REVISIONS LTR DESCRIPTION DATE (yR-M0-DA) APPROVED A Changes in accordance with NOR 5962-R231-93. 93-09-21 M. A. Frye Updated boilerplate. Added device types 03-05. 94-08-19 M. A. Frye Removed programming requirements from drawing. TABLE I. changes. Editorial changes throughout. REV SHEET REV SHEET REV STATUS REV B 8 B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PREPARED BY PMIC N/A James . Jamison DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARD CHECKED BY MICROCTIRCUIT Ray Monnin DRAWING MICROCIRCUITS, MEMORY, DIGITAL, CMOS APPROVED BY vrs prawine 1s avanurate | Miehael A. Frye 1K X 8 REGISTERED PROM, MONOLITHIC FOR USE BY ALL DEPARTMENTS SILICON AND AGENCIES OF THE DRAWING APPROVAL DATE DEPARTMENT OF DEFENSE 88-09-22 SIZE CAGE CODE 5962-88636 AMSC N/A REVISION LEVEL A 67268 8 SHEET 1 OF "1 nah an gE DESC FORM 193 JUL 94 5962-E349-94 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. M@ 9004708 0003423 2761. SCOPE 1.1 Scope. This drawing describes device requirements for class 8 microcircuits in accordance with 1.2.1 of HIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". 1.2 Part_or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-88636 o1 XxX xX { { | a _l Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 4.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 70235 1K X 8-bit registered PROM 40 02 70235 1K X 8-bit registered PROM 30 03 TC235A 1K X 8-bit registered PROM 40 04 7C235A 1K X 8bit registered PROM 30 05 7C235A 1K X 8-bit registered PROM 25 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline Letter Descriptive designator Terminals Package style K CDFP3-F24 or GDFP2-F24 24 flat package L CDIP4-T24 or GDIP3-T24 24 Dual-in-Line 3 CQCC1-N28 28 Square chip carrier not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. 1.3 Absolute maximum ratings. 2/ Supply voltage range to ground potential Vee) ------ ee 0.5 V de to +7.0 V de DC voltage range applied to the outputs in the high Z state - - -0.5 V de to +7.0 V de OC input voltage --------------------++-- -3.0 V de to +7.0 V de Maximum power dissipation ----+--+-+-----------77 4.00 3/ Lead temperature (soldering, 10 seconds) ----------- +260C Thermal resistance, junction-to-case (850) cote eee te See MIL-STO-1835 Junction temperature (Tj) ----------- 7-7-7 ree +150C 4/ Storage temperature range (Toy-) -- ----- 7-7 tr -65C to +150C Temperature under bias - ------------------- -55C to +125C Data retention ------------ 5 - eee or ree 10 years, minimum 1.4 Recommended operating conditions. Supply voltage range Wee? ccc cr cer er ee ee ee ee eee +4.5 V de minimum to +5.5 V dco maximum Ground voltage (GND) - -------------------- OV dc Input high voltage range (Vj) - ----- >> tt +2.0 V de to Ve_ Input low voltage range wd wer rr tr tr rrr ree -0.5 V de to +58 V de Case operating temperature range (T.) ------------ -55C to +125C 1/ Generic numbers are also Listed on the Standardized Military Drawing Source Approval Bulletin and in MIL-BUL-103. / Unless otherwise specified, all voltages are referenced to ground. 3/ Must withstand the added Py due to short circuit test; e.g., Ing 4/ Maximum junction temperature may be inceased to +175C during burn-in and steady state Life tests. 1.2.3 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter X" shall STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B DESC FORM 193A JUL 94 me 9004708 0003b2e4 102. APPLICABLE DOCUMENTS 2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards, bulletin, and handbook of the issue Listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MICROCIRCUIT MIL-I-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS MICROCIRCUIT MIL-STD-883 Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MICROCIRCUIT MIL-BUL-103 - List of Standardized Military Drawings (SMD's). (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIPEMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. Product buiit to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-1-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-1-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or QML" certification mark in accordance with MIL-1-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STD-883 (see 3.1 herein) and herein. 3.2.1 Terminat connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, 8, C, or D (see 4.4), the devices shall be programmed by the manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at Least 25 percent of the total number of bits programmed. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. STANDARD SIZE 5962-88636 MICROCIRCULT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 3 DESC FORM 193A JUL 94 me 9004708 0003625 045 @3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.4 herein). The part shall be marked with the PIN Listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein). 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-EC prior to Listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificatin_of change. Notification of change to DESC-EC shall be required in accordance with MIL-STD-883 (see 3.1 herein). 3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of configurations, two processing options are provided for selection in the contract using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.3.4d and Table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done initially and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but wilt guarantee the number of years Listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request. 4, QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be 1n accordance with MIL-STD-833 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision Level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) Ty = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quatity conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, 8, C, and D inspections. The following additional criteria shall apply. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 4 DESC FORM 193A JUL 94 me 9004708 g003beb T45TABLE I. Electrical performance characteristics. Conditions Limits Test Symbol -55C = r= +#125C Group A |Device [Unit 4.5.VS Ve. 35.5 V subgroups| types Min | Max unless otherwise specified Output voltage high Vou Vee = Min, In, = -4 mA 1, 2,3 ALL 2.4 v Vin = Vin OF Vin Output voltage low You Voc = Min, Ip, = 16 mA 1, 2, 3 ALL 0.4 Vv | WVon = Yan OF Yap | | | Input voltage high Vou V 1, 2,3 ALL 2.0 | Vv Input voltage tow Vo V 1, 2, 3 ALL 0.8 v | | | | | | | | j { | { IYee = Max | | | Input leakage current Liy [Viy = 9-5 and GND. 1,2, 3 | all | -10 | 10 | pA | Voc = Max | Output leakage current [Ip IVoyy = 5-5 and GND 2/ |1, 2, 3 ALL | -10 {| 10 | pA Outputs disabled Output short circuit Io Veo = Max, Vouy_ = GND 1, 2, 3 ALL -20 | -90 | mA current 3) 4/ { | Power supply current [ee IVoe M:x, 1, 2,3 ALL | 120 | mA | Hour O mA | | | | |T, = +25 C, Viy = OV Input capacitance [Cry |f = 1 MHz, Vee = 5.0 V | 4 [Aut | 410 pF [See 4.3.1 | [T. = +25 C, V =OV | Output capacitance oyy LF = 1 MHZ, Veg 5.0 4& ALL | } 10 | pF [See 4.3.1 | | | Functional tests [See 4.3.1e |7, 84,88 | ALL | { | | | {_ 01,03 | 40 __ Address setup to clock [toy |S/ 9, 10, 11|_ 02,04 | 30 | ns high | | 05 25 | | | | Address hold from clock |ty, | 9, 10, 11[ ALL | ns high | | | | | 01,03 20 Clock high to output Ite | {9, 10, 11|__02,04 15 ] ns valid | | | 05 | 12 | | Clock pulse width Itpye | 9, 10, 11]__01,03 20 ns | | | j_02,04 | 15 | ! | | os | 12 | See footnotes at end of table. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL | SHEET B 5 DESC FORM 193A JUL 94 me 9004708 o003bc? 411TABLE I. Electrical performance characteristics - continued. Conditions Limits Test Symbol -55C ST. S +125C Group A |Device Unit 4.5 VEV, 25.5 subgroups] types Min | Max unless otherwise specified Es setup to clock high tses 3/ 9, 10, 11[__01,03 15 ns | 02,04, | 05 10 - | Es hold from clock HIGH |t,-. | 9, 10, 11 ALL 5 ns | | Inactive to valid output tens | 9, 10, 11|__ 01,03 25 ns from clock high 6/ | 02,04 | | 0 | 20 [ | { | Inactive output from tuze | 19, 10, 11|__ 01,03 | 25 ns clock high 3/ 6/ 7/ | 02,04 | | | 20 | Valid output from E tnoe 9, 10, 11|__01,03 25 | ns low 8/ 02,04 0s 20 Inactive output tuze 9, 10, 11] 01,03 25 ns from E high 3/ 7/ 8/ 02,04 05 20 Delay from INIT to tor 9, 10, 11|__ 01,03 35 ns valid output 3/ 02,04 05 25 INIT recovery ter 9, 10, 11 ALL 20 ns to clock high 3/ INIT pulse width 3/ tour 9, 10, 11{_ C1,03 25 ns | 02,04 | | 05 20 1/ These are absolute values with respect to device ground pin and include all overshoots due to system or tester noise. Do not attempt to test these values without suitable equipment. 2/ For devices using synchronous enable, the device must be clocked after applying these voltages to perform this measurement. 3/ These parameters may not be tested, but shall be guaranteed to the Limits specified in table I. 4/ For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds. 5/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference Levels of 1.5 V, input pulse levels of 0 V to 3.0 V, output Loading of the specified Ig, OF Igy and 50 pF load capacitance. See figure 3. 6/ Applies only when the synchronous (Es) function is used. 7/ Transition is measured at steady state high Level -500 mV or steady state low Level +500 mV on the output from the 1.5 V level on the input and 5 pF load capacitance. See figure 3. 8/ Applies only when the asynchronous () function is used. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 6 DESC FORM 193A JUL 9% mm 9004708 0003625 455 meDevice types ALL Case out Lines K, kL 3 Terminal Terminal number symbol 1 A NC 2 Ne { Ay 3 Ag | Ag | 4 | Ag | As [ 5 [ Ag | Ay | 6 | a | ay ! 7 | Ay | Ag | 8 Ay Ay { | 9 | 0 | 10 | oF nt | VW 05 Q% | 12 GND 04 13 oO; 05 14 oO, GND | 15 | 05 NC | | | 16 0 0 7 | 08 0, | 18 cP 0, 19 Es 6 i __ } 20 INIT 07 | _ | | | 21 E | NC | | | | 22 | Ag | cP | | 23 Ag | s | J | 24 Vee | INIT | porte J | | 25 [ose | | - | | 26 --- | Ag J 27 Joo wee | Ag | 28 { _s | Vee | i | L NC = no connection FIGURE 1. Terminal connections. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 7 DESC FORM 193A JUL 94 ms 9004708 00036be9 774During read operation, the output latc! Pin 19 must be LOW prior to the "Q" to Pin 19 must be HIGH prior to the "O" to 1" transition on CP (18) that loads the Low to high clock transition required to enable outputs. FIGURE 2. Truth table. GNO ALL INPUT PULSES 2500. v O AN Ry GUTPUT | Ra 1e7N SEE NOTE 3. ALL device test loads should be located within two inches of device outputs. Read or output disable Aa ce Es INIT E A, Outputs Mode Read 1/ 2/ 3/ x x Yu din Vu X | Data out Output disable 1/ 4/ Xx x Vin 1 in x X J High Z Output disable 1/ x x X [Vin Vin X High Z INIT 1/ 5/ x X XUVy Viv X | 1025th word 1/ xX = don't care, but not to exceed Vp, = 13.0 V, maximum. hes are loaded on a "0" to "1" transition of CP. "1" transition on CP (18) that loads the register. register. NOTES: VG includes probe and jig capacitance. C, = 50 pF for all switching characteristics except ty7- and t C, = 5 pF for t and tyr. HZE L Hee . Hae 2. Tests are performed with rise and fall times of 5 ns or less. FIGURE 3. Output load circuit and test conditions. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 8 DESC FORM 193A JUL 94 me 7004708 noo0ab30 4Ob atua tsa mT tia Ag - Alo SEs HE 5 SEs DM a Es ses tues cP tpyc teuc tence | _J T teuc teuc [tne PY SSA SEE SEE \, NOTE N - wy [2 99 - 07 _X. ? 4 { ats c o beg me tC ee bogs wee oe E t Or terete INIT 50% tpul NOTE: Transition is measured at steady-state high level -500 mV or steady-state low Level +500 mv on the output, from the 1.5 V Level on the input and 5 pF load capacitance. See figure 3. FIGURE 4. Switching waveforms. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 9 DESC FORM 193A JUL 94 me 970047048 0003631 342 @TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/ MIL-STD-883 test requirements Subgroups Cin accordance with method 5005, table I) Interim electrical parameters -- (method 5004) Final electrical test parameters 1k, 2, 3, Tk, (method 5004) 8A, 8B, 9, 10, 11 Group A test requirements 1, 2, 3, 4%k, 7,8A, (method 5005) 88, 9, 10, 11 Groups C and D end-point 2, 3, 7, 8A, 88 electrical parameters (method 5005) 1/ * Indicates PDA appiies to subgroups 1 and 7. 2/ Any or all subgroups may be combined when using high-speed testers. 3/ kk See 4.3.1. 4/ AS a minimum, subgroups 7 and 8 shall consist of verifying the data pattern. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (Cry and Coyy measurement) shall be measured only for the initiat test and after process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10, and 11. Either of two techniques is acceptable: (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming (see 3.2.2.2). If more than two devices fail to program, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 24 total devices with no more than & total device failures allowable. Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 20 total devices with no more than 4 total device failures allowable. e. Subgroups 7 and 8 shall include verification of the truth table. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 10 DESC FORM 193A JUL 94 mm 9004708 0003632 255 @4.3.2 Groups C and D inspections. a. nd-point electrical parameters shall be as specified in table II herein. b. Steady-state Life test conditions, method 1005 of MIL-STD-883. (1) Test condition C or 0. The test circuit shall be maintained by the manufacturer under document revision Level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-ST0-883. (2) TT, = #125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. c. Group C, subgroup 1 ~ple shall include devices tested in accordance with 4.3.1d. 4.4 Programming procedure. ine programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-STD-883 (see 3.1 herein). 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. ALL proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and the applicable SMD. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DESC-EC, telephone (513) 296-6047. 6.5 Comments. Comments on this drawing should be directed to DESC-EC, Dayton, Ohio 45444-5270, or telephone (513) 296-5377. 6.6 Approved sources of supply. Approved sources of supply are Listed in MIL-BUL-103. The vendors Listed in MIL-8UL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-EC. STANDARD SIZE 5962-88636 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B ll DESC FORM 193A JUL 94 mm 9004708 qo03b33 115 =