ZAXM-201-1
APEX SERIES TRANSCEIVER MODULES
DESCRIPTION
Apex modules provide a cost-effective RF transceiver solution for 2.4GHz
ZigBee and IEEE 802.15.4 data links and wireless networks.
The ZAXM-201-1 Apex module is based on the Ember™ EM250 plat-
form. It combines Ember’s transceiver IC and 16-bit microprocessor with
an onboard 100mW Power Amplier. It’s designed to support point to
point, point to multi-point, and EmberZNet applications.
The APEX module provides over 4000 feet of range and is designed to
deliver constant RF output power across the 2.1 to 3.6V voltage input,
ensuring consistent performance over the entire life of the battery.
Integrated Transceiver Modules for ZigBee/IEEE 802.15.4
Evaluation Kit available: ZAXM-201-KIT-1
The information in this document is subject to change without notice, please conrm data is current.
Document No: 0002-00-07-00-000 (Issue C)
Date Published: April 29, 2010
DATA SHEET
• Ember™EM250platform
• 128kBFlashmemory
• 5kBSRAM
• 16-bitXAP2bmicroprocessor
• 16generalpurposeI/Oports
• DMA–SPI,I2C and UART interfaces
• IntegratedADCwith12-bitresolution
APEX MODULE
ZAXM-201-1
APPLICATIONS
• 1 - 100mW output power, software controlled
• Designed for EmberZNet networks
• Miniature footprint: 1.00” x 1.275”
• Integrated PCB trace antenna
• Optional MMCX connector for external antenna
• 16 RF channels (Channel 16 operates at reduced power levels)
• Over 4000 feet of range
• Integrated hardware support for Ember InSight Development
Environment
• Non-intrusive debug interface (SIF)
• AES 128 bit encryption
• Low power consumption
• Constant RF output power over 2.1– 3.6 V voltage range
• FCC, IC, and CE certied
• RoHS compliant
FEATURES
Home&
BuildingAutomation
•Security
•HVACcontrol
•Lightingcontrol
•Thermostats
Industrial Controls
•Foodprocessingcontrols
•TrafcManagement
•SensorNetworks
•AssetManagement
•Barcodereader
•PatientMonitoring
•Glucosemonitor
AutomatedMeter
Reading
•Inmeterapplications
•Thermostats
•In-homedisplayunits
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
ORDERINGINFORMATION
ZAXM-200 Series
PartNumber OrderNumber Description Mins/Mults Status
APEX
ZAXM-201
ZAXM-201-1 Apex 100mW transceiver module PCB Trace Antenna 5,120 pcs / 160 pcs
Not Recommended
For New Design
ZAXM-201-1C Apex 100mW transceiver MMCX connector installed
ZAXM-201-1-B Apex 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs
ZAXM-201-1C-B Apex 100mW transceiver MMCX connector installed Bulk (1 tray)
ZAXM-201-KIT-1 100mW Apex Module Kit N/A Discontinued
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
APEXMODULEBLOCKDIAGRAM
24 MHz
32.768 kHz XTAL
XTAL
Radio
Micro
processor
Ember EM250
ZigbeeTM SOC
RF Front End
(NEC PA and
NEC Switch)
ANT
Castellation Edge
Connector
PWR
Reg
APEX
EVALUATION KIT
CEL provides Apex Evaluation Kits to assist users in evaluating
Apex and Apex LT modules. The key components of the Apex
Evaluation Kit are the interface board and the CEL’s Apex radio
module.
Apex module combines an Ember EM250 transceiver IC with an
NEC high gain Power Amplier and a high performance
NEC RFIC switch.
The interface board features a serial communication interface, a
power management module, peripherals such as potentiometer
and accelerometer, and GPIO headers. The Evaluation Kit also
contains four AA batteries and two USB cables.
For more detail information regarding Apex Evaluation Kit, refer to
the ApexModuleEvaluationKitUserGuide document. (http://
www.cel.com/pdf/misc/apexseries_ug.pdf)
Kit Contents:
•EvaluationBoards(2)
•ZigBeeModules(2)
•USBCables(2)
•AABatteries(4)
•TechnicalInformationCD(1)
OrderNumber Description
ZAXM-201-KIT-1 Engineering Evaluation Kit
PartNumber OrderNumber Description Mins/Mults Status
APEX
ZAXM-201
ZAXM-201-1 Apex 100mW transceiver module PCB Trace Antenna 5,120 pcs / 160 pcs
Not Recommended
For New Design
ZAXM-201-1C Apex 100mW transceiver MMCX connector installed
ZAXM-201-1-B Apex 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs
ZAXM-201-1C-B Apex 100mW transceiver MMCX connector installed Bulk (1 tray)
ZAXM-201-KIT-1 100mW Apex Module Kit N/A Discontinued
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
IntroductionandOverview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
OrderingInformation............................................................................................................................................................................. 2
ApexModuleBlockDiagram................................................................................................................................................................. 3
Evaluation Kit......................................................................................................................................................................................... 3
SystemLevelFunction
ApexModuleMicroprocessor................................................................................................................................................................ 5
Antenna................................................................................................................................................................................................... 5
ModesofOperation(TX,RX,Sleep)...................................................................................................................................................... 7
Processor ACTIVE.................................................................................................................................................................................. 7
Processor IDLE....................................................................................................................................................................................... 7
PowerAmplierRegulatorControlLine................................................................................................................................................ 8
SIFInterface............................................................................................................................................................................................ 8
HostProtocolInterfaceCommands...................................................................................................................................................... 8
ElectricalSpecication
AbsoluteMaximumRatings................................................................................................................................................................... 9
Recommended(OperatingCondition).................................................................................................................................................. 9
DCCharacteristics.................................................................................................................................................................................. 9
RFCharacteristics.................................................................................................................................................................................. 10
PinSignal&Interfaces
PinSignalsI/OConguration................................................................................................................................................................ 10
ApexI/OPinAssignment....................................................................................................................................................................... 11
ApexModuleDimensions...................................................................................................................................................................... 12
PCBCopperPatternLayout................................................................................................................................................................... 13
PCB Stencil Pattern................................................................................................................................................................................ 13
PCBKeep-OutAreas.............................................................................................................................................................................. 14
Processing 15
AgencyCertications 17
Shipment,Storage&Handling 18
References&RevisionHistory 19
TABLEOFCONTENTS
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
APEX MODULE MICROPROCESSOR
APEX modules provide 16 GPIO ports that are shared with other peripheral or alternate functions. The alternate functions
can be utilized on a variety of different GPIOs as detailed on the following page in the Table of Pin Assignments. All the
GPIO pads are selectable as input, output, or bi-directional and have an internal pull-up or pull-down.
The integrated Serial Controller SC1 can be congured for SPI (master-only), I2C (master-only), or UART functionality. The
Serial Controller SC2 can be congured for SPI (master or slave) or I2C (master-only) operation. The integrated ADC can
sample analog signals from three GPIO pins single-ended or differentially. The integrated voltage reference VREF for the
ADC can be made available to a GPIO port.
Please consult the Ember EM250 datasheet for details on conguring and controlling the information ow of the APEX
module interface ports to setup the following:
• GPIO Data Registers
• Alternate function routing
• External Interrupts
• Serial Controller SC1 module (UART mode, SPI Master mode, I2C Master mode)
• Serial Controller SC2 module (SPI modes, I2C Master mode)
• General Purpose Timers
• ADC Module
• Event Manager
ANTENNA
The APEX module includes an integrated PCB trace antenna. An
optional MMCX connector can be specied, enabling connection to a
50-ohm external antenna of the user’s choice. See Ordering
Information.
The PCB antenna employs an F-Antenna topology that is compact and
supports an omni-directional radiation pattern.To maximize antenna efciency, an adequate ground plane must be provided
on the host PCB. If positioned correctly, the ground plane on the host board under the module can contribute signicantly
to antenna performance.
The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor-
mance. Poor design effects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted
signal. Measured radiation patterns of these modules are available from California Eastern Labs and can be used to
benchmark design performance.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metallized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
TOP VIEW
TOP VIEW TOP VIEW
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
Orientation of EUT Peak Gain was in the Horizontal Position. The receiver antenna was in the Horizontal Position.
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
Horizontal Polarization Gain (dBi)
min: -8.9 max: +1.8 avg: -2.7
Vertical Polarization Gain (dBi)
min: -26.1 max: -7.3 avg: -14.7
Frequency = 2405 MHz
Horizontal Polarization Gain (dBi)
min: -15.2 max: +1.4 avg: -3.1
Vertical Polarization Gain (dBi)
min: -22.1 max: -8.7 avg: -13.9
Frequency = 2480 MHz
Frequency = 2440 MHz
Vertical Polarization Gain (dBi)
min: -24.7 max: -9.6 avg: -14.8
Horizontal Polarization Gain (dBi)
min: -8.1 max: +0.4 avg: -3.4
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
ANTENNA (Continued)
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
MODESOFOPERATION
The Apex supports three power modes: Processor ACTIVE, processor IDLE, and DEEP SLEEP.
Processor ACTIVE
In this mode all operations are running normally.
Processor IDLE
In this mode the processor stops code execution of the XAP2b microprocessor until any interrupt occurs or external SIF
wake up command is seen. The radio is operating normally in this mode.
DeepSleep
To achieve the lowest power consumption, the module can be set in DEEP SLEEP mode. In this mode most of the function-
alities of the modules are turned off with the exception of the critical functions such as GPIO pads and RAM that is powered
by the high voltage supply (DCC_PADS).
The module can be taken out of DEEP SLEEP in 3 ways:
• Conguring the sleep timer to generate an interrupt after some periods of time.
• Issuing external interrupt signal.
• Issuing commands through the SIF interface.
In DEEP SLEEP the current consumption of the module will drop to 5.0μA (5.5μA with optional 32.768kHz oscillator
enabled).
For more detail information on modes of operation refer to Ember EM250 datasheet available at Ember’s
website (www.ember.com)
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
POWERAMPLIFIERREGULATORCONTROLLINE
The APEX modules include a separate 1.8V regulator for a power amplier bias that enables consistent module output per-
formance over the wide 2.1 – 3.6V voltage range. To prevent excessive sleep currents, this regulator should be disabled
when the module is in sleep mode. An external pull up resistor option is provided on each module (R6) that allows the
regulator to be constantly enabled. This option increases the sleep current of the module to a point well above the speci-
ed values.
SPECIFICATIONS—GPIO7(APEX)
Parameter Min Typ Max Unit
Regulator enable voltage 0.95 V
Regulator disable voltage 0.4 V
Enable line current (VEN = 0) 0.1 μA
Enable line current (VEN = VDD) 10 μA
Turn on Time 250 μsec
On the APEX module, the regulator control line is connected to the module via the GPIO7 port. The host can drive this port
as it does on the APEX LT module, but it can also use the default serial digital function of this port as an external voltage
regulator enable. Please consult the EM250 datasheet for details on the operation of this function. Note that both these
approaches preclude the use of the GPIO7 port for any other functions, including use as the ADC3 input.
If the application does not put the module to sleep or if sleep current is not an issue, the power amplier regulator may
be permanently enabled by tying the control line high. In this setup, the sleep current will increase by 80μA over the 5μA
Standby Current gure provided in Electrical Specications.
SIFINTERFACE
The APEX module provide access to the SIF module programming and debug interface.
Consult the EM250 datasheet for further details on the following SIF features:
• Production Testing
• Firmware Download
• Product Control and Characterization
• XAP2b Code Development (APEX only)
HOSTPROTOCOLINTERFACECOMMANDS
For information on Host Protocol Interface Commands and for other software-related documents refer to Ember’s website:
http://www.ember.com/products_documentation.html
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
ABSOLUTEMAXIMUMRATINGS
Rating Value Unit
Power Supply Voltage 3.6 Vdc
Voltage on Any Digital Pin VDD + 0.3,
Max 3.6 Vdc
RF Input Power +10 dBm
Storage Temperature Range -45 to 125 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED(OPERATINGCONDITIONS)
Characteristic Min Typ Max Unit
Power Supply Voltage (VDD) 2.1 3.6 V
Input Frequency 2405 2480 MHz
Ambient Temperature Range -40 25 85 °C
Logic Input Low Voltage 0 20% VDD V
Logic Input High Voltage 80% VDD VDD V
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter Min Typ Max Unit
Logic Input Low 0 0.2 x VDD V
Logic Input High 0.8 x VDD VDD V
Logic Output Low 0 0.18 x VDD V
Logic Output High 0.82 x VDD VDD V
Output source current (standard pad – APEX) 4 mA
Output sink current (standard pad – APEX) 4 mA
Output source current (high current pad – APEX) 8 mA
Output sink current (high current pad – APEX) 8 mA
I/O pin pull-up and pull-down resistor (APEX) 30 kΩ
PowerConsumption
Transmit Mode (100mW output):
APEX 170 mA
Receive Mode:
APEX 37 mA
Standby Mode:
10mW 5 μA
100mW 5 μA
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
RFCHARACTERISTICS(@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter Min Typ Max Unit
GeneralCharcteristics
RF Frequency Range 2400 2483.5 MHz
RF Data Rate 250 kbps
Microcontroller Operating Frequency 12 MHz
Flash Memory 128 kB
RAM 5 kB
Transmitter
Nominal Output Power 20 dBm
Programmable Output Power Range 32 dB
Error Vector Magnitude 15 35 %
Receiver
Receiver Sensitivity (1% PER) – normal mode -92 -96 dBm
Receiver Sensitivity (1% PER) – boost mode* -93 -97 dBm
Saturation (Maximum Input Level) (1% PER) 0 dBm
802.15.4 Adjacent Channel Rejection:
APEX 35 dB
802.15.4 Alternate Channel Rejection 40 dB
802.11 g Rejection (±10 MHz):
APEX 40 dB
*Boost Mode is an optional software-selectable high performance mode designed to increase receiver sensitivity.
Note: Refer to Ember EM250 datasheet for additional details.
PINSIGNALSI/OPORTCONFIGURATION
The APEX module has a 28 edge I/O interface for connection
to the user’s host board. Figure 1 shows the layout of the 28 edge castellations.
PIN 1
PIN 10
PIN 28
PIN 19
Figure 1 (Top View)
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
UnusedI/OpinsshouldbeleftunconnectedandthepinstatesetviatheHostProtocol.
DI = Digital Input PI = Power Input
DO = Digital Output GND = Ground
AI = Analog Input
AO = Analog Output
APEXI/OPINASSIGNMENTS
Pin # Name Type Description
1GROUND GND Ground
2GROUND GND Ground
3GROUND GND Ground
4 VDD PI Power Supply Input
5 RSTB DI Reset, active low
6GPIO11 DI/DO General Purpose Digital I/O, SC1 UART CTS, SC1 SPI master clock,
or Capture Input A of Timer 2
7GPIO12 DI/DO General Purpose Digital I/O, SC1 UART RTS, or Capture Input B of Timer 2
8GPIO0 DI/DO General Purpose Digital I/O, SC2 SPI MOSI, or Capture Input A of Timer 1
9GPIO1 DI/DO General Purpose Digital I/O, SC2 SPI MISO, SC2 I2C SDA,
or Capture Input A of Timer 2
10 GPIO2 DI/DO General Purpose Digital I/O, SC2 SPI master clock, SC2 I2C SCL, or Capture
Input B of Timer 2
11 GPIO3 DI/DO General Purpose Digital I/O, SC2 SPI slave select, or Capture Input B of Timer 1
12 GPIO4 DI/DO/AI General Purpose Digital I/O, ADC Input 0, or PTI frame signal
13 GPIO5 DI/DO/AI General Purpose Digital I/O, ADC Input 1, or PTI data signal
14 GPIO6 DI/DO/AI General Purpose Digital I/O, ADC Input 2, Timer 2 Clock Input, or Timer 1 Enable
15 GPIO7 DO Regulator Enable, active high (see section of “Power Amplier Regulator Control Line”)
16 GPIO8 DI/DO/AO General Purpose Digital I/O, ADC Reference Output, Timer 1 Clock Input,
Timer 2 Enable, or Source A Interrupt
17 GPIO9 DI/DO General Purpose Digital I/O, SC1 TXD, SC1 MO, SC1 I2C Data,
or Capture Input A of Timer 1
18 GPIO10 DI/DO General Purpose Digital I/O, SC1 RXD, SC1 MI, SC1 I2C Clock,
or Capture Input B of Timer 1
19 CLK DI SIF Interface clock
20 MISO DO SIF Interface master in/slave out
21 MOSI DI SIF Interface master out/slave in
22 LOADB DI/DO SIF Interface load strobe
23 GPIO16 DI/DO General Purpose Digital I/O, Output B of Timer 1, Capture Input B of Timer 2,
or Source D Interrupt
24 GPIO15 DI/DO General Purpose Digital I/O, Output A of Timer 1, Capture Input A of Timer 2,
or Source C Interrupt
25 GPIO14 DI/DO General Purpose Digital I/O, Output B of Timer 2, Capture Input B of Timer 1,
or Source B Interrupt
26 GPIO13 DI/DO General Purpose Digital I/O, Output A of Timer 2, or Capture Input A of Timer 1
27 GROUND GND Ground
28 GROUND GND Ground
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
DIMENSIONS:ZAXM-201-1ApexDimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
PIN 19: SIF_CLK
MISO
MOSI
LOADB
GPIO 16
GPIO 15
GPIO 14
GPIO 13
GROUND
PIN 28: GROUND
PIN 10: GPIO 2
GPIO1
GPIO 0
GPIO 12
GPIO 11
RSTB
VDD
GROUND
GROUND
PIN 1: GROUND
PIN 18: GPIO10
GPIO 9
GPIO 8
GPIO 7
GPIO 6
GPIO 5
GPIO 4
PIN 11: GPIO 3
0.062
1.275
1.000
0.895
RF Shield
0.195
PCB Trace Antenna
TOP VIEW
DIMENSIONS:ZAXM-201-1CApexwithOptionalMMCXConnector
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
TOP VIEW
PIN 19: SIF_CLK
MISO
MOSI
LOADB
GPIO 16
GPIO 15
GPIO 14
GPIO 13
GROUND
PIN 28: GROUND
PIN 10: GPIO 2
GPIO1
GPIO 0
GPIO 12
GPIO 11
RSTB
VDD
GROUND
GROUND
PIN 1: GROUND
PIN 18: GPIO10
GPIO 9
GPIO 8
GPIO 7
GPIO 6
GPIO 5
GPIO 4
PIN 11: GPIO 3
0.062
0.205
1.275
1.000
0.895
RF Shield
0.195
Optional MMCX Connector
for external antenna
Overall Height
w/MMCX Connector
J2 J2
0.410
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
PCBCOPPERPATTERNLAYOUT:Apex
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.850
0.090
0.050
0.240
0.025
0.025
0.970
0.100 Pitch Typ0.040 0.125 Typ 28 Pads
0.070 Typ 28 Pads
Recommended Host PCB Board Edge
0.040
PIN 128
PCBPASTESTENCILPATTERN:Apex
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.900
0.100 Pitch Typ0.065 0.100 Typ 28 Pads
0.070 Typ 28 Pads
0.065
PIN 128
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
PCBKeep-outareas:Apex
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
For optimum antenna performance, The APEX module should be mounted with the PCB trace antenna overhanging the
edge of the host board. To further improve performance, a ground plane may be placed on the host board under the
module, up to the PCB edge. The installation of an uninterrupted ground plane on a layer directly beneath the module will
also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
1.275
1.000
1.200
0.190
0.315 0.050
If optional MMCX connector is specified, edge
of host board must be notched as shown
Edge of Host PCB
Recommended overhang
for PCB Antenna = 0.230
If module does not overhang edge
of host PCB, no components, copper
or traces are allowed in this area
Component Keep Out Area:
No components within 0.100 inches of module
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
PROCESSING
RecommendedReowProle
ParametersValues
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 260 + 0ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Achieve the brightest possible solder llets with a good shape and low contact angle.
Pb-FreeSolderingPaste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate
IPC specication. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
OpticalInspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
RepeatingReowSoldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
AdditionalGrounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
PROCESSING (Continued)
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
AGENCYCERTIFICATIONS
FCCPart15.247ModuleCertied(Mobile)
The APEX modules comply with Part 15 of the Federal Communications Commission rules and regulations.
To meet the FCC Certication requirements, the user must meet these regulations:
• The text on the FCC ID label provided with the module must be placed on the outside of the nal product.
• The modules may only use the antennas that have been tested and approved with these modules:
— The on-board PCB trace antenna
— Nearson S131CL-5-RMM-2450S antenna.
To meet the Section 15.209 emission requirements in the restricted frequency bands of Section 15.205, the transceiver
transmitter power for the APEX (EM250) module needs to be reduced from the typical maximum setting on the upper two
channels (2475 MHz and 2480 MHz). Maximum values are TBD.
Per Section 2.109, the APEX module have been certied by the FCC for use with other products without additional
certication. Any modications to this product may violate the rules of the Federal Communications Commission and make
operation of the product unlawful.
Per Sections 15.107 and 15.109, the user’s end product must be tested for unintentional radiators compliance.
Per Section 47 C.F.R. Sec.15.105(b), The APEX module is certied as mobile devices for the FCC radiation exposure limits
set forth for an uncontrolled environment. The antennas used with this module must be installed to provide a separation
distance of at least 8 inches (20cm) from all persons. If the module is to be used in a handheld application, the user
is responsible for passing additional FCC part 2.1091 rules (SAR) and FCC Guidelines for Human Exposure to Radio
Frequency Electromagnetic Fields, OET Bulletin and Supplement C.
ICCertication—Canada
The APEX module is IC certied. The labeling requirements for Industry Canada are similar to those of the FCC. A visible
label on the outside of the nal product must display the IC labeling. The user is responsible for the end product to comply
with IC ICES-003 (Unintentional radiators).
CECertication—Europe
The APEX module is CE certied. The CE marking must be afxed legibly and indelibly to a visible location on the user’s
product.
FCCApprovedAntennas
•IntegratedPCBtraceantenna
•NearsonS131CL-5-RMM-2450S–A 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector.
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
SHIPMENT,HANDLING,ANDSTORAGE
Shipment
The Apex Module is deliveredin trays of 32. Each package consist of 5 trays and therefore the total module quantity
per package is 160.
Handling
The Apex Module is designed and packaged to be processed in an automated assembly line.
!Warning The Apex Module contains a highly sensitive electronic circuitry. Handling without proper ESD protection may
destroy or damage the module permanently.
!Warning According to JEDEC ISP, the Apex Module is moisture sensitive devices. Appropriate handling instructions and
precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
MoistureSensitivityLevel(MSL)
MSL 3, per J-STD-033
NOT RECOMMENDED
FOR NEW DESIGN
ZAXM-200 Series
REFERENCES&REVISIONHISTORY
References
ReferenceDocuments
Apex Module Evaluation Kit User Guide
Ember EM250 Datasheet (June 29, 2007)
RevisionHistory
Previous Versions ChangestoCurrentVersion Page
0002/3-00-07-00-000
(Issue A) May 7, 2008 Initial preliminary datasheet. N/A
0002-00-07-00-000
(Issue B) January 22, 2009 Datasheet Unication for ZigBee product line N/A
0002-00-07-00-000
(Issue C) April 29, 2010 The following corrections/changes were made: On page 11, pin 10 was changed
from GND to GPIO2 and the module height was changed from 0.162” to 0.195”. On
page 6, the deep sleep mode current consumption was changed to 5.0μA.
6, 11
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s •equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.
NOT RECOMMENDED
FOR NEW DESIGN
