WS483 Sn62 and Sn63 Water Soluble Solder Paste Features: - 48 Hour Stencil Life - Excellent Activity - 24 Hour Tack Time - Excellent Printing Characteristics - Slump Resistant - Good for Batch or Continuous Runs - Extended Cleaning Window - High-Humidity Resistant - Will Not Foam During Wash Description: WS483 is an organically activated formulation developed to better resist the effects of increased humidity levels. WS483 offers improved heat and humidity resistance, while maintaining high tack and resistance to slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the cleaning process, even in high-pressure wash systems. Printing: - Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (1/2 to inch) is normally sufficient to begin). - Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. - WS483 provides the necessary tack time and force for today's high speed placement equipment, which will enhance product performance and reliability. RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN PARAMETER RECOMMENDED INITIAL SETTINGS PARAMETER Squeegee Pressure Squeegee Speed Snap-off Distance 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade 12-150 mm/sec (.5-6"/sec) On Contact 0.00 mm (0.00") PCB Separation Distance PCB Separation Speed RECOMMENDED INITIAL SETTINGS 0.75-2.0 mm (.030-.080") Slow Reflow Profile: Either a straight ramp-spike or ramp-soak-spike profile can be used as shown below. Both profiles would have a similar peak temperature and time above liquidus (TAL). The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the process. RATE OF RISE 1.5-2 C / SEC MAX RAMP TO 150 C ( 300F) Standard Profile 75 Sec PROGRESS THROUGH 150C-170C (300F-340F) 30-60 Sec TO PEAK TEMP 210 C-220C (410F-430F) TIME ABOVE 183 C (380F) COOLDOWN 4C / SEC 45-75 Sec 30-60 Sec 45 15 Sec PROFILE LENGTH AMBIENT TO COOL DOWN 2.75-3.5 Min THE RECOMMENDED REFLOW PROFILE FOR WS483 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY LAYOUT, OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE. THE REFLOW PROFILE FOR THE Sn/Pb PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230C - 245C. Compatible Products: - Electropure Solder Bar - WS Tacky Flux - WS715; WS375 Spray Flux - WS482 Cored Wire - Epoxy 4089 - Chip Bonding Epoxy - 200AX - Stencil Cleaner Cleaning: WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 38C (100F) - 66C (150F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. Handling and Storage: - WS483 has a refrigerated shelf life of 6 months at 4C (40F). - Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. - Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material. - Do not store new and used paste in the same container, and reseal any opened containers while not in use. - Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal. Safety: - Use with adequate ventilation and proper personal protective equipment. - Refer to the accompanying Material Safety Data Sheet for any specific emergency information. - Do not dispose of any lead-containing materials in non-approved containers. Physical Properties: ITEM Appearance Alloy Melting Point Particle Size General Metal Loading Viscosity Packaging SPECIFICATION Gray, Smooth, Creamy Sn63 and Sn62 183C T3, T4, T5 90% (T3) Print/Dispense Available in all industry standard packaging. Test Data Summary: CLASSIFICATION Product Name WS483 POWDER TESTING No. Item 1 IPC Classification to J-STD-004 Copper Mirror to J-STD-004 Silver Chromate to J-STD-004 ORM0 Low Pass Powder Size 2 Powder Shape FLUX MEDIUM TESTING No. Item 1 Acid Value 2 Fluorides Spot Test 3 Corrosivity Test/ Copper Mirror 4 Halide-Free/Silver Chromate Paper Test 7 Surface Insulation Resistance 8 Compatibility Test VISCOSITY TESTING No. Item 1 T-Bar Spindle Test Method SOLDER PASTE TESTING No. Item 1 Tack Test 2 Tack Test 3 Solder Ball Test 4 Wetting Test 5 Paste Shelf Life 6 Solder Paste Slump Test Results Type 3 - 45-25 micron Type 4 - 38-20 micron Spherical Test Method Results 150.02 mg KOH/g Flux No Fluoride Low Pass Control Coupons > 1E at 96 & 168 h. - Pass Sample Coupons > 1E at 96 & 168 h. - Pass > No dendrite growth or corrosion, after a visual inspection - pass See list of recommended products above Test Method J-STD-004 IPC TM 650 2.3.13 J-STD-004 IPC TM 650 2.3.35.1 J-STD-004 IPC TM 650 2.3.32 J-STD-004 IPC TM 650 2.3.33 Results 900 10% kcps Test Method J-STD-005 IPC TM 650 2.4.34 Results 30.5 gf 82.8 gf Pass Pass 4C (39F) = 6 months Pass Test Method J-STD-005 IPC TM 650 2.4.44 JIS Z 3284 Annez 9 J-STD-005 IPC TM 650 2.4.43 J-STD-005 IPC TM 650 2.4.45 AIM TM 125-11 J-STD-005 IPC TM 650 2.4.35 J-STD-004 IPC TM 650 2.2.14 Microscope J-STD-004 IPC TM 650 2.6.3.3 GR-78-CORE Canada +1-514-494-2000 * USA +1-401-463-5605 * Mexico +52-656-630-0032 * Europe +44-1737-222-258 Asia-Pacific +86-755-2993-6487 * India +91-80-41554753 * info@aimsolder.com * www.aimsolder.com AIM IS ISO9001:2008 CERTIFIED The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to http://www.aimsolder.com/Home/TermsConditions.aspx to review AIM's terms and conditions. 03/12 Document Rev # 3 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: AIM - American Iron and Metal: 21529 21613 21620 21622 21630 21674 21681 21691 21748 21758 21887 21918 21963 22114 22685 22731 22744 22780 22787 22992 50011 55275 89010 89011