LINEAR INTEGRATED CIRCUIT CHIPS GENERAL DESCRIPTION Motorola now offers a very broad selection of linear integrated circuit chips. Among the types of circuits which compose the linear family there are: . Operational Amplifiers Voltage Regulators Comparators . Drivers and Receivers . Sense Amplifiers . D/A and A/D Converters As a general rule of thumb, all linear chips from Motorola are 100% unit probed to the D.C. parameters given in Volume 6 of the Semiconductor Data Library. Far specific information on electrical parameters which are probed contact the nearest Motorola Sales Office. mmooOmp STANDARD FEATURES FOR LINEAR INTEGRATED CIRCUIT CHIPS All linear integrated circuit chips... are 100% electrically tested to sufficient param- eter limits (min/max) to permit distinct identi- fication as either premium or industrial versions @ employ phosphorsilicate passivation which pro- tects the entire active surface area including metallization interconnects during shipping and handling : @ are 100% visually inspected to a modified cri- teria per MIL-STD-883, Method 2010, Condi- tion B @ incorporate a minimum of 4000 A gold backing to ensure positive adherence bonding GENERAL PHYSICAL CHARACTERISTICS OF LINEAR CHIPS The following characteristics represent the vast majority of all Motorola linear chips. Since an indi- vidual chip type may vary slightly, contact your local sales office for information regarding physical charac- teristics critical to a specific application. The overall size and final metallization patterns are shown in the following pages; however the geometries shown and MIC numbers listed are current at the date of print- ing. Since we are constantly striving to improve the quality, performance, and yield of our linear devices we cannot be responsible for changes at future dates. Please contact your local Motorola Sales representative for the most current information. A. Chips thickness: 8 + 1 mil B. Passivation: Phosphorsilicate C. Passivation thickness: 5kA + 1k D. Metallization: Aluminum E. Metallization thickness: 12kA + 2kA F. Back metallization: Gold, alloyed G. Bonding pad dimensions: Typical 4.0 mil x 5.0 mil H. Overall chip dimensions: See pages that follow for individual device type. Tolerance of +5 mils should be allowed. HANDLING PRECAUTIONS Although passivation on all chips provides protec- tion in shipping and handling, care should be exercised to prevent damaging the face of the chip. A vacuum pickup is most useful for this purpose; tweezers are not recommended. There are four basic requirements for handling devices in a prudent manner: 1. Store the chips in a covered or sealed container 2. Store devices in an environment of no more than 30% relative humidity 3. Process the chips in a non-inert atmosphere not exceeding 100C, or in an inert atmosphere not exceeding 400C. 4. Processing equipment should conform to the minimum standards that are normally em- ployed by semiconductor manufacturers. Motorolas engineering staff is available for consul- tation in the event of correlation or processing prob- lems encountered in the use of Motorola linear chips. For assistance, please contact your nearest Motorola sales representative. CHIP AND WAFER PACKAGING Chips Motorolas linear integrated circuit chips come Packaged to the customer in the Multi-Pak carrier. Refer to page 1-11, Figure 7. Wafers Motorolas linear integrated circuit wafers come packaged to the customer in the Wafer-Pak plastic bow. The wafer has been probed and rejects are designated by a red color dot on the die surface. Refer to page 1-8, Figure 2. HOW TO ORDER LINEAR CHIPS OR WAFERS FROM MOTOROLA 1. Remove all suffix package designators from the desired device type. (EXAMPLE: MC1741CP1 now becomes MC1741C) 2. Add a C to the prefix designator if individual chips are desired. (EXAMPLE: MC1741C now is McC1741C) Add a W to the prefix designator if a wafer is de- sired. (EXAMPLE: MC1741C now is MCW1741C) 3. When ordering chips, two options are available: a. The ~1 suffix designator will deliver to you 10 chips per Multi-Pak, up to 1000 chips. (EXAMPLE: MCC1741C-1} 5-2 ITT MCC700 Series (+15 to +55C) MRTL integrated circuits provide a broad line of low- MCC800 Series (0 to +100C) cost, muiti-function, digital circuits. Typical gate speed is MCC900 Series (-55 to 125C) 12 ns, with power dissipation averages of 19 mW (input high) and 5.0 mW (inputs low) per logic node. Type Wafer Mask SP +15 to +55C | 0 to +100C | -55 to +125C Function Set # (Mils) mMcc700 MCC800 mMCC900 Buffer 67D 25 x 35 MCC701 MCC801 Mccso01 Counter Adapter 5MH 32 x 34 MCC702 MCC802 MCC902 R-S Flip Flop 6ML 25 x 30 MCC703 MCC803 MCC903 3-Input NOR Gate 2MH 25x 27 MCC704 MCC804 MCC904 Half Adder 6JC 39 x 36 MCC705 MCC805 MCC905 Half Shift Register co2 40x 40 MCC706 MCC806 MCC906 Half Shift Register (w/o inverter) 8ME 40x 40 MCC707 MCC807 MCC907 4-tnput NOR Gate B77 25 x 35 MCC708 MCC808* mccs0s Half Adder 3JB 43 x 34 MCC709 McC8so09"* mccgs09 2-Input Buffer c15 32 x 39 MCC710 MCC810* MCC910 Dual 2-Input NOR Gate FIC 38 x 31 MCC711 mccei1* MCC911 4-Input OR/NOR Gate 4sCc 48 x 57 MCC712 MCC812* MCC912 Half Adder 3JB 43 x 34 McC713 MCC813* MCC913 Type D Flip Flop 1JD 48 x 57 MCC714 MCC814 MCC914 Dual 2-Input NOR Gate 9KM 30 x 37 MCC715 MCC815 mMcc9g15 Dual 3-Input NOR Gate IMF 35 x 33 Not Avail. MCC816 MCC916 J-K Flip Flop 78M 43 x 43 MCC717 MCC817* MCC917 Quad 2-Input NOR Gate 2KD 35 x 35 MCC718 MCC818* mcc918 Dual 3-Input NOR Gate IMF 35 x 33 McC719 MCC819* MCC919 Dual 4-Input NOR Gate IMF 35 x 33 MCC720 MCC820* MCC920 J-K Flip Flop 810 60 x 60 MCC721 MCC821* MCC921 Dual 2-Input Gate Expander WJC 38x 31 MCC722 MCC822* MCC922 J-K Flip Flop STA 54 x 58 MCC723 Not Avail. Not Avail. J-K Flip Flop 78M 43 x 43 MCC724 MCC824 MCC924 Quad 2-Input NOR Gate 2KD 35 x 35 MCC725 MCC825 MCC925 Dual 4-Input NOR Gate IMF 35 x 33 MCC726 MCC826 MCC926 J-K Flip Flop 12C 51x 57 MCC727 MCC827 MCC927 Quad Inverter 12L 29 x 29 MCC728 MCC828* McCc928 5-Input NOR Gate 774 45x 45 MCC729 MCC829 MCC929 5-Input NOR Gate B86 33 x 35 MCC764 MCC864* MCC964 Dual Exclusive OR/NOR Gate 314A 42 x 49 MCC767 MCC867* MCC967 Quad Latch 694A 60 x 64 MCC770 MCC870* McCc970 BCD to Decimal Decoder 88G 54x 71 MCC771 MCC871 MCC971 Quad Exclusive OR Gate 30A 47x 55 MCC774 MCC874 MCC974 J-K Flip Flop 12C 51x 57 MCC775 MCC875 MCC975 Dual Half Adder 19K 36x 37 MCC776 MCC876* MCC976 Dual J-K Flip Floe E90 50 x 58 MCC777 MCC877 MCC977 Binary Up Counter 80D 72x 80 MCC778 MCC878* MCC978 Dual Type D Flip Flop 49D 45x73 MCC779 MCC879 McC979 J-K Flip Flop, 1 Expander, 2 Buffers 2MkK 39 x 46 MCC780 MCC880 mccgs0 Decade Up Counter 80D 72x 80 MCC781 mMcCC881* MCC981 Oual Buffer 37B 43 x 45 MCC782 MCC882* MCC982 J-K Flip Flop 28C 50x 50 MCC783 MCC883 MCC983 Dual Half Shift Register 54K 43 x 37 MCC784 MCC884 MCC984 Dual Half Shift Register (w/inverter) E24 42 x 63 MCC785 MCC885 MCC985 Quad 2-Input Expander 2KD 35x 35 MCC786 MCC886 MCC986 Duai 4-Input Expander IMF 35x 33 MCC787 MCC887 MCC987 1J-K Flip Flop, 1 Inverter, 2 Buffers 2MK 39 x 46 MCC788 MCC888 Mccg9ss Dual 3-Input Buffer, non-I nverting 19H 37x 38 McCC789 MCC889 mMccg9gs9 Hex Inverter 3KD 34 x 36 MCC790 mccsso mMccss0 Dual J-K Flip Flop SKE 48 x 51 *These device types are guaranteed over the operating range 0 to +75C. 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