2002 Microchip Technology Inc. DS21743A-page 1
MTC72
Features
• Temperature-to-Digital Converter
• SPI™ Compatible Interface
• 10-Bit Resolution (0.25°C/Bit)
• ±2°C (max.) Accuracy from -40°C to +85°C
• ±3°C (max.) Accuracy from -55°C to +125°C
• 2.65V to 5.5V Operating Range
• Low Power Consumption:
- 250 µA (typ.) Continuous Temperature
Conversion Mode
- 1 µA (max.) Shutdown Mode
• Power Saving One-Shot Temperature
Measurement
• Industry Standard 8-Pin MSOP Package
• Space Saving 8-Pin DFN (3x3 mm) Package
Typical Applications
• Personal Computers and Servers
• Hard Disk Drives and Other PC Peripherals
• Entertainment Systems
• Office Equipment
• Datacom Equipment
• Mobile Phones
• General Purpose Temperature Monitoring
Package Types
General Description
The TC72 is a digital temperature sensor capable of
reading temperatures from -55°C to +125°C. This sen-
sor features a serial interface that allows communica-
tion with a host controller or other peripherals. The
TC72 interface is compatible with the SPI protocol. The
TC72 does not require any additional external compo-
nents. However, it is recommended that a decoupling
capacitor of 0.01 µF to 0.1 µF be provided between the
VDD and GND pins.
The TC72 can be used either in a Continuous Temper-
ature Conversion mode or a One-Shot Conversion
mode. The Continuous Conversion mode measures
the temperature approximately every 150 ms and
stores the data in the temperature registers. In con-
trast, the One-Shot mode performs a single tempera-
ture measurement and returns to the power saving
shutdown mode.
The TC72 features high temperature accuracy, ease-
of-use and is the ideal solution for implementing ther-
mal management in a variety of systems. The device is
available in both 8-pin MSOP and 8-pin DFN space-
saving packages. The TC72 also features a shutdown
mode for low power operation.
Block Diagram
SCK
CE
GND
NC
SDI
1
2
3
4
8
7
6
5SDO
VDD
NC
MSOP
TC72
CE
SCK
GND
NC
SDO
1
2
3
4
8
7
6
5SDI
VDD
NC
DFN
TC72
TC72
Diode
Temperature
Sensor
VDD
SCK
CE
Serial
Port
Interface
10-Bit
Sigma Delta
A/D Converter
Register
Temperature
Register
Internal
Control
Manufacturer
ID Register
GND
SDO
SDI
Digital Temperature Sensor with SPI™ Interface
TC72
DS21743A-page 2 2002 Microchip Technology Inc.
Typical Application
AN0
SCK
SDI
CE
SCK
SDO
TC72
0.1µF
VDD
GND
VDD
PICmicro®
MCU
SDOSDI
2002 Microchip Technology Inc. DS21743A-page 3
TC72
1.0 ELECTRICAL
CHARACTERISTICS
1.1 Maximum Ratings†
VDD........................................................................ 6.0V
All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V
Storage temperature .......................... -65°C to +150°C
Ambient temp. with power applied ..... -55°C to +125°C
Junction Temperature ........................................ 150°C
ESD protection on all pins:
Human Body Model (HBM)............................. > 4 kV
Man Machine Model (MM)............................. > 400V
Latch-Up Current at each pin ........................ ±200 mA
Maximum Power Dissipation........................... 250 mW
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
PIN FUNCTION TABLE
Name Function
NC No Internal Connection
CE Chip Enable Input, the device is selected
when this input is high
SCK Serial Clock Input
GND Ground
SDO Serial Data Output
SDI Serial Data Input
NC No Internal Connection
VDD Power Supply
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Power Supply
Operating Voltage Range VDD 2.65 — 5.5 V Note 1
Operating Current:
Normal Mode, ADC Active
IDD-CON — 250 400 µA Continuous temp. conversion mode
(Shutdown Bit = ‘0’)
Shut-Down Supply Current ISHD — 0.1 1.0 µA Shutdown Mode (Shutdown Bit = ‘1’)
Temperature Sensor and Analog-to-Digital Converter
Temperature Accuracy
(Note 1)
TACY -2.0 — +2.0 °C -40°C < TA < +85°C
-3.0 — +3.0 -55°C < TA < +125°C
Resolution — 10 — Bits Note 4
ADC Conversion Time tCONV —150200ms
Digital Input / Output
High Level Input Voltage VIH 0.7 VDD ——V
Low Level Input Voltage VIL — — 0.2 VDD V
High Level Output Voltage VOH 0.7 VDD ——VI
OH = 1 mA
Low Level Output Voltage VOL — — 0.2 VDD VI
OL = 4 mA
Input Resistance RIN 1.0 — — MΩ
Pin Capacitance CIN —15—pF
COUT —50—
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the
TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to
Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.
The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit
TC72
DS21743A-page 4 2002 Microchip Technology Inc.
Serial Port AC Timing (Note 2,3)
Clock Frequency fCLK DC — 7.5 MHz
SCK Low Time tCL 65 — — ns
SCK High Time tCH 65 — — ns
CE to SCK Setup tCC 400 — — ns
SCK to Data Out Valid tCDD — — 55 ns
CE to Output Tri-state tCDZ — — 40 ns
SCK to Data Hold Time tCDH 35 — — ns
Data to SCK Set-up Time tDC 35 — — ns
SCK to CE Hold Time tCCH 100 — — ns
SCK Rise Time tR——200ns
SCK Fall Time tF——200ns
CE Inactive Time tCWH 400 — — ns
Thermal Package Resistance
Thermal Resistance, MSOP-8 θJA —206—°C/W
Thermal Resistance, DFN-8 θJA —60.5—°C/W
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125 °C.
Parameters Sym Min Typ Max Units Conditions
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the
TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,
3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to
Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.
The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit
2002 Microchip Technology Inc. DS21743A-page 5
TC72
FIGURE 1-1: Serial Port Timing Diagrams.
CE
1/fCLK
tCL
tCH
D7 D0
HIGH Z
SDI
SPI READ DATA TRANSFER
CE
1/fCLK
tCC
A7 = 1
tCL
tCH
D7 D0
SDI A0
A7
tDC tCDH
A0
tFtR
tDC tCDH
tR
tF
SCK
tCC
(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0)
(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1)
tCDD
SDO
SCK
tCCH
tCWH
tCDZ
HIGH Z
tCWH
tCCH
Note: The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1;
however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2.
SPI WRITE DATA TRANSFER
MSb LSb
MSb LSb
MSb LSb MSb LSb
TC72
DS21743A-page 6 2002 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.
FIGURE 2-1: Accuracy vs. Temperature
(TC72-X.XMXX).
FIGURE 2-2: Supply Current vs. Supply
Voltage.
FIGURE 2-3: Supply Current vs.
Temperature.
FIGURE 2-4: Shutdown Current vs.
Temperature.
FIGURE 2-5: Temperature Accuracy vs.
Supply Voltage (TC72-2.8MXX).
FIGURE 2-6: Temperature Accuracy vs.
Supply Voltage (TC72-5.0MXX).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
-55 -25 5 35 65 95 125
Reference Temperature (°C)
Temperature Error (°C)
Lower Specification Limit
Upper Specification Limit
Mean + 3V
Mean - 3V
Mean
200
210
220
230
240
250
260
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Supply Voltage (V)
Supply Current (µA)
TA = +25°C
TA = +125°C
TA = -55°C
TC72-X.XMXX
0
50
100
150
200
250
300
350
400
-55-25 5 356595125
Temperature (°C)
Supply Current (uA)
TC72-5.0MXX
VDD = 5.0V
TC72-3.3MXX
VDD = 3.3V
TC72-2.8MXX
VDD = 2.8V
0.00
0.05
0.10
0.15
0.20
-55 -25 5 35 65 95 125
Temperature (°C)
Shutdown Current (µA)
TC72-5.0MXX
VDD = 5.0V
TC72-5.0MXX
VDD = 2.8V
TC72-3.3MXX
VDD = 3.3V
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
2.6 2.7 2.8 2.9 3.0
Supply Voltage (V)
Temperature Change (°C)
TA = +25°C
TA = -25°C
TA = +85°C
TC72-2.8MXX
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
Supply Voltage (V)
Temperature Change (°C)
TA = +25°C
TA = -25°C
TA = +85°C
TC72-5.0MXX
2002 Microchip Technology Inc. DS21743A-page 7
TC72
Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.
FIGURE 2-7: Histogram of Temperature
Accuracy at -55 Degrees C.
FIGURE 2-8: Histogram of Temperature
Accuracy at -40 Degrees C.
FIGURE 2-9: Histogram of Temperature
Accuracy at +25 Degrees C.
FIGURE 2-10: Histogram of Temperature
Accuracy at +65 Degrees C.
FIGURE 2-11: Histogram of Temperature
Accuracy at +85 Degrees C.
FIGURE 2-12: Histogram of Temperature
Accuracy at +125 Degrees C.
0
5
10
15
20
25
30
35
40
45
50
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = -55°C
0
10
20
30
40
50
60
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = -40°C
0
10
20
30
40
50
60
-1.50
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
1.50
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = +25°C
0
10
20
30
40
50
60
-1.50
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
1.50
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = +65°C
0
5
10
15
20
25
30
35
40
45
50
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = +85°C
0
5
10
15
20
25
30
35
40
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
Temperature Error (°C)
Percentage of Occurances (%)
TC72-X.XMXX
Sample Size = 166
TA = +125°C
TC72
DS21743A-page 8 2002 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The TC72 consists of a band-gap type temperature
sensor, a 10-bit Sigma Delta Analog-to-Digital Con-
verter (ADC), an internal conversion oscillator and a
double buffer digital output port. The 10-bit ADC is
scaled from -128°C to +127°C; therefore, the resolution
is 0.25°C per bit. The ambient temperature operating
range of the TC72 is specified from -55°C to +125°C.
This device features a four-wire serial interface that is
fully compatible with the SPI specification and, there-
fore, allows simple communications with common
microcontrollers and processors. The TC72 can be
used either in a Continuous Temperature Conversion
mode or a One-Shot Conversion mode. The TC72 tem-
perature measurements are performed in the back-
ground and, therefore, reading the temperature via the
serial I/O lines does not affect the measurement in
progress.
The Continuous Conversion mode measures the tem-
perature approximately every 150 ms and stores the
data in the temperature registers. The TC72 has an
internal clock generator that controls the automatic
temperature conversion sequence. The automatic tem-
perature sampling operation is repeated indefinitely
until the TC72 is placed in a shutdown mode by a write
operation to the Control register. The TC72 will remain
in the shutdown mode until the shutdown bit in the
Control register is reset.
In contrast, the One-Shot mode performs a single tem-
perature measurement and returns to the power-sav-
ing shut down mode. This mode is especially useful for
low power applications.
FIGURE 3-1: Temperature-To-Digital Transfer Function (Non-linear Scale).
Tem p
Te m p
Output
Code
+125°C
-55°C
+25°C
-25°C
+0.25°C
-0.125°C
0111 1101 / 0000 0000
MSB LSB
Note: The ADC converter is scaled from -128°C to -127°C, but the operating range of the
TC72 is specified from -55°C to +125°C.
0001 1001 / 0000 0000
MSB LSB
0000 0000 / 0100 0000
MSB LSB
0000 00 00 / 0000 000 0
MSB LSB
1111 1111 / 1100 0000
MSB LSB
1110 0111 / 0000 0000
MSB LSB
1100 1001 / 0000 0000
MSB LSB
0°C
2002 Microchip Technology Inc. DS21743A-page 9
TC72
3.1 Temperature Data Format
Temperature data is represented by a 10-bit two’s com-
plement word with a resolution of 0.25°C per bit. The
temperature data is stored in the Temperature registers
in a two’s complement format. The ADC converter is
scaled from -128°C to +127°C, but the operating range
of the TC72 is specified from -55°C to +125°C.
Example:
Temperature = 41.5°C
MSB Temperature Register= 00101001b
=2
5 + 23 + 20
= 32 + 8 + 1 = 41
LSB Temperature Register = 10000000b = 2-1 = 0.5
TABLE 3-1: TC72 TEMPERATURE
OUTPUT DATA
TABLE 3-2: TEMPERATURE REGISTER
3.2 Power-Up And Power-Down
The TC72 is in the low power consumption shutdown
mode at power-up. The Continuous Temperature Con-
version mode is selected by performing a Write opera-
tion to the Control register, as described in Section 4.0,
“Internal Register Structure”.
A supply voltage lower than 1.6V (typical) is considered
a power-down state for the TC72. If the supply voltage
drops below the 1.6V threshold, the internal registers
are reset to the power-up default state.
3.3 Serial Bus Interface
The serial interface consists of the Chip Enable (CE),
Serial Clock (SCK), Serial Data Input (SDI) and Serial
Data Output (SDO) signals. The TC72 operates as a
slave and is compatible with the SPI bus specifications.
The serial interface is designed to be compatible with
the Microchip PICmicro® family of microcontrollers.
The CE input is used to select the TC72 when multiple
devices are connected to the serial clock and data
lines. The CE is active-high, and data is written to or
read from the device, when CE is equal to a logic high
voltage. The SCK input is disabled when CE is low. The
rising edge of the CE line initiates a read or write oper-
ation, while the falling edge of CE completes a read or
write operation.
The SCK input is provided by the external microcontrol-
ler and is used to synchronize the data on the SDI and
SDO lines. The SDI input writes data into the TC72’s
Control register, while the SDO outputs the tempera-
ture data from the Temperature register and the status
of Shutdown bit of the Control register.
The TC72 has the capability to function with either an
active-high or low SCK input. The SCK inactive state is
detected when the CE signal goes high, while the
polarity of the clock input (CP) determines whether the
data is clocked and shifted on either the rising or falling
edge of the system clock, as shown in Figure 3-2.
Table 3-3 gives the appropriate clock edge used to
transfer data into and out of the registers. Each data bit
is transferred at each clock pulse, and the data bits are
clocked in groups of eight bits, as shown in Figure 3-3.
The address byte is transferred first, followed by the
data. A7, the MSb of the address, determines whether
a read or write operation will occur. If A7 = ‘0’, one or
more read cycles will occur; otherwise, if A7 = ‘1’, one
or more write cycles will occur.
Data can be transferred either in a single byte or a
multi-byte packet, as shown in Figure 3-3. In the 3-byte
packet, the data sequence consists of the MSb temper-
ature data, LSb temperature data, followed by the Con-
trol register data. The multi-byte read feature is initiated
by writing the highest address of the desired packet to
registers. The TC72 will automatically send the register
addressed and all of the lower address registers, as
long as the Chip Enable pin is held active.
Temperature Binary
MSB / LSB Hex
+125°C 0111 1101/0000 0000 7D00
+25°C 0001 1001/0000 0000 1900
+0.5°C 0000 0000/1000 0000 0080
+0.25°C 0000 0000/0100 0000 0040
0°C 0000 0000/0000 0000 0000
-0.25°C 1111 1111/1100 0000 FFC0
-25°C 1110 0111/0000 0000 E700
-55°C 1100 1001/0000 0000 C900
D7 D6 D5 D4 D3 D2 D1 D0 Address/
Register
Sign 2625242323212002H
Te m p. MS B
2-1 2-2 000000 01H
Temp. L SB
TC72
DS21743A-page 10 2002 Microchip Technology Inc.
TABLE 3-3: OPERATIONAL MODES
3.4 Read Operation
The temperature and control register data is outputted
from the TC72 using the CE, SCK and SDO lines.
Figure 3-3 shows a timing diagram of the read opera-
tion. Communication is initiated by the chip enable (CE)
going high. The SDO line remains at the voltage level
of the LSb bit that is outputted and goes to the tri-state
level when the CE line goes to a logic low level.
3.5 Write Operation
Data is clocked into the Control register in order to
enable the TC72’s power saving shutdown mode. The
write operation is shown in Figure 3-3 and is
accomplished using the CE, SCK and SDI line.
FIGURE 3-2: Serial Clock Polarity (CP)
Operation.
Mode CE SCK (Note 1) SDI SDO
Disable L Input Disabled Input Disabled High Z
Write (A7 = 1)HCP=1, Data Shifted on Falling Edge,
Data Clocked on Rising Edge
Data Bit Latch High Z
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Read (A7 = 0)HCP=1, Data Shifted on Falling Edge,
Data Clocked on Rising Edge
X Next data bit shift,
Note 2
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high,
CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’.
2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin
to be shifted out of the Temperature register.
SHIFT
EDGE
CLOCK
EDGE
SHIFT
EDGE
CLOCK
EDGE
SCK
CE
CE
SCK
CP = 0
CP = 1
2002 Microchip Technology Inc. DS21743A-page 11
TC72
FIGURE 3-3: Serial Interface Timing Diagrams (CP=0).
A
1
SCK
SDI
SDO High Z
A7=1
CE
Single Byte Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)
2345678910 11 12 13 14 15 16
A A A A A A A D D D D D D D D
7654321076543210
MSb LSb
Single Byte Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)
CE
A
1
SCK
SDI
A7=0
2345678910 11 12 13 14 15 16
AAAAAAA
D D
SDO High Z High Z
76543210
MSb LSb
70
SPI Multiple Byte Transfer
CE
SCK
Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)
SDI Address Byte = 80hex
High Z
SDO
Control Byte
A7 A0 D7 D0
Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)
SDI
SDO High Z High Z
MSB Temp. Byte LSB Temp. Byte
Address Byte = 02hex
Control Byte
A7 A0
D7 D0 D7 D0 D7 D0
TC72
DS21743A-page 12 2002 Microchip Technology Inc.
4.0 INTERNAL REGISTER
STRUCTURE
The TC72 registers are listed below.
TABLE 4-1: REGISTERS FOR TC72
4.1 Control Register
The Control register is both a read and a write register
that is used to select either the Shutdown, Continuous
or One-Shot Conversion operating mode. The Temper-
ature Conversion mode selection logic is shown in
Table 4-2. The Shutdown (SHDN) bit is stored in bit 0
of the Control register. If SHDN is equal to ‘1’, the TC72
will go into the power-saving shutdown mode. If SHDN
is equal to ‘0’, the TC72 will perform a temperature
conversion approximately every 150 ms.
At power-up, the SHDN bit is set to ‘1’. Thus, the TC72
is in the shutdown operating mode at startup. The Con-
tinuous Temperature Conversion mode is selected by
writing a ‘0’ to the SHDN bit of the Control register.
The Shutdown mode can be used to minimize the
power consumption of the TC72 when active tempera-
ture monitoring is not required. The shutdown mode
disables the temperature conversion circuitry; how-
ever, the serial I/O communication port remains active.
A temperature conversion will be initialized by a Write
operation to the Control register to select either the
Continuous Temperature Conversion or the One-Shot
operating mode. The temperature data will be available
in the MSB and LSB Temperature registers approxi-
mately 150 ms after the Control register Write
operation.
The One-Shot mode is selected by writing a ‘1’ into bit
4 of the Control register. The One-Shot mode performs
a single temperature measurement and returns to the
power-saving shutdown mode. After completion of the
temperature conversion, the One-Shot bit (OS) is reset
to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit
to ‘1’ to initiate another temperature conversion.
Bits 1, 3, 5, 6 and 7 of the Control register are not used
by the TC72. Bit 2 is set to a logic ‘1’. Any write opera-
tion to these bit locations will have no affect on the
operation of the TC72.
4.2 Temperature Register
The Temperature register is a read-only register and
contains a 10-bit two’s complement representation of
the temperature measurement. Bit 0 through Bit 5 of
the LSB Temperature register are always set to a logic
‘0’.
At Power-On Reset (POR) or a Brown-Out Reset
(BOR) low voltage occurrence, the temperature regis-
ter is reset to all zeroes, which corresponds to a tem-
perature value of 0°C. A VDD power supply less than
1.6V is considered a reset event and will reset the
Temperature register to the power-up state.
4.3 Manufacturer ID Register
The Manufacturer Identification (ID) register is a read-
only register used to identify the temperature sensor as
a Microchip component.
TABLE 4-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION
Register Read
Address
Write
Address
Bit
7
Bit
6
Bit
5
Bit
4
Bit
3
Bit
2
Bit
1
Bit
0
Value on
POR/BOR
Control 00hex 80hex 000One-Shot
(OS)
010Shutdown
(SHDN)
05hex
LSB Temperature 01hex N/A T1 T0 0 0 000 0 00hex
MSB Temperature 02hex N/A T9 T8 T7 T6 T5 T4 T3 T2 00hex
Manufacturer ID 03hex N/A 010 1 010 0 54hex
Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0
Continuous Temperature Conversion 00
Shutdown 01
Continuous Temperature Conversion
(One-Shot Command is ignored if SHDN = ‘0’)
10
One-Shot 11
2002 Microchip Technology Inc. DS21743A-page 13
TC72
5.0 APPLICATIONS INFORMATION
The TC72 does not require any additional components
in order to measure temperature; however, it is recom-
mended that a decoupling capacitor of 0.1mF to 1mF
be provided between the VDD and GND pins. Although
the current consumption of the TC72 is modest
(250 mA, typical), the TC72 contains an on chip data
acquisition with internal digital switching circuitry. Thus,
it is considered good design practice to use an external
decoupling capacitor with the sensor. A high frequency
ceramic capacitor should be used and be located as
close as possible to the IC power pins in order to
provide effective noise protection to the TC72.
The TC72 measures temperature by monitoring the
voltage of a diode located on the IC die. The IC pins of
the TC72 provide a low impedance thermal path
between the die and the PCB, allowing the TC72 to
effectively monitor the temperature of the PCB board.
The thermal path between the ambient air is not as effi-
cient because the plastic IC housing package functions
as a thermal insulator. Thus the ambient air tempera-
ture (assuming that a large temperature gradient exists
between the air and PCB) has only a small effect on the
temperature measured by the TC72.
Note that the exposed metal center pad on the bottom
of the DFN package is connected to the silicon sub-
strate. The center pad should be connected to either
the PCB ground plane or treated as a “No Connect” pin.
The mechanical dimensions of the center pad are given
in Section 6.0, “Packaging Information”, of this
datasheet.
A potential for self-heating errors can exist if the TC72
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the rela-
tively small current consumption of the TC72. A tem-
perature accuracy error of approximately 0.5°C will
result from self-heating if the SPI communication pins
sink/source the maximum current specified for the
TC72. Thus to maximize the temperature accuracy, the
output loading of the SPI signals should be minimized.
TC72
DS21743A-page 14 2002 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Taping Form
Tape and Reel information for the 8-Lead DFN package will be available TBD.
PIN 1
PIN 1
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
User Direction of Feed
Standard Reel Component Orientation
for TR Suffix Device Reverse Reel Component Orientation
for RT Suffix Device
W
P
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
2002 Microchip Technology Inc. DS21743A-page 15
TC72
6.2 Package Marking Information
Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
8-Lead DFN Example:
XXXXXXXX
MYWW
NNN
7228
8221
067
8-Lead MSOP Example:
XXXXXX
YWWNNN
TC722M
221067
TC72
DS21743A-page 16 2002 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
p
A
A1
A2
D
L
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037.035FFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
7
7
.004
.010
0
.006
.012
(F)
β
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff §
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.114
.114
.022
.118
.118
.002
.030
.193
.034
MIN
p
n
Units
.026
NOM
8
INCHES
1.000.950.90.039
0.15
0.30
.008
.016
6
0.10
0.25
0
7
7
0.20
0.40
6
MILLIMETERS*
0.65
0.86
3.00
3.00
0.55
4.90
.044
.122
.028
.122
.038
.006
0.40
2.90
2.90
0.05
0.76
MINMAX NOM
1.18
0.70
3.10
3.10
0.15
0.97
MAX
8
α
E1
E
B
n 1
2
φ
§ Significant Characteristic
.184 .200 4.67 .5.08
2002 Microchip Technology Inc. DS21743A-page 17
TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
E2
D
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
Exposed Pad Width
Exposed Pad Length
Lead Length
*Controlling Parameter
Lead Width
Drawing No. C04-062
Notes:
Exposed pad dimensions vary with paddle size.
exceed .010" (0.254mm) per side.
Overall Width
D2
E2
L
b
D
.019
.012
.007
.047
.055
.010
.118 BSC
A1
Number of Pins
Standoff
Lead Thickness
Overall Length
Overall Height
Pitch
A
A3
p
n
Units
A
A1
E
A3
Dimension Limits
8
.000 .001
.008 REF.
.118 BSC
.031
.026 BSC
MIN
INCHES
NOM
TOP VIEW
EXPOSED
METAL
PAD
0.48
0.26
3.00 BSC
0.30.022
.069
.015
.096
0.23
1.20
1.39
0.55
0.37
1.75
2.45
0.02
0.80
3.00 BSC
0.20 REF.
0.65 BSC
MILLIMETERS*
.002
.039
0.00
MINMAX NOM
8
0.05
1.00
MAX
BOTTOM VIEW
2 1 ID INDEX
PIN 1
E
L
D2
p
bn
3.
4.
Package may have one or more exposed tie bars at ends.1.
AREA
Pin 1 visual index feature may vary, but must be located within the hatched area.2.
(NOTE 2)
TIE BAR
(NOTE 1)
EXPOSED
0.90.035
(Note 4)
(Note 4)
5. JEDEC equivalent: Pending
TC72
DS21743A-page 18 2002 Microchip Technology Inc.
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
H
Exposed Pad Length
Thermal Via Diameter
*Controlling Parameter
Termal Via Pitch
Drawing No. C04-2062
Exposed Pad Width
H
V
P1
G2
.012
.130
.047
Terminal Land Pattern I.D.
Terminal Land Width
Terminal Land Length
Terminal Land Pattern O.D.
Terminal Pitch p
Units
Z
A1
Y
X
Dimension Limits
.057
.134
.026 BSC
MIN
INCHES
NOM
0.30
1.20
3.30
3.40
0.65 BSC
MILLIMETERS*
.060
.157
1.45
MINMAX NOM
1.53
4.00
MAX
Y
G2
p
X
CP
Z G
P1
THERMAL VIAS
ON 4 LAYER
PC BOARD
DFN LAND PATTERN
OPTIONAL TWO LAYER
PCB LAND PATTERN
PCB LAND PATTERN
OPTIONAL FOUR LAYER
0.420.35.014 .017
.033 .035 0.85 0.88
1.501.45.059.057
Exposed Pad Clearance .006CP 0.15
0V
(Note 1)
Exposed pad dimensions vary with paddle size.1.
Notes:
Interior Lead Clearance Z .071 1.80
Optional Exposed Pad Length .130
H2 3.30
H2
TYPCAL SOLDER MASKS
Minimum Solder Mask Clearance M .002 0.05
M (TYP)
2002 Microchip Technology Inc. DS21734A-page19
TC72
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
092002
TC72
DS21734A-page20 2002 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
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To : Technical Publications Manager
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Telephone: (_______) _________ - _________
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DS21734A
TC72
2002 Microchip Technology Inc. DS21743A-page21
TC72
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
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Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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PART NO. -X.X XX
PackageVoltage
Range
Device
Device: TC72: Digital Temperature Sensor w/SPI Interface
Voltage Range: 2.8 = Accuracy Optimized for 2.8V
3.3 = Accuracy Optimized for 3.3V
5.0 = Accuracy Optimized for 5.0V
Temperature Range: M = -55°C to +125°C
Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead
MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead
(Tape and Reel)
UA = Plastic Micro Small Outline (MSOP), 8-lead
UATR = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
Examples:
a) TC72-2.8MUA: Digital Temperature Sensor,
2.8V, 8LD MSOP package.
b) TC72-2.8MUATR: Digital Temperature Sen-
sor, 2.8V, 8LD MSOP (tape and reel) package.
c) TC72-2.8MMF: Digital Temperature Sensor,
2.8V, 8LD DFN package.
d) TC72-3.3MUA: Digital Temperature Sensor,
3.3V, 8LD MSOP package.
e) TC72-3.3MMF: Digital Temperature Sensor,
3.3V, 8LD DFN package.
f) TC72-5.0MUA: Digital Temperature Sensor,
5.0V, 8LD MSOP package.
g) TC72-5.0MMF: Digital Temperature Sensor,
5.0V, 8LD DFN package.
h) TC72-5.0MMFTR: Digital Temperature Sen-
sor, 5.0V, 8LD DFN (tape and reel) package.
X
Temperature
Range
TC72
DS21743A-page 22 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21743A - page 23
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21743A-page 24 2002 Microchip Technology Inc.
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