 820
100pF 101 100pF 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1.0nF 102 1.0nF 102
1.2 122 1.2 122
1.5 152 1.5 152
1.8 182 1.8 182
2.2 222 2.2 222
2.7 272 2.7 272
3.3 332 3.3 332
3.9 392 3.9 392
4.7 472 4.7 472
5.6 562 5.6 562
6.8 682 6.8 682
8.2 822 8.2 822
10nF 103 10nF 103
12 123 12 123
15 153 15 153
18 183 18 183
22 223 22 223
27 273 27 273
33 333 33 333
39 393 39 393
47 473 47 473
56 563 56 563
68 683 68 683
82 823 82 823
100nF 104 100nF 104
120 124 120 124
150 154 150 154
180 184 180 184
220 224 220 224
270 274 270 274
330 334 330 334
390 394 390 394
470 474 470 474
560 564 560 564
680 684 680 684
820 824 820 824
1.0µF 105 1.0µF 105
1.2 125 1.2 125
1.5 155 1.5 155
1.8 185 1.8 185
2.2 225 2.2 225
2.7 275 2.7 275
3.3 335 3.3 335
3.9 395 3.9 395
4.7 475 4.7 475
5.6 565 5.6 565
6.8 685 6.8 685
8.2 825 8.2 825
10µF 106 10µF 106
12 126 12 126
15µF 156 15µF 156
Capacitance
Code
Capacitance
Code
8141M
C0G/NP0 X7R
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6kV
8151M
C0G/NP0 X7R
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
8161M
C0G/NP0 X7R
8171M
C0G/NP0 X7R
C0G/NP0 & X7R rangesRadial Leaded capacitors
Capacitance
Code
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
6.3mm
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
6.3mm
6kV
50/63V
100V
7.0mm
200/250V
7.0mm
500V
7.0mm
630V
7.0mm
1kV
7.0mm
1.2kV
7.0mm
1.5kV
7.0mm
2kV
7.0mm
2.5kV
7.0mm
3kV
7.0mm
4kV
7.0mm
5kV
6kV 7.0mm
Note: The highlighted parts are dened as ‘dual-use’ under export control legislation and as
such are subject to export licence restrictions. Please refer to page 9 for further details.
50/63V
100V
7.0mm
200/250V
7.0mm
500V
7.0mm
630V
1kV
7.0mm
1.2kV
7.0mm
1.5kV
7.0mm
2kV
7.0mm
2.5kV
7.0mm
3kV
7.0mm
4kV
7.0mm
5kV
6kV 7.0mm
7.0mm
50/63V
100V
200/250V
500V
630V
1kV
1.2kV
1.5kV
2kV
2.5kV
3kV
4kV
5kV
Radial Leaded capacitors
Cropped leads
Cropped leads between 4.0 (0.157) and 30.0 (1.18) are
available to special order. Some of the preferred codes are
listed below, together with the appropriate sufx code.
Dimensions as for standard product except as specied.
Bandoliered sufx codes
Dipped radial leaded with 2.54 and 5.08mm lead spacing can
be supplied bandoliered on reels or in ammo boxes to special
order. Some of the preferred sufx codes for bandoliered
products are given below.
For bandoliered products the minimum order quantity, pieces,
is specied in the tables below, larger orders must be in
multiples of this quantity.
This style has been
developed to provide
a meniscus-free
seating plane with a
stress relieving form
for auto-insertion.
Dipped – stand-off lead form
H0
Y
H
0
H
A
B
Sufx code
Reel AMMO pack
Product code Lead style Diagram H H0
2500pcs 1000pcs 2000pcs
8111M Straight 2.54 crs A 19±1 – C01 C02 C11
8111M Straight 2.54 crs A 16±0.5 – C30 C31 C32
8111N Formed 5.08 crs B – 16±0.5 C01 C02 C11
8121M Straight 2.54 crs A 19±1 – C01 C02 C11
8121M Straight 2.54 crs A 16±0.5 – C30 C31 C32
8121N Formed 5.08 crs B – 16±0.5 C01 C02 C11
8131M Straight 5.08 crs A 19±1 – C01 C02 C11
8131M Straight 5.08 crs A 16±0.5 – C30 C31 C32
8121T and 8131T available in bulk packaging only.
Product code Lead style Y max H0
2500pcs 1000pcs 2000pcs
8111N Formed 5.08 crs 7.5 16±0.5 C12 C23 C22
8111N Formed 5.08 crs 7.5 19±1 C13 C25 C24
8121N Formed 5.08 crs 8.5 16±0.5 C12 C23 C22
8121N Formed 5.08 crs 8.5 19±1 C13 C25 C24
Dimensions mm (inches)
Snap in leads
Various forms of snap in leads (preformed) are available to
special order, some of the preferred sufx codes are listed
below. Dimensions as for standard product except as specied.
Sufx code - AD1
For PCB holes 0.9mm diameter
Types 8121N and 8131M
Dimensions
Y = 8121N 8 (0.315) Max
8131M 10 (0.394) Max
L = Min: 2.75 (0.108)
Max: 3.50 (0.138)
Sufx code - AD3
For PCB holes 1.2mm diameter
Types 8121N
Dimensions
Y = 8 (0.315) Max
L = Min: 2.75 (0.108)
Max: 3.50 (0.138)
5±0.5
Y
L
4±0.5
6±0.5
6.0 +1.0
Seating plane
4.2±0.5
Y
L
5±0.5
6.6±0.5
8.8 Max
Seating plane
4.2±0.5
Y
L
5±0.5
6.6±0.5
7.6 Max
Seating plane
Sufx code - AD2
For PCB holes 1.2mm diameter
Types 8131M
Dimensions
Y = 10 (0.294) Max
L = Min: 2.75 (0.108)
Max: 3.50 (0.138)
Sufx code - AE3
All radial ranges Sufx code - AE4
All radial ranges Sufx code - AD7
All radial ranges Sufx code - AD5
All radial ranges
Lead length (L)
6 ±1 (0.236 ±0.04)
from seating plane
Lead length (L)
4 ± 1 (0.162 ±0.04)
from seating plane
Lead length (L)
5 ± 1 (0.2 ±0.04)
from seating plane
Lead length (L)
10 ± 1 (0.4 ±0.04)
from seating plane
Packaging information
Dipped – straight and formed leads
The adhesive tape faces outwards. The dispensing direction
is as shown. For the protection of the components a paper
inlay is inserted between the windings of the bandolier. At the
end of the bandolier this paper inlay continues for at least a
further two rotations.
A maximum of 3 consecutive components may be missing
from the bandolier, followed by at least 6 lled positions.
Components missing from the bandolier are included in the
total quantity, whereby the number of missing components
may not exceed 0.25% of this total per packing module.
At the beginning and end of a reel the bandolier will exhibit at
least 10 blank positions.
Minimum pull strength of product from tape = 5N.
Each reel/carton is provided with a label showing the:
Manufacturer, product style, batch identication, quantity
and date code.
Labelling with bar codes (code 39) is available on request. In accordance with IEC 60286 part 2.
355±1.0
45±1.0
85±1.0
30±1.0
52 max
335
(13.1)
230
(9.05)
(2000 pcs)
48
(1.88)
24
(0.94)
115
(4.50)
(1000 pcs)
45
(1.77)
20 dia.
(0.79)
Bandoliered ammo packing
2 carton sizes
Dh
H
1
H
0
H
L
P
P
2
D
0
W
2
W
0
W
1
t
WL
2
P
1
P
0
F
Bandoliered reels
Dimensions mm (inches)
Description
Symbol
2.5mm
lead space
5mm
lead space
Tolerance
Lead wire diameter d 0.5 (0.02)
0.6 (0.025) 0.5 (0.02)
0.6 (0.025) ±0.05 (0.002)
Component pitch P 12.7 (0.5) 12.7 (0.5) 1.00 (0.04)
Feed hole pitch P012.7 (0.5) 12.7 (0.5) ±0.30 (0.01)
Feed hole centre to lead P15.08 (0.2) 3.81 (0.15) ±0.70 (0.03)
Feed hole centre to component P26.35 (0.25) 6.35 (0.25) ±0.70 (0.03)
Lead spacing F 2.54 (0.10) 5.08 (0.20) +0.6 (0.02)
-0.1 (0.004)
Component alignment Dh0 0 ±2.00(0.08)
Tape width W 18.0 (0.70) 18.0 (0.70) +1.00 (0.04)
-0.50 (0.02)
Hold down tape width W06.0 (0.23) 6.0 (0.23) ±0.30 (0.01)
Hole position W19.0 (0.35) 9.0 (0.35) ±0.50 (0.02)
Hold down tape position W20.50 (0.02) 0.50 (0.02) Max
Height to seating plane from tape centre (straight leads) (2) H 16 (0.63) to 20 (0.79) 16 (0.63) to 20 (0.79) As required
Height to seating plane from tape centre (formed leads) (2) H016 (0.63) to 20 (0.79) 16 (0.63) to 20 (0.79) As required
Height to top of component from tape centre H132.2 (1.26) 32.2 (1.26) Max
Feed hole diameter D04.0 (0.16) 4.0 (0.16) ±0.20 (0.008)
Carrier tape plus adhesive tape thickness t 0.7 (0.03) 0.7 (0.03) ±0.20 (0.008)
Carrier tape thickness - 0.5 (0.02) 0.5 (0.02) ±0.10 (0.004)
Cut out component snipped lead length from tape centre L 11.0 (0.43) 11.0 (0.43) Max
Lead wire protusion from hold down L22.0 (0.08) 2.0 (0.08) Max
Radial Leaded capacitorsPackaging information
46/11/C