BIPOLAR ANALOG INTEGRATED CIRCUIT PC3232TB 5 V, SILICON GERMANIUM MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC3232TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Low current : ICC = 26.0 mA TYP. * Medium output power : PO (sat) = +15.5 dBm TYP. @ f = 1.0 GHz : PO (sat) = +12.0 dBm TYP. @ f = 2.2 GHz * High linearity : PO (1 dB) = +11.0 dBm TYP. @ f = 1.0 GHz : PO (1 dB) = +8.5 dBm TYP. @ f = 2.2 GHz * Power gain : GP = 32.8 dB MIN. @ f = 1.0 GHz : GP = 33.5 dB MIN. @ f = 2.2 GHz * Gain flatness : GP = 1.0 dB TYP. @ f = 1.0 to 2.2 GHz * Noise figure : NF = 4 dB TYP. @ f = 1.0 GHz : NF = 4.1 dB TYP. @ f = 2.2 GHz * Supply voltage : VCC = 4.5 to 5.5 V * Port impedance : input/output 50 APPLICATIONS * IF amplifiers in LNB for DBS converters etc. ORDERING INFORMATION Part Number PC3232TB-E3 Order Number Package PC3232TB-E3-A 6-pin super minimold Marking C3S (Pb-Free) Supplying Form Embossed tape 8 mm wide Pin 1, 2, 3 face the perforation side of the tape Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office Part number for sample order: PC3232TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10597EJ01V0DS (1st edition) Date Published May 2006 NS CP(K) PC3232TB PIN CONNECTIONS Pin No. Pin Name 1 OUTPUT 2 GND 3 VCC 4 INPUT 5 GND 6 GND PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER (T A = +25C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 ) PO (sat) GP NF ICC (dBm) (dB) (dB) (mA) PC2708TB +10.0 15.0 6.5 26 PC2709TB +11.5 23.0 5.0 25 C1E PC2710TB +13.5 33.0 3.5 22 C1F PC2776TB +8.5 23.0 6.0 25 C2L PC3223TB +12.0 23.0 4.5 19 C3J 24.5 C3M Part No. PC3225TB +15.5 Note 32.5 Note 3.7 Note Package Marking 6-pin super minimold C1D PC3226TB +13.0 25.0 5.3 15.5 C3N PC3232TB +15.5 32.8 4.0 26 C3S Note PC3225TB is f = 0.95 GHz Remark 2 Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Data Sheet PU10597EJ01V0DS PC3232TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 6.0 V Total Circuit Current ICC TA = +25C 45 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin 0 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 C Data Sheet PU10597EJ01V0DS 3 PC3232TB ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit No input signal 20 26 32 mA dB Circuit Current ICC Power Gain 1 GP1 f = 0.25 GHz, Pin = 35 dBm 29 31.5 34 Power Gain 2 GP2 f = 1.0 GHz, Pin = 35 dBm 30 32.8 35.5 Power Gain 3 GP3 f = 1.8 GHz, Pin = 35 dBm 31 33.8 37 Power Gain 4 GP4 f = 2.2 GHz, Pin = 35 dBm 30.5 33.5 36.5 Power Gain 5 GP5 f = 2.6 GHz, Pin = 35 dBm 29 32.2 35.5 Power Gain 6 GP6 f = 3.0 GHz, Pin = 35 dBm 27 30.7 34 Gain Flatness GP f = 1.0 to 2.2 GHz, Pin = 35 dBm 1.0 dB K factor 1 K1 f = 1.0 GHz, Pin = 35 dBm 1.3 K factor 2 K2 f = 2.2 GHz, Pin = 35 dBm 1.9 dBm Saturated Output Power 1 PO (sat) 1 f = 1.0 GHz, Pin = 0 dBm +13 +15.5 Saturated Output Power 2 PO (sat) 2 f = 2.2 GHz, Pin = 5 dBm +9.5 +12 Gain 1 dB Compression Output Power PO (1 dB) 1 f = 1.0 GHz +8 +11 PO (1 dB) 2 f = 2.2 GHz +6 +8.5 Noise Figure 1 NF1 f = 1.0 GHz 4 4.8 Noise Figure 2 NF2 f = 2.2 GHz 4.1 4.9 Isolation 1 ISL1 f = 1.0 GHz, Pin = 35 dBm 36 41 Isolation 2 ISL2 f = 2.2 GHz, Pin = 35 dBm 38 45 Input Return Loss 1 RLin1 f = 1.0 GHz, Pin = 35 dBm 9.5 13 Input Return Loss 2 RLin2 f = 2.2 GHz, Pin = 35 dBm 10 14.5 Output Return Loss 1 RLout1 f = 1.0 GHz, Pin = 35 dBm 12 15.5 Output Return Loss 2 RLout2 f = 2.2 GHz, Pin = 35 dBm 12 15 Input 3rd Order Distortion Intercept Point 1 IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 9 Input 3rd Order Distortion Intercept Point 2 IIP32 f1 = 2 200 MHz, f2 = 2 201 MHz 15.5 Output 3rd Order Distortion Intercept Point OIP31 f1 = 1 000 MHz, f2 = 1 001 MHz +23.5 OIP32 f1 = 2 200 MHz, f2 = 2 201 MHz +18 IM2 f1 = 1 000 MHz, f2 = 1 001 MHz, 50 dBc 70 dBc dBm 1 Gain 1 dB Compression Output Power 2 dB dB dB dB dBm dBm 1 Output 3rd Order Distortion Intercept Point 2 2nd Order Intermodulation Distortion Pout = 5 dBm/tone 2nd Harmonic 4 2f0 f0 = 1.0 GHz, Pout = 15 dBm Data Sheet PU10597EJ01V0DS PC3232TB TEST CIRCUIT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value R1 Chip Resistance 560 L1 Chip Inductor 47 nH L2 Chip Inductor 68 nH C1 Chip Capacitor 100 pF C2 Chip Capacitor 33 pF C3, C4 Chip Capacitor 1 000 pF C5 Chip Capacitor 39 pF C6 Feed-through Capacitor 1 000 pF INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 3) and output pin (pin 1). Select inductance, as the value listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable (Refer to the following page). CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). Data Sheet PU10597EJ01V0DS 5 PC3232TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST Notes Value Size R1 560 1005 L1 47 nH 1005 2. Back side: GND pattern L2 68 nH 1005 3. Au plated on pattern C1 100 pF 1608 4. : Through holes 5. L1, L2: FDK's products C2 1. 33 pF 1608 1 000 pF 1005 C5 39 pF 1608 C6 1 000 pF C3, C4 19 21.46 0.51 mm double sided copper clad RO4003C (Rogers) board. Feed-through Capacitor 6 Data Sheet PU10597EJ01V0DS PC3232TB TYPICAL CHARACTERISTICS (T A = +25C, VCC = 5.0 V, ZS = ZL = 50 , unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PU10597EJ01V0DS 7 PC3232TB Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10597EJ01V0DS PC3232TB Remark The graphs indicate nominal characteristics. Data Sheet PU10597EJ01V0DS 9 PC3232TB S-PARAMETERS (T A = +25C, VDD = VCC = 5.0 V, Pin = 35 dBm) S11FREQUENCY S22FREQUENCY 10 Data Sheet PU10597EJ01V0DS PC3232TB S-PARAMETERS Data Sheet PU10597EJ01V0DS 11 PC3232TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 12 Data Sheet PU10597EJ01V0DS PC3232TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 WS260 HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10597EJ01V0DS 13