W24010A & Winbond 128K x 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W24010A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbonds high performance CMOS technology, which can meet the industrial grade requirement. FEATURES Meet industrial grade: -40 to 85 C Fully static operation High speed access time: 12/15 nS (max.) + Allinputs and outputs directly TTL compatible + Low power consumption: + Three-state outputs Active: 600 mW (typ.) Available packages: 32-pin 300 mil SOJ, 400 + Single +5V power supply mil SOJ, skinny DIP and standard type one TSOP (8 mm x 20 mm) PIN CONFIGURATIONS BLOCK DIAGRAM wi Vop -~ we (1 32 [1] voo Vss > Ate q 2 31 [J ats aa (3 30 [} cse AD tte a2 Ce a we 2 SORE. a (ls 2a L) ass M6 To. : becaad ss Es a7[] ~ Bs AS : 7 26 r Ag csz Le m= - _ Aa 8 28 AY csi eu E L. Ot = Cs uP x oe | ore - -GATANO a Az q 10 23 1 AID WE "| . ~ a Opes 22 a cst (ie 21 [] vos uot q 13 20 r] vo? PIN DESCRIPTION WO? q 14 19 a el vos Clis te D wos SYMBOL DESCRIPTION vss C16 17 [} wos A0-A16 Address Inputs _ 101-1108 Data Inputs/Outputs arcu 10 a FR of ag 2 3) Ea Ata ca Chip Select Inputs ag: 2Be cS1, CS2 P P ce Sl i 3 ee WE Write Enable Input me el eb 2B OE Output Enable Input na = " x ES bet VDD Power Supply 6 Co 14 19 At aie Fae Vss Ground NC No Connection Publication Release Date: May 1997 -l- Revision AlW24010A linbond Electronics Corp. TRUTH TABLE . CSi | cS2| OF | WE MODE 01-08 Vpp CURRENT H x x xX Not Selected High Z iss, IsB1 X L Xx xX Not Selected High Z Isp, 1sB1 L H H H Output Disable High Z lop L H L H Read Data Out IDD L H xX L Write Data In IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT Supply Voltage to Vss_ Potential -0.5 to +7.0 Vv Input/Output to Vss Potential -0.5 to Vob +0.5 Vv Allowable Power Dissipation 1.0 Ww Storage Temperature -65 to +150 C Operating Temperature -40 to +85 C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the evice. Operating Characteristics (Vop = 5V 410%, Vss= OV, Ta= -40 to 85 C) PARAMETER SYM. TEST CONDITIONS MIN. | TYP. MAX. UNIT Input Low Voltage VIL - -0.5 - +0.8 Vv Input High Voltage VIH - +2.2 - Vop +0.5 v Input Leakage Current IL! | VIN = Vss to VoD -10 - +10 pA Output Leakage ILO. | Vivo = Vss to VoD Current CS1 = Vi (min.) or CS2=Vi | 19 | - +10] BA (max.) or OE = Vin (min.) or WE = ViL (max.) Output Low Voltage | VoL | loL=+8.0 mA - - 0.4 V Output High Voltage | VOH | IOH = -4.0 mA 2.4 - - Vv Operating Power lop | GS4 = Vi (max.), Supply Current CS2 = VIH (min.) VO = 0 mA. Cvcle = mim. - - 200 mA Duty = 100% Standby Power ISB | GS4 = Vin (min.), - - 30 mA Supply Current or CS2 = VIL (max.) ISB1 | CS1 > Vpb -0.2V or - - 10 mA CS2 < 0.2V Note: Typical characteristics are at \op = 5V, Ta= 25 C.W24010A \ Winbond Ey Electronics Corp. CAPACITANCE (Voo = 5V, TA= 25 C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT input Capacitance CIN VIN = OV 8 pF Input/Output Capacitance Cvo Vout = 0V 10 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS Input Pulse Levels OV to 3V Input Rise and Fall Times 5nS Input and Output Timing Reference Level 1.5V Output Load Ct = 30 pF, lon/lon = -4 mMA/B mA AC Test Loads and Waveform R1 480 ohm R1 480 ohm 5V Qn ey CN a OUTPUT -~f-~# OUTPUT Toe! Spr RO 30pF R2 Including Wicking 255 ohm digand = | 268.0hm Jigand | 7ecope =Scope = (For Tz. Terzz, Towz, Tenzs, Tenzz. Touz, Twuz, Tow) 3.0V ~~ | 90% k 90% ! \ i} \ id ov ---110% 10% Joy 5nS~ + 5nS Publication Release Date: May 1997 Revision AlW24010A linbond Electronics Corp. AC Characteristics, continued (Vbp = 5V +10%, Vss = OV, Ta = -40 to 85 C) Read Cycle PARAMETER SYM. W24010A-12I W24010A-15i UNIT MIN. | MAX. | MIN. | MAX. Read Cycle Time Tre 12 - 15 - ns Address Access Time TAA - 12 - 15 ns Chip Select Access Time Csi TACS1 - 12 - 15 ns CS2 Tacs2 - 12 - 15 ns Output Enable to Output Valid TAOE - 6 - 7 ns Chip Selection to Output in Low Z CS! TcLz1* 3 - 3 - nS CS2 Tciz2* 3 - 3 - ns Output Enable to Output in Low Z TOLZ* 0 - 0 - ns Chip Deselection to Output in Csi Tenz1* - 6 - 7 ns High Z CS2 TCHz2* - 6 - 7 ns Output Disable to Output in High Z TOHz* - 6 - 7 ns Output Hold from Address Change TOH 3 - 3 - ns * These parameters are sampled but not 100% tested. Write Cycle PARAMETER SYM. W24010A-12! W24010A-151 UNIT MIN. MAX. MIN. MAX. Write Cycle Time Twe 12 - 15 - ns Chip Selection to End of Write csi Tow 10 - 13 - ns cs2 Tow2 10 - 13 - ns Address Valid to End of Write Taw 10 - 13 - ns Address Setup Time TAs 0 - 0 - ns Write Pulse Width Twp 10 - 10 - ns Write Recovery Time CS, WE TwrR1 0 - 0 - ns cs2 TWR2 0 - 0 - ns Data Valid to End of Write Tow 7 - 9 - ns Data Hold from End of Write TDH 0 - 0 - ns Write to Output in High Z TwHz* - 7 - 8 ns Output Disable to Output in High Z Tonz* - 7 - 8 nS Output Active from End of Write Tow 0 - 0 - ns * These parameters are sampled but not 100% tested.W24010A linbond Electronics Corp. TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRe Address Y at | ee TOH a TOH 7 | Read Cycle 2 (Chip Select Controlled) be ToLzt Tez Read Cycle 3 (Output Enable Controlled) Address C$2 DouT Publication Release Date: May 1997 -5- Revision AlW24010A finbond Electronics Corp. Timing Waveforms, continued Write Cycle 1 (OE Clock) Adress S< _ 2 SSS) ~t OS @ XXX YZ777777Z os2 / / / / / V / je Tow Dour ID D2 LL LY Tow _,! Tow - << XXXXX I~ Write Cycle 2 (OE = Vit Fixed) Address csi cs2 TWP TWHZ (1, 4) Tow DouT Tow TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from Dour are the same as the data written to On during the write cycle. 3. Dout provides the read data for the next address. 4. Transition is measured +500 mV from steady state with = 5 pF. This parameter is guaranteed but not 100% tested.W24010A finbond Electronics Corp. ORDERING INFORMATION PART NO. ACCESS | OPERATING STANDBY PACKAGE TIME CURRENT CURRENT (nS) MAX, (mA) MAX. (mA) W24010AK-121 12 200 10 300 mil skinny DIP W24010AK-151 15 200 10 300 mil skinny DIP W24010AJ-121 12 200 10 300 mil SOJ W24010AJ-15! 15 200 40 300 mil SOJ W24010AI-121 12 200 10 400 mil SOJ W24010AI-151 15 200 10 400 mil SOJ W24010AT-121 12 200 10 Standard type one TSOP W24010AT-15! 15 200 10 Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. Publication Release Date: May 1997 Revision Alfinbond Electronics Corp. PACKAGE DIMENSIONS 32-pin P-DIP Skinny (300 mil) W24010A 2. Dimension E+ does not include interlead flash. 3. Dimension D & 3 include mold mismatch and determined at the mold parting line. 4. Dimension B11 does not include dambar 5. Controlling dimension: Inches. Dimension in inches: Timension in ram A | _|o~0 | | [508 A: Ooms | | O38 _ = Ar | 01465 [0150 Josss | 368 [sar | 29s | eB o.o1g joo fom | 041 [om | O56 | Fl, , 0058 [0.080 |ocse 14 | r82 | 10 0.008 [0.010 Joo | o20 | 025 | 038 Db {te 182 | 40.86: 6418 E os. /o215 | oass | 7a | 8.00 | 850 Ei __| 2286 | e200 | ozes | 7.268 | 728 | 748 e, [oo awe [ero | 239 | asa | 179 L 9.120 |0.190 {0.140 | 305 | 3.30 | 356 2 a | 6 f om bm foe ea [0-40 lose [oso frog? fits [11d s | looms | | - 168 Notes: +. Dimension 0 Max. & S inchide mold flash or bar burrs. intrusion. 8, General final vis Spec. shouid be based o+ ual Inspection Spec. 32-pin SOJ (300 mil) KJ 7 PAO ao ey i i | O { Wow ota OO rs oo a 1 16 nee \ \ \ Seating Plane - Dimension in inches. Olreension in ren Symbol Thin. [ Nom.| Max.| Min. | Nom. | Max. A | =~, om] | 3586 As | oot | ome) Az | 0095 | atc | aos | 2413 | 25001 2687 a core coe | aosz | oes | 0711 | o813 b core | aos | age | 640s | oss? | osse 0.008 | core | ogra | 0205 | case | o.356 B osis | oees | 0895 [20701 | 20968 | 21.200 0296 | e300 | oss | 7493 | 7.820 | 7747 e oos4 | oose | cess | rsa | v2re] +42 e+ | aoe | ozs? | owt | ea7a| are2| 7200 He | ows | o33%6 | oes | a25s | ase] 3763 L ooo | | | 2o| ~ | s | | oom | | | 113 Y | [ema}| | ~ | ote 8 G _ 0 of _ 104W24010A inbond Electronica Corp. Package Dimensions, continued 32-pin SOJ (400 mil) Dimessida in inches | Dimension in mm Symbot yin. [Hom,/ Max. | Min. [Nom.|Max. oonn ee ee A 0.134 [0.138 [0.945 | 3.33 | 3.51 | 3.88 | As [0025] | joss! - | . Aa {0.105 |o.sto fo.115 | 2.67 | 279 | 291 \ ts bi | 0.026 [0.028 | 0.032 | 0.66 | 0.71 | 081 \ \ E b {0.016 [0.018 [o.020 [0.41 | a4 | 0.51 oO } } ct 0.006 |o.00 [9.011 | 0.15 | 0.20 | 0.28 D 0.820 [0.825 | 0.820 | 20.83 | 20.96 [21.08 r : RMN a E [0.395 [0.400 | 0.405 | 10.03 | 10.16 | 10 29 fp) [0.044 Jo.080 loose | 1.12 | 127 | +42 @: (0.360 1937 |o3sa [915 | 940 | 965 He [0.495 [0.440 | 0.445 [11.05 [14.18 | 91.34 L o.os2| | [208 | | 2 s a7 | = [oods | | [tt y | = [ooo] - | | ot0 6 6 2 6 | 45 2 6 Notes: 1. Dimension D Max & S include maid flasty or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E inciude mold mismatch misma Bere reid at tee ite 4. Controlling dimension: Inches 5, General appearance spec. should be based on final visual inspection spec. 32-pin Standard Type One TSOP Ho Dimension in inches Dimension in mn Symbot | Min. | Nom. | Max. | Min. | Nom. | Max. D s A | 7 foo; mm | TT 1 420 As {0.002} | 0.008 | 005; | 0.15 Ca = Oo po Az | 0.037 | 0.030; 0.041 | 0.95 | 1.00! 4.05 fas = b {0.007 | 6.008 | 9.009 | 0.17 | 0.20) 0.23 foo OE | i == | 0.005 | 0.008 | 0.007 | 0.12 | 0.15 | 0.17 = = D | 0.720 | 0.724 | 0.720 | 18.30 | 16.40 | 18.50 b fe E {0311 /0315| o319/ 7.90) 800) a0 Ho | 0.780 | 0.787/ 0.795 |19.80 | 20.90! 20.20 e | 0020} | | oso) L | 0.016! 0.020! 0.024] 0.40] 050] 0.60 by [0.0311 | | 080; | {A y | 9000; | 6.004} 0.00! | 0.10 } Th e tt 6 1 3 5 1 3 5 oy Al {oJ Y] (eat Note: Controlling dimension: Millimeter Publication Release Date: May 1997 Revision AlW24010A linbond Electronics Corp. Tire 1 Winbond Electronics Corp. Headquarters Winbond Electronics (H.K.) Ltd. | Winbond Electronics North America Corp. No. 4, Creation Rd. fll, Rm. 803, World Trade Square, Tower Ii, Winbond Memory Lab. Science-Based Industrial Park, we Hoi Bun Rd., Kwun Tong, Winbond Microelectronics Corp. Hsinchu, Taiwan owloon, Hong Kong . TEL: 886-3-8770066 TEL: 852-27513100 Winbond Systems Lab. FAX: 886-3-5792647 FAX: 852-27552064 2730 Orchard Parkway, San Jose, http:/www.winbond.com.tw/ CA 95134, U.S.A. Voice & Fax-on-demand: 886-2-27197006 TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502 Note: Alf data and specifications are subject to change without notice. -10-