CPC1125N Single-Pole, Normally Closed 4-Pin SOP OptoMOS(R)Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 400 100 35 2 Units VP mArms / mADC mA Description CPC1125N is a miniature single-pole, normally closed (1-Form-B) solid state relay. It uses IXYS Integrated Circuits Division's patented, optically coupled, OptoMOS architecture to provide 1500Vrms of input/output isolation in a small 4-Pin SOP package. CPC1125N uses IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging to produce one of the world's smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Features * 1500Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Small 4-Pin SOP Package * Machine Insertable, Wave Solderable * Tape & Reel Version Available Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * Certified to: IEC60950-1: 2005 EN60950-1: 2006 TUV Certificate: B 09 07 49410 006 Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Ordering Information Part # CPC1125N CPC1125NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 Load 3 2 Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1125N-R02 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1125N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 400 5 50 1 150 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 3.33 mw / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=0mA t =10ms IL=100mA IL ILPK RON - 26 100 350 35 mArms / mADC mAP IF=5mA, VL=10V ton toff VL=400V, IF=2mA IF=2mA, VL= 50V, f=1MHz ILEAK COUT - 0.31 0.30 6 2 2 1 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.2 - 2 1.4 10 mA mA V A 1 - pF CI/O Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60C) a LED drive current of 4mA is recommended. www.ixysic.com ms A pF R02 INTEGRATED CIRCUITS DIVISION CPC1125N PERFORMANCE DATA* 15 10 5 15 10 5 Device Count (N) 10 5 0 0.26 0.14 0.16 0.18 0.20 LED Current (mA) 0.20 25 15 10 5 50 24 25 25 26 27 On-Resistance (:) 28 10 800 600 400 0 10 2000 1.3 1.2 IF=10mA IF=5mA IF=2mA -20 420 430 440 450 460 Blocking Voltage (VP) 314 312 310 0 1600 1200 10 IF=5mA 800 400 20 30 LED Current (mA) 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 40 50 Typical Turn-On Time vs. Temperature (IL=60mA) 450 400 350 300 250 IF=5mA 200 IF=2mA 150 0 470 Typical Turn-On Time vs. LED Forward Current (IL=60mA, TA=25C) 500 0 1.0 -40 410 316 50 Turn-On Time (Ps) 1.4 1.1 40 IF=2mA Turn-Off Time (Ps) 1.5 20 30 LED Current (mA) Typical Turn-Off Time vs. Temperature (IL=60mA) Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA 5 306 0 1.6 10 308 200 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 Forward Voltage (V) 15 318 Turn-On Time (Ps) Turn-Off Time (Ps) 20 0.38 20 400 1000 30 0.26 0.29 0.32 0.35 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50, IF=2mA, TA=25C) 28 Typical Turn-Off Time vs. LED Forward Current (IL=60mA, TA=25C) 1200 40 0.23 0 0.22 Typical LED Forward Voltage vs. Forward Current (TA=25C) 10 0.36 0 0.12 LED Forward Voltage (V) 0.28 0.30 0.32 0.34 Turn-On Time (ms) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA, TA=25C) 20 15 15 0 0.24 1.275 20 20 5 Device Count (N) 1.255 1.260 1.265 1.270 LED Forward Voltage (V) Form-B IF for Switch Operation (N=50, IL=120mA, TA=25C) 25 Device Count (N) 25 20 0 1.250 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA, TA=25C) 30 Device Count (N) 20 0 Forward Current (mA) Typical Turn-On Time (N=50, IF=5mA, IL=60mA, TA=25C) 25 Device Count (N) Device Count (N) 25 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1125N PERFORMANCE DATA* 0.8 45 On-Resistance (:) 0.6 0.5 0.4 0.3 0.2 0.1 35 30 25 -20 0 20 40 60 Temperature (C) 80 100 110 Blocking Voltage (VP) 90 80 70 60 -20 0 20 40 60 Temperature (C) 80 -20 0 20 40 60 Temperature (C) Output Capacitence (pF) 70 80 100 455 450 445 -20 0 20 40 60 Temperature (C) 1.0 60 50 40 30 20 10 0 1 -2 -1 0 1 Load Voltage (V) 2 3 Leakage Current vs. Temperature Measured Between Pins 3&4 (IF=5mA, VL=400V) 120 100 80 60 40 20 0 -40 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz, TA=25C) 0.1 -3 140 460 Load Current (A) -40 0 -50 100 440 50 50 Typical Blocking Voltage vs. Temperature (IF=5mA) 465 100 100 -150 -40 Maximum Load Current vs. Temperature (IF=0mA) Typical Load Current vs. Load Voltage (IF=0mA, TA=25C) -100 20 -40 Load Current (mA) 40 150 Leakage Current (nA) LED Current (mA) 0.7 Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) Load Current (mA) Typical IF for Switch Operation (IL=60mA) 10 100 Load Voltage (V) 1000 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 Energy Rating Curve (TA=25C) 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1125N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1125N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1125N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R02 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1125N MECHANICAL DIMENSIONS CPC1125N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1125NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1125N-R02 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012 6