Features 256 x 9, 512 x 9, 1,024 x 9, 2048 x 9, and 4096 x 9 FIFO buffer memory Dual-port RAM cell Asynchronous read/write High-speed 50.0-MHz read/write independent of depth/width Low operating power Icct =35mA Half Full flag in standalone Empty and Full flags Retransmit in standalone Expandable in width and depth Parallel cascade minimizes bubble-through 5V + 10% supply 300-mil DIP packaging 7x7 TQFP 300-mil SOJ packaging TTL compatible Three-state outputs Pin compatible and functional equivalent to IDT7200, IDT7201, IDT7202, IDT7203, and IDT7204 CYPRESS CY7C419/21/25/29/33 256 x 9,512 x9, 1K x9, 2K x 9, 4K x 9 Cascadable FIFO Functional Description The CY7C419, CY7C420/1, CY7C424/5, CY7C428/9, and CY7C432/3 are first-in first-out (FIFO) memories offered in 600-mil wide and 300-mil wide packages. They are, respectively, 256, 512, 1,024, 2,048, and 4,096 words by 9-bits wide. Each FIFO memory is organized such that the data is read in the same sequential or- der that it was written. Full and Empty flags are provided to prevent overrun and underrun. Three additional pins are also provided to facilitate unlimited expansion in width, depth, or both. The depth expan- sion technique steers the control signals from one device to another in parallel, thus eliminating the serial addition of propaga- tion delays, so that throughput is not re- duced. Data is steered ina similar manner. The read and write operations may be asynchronous; each can occur at a rate of 50.0 MHz. The write operation occurs when the write (W) signal is LOW. Read occurs when read (R) goes LOW. The nine data outputs go to the high-impedance state when R is HIGH. A Half Full (HF) output flag is provided that is valid in the standalone and width ex- pansion configurations. In the depth ex- pansion configuration, this pin provides the expansion out (XO) information that is used to tell the next FIFO that it will be ac- tivated. In the standalone and width expansion configurations, a LOW on the retransmit (RT) input causes the FIFOs to retransmit the data. Read enable (R) and write en- able (W) must both be HIGH during re- transmit, and then R is used to access the data. The CY7C419, CY7C420, CY7C421, CY7C424, CY7C425, CY7C428, CY7C429, CY7C432, and CY7C433 are fabricated using an advanced 0.65-micron P-well CMOS technology. Input ESD pro- tection is greater than 2000V and latch-up is prevented by careful layout and guard rings. Logic Block Diagram DATA INPUTS Pin Configurations (Op-Dg) PLCC/LCC DIP Top View Top View LE ETT TET Piz 2 Bot gs wee| WRITE paw MARAY 4 3 2 1! 323130 CONTROL t 256 x9 20 S12x9 2a WRITE 1024x9 {) READ 27 POINTER zoaaxg [yd POINTER 4096 x9 28 25 24 TIIE Tri 23 THREE- stare \ Je We 2 SUFFERS 13 at 14 18 1617 181920 DATA OUTPUTS PHPSLE te {Qg-Qg} j reset [MR 420-2 A READ LOGIC bg FLAT Th] CONTROL | Fag 4 EF q Loaic FF EXPANSION xi | woac = [* > XOHF 420-1CY7C419/21/25/29/33 CYPRESS Selection Guide 256x9 7C419-10 | 7C419-15 | 7419-20 | 7C419-25 | 7C419-30 | 7C419-40 | 70419-65 512 x 9 (600-mil only) 7C420-20 | 7C420-25 | 7420-30 | 7C42040 | 70420-65 512x9 7C421-10 | 7421-15 | 7C421-20 | 7C421-25 | 7421-30 | 7C421-40 | 70421-65 1K x 9 (600-mil only) 70424-20 | 7C424-25 | 7C424-30 | 7C42440 | 7C424-65 1Kx9 7425-10 | 7C425-15 | 7425-20 | 7C425-25 | 7C425-30 | 7C425-40 | 7C42565 2K x 9 (600-mil only) 7C42820 | 7C428-25 | 7C428-30 | 7C42840 | 70428-65 2K x9 7C429-10 | 7C429-15 | 7429-20 | 7429-25 | 7C429-30 | 7C429-40 | 7C429-65 4K x 9 (600-mil only) 7C432-25 | 70432-30 | 7C432~-40 | 7C432-65 4K x9 7C433~-10 | 7C433-15 | 70433-20 | 7C433-25 | 7C433-30 | 7C433-40 | 7C433-65 Frequency (MHz) 50 40 33.3 28.5 25 20 12.5 Maximum Access Time (ns) 10 15 20 25 30 40 65 Iccy (mA) 35 35 35 35 35 35 35 Pin Configurations (continued) TQFP Top View eases Saas Maximum Rating (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ...............00. 65C to +150C Ambient Temperature with Power Applied .................0 0005 55C to +125C Supply Voltage to Ground Potential ........ ~-0.5V to +7.0V by cy 7 890 7928 27 2828 ia High estate Outputs ne -0.5V to +7.0V io DC Input Voltage ............0..0000 200 -0.5V to +7.0V NC 4 reaanee 7 Power Dissipation ......... 0606s cece ence eee 1.0W ro : 70433 we Output Current, into Outputs (LOW) ............-. 20 mA Qy 7 ta |= KOE Static Discharge Voltage ......0000.. 0.4.00 e eee > 2000V Qc. 8 17/. 2D Q) (per MIL-STD-883, Method 3015) i 8 101812 1314 15 16 Latch-Up Current 10.0.0... 0000000 e eee eee >200 mA | / | 1 ! | : c420.4 Operating Range o F3 dd Range Temperature Vcc Commercial 0C to + 70C SV + 10% Industrial ~40C to +B5C SV + 10% Military ~55C to +125C SV + 10% Electrical Characteristics Over the Operating Rangel?! 7C41910, 15, 20, 25, 30, 40, 65 7C420/110, 15, 20, 25, 30, 40, 65 7C424/510, 15, 20, 25, 30, 40, 65 7C428/910, 15, 20, 25, 30, 40, 65 7C432/310, 15, 20, 25, 30, 40, 65 Parameter Description Test Conditions Min. Max, Unit Von Output HIGH Voltage Vec = Min., lon = -2.0mA 2..4 v VoL Output LOW Voltage Vec = Min., lo, = 8.0 mA 0.4 Vv Vin Input HIGH Voltage Com! 2.0 Vec v Mil/Ind 2.2 Vcc Vin Input LOW Voltage Note 3 0.8 v Ix Input Leakage Current GND < Vi < Vcc -10 +10 pA loz Output Leakage Current R > Vin, GND < Vo < Voc -10 +10 pA los Output Short Circuit Currentl4] | Vcc = Max., Vour = GND -90 mACY7C419/21/25/29/33 CYPRESS Electrical Characteristics Over the Operating Rangel?! (continued) 7C419-10 | 7C419-15 | 7C419-20 | 70419-25 7C420-20 | 70420-25 7C421-10 | 7C421-15 | 7C421-20 | 7C42125 7C424-20 | 7C424-25 7C425-10 | 7C425-15 | 7C425-20 | 7C425-25 7C428-20 | 7C428-25 7C429-10 | 7C429-15 | 70429~20 | 70429-25 7C432-25 7C433-10 | 7C433-15 | 7C43320 | 7C433-25 Parameter Description Test Conditions Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit lec Operating Current Voc = Max., | Corn! 85 65 55 50 [mA lout = OmA - f = fMax Mil/Ind 100 90 80 ley Operating Current Voc = Max., | Com'l 35 35 35 35 | mA louT = 0 mA F = 20 MHz Isp Standby Current Alt Inputs = | Com! 10 10 10 10 | mA Vin Min. - Mil/Ind 15 15 15 Ispo Power-Down Current | All Inputs > | Com'l 5 5 5 5 mA Veo - 0.2V Mil/Ind 8 8 8 Electrical Characteristics Over the Operating Rangel] (continued) 7C41930 7C419-40 7C419-65 7C420-30 7C42040 70420-65 7C421-30 7C 421-40 7C42165 7C424-30 7C424-40 71C424-65 7C425-30 7C425-40 7C425-65 7C428-30 7C428-40 7C428-65 7C0429-30 7042940 7C429~65 7C432-30 70432-40 7C432-65 7C43330 70433-40 7C433-65 Parameter Description Test Conditions Min. | Max. | Min. | Max. | Min. | Max. | Units Iec Operating Current Vcc = Max., Com! 40 35 35 mA lour = 0mA f= fMax Mil/Ind 78 70 65 [cel Operating Current Vcc = Max. Com! 35 a5 35 mA Tout = 0OmMA F = 20 MHz Ispi Standby Current All Inputs = Com) 10 10 10 mA Vin Min. - Mit 15 15 15 Isp2 Power-Down Current All Inputs > Com! 5 5 5 mA Voc 0.2V - Mil 8 8 8 Capacitancel*) Parameter Description Test Conditions Max. Unit Cin Input Capacitance Ta = 25C, f = 1 MHz, 6 pF Cout Output Capacitance Voc = 45V 6 pF Notes: 1. Ta is the instant on case temperature. 2. See the last page of this specification for Group A subgroup testing in- formation. 3) Vir. (Min.) = 2.0V for pulse durations of less than 20 ns. 4. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds. Tested initially and after any design or process changes that may affect these parameters.7 CY7C419/21/25/29/33 CYPRESS PN2S/29! AC Test Loads and Waveforms R1 5002 Rt 500Q 5V 5V 0_-~w ALL INPUT PULSES i me TT Re R2 30 pF 5 pF I 333Q I 333Q INCLUDING = INCLUDING = JIG AND = = ca205 JIGAND~ = 4708 420-7 SCOPE (a) Normal Load SCOPE (b) High-Z Load Equivatent to: THEVENIN EQUIVALENT 200Q OUTPUT og av Switching Characteristics Over the Operating Range! 71 7C419-10 7C419-15 7C41920 7C419-25 7C420-20 7C420-25 7C0421-10 7C421-15 7C421-20 7C421-25 9) 7C42420 7C424-25 70425-10 70425 -15 7042520 7C425~25 7C42820 7C428-25 70429-10 70429-15 70429-20 7C42925 7C432~25 7C433-10 70433 -15 7C043320 7C433-25 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit tre Read Cycle Time 20 25 30 35 ns ta Access Time 10 15 20 25 ns tRR Read Recovery Time 10 10 10 10 ns (pr Read Pulse Width 10 15 20 25 ns trzRb4) Read LOW to Low Z 3 3 3 3 ns tpvrk@l | Data Valid After Read HIGH 5 5 5 5 ns tHzRO Read HIGH to High Z 15 15 15 18 ns twc Write Cycle Time 20 25 30 35 ns tpw Write Pulse Width 10 15 20 25 ns tywze4l [| Write HIGH to Low Z 5 5 5 5 ns twr Write Recovery Time 10 10 10 10 ns tsp Data Set-Up Time 6 8 12 15 ns tup Data Hold Time 0 0 0 0 ns tMRSC MR Cycle Time 20 25 30 35 ns {PMR MR Pulse Width 10 15 20 25 ns tRMR MR Recovery Time 10 10 10 10 ns trew Read HIGH to MR HIGH 10 1S 20 25 ns twew Write HIGH to MR HIGH 10 15 20 25 ns trTC Retransmit Cycle Time 20 25 30 35 ns tprr Retransmit Pulse Width 10 15 20 25 ns trrr Retransmit Recovery Time 10 10 10 10 ns Notes: 6. Test conditions assume signal transition time of 3 ns or less, timingref- 8. tyzR transition ismeasured at +200 mV from Vo, and 200mV from erence levels of 1.5V and output loading of the specified IoLToy and Vou. tpve transition is measured at the 1.5 level. tywz and 1LzR 30 pF load capacitance, as in part (a) of AC Test Load and Waveforms, transition is measured at + 100 m from the steady state. unless otherwise specified. 9. tyzp and tpyp use capacitance loading as in part (b) of AC Test Load 7. See the last page of this specification for Group A subgroup testing in- and Waveforms. formation.CY7C419/21/25/29/33 CYPRESS Switching Characteristics Over the Operating Rangel 7I (continued) 7C419-10 | 70419-15 7C419-20 | 7C419-25 7C420-20 | 7C420-25 7C421-10 | 7C421-15 | 7421-20 | 7C421-25 7C424-20 | 7C424-25 7C425-10 | 7C425-15 | 7C425-20 | 7C425-25 7C428-20 | 7C428-25 7C429-10 | 7C429-15 | 7C429-20 | 7C429-25 70432-2585 7C433-10 | 7C433~-15 | 7C433-20 | 7C433-25 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. | Min. | Max. | Unit {EFL MR to EF LOW 20 25 30 35 ns tHFH MR to HF HIGH 20 25 30 35 ns tFFH MR to FF HIGH 20 25 30 35 ns tREF Read LOW to EF LOW 10 15 20 25 ns tREF Read HIGH to FF HIGH 10 15 20 25 ns tWEF Write HIGH to EF HIGH 10 15 20 25 ns twrr Write LOW to FF LOW 10 15 20 25 ns twHr Write LOW to HF LOW 10 15 20 25 ns tRHF Read HIGH to HF HIGH 10 15 20 25 ns tRAE Effective Read from Write HIGH 10 15 20 25 ns treE Effective Read Pulse Width After EF HIGH | 10 15 20 25 ns tWaAF Effective Write from Read HIGH 10 15 20 25 ns twpF Effective Write Pulse Width After FF HIGH | 10 15 20 25 ns txoL Expansion Out LOW Delay from Clock 10 15 20 25 ns txoH Expansion Out HIGH Delay from Clock 10 15 20 25 nsCY7C419/21/25/29/33 CYPRESS Switching Characteristics Over the Operating Rangel 7] (continued) 7C419-30 7C419-40 7C419-65 7C 420-30 7C420-40 7C420-65 7C421-30 7C421-40 71C421-65 70424-30 7C42440 71C424-65 7C42530 7C42540 7C425-65 7C42830 7C42840 7C428-65 7C429-30 7C42940 7C429-65 7C432-30 7C43240 7C432-65 7C433-30 7C433-40 7C433-65 Parameter Description Min. | Max. | Min. | Max. | Min. | Max. Unit tre Read Cycle Time 40 50 80 ns ta Access Time 30, 40 65 ns tRR Read Recovery Time 10 10 15 ns tpr Read Pulse Width 30 40 65 ns trzrh 4) Read LOW to Low Z 3 3 3 ns tpvrio"l Data Valid After Read HIGH 5 5 5 ns tuzre el Read HIGH to High Z 20 20 20 ns twe Write Cycle Time 40) 50 80 ns tpw Write Pulse Width 30 40 65 ns taw2z4) Write HIGH to Low Z 5 5 5 ns twr Write Recovery Time 10 10 15 ns tsp Data Set-Up Time 18 20 30 ns typ Data Hold Time 0 0 0 ns tmrsc MR Cycle Time 40 50 80 ns tpMR MR Pulse Width 30 40 65 ns tRMR MR Recovery Time 10 10 15 ns thew Read HIGH to MR HIGH 30 40 65 ns twew Write HIGH to MR HIGH 30 40 65 ns trTc Retransmit Cycle Time 40 50 80 ns tprT Retransmit Pulse Width 30 40 65 ns tRTR Retransmit Recovery Time 10 10 15 ns tee MR to EF LOW 40 50 80 ns tHEH MR to HF HIGH 40 50 BO ns trEH MR to FF HIGH 40 50 80 ns tREF Read LOW to EF LOW 30 35 60 ns tRFF Read HIGH to FF HIGH 30 35 60 ns IWEF Write HIGH to EF HIGH 30 35 60 ns twrF Write LOW to FF LOW 30 35 60 ns tWHF Write LOW to HF LOW 30 35 60 ns (RHF Read HIGH to HF HIGH 30 35 60 ns tRaE Effective Read from Write HIGH 30 35 60 ns tReE Effective Read Pulse Width After EF HIGH 30 40 65 ns lwaF Effective Write from Read HIGH 30 35 60 ns tweF Effective Write Pulse Width After FF HIGH 30 40 65 ns xo. Expansion Out LOW Delay from Clock 30 40 65 ns txoH Expansion Out HIGH Delay from Clock 30 40 65 ns: CY7C419/21/25/29/33 CYPRESS Switching Waveforms Asynchronous Read and Write tac ter {pvr tHzA DATA VALID DATA VALID x~oe Iwo tpw twR i KC St~w {sp > tp Do-Dg DATA VALID DATA VALID ca20-8 Master Reset tuasc!! temp UR R, W [10] tere EF tHEH HF ter } FR OLLLLLLLLEILILLILLL AL AL 420-9 Half-Full Flag HALF FULL HALF FULL +14 HALF FULL Wo taHE R Lr L iWHF AF 420-10 Notes: 10. Wand R > Vy) around the rising edge of MR. 11. tyrsc = tpmr + true:CYPRESS CY7C419/21/25/29/33 Switching Waveforms (continued) Last Write to First Read Full Flag ADDITIONAL i LAST WRITE FIRST READ READS FIRST WRITE y \ 4 LS Ww y / \_/ wer > REF fe FF T t \ 420-11 Last Read to First Write Empty Flag ADDITIONAL LAST READ FIRST WRITE WRITES FIRST READ WwW y \__y LS " \_/ itwer EF F V 0 DATAOUT = x) (X) C420-12 Retransmitl!?] $< tatcl3) SS TUES {prt FURT 7 f a, RW ara 420-13 Notes: 12. EF, HF and FF may change state during retransmit asa result of the off- set of the read and write pointers, but flags will be valid at tac. 13. trrc = tprt + trrr-CY7C419/21/25/29/33 G72 prs Switching Waveforms (continued) Empty Flag and Read Data Flow-Through Mode DATA IN Y Tf et tpac F NAYAK +_ tare e tRer f{_. _f\ twer i ta 7 tuwz DATA OUT DATA VALID 420-14 Full Flag and Write Data Flow-Through Mode * } r* twar @f* twee * y W AMANO ] tare | twee _ FF Sas tHp DATA IN DATA VALID ho ta K# tsp >4 oatnour HK one vaio XXX 420-15je: CY7C419/21/25/29/33 CYPRESS Switching Waveforms (continued) Expansion Timing Diagrams WRITE TO LAST PHYSICAL WRITE TO FIRST PHYSICAL LOCATION OF DEVICE 1 LOCATION OF DEVICE 2 Ww { tyoL txoH XO, (XIa)!141 tHo tuo _ VYVYYVYVVYYVYVV VY VYVYVVVVV { DATAVALID Do-Os XRXXMAXKKAXKAAA CATA VALIO OOOO XA _DATA vaLiD 420-16 READ FROM LAST PHYSICAL READ FROM FIRST PHYSICAL LOCATION OF DEVICE 1 LOCATION OF DEVICE 2 R ~~ \ y~SY t~ Ae tre iY txoL txou XO, (X1Q)/'4) 4 tyzA THRXHOKRK SSX Qo-Q, _ AAA VALID WY) C420-17 Note: 14. Expansion Out of device 1 (XO}) is connected to Expansion In of de- vice 2 (XIn). CYPRESS CY7C419/21/25/29/33 Architecture The CY7C419, CY7C420/1, CY7C424/5, CY7C428/9, CY7C432/3 FIFOs consist of an array of 256, 512, 1024, 2048, 4096 words of 9 bits each (implemented by an array of dual-port RAM cells), a read pointer, a write pointer, control signals (W, R, XI, XO, FL, RT, MR), and Full, Half Full, and Empty flags. Dual-Port RAM The dual-port RAM architecture refers to the basic memory cell used in the RAM. The cell itself enables the read and write opera- tions to be independent of each other, whichis necessary to achieve truly asynchronous operation of the inputs and outputs. A second benefit is that the time required to increment the read and write pointers is much less than the time that would be required for data propagation through the memory, which would be the case if the memory were implemented using the conventional register array architecture. Resetting the FIFO Upon power-up, the FIFO must be reset witha Master Reset (MR) cycle. This causes the FIFO to enter the empty condition signified by the Empty flag (EF) being LOW, and both the Half Full (HF) and Full flags (FF) being HIGH. Read (R) and write (W) must be HIGH tppw/twpw before and tame after the rising edge of MR for a valid reset cycle. If reading from the FIFO after a reset cycle is attempted, the outputs will all be in the high-impedance state. Writing Data to the FIFO The availability of at least one empty location is indicated by a HIGH FF. The falling edge of W initiates a write cycle. Data ap- pearing at the inputs (Dy - Dg) tsp before and typ after the rising edge of W will be stored sequentially in the FIFO. The EF LOW-to-HIGH transition occurs twer after the first LOW-to-HIGH transition of W for an empty FIFO. AF goes LOW twue after the falling edge of W following the FIFO actually being Half Full. Therefore, the HF is active once the FIFO is filled to half its capacity plus one word. HF will remain LOW while less than one half of total memory is available for writing. The LOW-to-HIGH transition of HF occurs true after the rising edge of R when the FIFO goes from half full +1 to half full. Ht is available in stand- alone and width expansion modes. FF goes LOW twer after the falling edge of W, during the cycle in which the last available toca- tion is filled. Internal logic prevents overrunning a full FIFO. Writes to a full FIFO are ignored and the write pointer is not in- cremented. FF goes HIGH typ after a read from a full FIFO. Reading Data from the FIFO The falling edge of R initiates a read cycle if the EF is not LOW. Data outputs (Qg-Qx) are in a high-impedance condition between read operations (R HIGH), when the FIFO is empty, or when the FIFO is not the active device in the depth expansion mode. When one word is in the FIFO, the falling edge of R initiates a HIGH-to-LOW transition of EF. The rising edge of R causes the data outputs to go to the high-impedance state and remain such un- til a write is performed. Reads to an empty FIFO are ignored and do not increment the read pointer. From the empty condition, the FIFO can be read twrr after a valid write. The retransmit feature is beneficial when transferring packets of data. It enables the receipt of data to be acknowledged by the re- ceiver and retransmitted if necessary. The Retransmit (RT) inputis active in the standalone and width ex- pansion modes. The retransmit feature is intended for use when a number of writes equal to or less than the depth of the FIFO have occurred since the last MR cycle. A LOW pulse on RT resets the a internal read pointer to the first physical location of the FIFO. R and W must both be HIGH while and tpre after retransmit is LOW. With every read cycle after retransmit, previously accessed data as well as not previously accessed data is read and the read pointer is incremented until it is equal to the write pointer. Full, Half Full, and Empty flags are governed by the relative locations of the read and write pointers and are updated during a retransmit cycle. Data written to the FIFO after activation of RT are trans- mitted also, Up to the full depth of the FIFO can be repeatedly retransmitted. Standalone/Width Expansion Modes Standalone and width expansion modes are set by grounding Ex- pansion In (XT) and tying First Load (FL) ta Voc. FIFOs can be expanded in width to provide word widths greater than nine in in- crements of nine. During width expansion mode, all controtline in- puts are common to all devices, and flag outputs from any device can be monitored. Depth Expansion Mode (see Figure 1) Depth expansion mode is entered when, during a MR cycle, Expan- sion Out (XO) of one device is connected to Expansion In (XP) of the next device, with XO of the last device connected to XL of the first device, In the depth expansion mode the First Load (FL) in- put, when grounded, indicates that this part is the first to be loaded. All other devices must have this pin HIGH. To enable the correct FIFO, XO is pulsed LOW when the last physical location of the previous FIFO is written to and pulsed LOW again when the last physical location is read. Only one FIFO is enabled for read and one for write at any given time. All other devices are in standby. FIFOs can also be expanded simullancously in depth and width. Consequently, any depth or width FIFO can be created of word widths in increments of 9. When expanding in depth, a composite FF must be created by ORing the FFs together. Likewise, a com- posite EF is created by ORing the EFs together. HF and RT func- tions are not available in depth expansion mode, Use of the Empty and Full Flags Inorder to achieve the maximum frequency, the flags must be valid at the beginning of the next cycle. However, because they can be updated by either edge of the read of write signal, they must be val- id by one-half of a cycle. Cypress FIFOs meet this requirement; some competitors FIFOs do not. The reason why the flags are required to be valid by the next cycle is fairly complex. It has to do with the effective pulse width viola- tion phenomenon, which can occur at the fulland empty boundary conditions, if the flags are not properly used. The empty flag must be used to prevent reading from an empty FIFO and the full flag must be used to prevent writing into a full FIFO. Forexample, consider an empty FIFO that is receiving read pulses. Because the FIFO is empty, the read pulses are ignored by the FIFO, and nothing happens. Next, a single word is written into the FIFO, with asignal that is asynchronous to the read signal. The (in- ternal) state machine in the FIFO goes from empty to empty+ 1. However, it does this asynchronously with respect to the read sig- nal, so that it cannot be determined what the effective pulse width of the read signal is, because the stale machine does not look at the read signal until it gocs to the empty + 1 state. In a similar manner, the minimum write pulse width may be violated by attempting to write into a full FIFO, and asynchronously performing a read. The empty and full flags are used to avoid these effective pulse width violations, but in order to do this and operate at the maximum fre- quency, the flag must be valid at the beginning of the next cycle. 36CY7C419/21/25/29/33 CYPRESS GY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 Vee CY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 CY7C419 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 * FIRST DEVICE C420-18 Figure 1. Depth ExpansionCY7C419/21/25/29/33 CYPRESS Ordering Information oo Ordering Code ree Package Type ORaeee 10 CY7C419- 10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C41910IC J65 32-Lead Plastic Leaded Chip Carrier CY7C41910PC P21 28-Lead (300-Mil) Molded DIP CY7C41910VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7C41915AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419-15JC J65 32-Lead Plastic Leaded Chip Carrier CY7C41915PC P21 28-Lead (300-Mil) Molded DIP CY7C419-15VC v2) 28-Lead (300-Mil) Molded SOJ CY7C419-1551 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41915PI1 P21 28-Lead (300-Mil) Molded DIP CY7C41915V1 V21 28-Lead (300-Mil) Molded SOJ CY7C419-15DMB D22 28-Lead (300-Mil) CerDIP Mititary CY7C419-15LMB LSS 32-Pin Rectangular Leadless Chip Carrier 20 CY7C41920AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C41920IC J65 32-Lead Plastic Leaded Chip Carrier CY7C41920PC P21 28-Lead (300-Mil) Molded DIP CY7C419-20VC V21 28-Lead (300-Mil) Molded SOJ CY7C419-20J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41920PI P21 28-Lead (300-Mil) Molded DIP CY7C419-20V1 V2) 28-Lead (300-Mil) Molded SOJ CY7C419-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-20LMB L55 32-Pin Rectangular Leadless Chip Carrier 25 CY7C419-25AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419-25)C Jas 32-Lead Plastic Leaded Chip Carrier CY7C419-25PC P21 28-Lead (300-Mil) Molded DIP CY7C41925VC v2t 28-Lead (300-Mil) Molded SOJ CY7C41925J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C419-25P] P2l 28-Lead (300-Mil) Molded DIP CY7C419-25VI v21 28-Lead (300-Mil) Molded SOJ CY7C419-25DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-25LMB L55 32-Pin Rectangular Leadless Chip Carrier 30 CY7C419-30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419-305C J65 32-Lead Plastic Leaded Chip Carrier CY7C41930PC P2i 28-Lead (300-Mil) Molded DIP CY7C41930VC v21 28-Lead (300-Mil) Molded SOJ CY7C419-3051 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41930PI P21 28-Lead (300-Mil) Molded DIP CY7C419-30V1 V21 28-Lead (300-Mil) Molded SOJ CY7C419-30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-30LMB Ls5 32-Pin Rectangular Leadless Chip Carrier 40 CY7C41940AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419405C Jos 32-Lead Plastic Leaded Chip Carrier CY7C41940PC P21 28-Lead (300-Mil) Molded DIP CY7C41940VC V21 28-Lead (300-Mil) Molded SOJCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) oa Ordering Code Pa Package Type ORreee 40 CY7C419-40J] J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C419~40PI P21 28-Lead (300-Mil) Molded DIP CY7C419-40VI V21 28-Lead (300-Mil) Molded SOJ CY7C419-40DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-40LMB LS5 32-Pin Rectangular Leadless Chip Carrier 65 CY7C419-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C419-65JC J65 32-Lead Plastic Leaded Chip Carrier CY7C41965PC P21 28-Lead (300-Mil) Molded DIP CY7C41965VC V21 28-Lead (300-Mil) Molded SOJ CY7C41965J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C41965PI P2t 28-Lead (300-Mil) Molded DIP CY7C41965VI V21 28-Lead (300-Mil) Molded SOJ} CY7C419-65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C419-65LMB LS5 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) ae Ordering Code ee Package Type ORaaee 20 CY7C420-20PC P15 28-Lead (600-Mil) Molded DIP Commercial 25 CY7C420 25PC P15 28-Lead (600-Mil} Molded DIP Commercial CY7C42025PI1 P15 28-Lead (600-Mil) Molded DIP Industrial CY7C420-25DMB D16 28-Lead (600-Mil) CerDIP Military 30 CY7C42030PC P15 28-Lead (600-Mil) Molded DIP Commercial CY7C42030PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C420-30DMB DI6 28-Lead (60(-Mil) CerDIP Military 40 CY7C42040PC PIS 28-Lead (600-Mil) Molded DIP Commerical CY7C42040PI P15 28-Lead (600-Mil) Molded DIP Industry CY7C420~40DMB D16 28-Lead (600-Mil) CerDIP Military 65 CY7C420-65PC P15 28-Lead (600-Mil) Molded DIP Commerical CY7C42065PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C420-65DMB D16 28-Lead (600-Mil) CerDIP MilitaryCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) Speed Ordering Code ene Package Type Operating 10 CY7C421-10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421105C J65 32-Lead Plastic Leaded Chip Carrier CY7C421~10PC P21 28-Lead (300-Mil) Molded DIP CY7C421-10VC V21 28-Lead (300-Mil} Molded SOJ 15 CY7C421- ISAC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421 - 15JC J65 32-Lead Plastic Leaded Chip Carrier CY7C421-15PC P2t 28-Lead (300-Mil) Molded DIP CY7C42115VC V21 28-Lead (300-Mil) Molded SOJ CY7C421-15J] J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C421E5PI P21 28-Lead (300-Mil) Molded DIP CY7C421-15V1 V2) 28-Lead (300-Mil) Molded SO} CY7C42115DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-15LMB L55 32-Pin Rectangular Leadless Chip Carrier 20 CY7C421 -20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial C7C421 20JC J65 32-Lead Plastic Leaded Chip Carrier CY7C421 -20PC P21 28-Lead (300-Mil) Molded DIP CY7C421-20VC V21 28-Lead (300-Mil) Molded SOJ CY7C421 -20J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42120PI P21) 28-Lead (300-Mil) Molded DIP CY7C421-20V1 V21 28-Lead (300-Mil) Molded SOJ CY7C421-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42120LMB L55 32-Pin Rectangular Leadless Chip Carrier 25 CY7C42125AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421 25IC J65 32-Lead Plastic Leaded Chip Carrier CY7C421 -25PC P21 28-Lead (300-Mil}) Molded DIP CY7C42125VC V2t 28-Lead (300-Mil} Molded SOJ CY7C421 -25J] J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42125P1 P21) 28-Lead (300-Mil) Molded DIP CY7C421 -25V1 V21 28-Lead (300-Mil} Molded SOJ CY7C42125DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421~25LMB LSs 32-Pin Rectangular Leadless Chip Carrier 30 CY7C421-30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421-30IC J65 32-Lead Plastic Leaded Chip Carrier CY7C421-30PC P21 28-Lead (300-Mil) Molded DIP CY7C42130VC V21 28-Lead (300-Mil) Molded SOJ CY7C421-30)1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42130PI P21 28-Lead (300-Mil) Molded DIP CY7C421-30VI V21 28-Lead (300-Mil) Molded SOJ CY7C42130DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-30LMB LS5 32-Pin Rectangular Leadless Chip Carrier 5-40CY7C419/21/25/29/33 CYPRESS Ordering Information (continued) ee Ordering Code ree Package Type OFage 40 CY7C421-40AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421-40JC J65 32-Lead Plastic Leaded Chip Carrier CY7C42140PC P21] 28-Lead (300-Mil) Molded DIP CY7C421-40VC V21 28-Lead (300-Mil) Molded SOF CY7C42140J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42140PI P21 28-Lead (300-Mil) Molded DIP CY7C42140VI V21 28-Lead (300-Mil) Molded SOJ CY7C421-40DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421~40LMB LSS 32-Pin Rectangular Leadless Chip Carrier 65 CY7C421-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C421~40JC J65 32-Lead Plastic Leaded Chip Carrier CY7C421-65PC P21 28-Lead (300-Mil) Molded DIP CYIC42165VC V21_ | 28-Lead (300-Mil) Molded SOJ CY7C421-65J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42165PI P21 28-Lead (300-Mil) Molded DIP CY7C421-65V1 Vv21 28-Lead (300-Mil) Molded SOJ CY7C421-65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C421-65LMB LS5 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) Spe Ordering Code ee Package Type fangs 20 CY7C424-20PC P15 28-Lead (600-Mil) Molded DIP Commercial 25 CY7C42425PC P15 28-Lead (600-Mil) Molded DIP Commercial CY7C42425P1 PLS 28-Lead (600-Mil) Molded DIP Industrial CY7C42425DMB D16 28-Lead (600-Mil) CerDIP Military 30 CY7C424-30PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C424-30PI P15 28-Lead (600-Mil) Molded DIP Industrial CY7C424-30DMB D16 28-Lead (600-Mil) CerDIP Military 40 CY7C42440PC P15 28-Lead (600-Mil) Molded DIP Commercial CY7C42440P1 P15 28-Lead (600-Mil) Molded DIP Industria! CY7C42440DMB D16 28-Lead (600-Mil) CerDIP Military 65 CY7C42465PC P15 28-Lead (600-Mil) Molded DIP Commercial CY7C424-65P1 PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C42465DMB D16 28-Lead (600-Mil) CerDIP MilitaryCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) See Ordering Code ee Package Type OVeaee 10 CY7C425-10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 10JC J65 32-Lead Plastic Leaded Chip Carrier CY7C42510PC P2i 28-Lead (300-Mil) Molded DIP CY7C42510VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7C425-15AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C42515JC J65 32-Lead Plastic Leaded Chip Carrier CY7C42515PC P21 28-Lead (300-Mil) Molded DIP CY7C42515VC V2) 28-Lead (300-Mil) Molded SOJ CY7C42515J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42515PI P21 28-Lead (300-Mil) Molded DIP CY7C425-15VI V21 28-Lead (300-Mil) Molded SOJ CY7C42515DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425- 1SLMB L55 32-Pin Rectangular Leadless Chip Carrier 20 CY7C425-20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425205C Jos 32-Lead Plastic Leaded Chip Carrier CY7C425 20PC P2) 28-Lead (300-Mil) Molded DIP CY7C42520VC V2i1 28-Lead (300-Mil) Molded SOJ CY7C425 2051 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42520PI P21 28-Lead (300-Mil) Molded DIP. CY7C425-20V1 v21 28-Lead (300-Mil) Molded SOJ CY7C425-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425 -20LMB L55 32-Pin Rectangular Leadless Chip Carrier 25 CY7C42525AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 25JC J65 32-Lead Plastic Leaded Chip Carrier CY7C42525PC P21 28-Lead (300-Mil) Molded DIP CY7C42525VC V21 28-Lead (300-Mil) Molded SOJ CY7C425-25}1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42525PI1 P21 28-Lead (300-Mil} Molded DIP CY7C42525VI V21 28-Lead (300-Mil) Molded SOJ CY7C425-25DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425-25LMB LS55 32-Pin Rectangular Leadless Chip Carrier 30 CY7C42530AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425305IC J65 32-Lead Plastic Leaded Chip Carrier CY7C425 30PC P21 28-Lead (300-Mil) Molded DIP CY7C425 -30VC v21 28-Lead (300-Mil) Molded SOJ CY7C425 ~30J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42530PI P21 28-Lead (300-Mil) Molded DIP CY7C425 30V1 V21 28-Lead (300-Mil) Molded SOJ CY7C425-30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42530LMB LSS 32-Pin Rectangular Leadless Chip CarrierCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) Speed Ordering Code one Package Type 40 CY7C425-40AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425 405C J65 32-Lead Plastic Leaded Chip Carrier CY7C42540PC P21 28-Lead (300-Mil) Molded DIP CY7C42540VC V21 28-Lead (300-Mil} Molded SOJ CY7C42540J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42540P1 P21 28-Lead (300-Mil) Molded DIP CY7C42540VI V21 28-Lead (300-Mil) Molded SOJ CY7C42540DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425-40LMB L55 32-Pin Rectangular Leadless Chip Carrier : 65 CY7C425-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C425~65IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42565PC P2I 28-Lead (300-Mil) Molded DIP CY7C425-65VC V21 28-Lead (300-Mil) Malded SOJ CY7C425 -65J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42565PI P21 28-Lead (300-Mil) Malded DIP CY7C42565V1 V2) 28-Lead (300-Mil) Malded SOJ CY7C425-65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C425-65LMB LS5 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) pew Ordering Code ree Package Type Range 20 CY7C42820PC PIS 28-Lead (600-Mil) Molded DIP Commercial 25 CY7C42825PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C428-25PI P15 28-Lead (600-Mil) Molded DIP Industrial CY7C42825DMB D16 28-Lead (600-Mil) CerDIP Military 30 CY7C42830PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42830PI1 PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C42830DMB D16 28-Lead (600-Mil) CerDIP Military 40 CY7C42840PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C42840PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C42840DMB D16 28-Lead (600-Mil) CerDIP Military 65 CY7C428-6SPC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C428-65P1 P15 28-Lead (600-Mil) Molded DIP Industrial CY7C428-6S5DMB Dit 28-Lead (600-Mil) CerDIP MilitaryCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) Spec Ordering Code ee Package Type ORaage 10 CY7C429 10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429- 10IC J65 32-Lead Plastic Leaded Chip Carrier CY7C429 1OPC P21 28-Lead (300-Mil) Molded DIP CY7C429 10VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7C429 15AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429 15IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42915PC P21 28-Lead (300-Mil)} Molded DIP CY7C429 ISVC V2i 28-Lead (300-Mil) Molded SOJ CY7C429 15J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C429 15P] P21 28-Lead (300-Mil) Molded DIP CY7C429 15VI V21 28-Lead (300-Mil) Molded SOJ CY7C429- 15DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429-15LMB L55 32-Pin Rectangular Leadless Chip Carrier 20 CY7C42920AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C42920IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42920PC P21 28-Lead (300-Mil) Molded DIP CY7C429-20VC v2! 28-Lead (300-Mil) Molded SOJ CY7C429 2051 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C429-20P] P21 28-Lead (300-Mil} Molded DIP CY7C429-20VI v21 28-Lead (300-Mil) Molded SOJ CY7C429-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429-20LMB LSS 32-Pin Rectangular Leadless Chip Carrier 25 CY7C42925AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429-253C J65 32-Lead Plastic Leaded Chip Carrier CY7C42925PC P21 28-Lead (300-Mil) Molded DIP CY7C42925VC V21 28-Lead (300-Mil) Molded SOJ CY7C42925])1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42925P] P21 28-Lead (300-Mil) Molded DIP CY7C42925V1 V2i 28-Lead (300-Mil) Molded SOJ CY7C42925DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429-25LMB L55 32-Pin Rectangular Leadless Chip Carrier 30 CY7C429-30AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429-30JC J65 32-Lead Plastic Leaded Chip Carrier CY7C429 -30PC P21 28-Lead (300-Mil) Molded DIP CY7C429-30VC v21 28-Lead (300-Mil) Molded SOJ CY7C429 3051 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42930PI P21 28-Lead (300-Mil) Moided DIP CY7C429-30V1 V21 28-Lead (300-Mil) Molded SOJ CY7C429-30DMB D22 28-Lead (300-Mil) CerDIP Military CY7C42930LMB LS5 32-Pin Rectangular Leadless Chip Carrier 40 CY7C429-40AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429~40IC J65 32-Lead Plastic Leaded Chip Carrier CY7C42940PC P21 28-Lead (300-Mil} Molded DIP CY7C429-40VC V21 28-Lead (300-Mil} Molded SOJCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) Speed Ordering Code ee Package Type Range 40 CY7C42940J1 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42940PI P21 28-Lead (300-Mil) Molded DIP CY7C429-40VI V21 28-Lead (300-Mil) Molded SOJ CY7C429-40DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429-40LMB LS5 32-Pin Rectangular Leadless Chip Carrier 65 CY7C429-65AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C429-65IC J65 32-Lead Plastic Leaded Chip Carrier CY7C429-65PC P21 28-Lead (300-Mil) Molded DIP CY7C429-65VC V21 28-Lead (300-Mil) Molded SOJ CY7C429-6551 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C42965PI P21 28-Lead (300-Mil) Molded DIP CY7C429-65V1 V21 28-Lead (300-Mil) Molded SOJ CY7C429-65DMB D22 28-Lead (300-Mil) CerDIP Military CY7C429-65LMB L55 32-Pin Rectangular Leadless Chip Carrier Ordering Information (continued) Ordering Code Nee Package Type Ore 25 CY7C43225PC PIs 28-Lead (600-Mil) Molded DIP Commercial 30 CY7C43230PC PIS 28-Lead (600-Mil) Molded DIP Commerical CY7C43230PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C432-30DMB DI6 28-Lead (600-Mil) CerDIP Military 40 CY7C432-40PC PIS 28-Lead (600-Mil) Molded DIP Commercial CY7C432~40PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C43240DMB DI6 28-Lead (600-Mil) CerDIP Military 65 CY7C432-65PC P15 28-Lead (600-Mil) Molded DIP Commercial CY7C432-65PI PIS 28-Lead (600-Mil) Molded DIP Industrial CY7C432-65DMB DI6 28-Lead (600-Mil) CerDIP Military Ordering Information (continued) Ordering Code Nene Package Type Ofare 10 CY7C433-10AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433 10JC J65 32-Lead Plastic Leaded Chip Carrier CY7C43310PC P2t 28-Lead (300-Mil} Molded DIP CY7C43310VC v21 28-Lead (300-Mil) Molded SOJ 1S CY7C433-15AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43315JC J65 32-Lead Plastic Leaded Chip Carrier CY7C43315PC P21) 28-Lead (300-Mil) Molded DIP CY7C43315VC V2) 28-Lead (300-Mil) Molded SOJ CY7C4331SJI J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43315PI P21] 28-Lead (300-Mil) Molded DIP CY7C43315VI v21 28-Lead (300-Mil) Molded SOJ CY7C433-15DMB D22 28-Lead (300-Mil) CerDIP Military CY7C43315LMB L55 32-Pin Rectangular Leadless Chip CarrierCY7C419/21/25/29/33 CYPRESS Ordering Information (continued) ea Ordering Code Nene Package Type Opraring 20 CY7C433-20AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433~20JC J65 32-Lead Plastic Leaded Chip Carrier CY7C43320PC P2] 28-Lead (300-Mil) Molded DIP CY7C43320VC v21 28-Lead (300-Mil} Molded SOJ CY7C433- 2031 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C433-20P1 P21 28-Lead (300-Mil) Molded DIP CY7C433-20V1 V21 28-Lead (300-Mil} Molded SOJ CY7C433-20DMB D22 28-Lead (300-Mil) CerDIP Military CY7C433-20LMB LS5 32-Pin Rectangular Leadless Chip Carrier 25 CY7C43325AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43325IC J65 32-Lead Plastic Leaded Chip Carrier CY7C43325PC P21 28-Lead (300-Mil) Molded DIP CY7C433-25VC V21 28-Lead (300-Mil) Molded SOJ CY7C433-2551 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43325PI P21 28-Lead (300-Mil) Molded DIP CY7C43325V] V21 28-Lead (300-Mil) Molded SOJ CY7C4332S5DMB D22 28-Lead (300-Mil) CerDIP Military CY7C433-25LMB L55 32-Pin Rectangular Leadless Chip Carrier 30 CY7C43330AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43330JC J65 32-Lead Plastic Leaded Chip Carrier CY7C43330PC P21 28-Lead (300-Mil) Molded DIP CY7C433~-30VC V2i 28-Lead (300-Mil) Molded SOJ CY7C4333051 565 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43330PI P21 28-Lead (300-Mil) Molded DIP CY7C43330VI V21 28-Lead (300-Mil) Molded SOJ CY7C433-30DMB D22 28-Lead (300-Mit) CerDIP Military CY7C433-30LMB LS5 32-Pin Rectangular Leadless Chip Carrier 40 CY7C43340AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C43340IC J65 32-Lead Plastic Leaded Chip Carrier CY7C43340PC P21 28-Lead (300-Mil) Molded DIP CY7C433-40VC V2) 28-Lead (300-Mil) Molded SOJ CY7C433-40H J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C433 40PI P21 28-Lead (300-Mil) Molded DIP CY7C433~40V1 V2i 28-Lead (300-Mil) Molded SOJ CY7C43340DMB D22 28-Lead (300-Mil) CerDIP Military CY7C43340LMB LSS 32-Pin Rectangular Leadless Chip Carrier 65 CY7C43365AC A32 32-Pin Thin Plastic Quad Flatpack Commercial CY7C433-653C J65 32-Lead Plastic Leaded Chip Carrier CY7C433 ~65PC P21 28-Lead (300-Mil) Molded DIP CY7C433-65VC V21 28-Lead (300-Mil) Molded SOJ CY7C433~6551 J65 32-Lead Plastic Leaded Chip Carrier Industrial CY7C43365P1 P21 28-Lead (300-Mil) Molded DIP CY7C433-65VI V21 28-Lead (300-Mil) Molded SOJ CY7C433-65DMB D22 28-Lead (300-Mil} CerDIP Military CY7C433-65LMB LS5 32-Pin Rectangular Leadless Chip CarrierCYPRESS CY7C419/21/25/29/33 MILITARY SPECIFICATIONS Group A Subgroup Testing DC Characteristics Switching Characteristics Parameters Subgroups Parameters Subgroups Vou 1, 2,3 tre 9,10, 11 VoL 1, 2,3 ta 9, 10, 11 Vin 1,2,3 tre 9,10, 11 Vit Max. 1, 2,3 tpr 9, 10, 11 lix 1,2,3 tpvR 9, 10, 11 Icc 1, 2,3 twe 9, 10, 11 lec 1, 2,3 tpw 9, 10, 11 Ispi 1,2,3 twR 9,10, 11 Isp2 1, 2,3 tsp 9,10, 11 Tos 1, 2,3 typ 9, 10, 11 tmRsc _ 9, 10, TL tpMR 9, 10, 11 tRMR 9, 10, 11 trpw 9, 10, 11 twew 9, 10, 11 trtc 9, 10, 11 tprr 9, 10, 11 IRTR 9,10, 11 tEFL 9, 10, 11 tHFH 9, 10, 11 {FFH 9, 10, 11 (REF 9, 10, 11 trFF 9, 10, 11 twEF 9, 10, 11 tWweF 9, 10, 11 {WHE 9, 10, 11 tRHF 9, 10, 11 tRAE 9, 10, 11 tRPE 9,10, 11 tWAF 9, 10, 11 twPF 9, 10, 11 txoL 9, 10, It xoH 9,10, 11 Document #: 3800079-L