Ordering number : ENA1983B LV56831P Monolithic Linear IC Multi Voltage Regulator IC for Car Audio Systems http://onsemi.com Overview The LV56831P has 4 system regulator, VDD 5V(3.3V), AUDIO(8.5V), AMP remote(12V) and REG(3.3V/5V select). About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. AMP remote and REG supply is independent terminal from VCC., Features * 4 system regulator VDD(LCD micon) : VOUT 5.0V(3.3V), IO max 300mA, reverse current prevention. Audio : VOUT 8.5V, IO max 400mA AMP remote : VOUT 12V, IO max 500mA REG3.3/5V : VOUT 3.3V(5V), IO max 500mA * Over-current-protection * Over-voltage-protection: Typ 21V(except VDD) * Thermal-shut-down Typ 175C * Applied Pch-LDMOS for output stages. (Warning)The protector functions only improve the IC's tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shut down state may degrade the IC's reliability and eventually damage the IC. Specifications Absolute Maximum Ratings at Ta = 25C Parameter Conditions Conditions Ratings Unit Supply voltage VCC max 36 V Allowable Power dissipation Pd max IC unit 1.3 W (*Ta 25C) With Al heatsink(50x50x1.5mm3) 5.3 W Infinite heat rediation 26 W Peak supply voltage VCC peak See below pulse wave. 50 V Operating ambient temperature Topr -40 to +85 C Storage temperature Tstg -55 to +150 C Junction temperature Tj max 150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Semiconductor Components Industries, LLC, 2013 August, 2013 52312 SY/30712 SY/O2611 SY 20111014-S00007 No.A1983-1/9 LV56831P Peak voltage testing pulse wave 50V 90% 10% 16V 5msec 100msec Recommended Operating condition at Ta = 25C Parameter Conditions Ratings Unit Power supply voltage rating 1 VDD output(5V/3.3V) 7 to 16 V Power supply voltage rating 2 REG output(5V3.3V): VCC=VCC1 7 to 16 V Power supply voltage rating 3 AUDIO output 11 to 16 V Power supply voltage rating 4 AMP remote output: VCC=VCC1 13 to 16 V Electrical Characteristics at Ta = 25C, VCC = VCC1 =14.4V (*1) Parameter Symbol Ratings Conditions min Quiescent current ICC typ VDD no load, ALL EN terminal = L Unit max 50 100 A 0.5 V AUDIO_EN Input Low input voltage VIL1 0 High input voltage VIH1 2.0 Input impedance RIH1 280 400 5.5 V 520 k AMP_EN Input Low input voltage VIL2 0 0.5 V High input voltage VIH2 2.0 5.5 V Input impedance RIH2 280 520 k 400 REG_EN input Low input voltage VIL3 0 0.5 V High input voltage VIH3 2.0 5.5 V Input impedance RIH3 280 400 520 k 5.0 5.25 VDD (5V/3.3V)output(reverse current prevention diode implemented) VDD output voltage 1 VO11 IO11 = 200mA, IKVDD is connected to 5PIN. 4.75 VDD output current 1 IO11 VO11 4.7V 300 VDD output voltage 2 VO12 IO12 = 200mA, IKVDD=GND 3.13 VDD output current 2 IO12 VO12 3.1V 300 Line regulation VOLN1 7V < VCC < 16V, IO1 = 200mA Load regulation VOLD1 Dropout voltage 1 VDROP1 VCC ripple rejection RREJ1 f=120Hz, IO1=200mA VDD reverse current IREV VO11=5.0V, VCC=0V V mA 3.3 3.47 V mA 50 100 mV 1mA < IO11, IO12 < 200mA 80 150 mV IO1 = 200mA (implemented diode) 1.5 2.5 40(*2) 50(*2) V dB 10 100 A 12 12.6 V 50 100 mV AMP remote output ; AMP_EN = High USB output voltage 1 VO2 IO2 = 400mA 11.4 USB output current 1 IO2 VO2 11.3V 500 Line regulation VOLN2 13V < VCC1 < 16V, IO2 = 400mA Load regulation VOLD2 10mA < IO2 < 400mA 80 160 mV Dropout voltage 1 VDROP2 IO2 = 400mA 0.4 0.8 V VCC1 ripple rejection RREJ2 f=120Hz, IO2=400mA 40(*2) mA 50(*2) dB Continued on next page. No.A1983-2/9 LV56831P Continued from preceding page. Parameter Symbol Ratings Conditions min typ Unit max AUDIO output ; AUDIO_EN = High AUDIO output voltage VO3 IO3 = 300mA 8.1 AUDIO output current IO3 VO3 8V 400 8.5 8.9 V Line regulation VOLN3 10V < VCC < 16V, IO3 = 300mA 30 100 mV Load regulation VOLD3 1mA < IO3 < 300mA 70 140 mV Dropout voltage VDROP3 IO3 = 300mA 0.6 1.05 V VCC ripple rejection RREJ3 f = 120Hz, IO3=300mA mA 40(*2) 50(*2) 5 dB REG (3.3V/5V) Output ; REG_EN = High REG output voltage 1 VO41 IO41 = 400mA, IKREG is connected to 10PIN. 4.75 REG output current 1 IO41 VO41 4.7V 500 REG output voltage 2 VO42 IO42 = 400mA, IKREG=GND 3.13 REG output current 2 IO42 VO42 3.1V 500 Line regulation VOLN4 7V < VCC1 < 16V, IO4 = 400mA Load regulation VOLD4 Dropout voltage VDROP4 5.25 V mA 3.3 3.47 V mA 30 100 mV 1mA < IO4 < 400mA 80 150 mV IO4 = 400mA 1.0 1.5 V VCC1 ripple rejection RREJ4 f = 120Hz, IO4=400mA 40(*2) 50(*2) dB *1: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta(=25C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature(Tj). *2 : design certification Package Dimensions unit : mm (typ) 3336 21.6 HEAT SPREADER (20.0) 3.0 (11.0) (11.0) 3.35 12.4 (9.05) (14.55) 17.9 (8.6) (R1.75) 1 0.4 15 (1.91) 1.27 2.54 2.54 0.7 SANYO : HZIP15 1 3 5 7 9 11 13 14 REG3.3V/5V GND AMP_EN 12 AMP12V 10 IKREG REG_EN VCC 8 VCC 1 6 (NC) IKVDD (NC) 4 VDD 2 LV56831P AUDIO AUDIO_EN (NC) Pin assignment 15 No.A1983-3/9 LV56831P Allowable power dissipation derating curve Pd max -- Ta Allowable power dissipation, Pd max - W 8 7 6 5.3 (a) IC unit(HZIP15) (b) With Al heatsink(50x50x1.5mm3) Al heatsink mounting conditions Tightening torque: 39N*cm, using silicone grease 5 Al heat sink (50 x 50 x 1.5mm3) 4 3 2 1.3 IC unit 1 0 0 50 25 75 100 125 150 Ambient temperature, Ta - C Block Diagram B+ VCC + 8 Start up OverVoltage Protection + AUDIO(8.5V) 3 + 400mA Vref + 5 AUDIO_EN 2 6 VDD(5V/3.3V) + 300mA IKVDD: VDD(3.3/5.0V) select IKVDD=5PIN(VDD :5.0V) IKVDD=GND: 3.3V OUTPUT REG_EN 10 9 Control + AMP_EN 12 Thermal VCC1 + ex.) DC-DC 13 AMP remote(12V) + 500mA 11 IKREG: REG(3.3/5V) select IKREG=10PIN(REG_EN): 5V IKREG=GND: 3.3V Shut Down + GND 14 15 REG(3.3V/5V) + 500mA No.A1983-4/9 LV56831P Pin Function Pin No. Pin name Description 1 N.C. - 2 AUDIO_EN AUDIO output CTRL Equivalent Circuit - VCC 8 2 14 3 AUDIO AUDIO output when AUDIO_EN = High, ON 8.5V/0.4A GND VCC 8 3 14 4 N.C. - 5 VDD VDD output 5.0V, 3.3V/0.3A GND - VCC 8 5 14 6 IKVDD VDD output voltage select OPEN : VDD = 5.0V GND VCC 8 GND : VDD = 3.3V 6 14 7 N.C. - 8 VCC VCC 9 VCC1 VCC1 GND - 8 VCC 9 14 GND Continued on next page. No.A1983-5/9 LV56831P Continued from preceding page. Pin No. 10 Pin name REG_EN Description Equivalent Circuit REG output CTRL 9 VCC1 10 14 11 IKREG GND REG output voltage select 9 OPEN : REG = 3.3V VCC1 GND : REG = 5.0V 11 12 AMP_EN 14 GND 9 VCC1 AMP output CTRL 12 14 13 AMP GND AMP output when AMP_EN = High, ON 9 12V, 0.5A VCC1 13 14 14 GND 15 REG GND GND REG output when REG_EN = High, ON 5.0V, 3.3V/0.5A 9 VCC1 15 14 GND No.A1983-6/9 LV56831P Timing Chart 21V VCC (8PIN) VCC1 (9PIN) VDD (5PIN) AMP_EN (12PIN) AMP (13PIN) AUDIO_EN (2PIN) AUDIO (3PIN) REG_EN (10PIN) REG (15PIN) No.A1983-7/9 LV56831P HZIP15 Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment * Use flat-head screws to attach heat sinks. * Use also washer to protect the package. * Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . * If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. * Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. * Take care a position of via hole . * Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. * Verify that there are no press burrs or screw-hole burrs on the heat sink. * Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. * Twisting must be limited to under 0.05 mm. * Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers * The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease * Spread the silicone grease evenly when mounting heat sinks. * Our company recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount * First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. * When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., * Take care not to allow the device to ride onto the jig or positioning dowel. * Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes * Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. * When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. * When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A1983-8/9 LV56831P ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. 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