RoHS Recast Compliant
Industrial Micro SD 3.0
Specifications
March 5th, 2013
Version 1.1
Apacer Technology Inc.
4
th
Fl., 75 Hsin Tai Wu Rd., Sec.1, Xizhi, New Taipei City, Taiwan 221
Tel: +886-2-2698-2888 Fax: +886-2-2689-2889
www.apacer.com
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
1
© 2013 Apacer Technology, Inc. Rev. 1.1
FEATURES:
Fully compatible with SD Card Association
specifications
-
Part 1, Physical Layer Specification, Version
3.1 Final
-
Part 3, Security Specification, Version 3.0
Final
Capacity range
-
4, 8, 16, 32 GB
Performance*
-
Sustained Read: Up to 19 MB/sec
-
Sustained Write: Up to 12
MB/sec
SD-protocol compatible
Supports SD SPI mode
Backward compatible with 2.0
NAND Flash Type: MLC
Operating frequency: up to 100 MHz
Intelligent endurance design
-
Built-in advanced ECC algorithm
-
Wear-leveling
-
Flash bad-block management
-
Built in write protect
Temperature ranges
-
Operating temperature: -25 ~ +85°C
-
Storage temperature: -40°C
~ +85°C
Operating voltage: 2.7V ~ 3.6V
Power consumption*
-
Operating: 47 mA
-
Standby: 150
uA
Physical dimension : 15mm(L) x
11mm(W) x 1mm(H)
RoHS Recast Compliant (2011/65/EU)
*Vary from capacities. Performance values presented here are typical and may vary depending on settings and platforms.
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
TABLE OF CONTENTS
1. General Description ....................................................................................................... 3
1.1 PRODUCT FUNCTION BLOCK .................................................................................................................. 3
1.2 FUNCTIONAL DESCRIPTION ..................................................................................................................... 3
1.2.1 Flash Management ....................................................................................................................... 4
1.2.2 Powerful ECC Algorithms ............................................................................................................. 4
1.2.3 Power Management......................................................................................................................4
2. Electrical characteristics............................................................................................. 5
2.1 CARD ARCHITECTURE ............................................................................................................................ 5
2.2 PIN ASSIGNMENT ................................................................................................................................... 5
2.3 CAPACITY SPECIFICATION ...................................................................................................................... 6
2.4 PERFORMANCE...................................................................................................................................... 6
2.5 ELECTRICAL .......................................................................................................................................... 6
3. Physical Characteristics............................................................................................... 7
3.1 PHYSICAL DIMENSION ............................................................................................................................ 7
3.2 ENVIRONMENTAL SPECIFICATIONS.......................................................................................................... 9
4. AC Characteristics ........................................................................................................11
4.1MICRO SD INTERFACE TIMING (DEFAULT)............................................................................................. 11
4.2 MICRO SD INTERFACE TIMING (HIGH SPEED MODE).............................................................................. 12
4.3 SD INTERFACE TIMING (SDR12, SDR25 AND SDR50 MODES) INPUT ................................................... 13
4.3.1 SDR50 Input Timing ...................................................................................................................13
4.3.2 Output .........................................................................................................................................14
4.3.3 SD Interface Timing (DDR50 Mode)........................................................................................... 14
4.3.4 Bus Timings – Parameters Values (DDR50 Mode) ....................................................................15
5. Product Ordering Information ...................................................................................16
5.1 PRODUCT CODE DESIGNATIONS ........................................................................................................... 16
5.2
VALID COMBINATIONS ......................................................................................................................... 17
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
1. General Description
As the demand of reliable and high-performance data storage in a small form factor increases, Apacer’s
Micro SD card 3.0 is designed specifically for multiple applications by offering high endurance, reliability,
and agility, where extreme flexibility, endurance, data integrity, and exceptionally transmission are
required.
The Micro SD 3.0 card fully complies with SD Card Association standard. The Command List is
compatible with [Part 1 Physical Layer Specification Ver3.1 Final] definitions, while the Card Capacity of
Non-secure Area, Secure Area supports [Part 3 Security Specification Ver3.0 Final] Specifications. The
card allows selection of either SD or SPI mode for compatibility in data communication. To provide higher
transfer rate, the card can extend to 100MHz clock frequency.
The card also comes with endurance features for data error detection and correction, write protection, and
password protection.
1.1 Product Function Block
The Micro SD contains a card controller and a memory core for the SD standard interface.
1.2 Functional description
The Micro SD device contains a high level, intelligent flash management that provides many capabilities
including:
High performance flash memory control
ECC algorithms
Wear leveling
Power management
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
1.2.1 Flash Management
The SD controller contains logic/physical flash block mapping and bad block management system. It will
manage all flash block including user data space and spare block.
The Micro SD also contains a sophisticated defect and error management system. It does a read after
write under margin conditions to verify that the data is written correctly (except in the case of write pre-
erased sectors). In case that a bit is found to be defective, the SD will replace this bad bit with a spare bit
within the sector header. If necessary, the Micro SD will even replace the entire sector with a spare sector.
This is completely transparent to the master (host device) and does not consume any user data space.
1.2.2 Powerful ECC Algorithms
The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD controller
supports up to 68bits ECC circuits to protect data transfer.
1.2.3 Power Management
A power saving feature of the Micro SD is automatic entrance and exit from sleep mode. Upon completion
of an operation, the SD will enter the sleep mode to conserve power if no further commands are received
within X seconds, where X is programmable by software. The master does not have to take any action for
this to occur. The SD is in sleep mode except when the host is accessing it, thus conserving power.
Any command issued by the master to the Micro SD will cause it to exit sleep mode and response to the
master.
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
2. Electrical characteristics
2.1 Card Architecture
2.2 Pin Assignment
SD Mode SPI Mode
Pin
Name Description Name Description
1 DAT2 Data line[bit 2] Reserved
2
CD/DAT3
2
Card Detect/Data line [bit 3] CS Chip select
3 CMD
Command/Response DI Data in
4 VDD Supply voltage VDD Supply voltage
5 CLK Clock SCLK Clock
6 VSS Supply voltage ground VSS Supply voltage ground
7 DAT0 Data line[bit 0] DO Data out
8 DAT1 Data line[bit 1] Reserved
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
2.3 Capacity Specification
The following table shows the specific capacity for the SD 3.0 card.
Capacity Total Bytes
4 GB 3,972,005,888
8 GB 7,960,788,992
16 GB 15,997,075,456
32 GB 32,078,036,992
Note: total bytes are viewed under Windows operating system and were measured by SD format too.
2.4 Performance
Performances of the SD 3.0 card are shown in the table below.
Capacity
Modes 4 GB 8 GB 16 GB 32 GB
Read (MB/s) 19 19 19 19
Write (MB/s) 12 12 12 12
Note: results may vary depending on settings and platforms.
2.5 Electrical
Operating Voltages
Symbol Parameter Min. Max. Unit
V
DD
Power Supply Voltage 2.7 3.6 V
Power consumption
Capacity
Modes 4 GB 8 GB 16 GB 32 GB
Operating (mA) 40 42 45 47
Standby (
uA
) 100 100 100 150
Note: results may vary depending on settings and platforms.
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
3. Physical Characteristics
3.1 Physical Dimension
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
3.2 Environmental Specifications
Climatic Testing
Test Condition
(Gold Series)
Test Item DUT
State
Temperature Duration
Storage 85℃ 500 Hours
High Temperature
Operation 85℃ 168 Hours
Storage - 40℃ 300 Hours
Low Temperature
Operation - 25℃ 168 Hours
Storage 40℃ 95% 500 Hours
High Temperature
&
High Humidity Operation 40℃ 95% 4 Hour
Thermal Cycling Storage* - 40℃ ~ 85℃
30min hold each
20 Cycles
Durability Testing
Test Item Descriptions
Insertion/Removal 10,000 cycles
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
Bending 10nt/Stimes for 6 faces and 4 corners
(each drop
was performed 3 times, total of 30 drops)
Electrostatic Discharge
Contact discharge: HCP & VCP
Air discharge: ALL – VSS (±),
ALL – VCC (±)
VCC – VSS (±),
ALL – ALL (±)
Ultraviolet Radiation
Units are non-operating. UVB bandwidth
：
313nm. Test irradiation
：
0.63 w/m²/nm.
Radiation cycle
：
Radiation on for 4 hours at
temperature 60°C, then radiation off for 4 hours
at temperature 50°C. Number of cycle
：
6 cycles.
Duration of test
：
48 hours
Drop 1.Sm free fall, 10times
Salt Water Spray 3+/-1%NaCl; 35
℃
; 24hrs
Torque 0.SN-m or 0.2Sdegree S time; 30sec/direction
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
4. AC Characteristics
4.1 Micro SD Interface Timing (Default)
SYMBOL
PARAMETER MIN MAX UNIT Note
Clock CLK (All values are referred to min(V
IH
) and max(V
IL
)
f
PP
Clock frequency Data Transfer Mode 0 25 MHz
C
card
≤10 pF
(1 card)
f
OD
Clock frequency Identification Mode 0
(1)
/100
400 kHz
C
card
≤10 pF
(1 card)
t
WL
Clock low time 10 - ns
C
card
≤10 pF
(1 card)
t
WH
Clock high time 10 - ns
C
card
≤10 pF
(1 card)
t
TLH
Clock rise time - 10 ns
C
card
≤10 pF
(1 card)
t
THL
Clock fall time - 10 ns
C
card
≤10 pF
(1 card)
t
ISU
Input setup time 5 - ns
C
card
≤10 pF
(1 card)
t
IH
Input hold time 5 - ns
C
card
≤10 pF
(1 card)
Industrial Micro SD 3.0
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© 2013 Apacer Technology, Inc. Rev. 1.1
t
ODLY
Output delay time 0 14 ns
C
L
≤40 pF
(1 card)
t
ODLY
Output Delay time during Identification
Mode 0 50 ns
C
L
≤40 pF
(1 card)
(1)0Hz means to stop the clock. The given minimum frequency range is for cases that requires the clock to be continued.
4.2 Micro SD Interface Timing (High Speed Mode)
SYMBOL PARAMETER MIN MAX UNIT Note
f
PP
Clock frequency data transfer mode
0 50 MHz Ccard≤10 pF
(1 card)
t
WL
Clock low time 7 - ns Ccard≤10 pF
(1 card)
t
WH
Clock high time 7 - ns Ccard≤10 pF
(1 card)
t
TLH
Clock rise time - 3 ns Ccard≤10 pF
(1 card)
t
THL
Clock fall time - 3 ns Ccard≤10 pF
(1 card)
t
ISU
Input setup time 6 - ns Ccard≤10 pF
(1 card)
t
IH
Input hold time 2 - ns Ccard≤10 pF
(1 card)
t
ODLY
Output delay time 14 ns CL≤40 pF
(1 card)
t
OH
Output hold time 2.5 50 ns CL≤15 pF
(1 card)
C
L System capacitance of each line* 40 pF CL≤15 pF
(1 card)
*In order to satisfy severe timing, host shall run on only one card
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
4.3 SD Interface Timing (SDR12, SDR25 and SDR50 Modes) Input
Symbol
Min Max Unit Remark
t
CLK
4.80 - ns 208MHz (Max.), Between rising
edge, VCT= 0.975V
t
CR
, t
CF
- 0.2* t
CLK
ns t
CR
, t
CF
< 2.00ns (max.) at 100MHz,
CCARD=10pF
Clock Duty
30 70 %
4.3.1 SDR50 Input Timing
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
Symbol
Min Max Unit SDR50 Mode
t
Is
3.00 - ns CCARD =10pF, VCT= 0.975V
t
IH
0.80 - ns CCARD =5pF, VCT= 0.975V
4.3.2 Output
Symbol
Min Max Unit Remark
t
ODLY
- 7.5 ns t
CLK
>=10.0ns, CL=30pF, using driver Type B,
for SDR50
t
ODLY
- 14 ns t
CLK
>=20.0ns, CL=40pF, using driver Type B,
for SDR25 and SDR12,
T
OH
1.5 - ns Hold time at the t
ODLY
(min.), CL=15pF
4.3.3 SD Interface Timing (DDR50 Mode)
Symbol
Min Max Unit Remark
t
CLK
20 - ns 50MHz (Max.), Between rising edge
t
CR
, t
CF
- 0.2* t
CLK
ns t
CR
, t
CF
< 4.00ns (max.) at 50MHz,
CCARD=10pF
Clock Duty
45 55 %
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
4.3.4 Bus Timings – Parameters Values (DDR50 Mode)
Symbol
Parameters Min
Max
Unit
Remark
Input CMD (referenced to CLK rising edge)
t
ISU
Input set-up time 6 - ns C
card
≤10 pF
(1 card)
t
IH
Input hold time 0.8 - ns C
card
≤10 pF
(1 card)
Output CMD (referenced to CLK rising edge)
t
ODLY
Output Delay time during
Data Transfer Mode - 13.7
ns C
L
≤30 pF
(1 card)
T
OH
Output Hold time 1.5 - ns C
L
≥15 pF
(1 card)
Inputs DAT (referenced to CLK rising and falling edges)
t
ISU2x
Input set-up time 3 - ns C
card
≤10 pF
(1 card)
t
IH2x
Input hold time 0.8 - ns C
card
≤10 pF
(1 card)
Outputs DAT (referenced to CLK rising and falling edges)
t
ODLY2x
Output Delay time during
Data Transfer Mode - 7.0 ns C
L
≤25 pF
(1 card)
T
OH2x
Output Hold time 1.5 - ns C
L
≥15 pF
(1 card)
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AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
5. Product Ordering Information
5.1 Product Code Designations
A P – MSD x x x C X 4 X – 1 TM
Configuration
S
：
：：
：
one chip
D
：
：：
：
two chip
H
：
：：
：
four chip
Model Name
Apacer Product Code
Capacities:
04G: 4GB
08G 8GB
16G 16GB
32G 32GB
Temperature:
C: Commercial Temperature
I: Extended Temperature
F/W
Flash Type:
T: Toshiba MLC
CTL Solution
4: SDHC
Industrial Micro SD 3.0
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© 2013 Apacer Technology, Inc. Rev. 1.1
5.2 Valid Combinations
5.2.1 Commercial Temperature
Capacity AP/N
4GB AP-MSD04GCS4P-1TM
8GB AP-MSD08GCS4P-1TM
16GB AP-MSD16GCD4P-1TM
32GB AP-MSD32GCH4P-1TM
Note: Please consult with Apacer sales representatives for availabilities.
Industrial Micro SD 3.0
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© 2013 Apacer Technology, Inc. Rev. 1.1
Revision History
Revision Description Date
1.0 Official release 03/01/2013
1.1 Revised operating temperature 03/05/2013
Industrial Micro SD 3.0
AP-MSDxxxCX4P-1TM
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© 2013 Apacer Technology, Inc. Rev. 1.1
Global Presence
Taiwan (Headquarters)
Apacer Technology Inc.
4
th
Fl., 75 Hsin Tai Wu Rd., Sec.1
Hsichih, New Taipei City
Taiwan 221
R.O.C.
Tel: +886-2-2698-2888
Fax: +886-2-2698-2889
amtsales@apacer.com
U.S.A.
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
sa@apacerus.com
Japan
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Europe
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267-0000#6199
sales@apacer.nl
China
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
sales@apacer.com.cn
India
Apacer Technologies Pvt Ltd,
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,
Bangalore – 560078, India
Tel: 91-80-4152-9061
sales_india@apacer.com
