
1996 Nov 15 1
Philips Components
Leaded resistors General Introduction
INTRODUCTION
Data in data sheets is presented, whenever possible,
eaccording to a ‘format’, in which the following chapters
are stated:
•TITLE
•FEATURES
•APPLICATIONS
•DESCRIPTION
•QUICK REFERENCE DATA
•ORDERING INFORMATION
•FUNCTIONAL DESCRIPTION
– Product characterization
– Limiting values
•MECHANICAL DATA
– Outlines
– Mass
– Marking
– Mounting
•TESTS AND REQUIREMENTS
The chapters listed above are explained in this section
“General Introduction Leaded resistors”
, with detailed
information (including
“Packaging”
) in the relevant data
sheet.
DESCRIPTION
Most types of conventional resistors have a cylindrical
ceramic body, either rod or tube. For special purposes, a
high-grade aluminium ceramic is used. The resistive
element is either a carbon film, metal film, thick film or a
wound wire element. Film types have been trimmed to the
required ohmic resistance by cutting a helical groove in the
resistive layer. This process is controlled completely by
computer and yields a high reliability. The terminations are
usually iron end caps onto which tinned connecting wires
of electrolytic copper are welded.
All resistor bodies are coated with a coloured lacquer or
enamel for protection. Dependent on types, this lacquer
provides electrical, mechanical and/or climatic protection,
also against soldering flux and cleaning solvents, in
accordance with
“MIL-STD-202E”
, method 215 and
“IEC 68-2-45”
.
ORDERING INFORMATION
Resistors are ordered by their ordering code, a 12-digit
number. The packaging method and resistance code are
integral parts of this number.
FUNCTIONAL DESCRIPTION
The functional description includes: nominal resistance
range and tolerance, limiting voltage, temperature
coefficient, absolute maximum dissipation, climatic
category and stability.
The limiting voltage (DC or RMS) is the maximum
voltage that may be continuously applied, see
“IEC publications 115-1 and 115-2”
. Where applicable,
derating details and performance nomograms are
given, showing the relationship between power
dissipation, ambient temperature, hot-spot temperature
and maximum resistance drift after prolonged operation.
For power resistors, graphs indicate the relationship
between temperature rise and dissipation with lead-length
or heatsinks as parameters.
The temperature rise in a resistor due to power dissipation,
is determined by the laws of heat - conduction, convection
and radiation. The maximum body temperature usually
occurs in the middle of the resistor and is called the
hot-spot temperature.
Heat conducted by the leads - which can be considerable
in power types - must not reach the melting point of the
solder at the joints. This condition may require the use of
heatsinks and/or longer leads.
In the normal operating temperature range of film resistors
the temperature rise at the hot-spot, ∆T, is proportional to
the power dissipated: ∆T = A × P. The proportionally
constant ‘A’ gives the temperature rise per Watt of
dissipated power and can be interpreted as a thermal
resistance in K/W. This thermal resistance is a function of
the dimensions of the resistor, the heat conductivity of the
materials used and to a lesser degree, the way of
mounting. The sum of the temperature rise and the
ambient temperature is:
Tm=T
amb + ∆T
where:
Tm= hot-spot temperature
Tamb = ambient temperature
∆T = temperature rise at hot-spot.
The stability of a film resistor during endurance tests is
mainly determined by the hot-spot temperature and the
resistance. The lower the resistance - other conditions
remaining constant - the higher the stability due to greater
film thickness.