ARK Menu Specifications Essentials Performance Memory Specifications Gre] s) aime #) imate at Expansion Options are le t=) tele Lee Lt Leg Advanced Technologies Intel? Data Protection Technology Intel Platform celta tee eel ody eli elie) tama cee Fae Ordering / sSpecs / Steppings Download Drivers Intel Core 17-6700 Processor (8M Cache, up to 4.00 GHz) Specifications Essentials USA (English) Status Launch Date Processor Number Intel Smart Cache Scalability Thermal Solution Specification Datasheet # of Cores Launched Q3'15 i7-6700 & MB GT/s 64-bit S5E4.1/4.2, AVA 2.0 14m 15 Only PCG 2015C (B5W) Link 3.4 GHz 4 GHz 65 W 64 GB DDR4-1866/2133, DDR3SL- 1333/1600 @ 1.35V 2 34.1 GB/s IQ| No S Graphics Specifications Processor Graphics * Graphics Base Frequency Graphics Video Max Memory Graphics Output ee eee # of Displays Supported * Device ID Intel? HD Graphics 530 350 MHz 1.15 GHz 1.7 GB eDP/DP/HDMI/DVI Wes, at 60HzZ 1080p 4096x2304 (a2 4H2 4096x2304@60Hz 4096x2304@60Hz N/A 12 4.4 3 Ox1912 Related Products 6th Generation Intel Core i? Processors Intel Core i7-6700 Desktop Processor Series Products formerly Skylake (intel Embedded Visit the Embedded Design Center > Quick Links Export Full Specifications > Find Compatible Boards > Search Distributors > Support Overview > Search all of intel.com > PCN/MDDS Information SR2L2 947202: PCN | MDDS 947559: MDDS 947566: MDDS PC| Express Revision 3.0 PC! Express Configurations * Up to 1x16, 2x8, 1x8+2x4 Max # of PCI Express Lanes 16 Ls a fs a] oe i fe f af sh a = = 3 wi Max CPU Configuration 1 Tease 71C Package Size 375mm x 3/7.5mm Graphics and IMC Lithography 14m ee f2sge 15 Low Halogen Options Available 5ee MDDS = al <= fu | ie | i cL | ( A =e | 5 | ci) iq ia] Intel? Turbo Boost Technology * 2.0 Intel vPro Technology + [Q| Intel? Hyper-Threading Technology * [Q| Intel Virtualization Technology (VT-x) + Intel Virtualization Technology for Directed 1/0 (VT- Intel TSX-NI Intel 64 # [a Idle States Enhanced Intel SpeedStep* Technology IQ! =] vl a 4 a a = to a | fa = | D | 7 | a a S Intel Platform Protection Technology OS Guard Trusted Execution Technology + [Q| Allinformation provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided as-is and Intel does mot make any representations or warranties whatsoever regarding accuracy of the information, mor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Contra! Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed a5 2 representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. Refer te Datasheet for formal definitions of product properties and features. Announced SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i?7-26300M/i7-26350M, i7-26700M/i7-267 50M, i5-2430M5-2435M, 5-24 70M si5-24 15M. Please contact OEM for the BlOS that includes the latest Processor configuration update. = This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HOD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platiorm software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. Conflict free and conflict-free means DRC conflict free, which is defined by the US. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groupes in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" ina broader sense to refer te suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 71,2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, mot to any additional included accessories, such as heatsinks/coolers. See http: wae. inteLcom/contentfwww/us/enfarchitecture-and-technology/hyper-threading/hyper-threading-technology html? wapkw=hyper+threading far more information including details on which processors support Intel? HT Technology. Max Turbo Frequency refers ta the maximum singl-core processor frequency that can be achieved with Intel" Turbo Boost Technology. See waww_intel.com/technology/turboboost/ for more information. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1/000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer fram Intel. Please work with your appropriate Intel representative toe obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TOP may be lower if mot all ls for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet J5-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. For benchmarking data see hitto:! weww-intel.com/ performance. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See hittes hw intel.com content www /us/en/processors/processor-numbers.html far details. Processors that support 64-bit computing on Intel? architecture require an Intel 64 architecture-enabled BIOS. E} Send us your feedback! About Support Legal Social Company Information Investor Relations Contact Us Newsroom Site Map Jobs (intel) 2 intel Corporation Support home Download Center Product Specifications (ARK) Terms of Use *Trademarks Privacy Cookies Supply Chain Transparency Ey (ntel Communities Eq intel on Twitter E@ Intel on Facebook Fi) Intel on LinkedIn Intel on Instagram [] Intel on YouTube