INTEGRATED CIRCUITS DIVISION
CPC1125N
Single-Pole, Normally Closed
4-Pin SOP OptoMOS®Relay
www.ixysic.com
DS-CPC1125N-R02 1
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Part # Description
CPC1125N 4-Pin SOP (100/tube)
CPC1125NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 400 VP
Load Current 100 mArms / mADC
On-Resistance (max) 35
LED Current to Operate 2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
CPC1125N is a miniature single-pole, normally closed
(1-Form-B) solid state relay. It uses IXYS Integrated
Circuits Division’s patented, optically coupled,
OptoMOS architecture to provide 1500Vrms of
input/output isolation in a small 4-Pin SOP package.
CPC1125N uses IXYS Integrated Circuits Division’s
state of the art double-molded vertical construction
packaging to produce one of the world’s smallest
relays. It is ideal for replacing larger, less-reliable reed
and electromechanical relays.
Approvals
Switching Characteristics of
Normally Closed Devices
Form-B
I
F
10%
90%
I
LOAD
ton
toff
1
23
4
+ Control
– Control
Load
Load
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• Certified to:
IEC60950-1: 2005
EN60950-1: 2006
TUV Certificate: B 09 07 49410 006
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R02
CPC1125N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 400 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 150 mW
Total Power Dissipation 1400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 3.33 mw / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=0mA IL- - 100 mArms / mADC
Peak t =10ms ILPK - - ±350 mAP
On-Resistance 2IL=100mA RON -2635
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.31 2 ms
Turn-Off toff - 0.30 2
Off-State Leakage Current VL=400V, IF=2mA ILEAK --1 µA
Output Capacitance IF=2mA, VL= 50V, f=1MHz COUT -6 - pF
Input Characteristics
Input Control Current to Activate 3IL=100mA IF--2 mA
Input Control Current to Deactivate - IF0.1 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output - CI/O -1 - pF
1 Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recommended.
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
CPC1125N
www.ixysic.com 3
R02
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.250 1.255 1.260 1.265 1.270 1.275
Device Count (N)
0
5
10
15
20
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Turn-On Time (ms)
0.24 0.26 0.28 0.30 0.32 0.34 0.36
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
Turn-Off Time (ms)
0.20 0.23 0.26 0.29 0.32 0.35 0.38
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=60mA, TA=25ºC)
LED Current (mA)
0.12 0.14 0.16 0.18 0.20 0.22
Device Count (N)
0
5
10
15
20
25
Form-B IF for Switch Operation
(N=50, IL=120mA, TA=25ºC)
On-Resistance (:)
24 25 25 26 27 28 28
Device Count (N)
0
5
10
15
20
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=100mA, TA=25ºC)
Blocking Voltage (VP)
400 410 420 430 440 450 460 470
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(N=50, IF=2mA, TA=25ºC)
Forward Voltage (V)
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
Forward Current (mA)
0
10
20
30
40
50
Typical LED Forward Voltage
vs. Forward Current
(TA=25ºC)
LED Current (mA)
0 1020304050
Turn-On Time (Ps)
306
308
310
312
314
316
318
Typical Turn-On Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
0
400
800
1200
1600
2000
Typical Turn-Off Time
vs. Temperature
(IL=60mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
100
150
200
250
300
350
400
450
500
Typical Turn-On Time
vs. Temperature
(IL=60mA)
IF=5mA
IF=2mA
LED Current (mA)
01020304050
Turn-Off Time (Ps)
0
200
400
600
800
1000
1200
Typical Turn-Off Time
vs. LED Forward Current
(IL=60mA, TA=25ºC)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R02
CPC1125N
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
50
60
70
80
90
100
110
Maximum Load Current
vs. Temperature
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
440
445
450
455
460
465
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
120
140
Leakage Current vs. Temperature
Measured Between Pins 3&4
(IF=5mA, VL=400V)
Load Voltage (V)
0.1 1 10 100 1000
Output Capacitence (pF)
0
10
20
30
40
50
60
70
Output Capacitance vs. Load Voltage
(IF=2mA, f=1MHz, TA=25ºC)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
(TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Typical IF for Switch Operation
(IL=60mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
20
25
30
35
40
45
Typical On-Resistance vs. Temperature
(IF=0mA, IL=60mA)
Load Voltage (V)
-3 -2 -1 0 1 2 3
Load Current (mA)
-150
-100
-50
0
50
100
150
Typical Load Current vs. Load Voltage
(IF=0mA, TA=25ºC)
INTEGRATED CIRCUITS DIVISION
CPC1125N
www.ixysic.com 5
R02
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1125N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1125N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1125N-R02
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/14/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1125N
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1125N
CPC1125NTR Tape & Reel
