2008563-1 - Tyco Electronics

Product

Specification 108-2284

24Jun08 Rev A

SMT and Through-Hole Poke-In Connector

Harrisburg, PA

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* Trademark

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LOC B

1. SCOPE

1.1. Content

This specification covers per formance, tests and quality requirements for the Tyco Elect ronics Surface

Mount (SMT) and Thr ough-Hole Poke-In Connectors used with 18 to 22 AWG solid copper wire, 18 to

20 AWG prebond stranded wire, and 18 AWG str anded wire in indoor/outdoor lighting.

1.2. Qualification

When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.

Al l i nspections shall be performed using the appli cable inspection plan and product drawing.

1.3. Qual ification Test Resul ts

Successful qualification testing on the subject product line was completed on 02M ay08. The

Qual ification Test Report number for this testing is 501-679. This documentation is on file at and

available f rom Engineering Practices and Standards (EPS).

2. APPLI CABLE DOCUMENTS

The follow ing documents form a part of this specification to the extent specified herein. Unless otherwi se

speci fied, the latest edition of the document applies. In the event of conflict between t he requirements of

this specif ication and the product drawi ng, the product draw ing shall take precedence. In the event of

conflict between the r equirements of this specification and the referenced documents, t his specification

shal l take precedence.

2.1. Tyco Electronics Documents

109 Series: Test Specifications as indicated in Figure 1

109-197: Test Speci fication (Tyco Elect ronics T est Specifications vs EIA and IEC Test Methods)

114-13194: Application Specification (S urface Mount Technology (SMT) and Through- Hole Poke-

In Connect ors)

501-679: Qualification Test Report (SMT and Through-Hole Poke-In Connect or)

2.2. Indust ry Documents

EIA- 364: Electrical Connector/Socket Test Procedures Including Environmental Classifications

JEDC JESD22-B102: Solderability

3. REQUIREMENTS

3.1. Desi gn and Construction

Product shall be of the design, construction and physical dimensi ons specified on the applicable product

drawing.

3.2. Materials

Materials used in the construction of this product shall be as specified on the applicable product draw ing.

108-2284

Rev A 2 of 5

3.3. Ratings

Vol tage: 250 vol ts AC RMS, 250 volt s DC

Curr ent: 4 amperes maximum

Temperature: -40 to 105

3.4. Perf ormance and Test Description

Product is designed to meet the electrical, mechanical and envi ronmental performance requirements

speci fied in Figur e 1. Unless otherwi se specified, all tests shall be performed at ambient environmental

conditions.

3.5. Test Requirements and Procedures Summary

Test Description Requi rement Procedur e

Initi al exami nation of product. Meets requirements of product

drawing. EIA-364-18.

Vi sual and di mensional (C of C)

i nspection per product draw ing.

Fi nal examination of product. Meets visual requirements. EIA- 364-18.

Vi sual i nspection.

ELECTRICAL

Low Level Contact Resistance

(LLCR). 18 milliohms maximum initial.

)

R 5 milliohms maximum. EIA-364-23.

Subject specimens to 100

milliamperes maximum and 20

millivolts maximum open cir cuit

voltage.

Wi thstanding voltage. One minut e hold with no breakdown

or f lashover. EIA-364-20, Condition I.

1500 volts AC at sea level.

Test between adjacent contacts.

MECHANICAL

Solderability, surface mount. Solderable area shall have a

minimum of 95% solder coverage. JEDC JESD22-B102.

Subject contacts to solderability.

Resi stance to reflow soldering heat. Housing shall be free of

defor mation and fusion.

See Note.

AMP Spec. 109-201, Condition B.

Random vibration. No di scontinuiti es of 1 microsecond

or longer durat ion.

See Note.

EIA- 364-28, Test Condition VII,

Condi tion Letter D.

Subject mated specimens to 3.10

G's rms between 20 to 500 Hz.

Fi fteen minutes in each of 3

mutual ly per pendicular planes.

See Fi gure 3.

Fi gure 1 (continued)

108-2284

Test Description Requi rement Procedur e

Rev A 3 of 5

Mechanical shock. No di scontinuiti es of 1 microsecond

or longer durat ion.

See Note.

EIA-364-27, Condition H.

Subject mated specimens to 30 G's

hal f-sine shock pulses of 11

milliseconds durat ion. T hree shocks

i n each direction appl ied along 3

mutual ly per pendicular planes, 18

tot al shocks.

See Fi gure 3.

Wire insertion force. 15.6 N [3.5 lbf] maximum for soli d

wire.

29.9 N [6.5 lbf] maximum for

prebond and st randed wi re.

EIA-364-13.

Measure force necessary to insert

wires at a maximum rate of 12.7

mm [.5 in] per minute.

Wi re retention force. 53.4 N [ 12 lbf] minimum for solid

wire.

22.2 N [ 5 lbf] minimum for prebond

and str anded wir e.

EIA-364-13.

Measure force necessary to extract

wire at a maximum rate of 12.7 mm

[. 5 in] per minute.

ENVIRONMENTAL

Thermal shock. See Note. EIA-364-32, Test Condition VII.

Subject specimens to 25 cycles

between -40 and 105

Humidity/temperature cycling. See Note. EIA-364-31, Method III.

Subject specimens to 10 cycles (10

days) between 25 and 65

C at 80 to

100% RH.

Temperature life. See Note. EIA-364-17, Method A, Test

Condi tion 4.

Subject specimens to 105

C for

648 hours.

Shall meet visual requirements, show no physical damage, and meet requirements of additional

NOTE

test s as specified in the Product Qualification and Requalificati on Test Sequence shown i n Figure

Fi gure 1 (end)

108-2284

Rev A 4 of 5

3.6. Product Qualification and Requalification Test Sequence

Test or Examination Test Group (a)

123456

Test Sequence (b)

Initi al exami nation of product 111111

LLCR 3,6 2,4 2,4

Wi thstanding voltage 2,5

Surf ace mount solderability 2

Resi stance to reflow soldering heat 2

Random vibration 4

Mechanical shock 5

Wire insertion force 2

Wi re retention force 7

Thermal shock 3

Humidity/temperature cycling 3 4

Temperature life 3

Fi nal examination of product 855633

(a) See paragraph 4.1.A.

NOTE

(b) Numbers indicate sequence in which tests ar e performed.

Fi gure 2

108-2284

Rev A 5 of 5

4. QUALI TY ASSURANCE PROVISIONS

4.1. Qual ification Testi ng

A. Specimen Selection

Speci mens shall be pr epared in accordance wit h appli cable Instruction Sheets and shall be

sel ected at random from current production. Test groups 1, 2 and 3 shall each consist of 15, tw o-

posi tion or 30, one-position board mounted specimens terminated to 18 AWG solid copper w ire, 18

AWG prebond w ire, 18 AWG 16 strand wire, 20 AWG solid copper w ire, 20 AWG prebond wire,

and 22 AWG sol id copper w ire. Test groups 4, 5 and 6 shall each consist of 15 unmounted and

unter minated specimens.

B. Test Sequence

Qual ification inspection shall be verified by testing specimens as speci fied in Figure 2.

4.2. Requal ification Testi ng

If changes significantly affecting form, fit or function are made to the product or manufacturing process,

product assurance shall coordinate requalification testing, consisting of all or part of the original testing

sequence as deter mined by development/product, quality and reliability engineering.

4.3. Acceptance

Acceptance is based on verification that the product meets t he requirements of Figure 1. Failures

att ributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product

failur e occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to

confirm correct ive action is required before resubmittal.

4.4. Qual ity Conformance Inspection

The applicable quality inspection plan shall specify t he sampling acceptable qual ity level to be used.

Di mensional and f unctional requirements shall be in accordance with the applicable product dr awing and

this specif ication.

Fi gure 3

Vi bration & Mechanical Shock Mount ing Fi xture