© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1050_GOLDMAX_X7R • 4/7/2017 14
Radial Leaded Multilayer Ceramic Capacitors
Goldmax, 300 Series, Conformally Coated, X7R Dielectric, 25 – 250 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodA,at235°C,Category3
TemperatureCycling JESD22MethodJA–104 5cycles(−55°Cto+125°C),measurementat24hours+/−4hoursaftertestconclusion.
BiasedHumidity MIL–STD–202Method
103
Loadhumidity,1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
Lowvolthumidity,1,000hours85C°/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
MoistureResistance
t=24hours/cycle.Steps7a&7bnotrequired.Unpowered.Measurementat24hours+/−4
hoursaftertestconclusion.
ThermalShock
−55ºCto+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.Dwelltime–15minutes.Air–Air.
HighTemperatureLife
MIL–STD–202Method
108/EIA–198
1,000hoursat125°C(85°CforZ5U)with1Xratedvoltageapplied.
Storage Life
125°C,0VDCfor1,000hours.
Vibration MIL–STD–202Method
204
5gfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB.031"thick7
securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2000Hz.
Resistance to Soldering
Heat
ConditionB.Nopreheatofsamples.Note:singlewavesolder–procedure2.
TerminalStrength
Conditions A (454g), Condition C (227g)
MechanicalShock
Figure1ofMethod213,ConditionC.
Resistance to Solvents
Addaqueouswashchemical–OKEMCleanorequivalent.
Storage & Handling
Theun-mountedstoragelifeofaleadedceramiccapacitorisdependentuponstorageandatmosphericconditionsas
wellaspackagingmaterials.Whiletheceramicchipsenvelopedundertheepoxycoatingthemselvesarequiterobust
inmostenvironments,solderabilityofthewireleadonthenalepoxy-coatedproductwillbedegradedbyexposureto
hightemperatures,highhumidity,corrosiveatmospheres,andlongtermstorage.Inaddition,packagingmaterialswillbe
degradedbyhightemperatureandexposuretodirectsunlight–reelsmaysoftenorwarp,andtapepeelforcemayincrease.
KEMETrecommendsstoringtheun-mountedcapacitorsintheiroriginalpackaging,inalocationawayfromdirectsunlight,
andwherethetemperatureandrelativehumiditydonotexceed40degreescentigradeand70%respectively.Foroptimum
solderability,capacitorstockshouldbeusedpromptly,preferablywithin18monthsofreceipt.Forapplicationsrequiring
pre-tinningofcomponents,storagelifemaybeextendedifsolderabilityisveried.Beforecleaning,bondingormoldingthese
devices,itisimportanttoverifythatyourprocessdoesnotaffectproductqualityandperformance.KEMETrecommends
testingandevaluatingtheperformanceofacleaned,bondedormoldedproductpriortoimplementingand/orqualifyingany
oftheseprocesses.