USB3-A, USB3-B SERIES
USB3–A–S–S–TH
USB3–B–S–F–TH
WWW.SAMTEC.COM
SPECIFICATIONS
USB3 A S PLATING TERMINATION
–TH
= Through-hole
–F
= Gold Flash on Mating Area, Matte Tin on Tails
–S
= 30µ" (0,76µm) Gold on Mating Area, Matte Tin on Tails
USB 3.0 INTERFACES
(12,50) .492
(5,12)
.202
(2,00)
.079
(3,50) .138
(1,00) .039
(4,00)
.157
(1,00) .039
(11,10) .437
(13,10) .516
(15,60) .614
(1,50)
.059
(2,00) .079
(6,00)
.236
(16,50)
.650
(6,99)
.275
(2,83)
.111
(11,78)
.464
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?USB3-A or
www.samtec.com?USB3-B
Insulator Material:
Nylon 6T Blue
Contact Material:
Phosphor Copper
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Shield Plating:
50µ" (1,27µm) Ni
Front Shield:
Phosphor Copper
Back Shield:
Brass
Operating Temp Range:
-50°C to +85°C
Current Rating:
1.8 A per power (VBUS)
contact and ground contact,
0.25A per other contact
Voltage Rating:
100 VAC
Contact Resistance:
30 mΩ max power and ground,
50 mΩ max for other contact
Minimum Cycles:
5000
RoHS Compliant:
Ye s
USB3 B S PLATING TERMINATION
–TH
= Through-hole
–F
= Gold Flash on Mating Area, Matte Tin on Tails
–S
= 30µ" (0,76µm) Gold on Mating Area, Matte Tin on Tails
(12,00) .472
(14,30) .563
(1,75)
.069 (2,00)
.079
(2,00)
.079
(1,25)
.049
(2,50)
.098
(18,25)
.719
(10,30)
.406
(2,80)
.110
(12,90)
.508
(10,30) .406
(2,72)
.107
USB3-A Mates with:
USBC3-AM
USB3-B Mates with:
USBC3-BM
F-212
