VN750-E High-side driver Datasheet - production data Features Type VN750-E VN750PT-E VN750B5-E VN750-12-E RDS(on) IOUT VCC 60 m 6A 36 V 0%.4!7 !44 '!0'2) 0%.4!7!44 IN LINE '!0'2) ECOPACK(R): lead free and RoHS compliant Automotive Grade: compliance with AEC guidelines 0 0! + 33$ . CMOS compatible input On-state open-load detection Off-state open-load detection Shorted load protection Description Undervoltage and overvoltage shutdown Protection against loss of ground Very low standby current Reverse battery protection The VN750-E is a monolithic device designed in STMicroelectronics(R) VIPower(R) M0-3 technology intended for driving any kind of load with one side connected to ground. '!0'2) '!0'2) Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart help protect the device against overload. The device detects open load condition in on-state and off-state. Output shorted to VCC is detected in the off-state. Device automatically turns off in case of ground pin disconnection. Table 1. Device summary Order codes Package Tube Tape and reel PENTAWATT VN750-E - P2PAK VN750B5-E VN750B5TR-E PPAK VN750PT-E VN750PTTR-E PENTAWATT in-line VN750-12-E - May 2012 This is information on a product in full production. Doc ID 10891 Rev 6 1/38 www.st.com 1 Contents VN750-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 2.5.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16 2.5.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17 2.6 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.7 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.8 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.9 PPAK/P2PAK maximum demagnetization energy (VCC=13.5V) . . . . . . . 19 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.1 P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.2 PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.2 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.2.1 5 2/38 PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . 27 2 4.3 P PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.4 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4.5 PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.6 P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 4.7 PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Doc ID 10891 Rev 6 VN750-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical transient requirements on VCC pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical transient requirements on VCC pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electrical transient requirements on VCC pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 P2PAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Doc ID 10891 Rev 6 3/38 List of figures VN750-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. 4/38 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 On-state resistance Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 On-state resistance Vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Ilim Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PPAK /P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . 19 P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 P2PAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . 20 P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 21 P2PAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PPAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . 23 PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23 PPAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PENTAWATT (in-line) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 P2PAK tape and reel (suffix "13TR"). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 PPAK tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Doc ID 10891 Rev 6 VN750-E 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram 6 ## /6%26/,4!'% $%4%#4)/. 6 ## #LAMP 5.$%26/,4!'% $%4%#4)/. '.$ 0OWER #,!-0 $2)6%2 ).054 /54054 ,/')# #522%.4 ,)-)4%2 /. 34!4% /0%. ,/!$ $%4%#4)/. 34!453 /6%24%-0%2!452% $%4%#4)/. /&& 34!4% /0%. ,/!$ !.$ /54054 3(/24%$ 4/ 6 ## $%4%#4) /. '!0'2) Figure 2. Configuration diagram (top view) 287387 67$786 9 && ,1387 *1' 33$.33$. 0%.4!7!44 '!0'2) '!0'2) Table 2. Suggested connections for unused and not connected pins Connection/pin Status N.C. Output Input Floating X X X X To ground X Doc ID 10891 Rev 6 Through 10 K resistor 5/38 Electrical specifications 2 VN750-E Electrical specifications Figure 3. Current and voltage conventions ,6 9) , ,1 ,1387 9 && , 67$7 , 287 67$786 9 && 287387 *1' 9 ,1 9 67$7 9 287 , *1' '!0'2) 2.1 Absolute maximum ratings Stress values that exceed those listed in the "Absolute maximum ratings" table can cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions greater than those, indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality documents. Table 3. Absolute maximum ratings Value Symbol Parameter P2PAK PENTAWATT VCC 41 V - VCC Reverse DC supply voltage - 0.3 V - Ignd DC reverse ground pin current - 200 mA IOUT DC output current Internally limited A -6 A - IOUT 6/38 DC supply voltage Unit PPAK Reverse DC output current IIN DC input current +/- 10 mA ISTAT DC status current +/- 10 mA VESD Electrostatic discharge (human body model: R=1.5 K; C=100pF) - Input - Status - Output - VCC 4000 4000 5000 5000 V V V V Doc ID 10891 Rev 6 VN750-E Electrical specifications Table 3. Absolute maximum ratings (continued) Value Symbol Parameter PENTAWATT EMAX Ptot 138 138 mJ 60 W Internally limited C Tj Junction operating temperature Tc Case operating temperature - 40 to 150 C Storage temperature - 55 to 150 C Tstg 2.2 PPAK Maximum switching energy (L=2.46 mH; RL=0 ; Vbat=13.5 V; Tjstart=150 C; IL=9 A) Power dissipation TC=25C Unit P2PAK Thermal data Table 4. Thermal data Max. value Symbol Parameter Unit PENTAWATT P2PAK PPAK Rthj-case Thermal resistance junction-case 2.1 2.1 2.1 C/W Rthj-lead Thermal resistance junction-lead - - - C/W 62.1 52.1(1) 77.1(1) C/W 62.1 37(2) 44(2) C/W Rthj-amb Thermal resistance junction-ambient 1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35m thick). Horizontal mounting and no artificial air flow. 2.3 Electrical characteristics Values specified in this section are for 8 V<VCC<36 V; -40 C< Tj <150 C, unless otherwise stated. Table 5. Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit Power VCC Operating supply voltage 5.5 13 36 V VUSD Undervoltage shutdown 3 4 5.5 V VUSDhyst Undervoltage shutdown hysteresis VOV Overvoltage shutdown RON On-state resistance 0.5 V 36 IOUT=2 A; Tj=25 C; VCC> 8 V IOUT=2 A; VCC>8 V Doc ID 10891 Rev 6 V 60 120 m m 7/38 Electrical specifications Table 5. Electrical characteristics (continued) Symbol IS VN750-E Parameter Supply current Test conditions Min. Typ. Max. Unit 10 10 25 20 A A 2 3.5 mA 0 50 A -75 0 A Off-state; VCC=13 V; VIN=VOUT=0 V Off-state; VCC=13 V; VIN=VOUT=0 V; Tj=25 C On-state; VCC=13 V; VIN=5 V; IOUT=0 A IL(off1) Off-state output current VIN=VOUT=0 V IL(off2) Off-state output current VIN=0V; VOUT=3.5 V IL(off3) Off-state output current VIN=VOUT=0 V; Vcc=13 V; Tj =125 C 5 A IL(off4) Off-state output current VIN=VOUT=0 V; Vcc=13 V; Tj =25 C 3 A Switching (VCC=13 V) td(on) Turn-on delay time RL=6.5 from VIN rising edge to VOUT=1.3 V 40 s td(off) Turn-off delay time RL=6.5 from VIN falling edge to VOUT=11.7 V 30 s dVOUT/dt(on) Turn-on voltage slope RL=6.5 from VOUT=1.3 V to VOUT=10.4 V See Figure 21. V/s dVOUT/dt(off) Turn-off voltage slope RL=6.5 from VOUT=11.7 V to VOUT=1.3 V See Figure 22. V/s Input pin VIL Input low level IIL Low level input current VIH Input high level IIH High level input current Vhyst Input hysteresis voltage VICL Input clamp voltage 1.25 VIN=1.25 V 1 A 3.25 V VIN=3.25 V 10 0.5 IIN=1 mA IIN=-1 mA V 6 A V 6.8 -0.7 8 V V 0.6 V VCC output diode VF Forward on voltage -IOUT=1.3 A; Tj=150 C Status pin VSTAT Status low output voltage ISTAT=1.6 mA 0.5 V ILSTAT Status leakage current Normal operation; VSTAT=5 V 10 A CSTAT Status pin input capacitance Normal operation; VSTAT=5 V 100 pF VSCL Status clamp voltage ISTAT=1mA ISTAT=-1mA 6 6.8 -0.7 8 V V 150 175 200 C Protections(1) TTSD 8/38 Shutdown temperature Doc ID 10891 Rev 6 VN750-E Table 5. Electrical specifications Electrical characteristics (continued) Symbol Parameter Test conditions Min. TR Reset temperature 135 Thyst Thermal hysteresis 7 tSDL Status delay in overload condition Tj>Tjsh Ilim Current limitation 9 V<VCC<36 V 5 V<VCC<36 V Turn-off output clamp voltage IOUT=2 A; VIN=0 V; L=6 mH Vdemag Typ. Max. Unit C 15 6 C 9 20 ms 15 15 A A VCC-41 VCC-48 VCC-55 V Open-load detection IOL Open-load on state detection threshold VIN= 5 V tDOL(on) Open-load on state detection delay IOUT= 0 A VOL Open-load off state voltage detection threshold VIN= 0 V tDOL(off) Open-load detection delay at turn-off 50 200 mA 200 s 3.5 V 1000 s 1.5 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles. Figure 4. Status timings /0%. ,/!$ 34!453 4)-).' WITH EXTERNAL PULL UP 6 /54 6 /, /6%24%-0 34!453 4)-).' ) /54 ) /, 4 J 4 JSH 6). 9 ,1 634!4 6 34!4 T $/,OFF T $/, ON T 3$, W 6'/ '!0'2) Doc ID 10891 Rev 6 9/38 Electrical specifications Figure 5. VN750-E Switching time waveforms 9 287 G 9 287 GW RII G 9 287 GW R Q W 9 ,1 WG WG RQ RII W '!0'2) Table 6. Truth table Conditions Input Output Status Normal operation L H L H H H Current limitation L H H L X X H (Tj < TTSD) H (Tj > TTSD) L Over temperature L H L L H L Undervoltage L H L L X X Overvoltage L H L L H H Output voltage > VOL L H H H L H Output current < IOL L H L H H L Table 7. Electrical transient requirements on VCC pin (part 1/3) Test levels ISO T/R 7637/1 10/38 test pulse I II III IV Delays and impedance 1 -25 V -50 V -75 V -100 V 2 ms 10 2 +25 V +50 V +75 V +100 V 0.2 ms 10 3a -25 V -50 V -100 V -150 V 0.1 s 50 Doc ID 10891 Rev 6 VN750-E Electrical specifications Table 7. Electrical transient requirements on VCC pin (part 1/3) (continued) Test levels ISO T/R 7637/1 test pulse I II III IV Delays and impedance 3b +25 V +50 V +75 V +100 V 0.1 s 50 4 -4 V -5 V -6 V -7 V 100 ms, 0.01 5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Table 8. Electrical transient requirements on VCC pin (part 2/3) Test levels results ISO T/R 7637/1 test pulse I II III IV 1 C C C C 2 C C C C 3a C C C C 3b C C C C 4 C C C C 5 C E E E Table 9. Class Electrical transient requirements on VCC pin (part 3/3) Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 10891 Rev 6 11/38 Electrical specifications Figure 6. VN750-E Waveforms NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE VUSDhyst VCC VUSD INPUT LOAD VOLTAGE STATUS undefined OVERVOLTAGE VCC<VOV VCC>VOV VCC INPUT LOAD VOLTAGE STATUS OPEN LOAD with external pull-up INPUT VOUT>VOL LOAD VOLTAGE VOL STATUS OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS Tj TTSD TR OVERTEMPERATURE INPUT LOAD CURRENT STATUS 12/38 Doc ID 10891 Rev 6 VN750-E 2.4 Electrical specifications Electrical characteristics curves Figure 7. Off-state output current Figure 8. High level input current Iih (uA) IL(off1) (uA) 7 3 2.5 6 Off state Vcc=36V Vin=Vout=0V 2 Vin=3.25V 5 1.5 4 1 3 0.5 2 0 1 -0.5 -1 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) Figure 9. 50 75 100 125 150 175 Tc (C) Input clamp voltage Figure 10. Status leakage current Ilstat (uA) Vicl (V) 8 0.05 7.8 Iin=1mA 0.04 7.6 Vstat=5V 7.4 0.03 7.2 7 0.02 6.8 6.6 0.01 6.4 6.2 0 6 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 11. 50 75 100 125 150 175 Tc (C) Tc (C) Status low output voltage Figure 12. Status clamp voltage Vstat (V) Vscl (V) 0.6 8 7.8 Istat=1mA 0.5 7.6 Istat=1.6mA 7.4 0.4 7.2 7 0.3 6.8 0.2 6.6 6.4 0.1 6.2 0 6 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Doc ID 10891 Rev 6 13/38 Electrical specifications VN750-E Figure 13. On-state resistance Vs Tcase Figure 14. On-state resistance Vs VCC Ron (mOhm) Ron (mOhm) 140 120 110 120 Iout=2A Iout=2A Vcc=8V; 13V; 36V 100 100 Tc= 150C 90 80 80 Tc= 125C 70 60 60 50 40 Tc= 25C 40 Tc= - 40C 20 30 0 20 -50 -25 0 25 50 75 100 125 150 175 5 10 15 20 Tc (C) 25 30 35 40 Vcc (V) Figure 15. Open-load on-state detection Figure 16. Input high level threshold Iol (mA) Vih (V) 220 3.6 200 3.4 Vcc=13V Vin=5V 180 3.2 160 140 3 120 2.8 100 2.6 80 60 2.4 40 2.2 20 0 2 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 Tc (C) Figure 17. Input low level Figure 18. Input hysteresis voltage Vil (V) Vhyst (V) 2.8 1.5 2.6 1.4 1.3 2.4 1.2 2.2 1.1 2 1 1.8 0.9 1.6 0.8 1.4 0.7 1.2 0.6 1 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) 14/38 -50 -25 0 25 50 75 Tc (C) Doc ID 10891 Rev 6 100 125 150 175 VN750-E Electrical specifications Figure 19. Overvoltage shutdown Figure 20. Open-load off-state voltage detection threshold Vol (V) Vov (V) 5 50 48 4.5 Vin=0V 46 4 44 3.5 42 40 3 38 2.5 36 2 34 1.5 32 30 1 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 Tc (C) Figure 21. Turn-on voltage slope Figure 22. Turn-off voltage slope dVout/dt/(on) (V/ms) dVout/dt(off) (V/ms) 1000 500 900 450 Vcc=13V Rl=6.5Ohm 800 Vcc=13V Rl=6.5Ohm 400 700 350 600 300 500 250 400 200 300 150 200 100 100 50 0 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 100 125 150 175 Tc (C) Figure 23. Ilim Vs Tcase Ilim (A) 20 18 Vcc=13V 16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 10891 Rev 6 15/38 Electrical specifications VN750-E Figure 24. Application schematic 6 6 6 ## 2 PROT 34!453 $ LD # 2 PROT ).054 /54054 '.$ 6 '.$ 2 '.$ $ '.$ '!0'2) 2.5 GND protection network against reverse battery 2.5.1 Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to size the RGND resistor. 1. RGND 600mV / (IS(on)max). 2. RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (2.5.2: Solution 2: diode (DGND) in the ground line). 16/38 Doc ID 10891 Rev 6 VN750-E 2.5.2 Electrical specifications Solution 2: diode (DGND) in the ground line A resistor (RGND=1 k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network. Series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. The safest configuration for unused input and status pin is to leave them unconnected. 2.6 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 2.7 Microcontroller I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with from latching-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100 V and Ilatchup 20 mA; VOHC 4.5 V 5 k Rprot 65 k. Recommended values: Rprot =10 k. 2.8 Open-load detection in off-state Off-state open-load detection requires an external pull-up resistor (RPU) connected between output pin and a positive supply voltage (VPU) like the +5 V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1. no false open-load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT=(VPU/(RL+RPU))RL<VOlmin. 2. no misdetection when load is disconnected: in this case the VOUT has to be higher than VOLmax; this results in the following condition RPU<(VPU-VOLmax)/IL(off2). Doc ID 10891 Rev 6 17/38 Electrical specifications VN750-E Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched off when the module is in standby. The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics section. Figure 25. Open-load detection in off-state V batt. VPU VCC RPU INPUT DRIVER + LOGIC IL(off2) OUT + R STATUS VOL GROUND 18/38 Doc ID 10891 Rev 6 RL VN750-E 2.9 Electrical specifications PPAK/P2PAK maximum demagnetization energy (VCC=13.5V) Figure 26. PPAK /P2PAK maximum turn-off current versus inductance ,/0$; $ $ % & / P+ ! 4JSTART # SINGLE PULSE " 4JSTART # REPETITIVE PULSE # 4JSTART # REPETITIVE PULSE 6). ), $EMAGNETIZATION $EMAGNETIZATION $EMAGNETIZATION T '!0'2) Note: Values are generated with RL =0 .In case of repetitive pulses, Tjstart (at the beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. Doc ID 10891 Rev 6 19/38 Package and PCB thermal data VN750-E 3 Package and PCB thermal data 3.1 P2PAK thermal data Figure 27. P2PAK PC board GAPGRI00194 Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness = 2 mm, Cu thickness=35 m, Copper areas: 0.97 cm2, 8 cm2). Figure 28. P2PAK Rthj-amb Vs. PCB copper area in open box free air condition 24(J?AMB #7 4J 4AMB # 0#" #U HEATSINK AREA CM> '!0'2) 20/38 Doc ID 10891 Rev 6 VN750-E Package and PCB thermal data Figure 29. P2PAK thermal impedance junction ambient single pulse =7+ &: CM CM 4IME S '!0'2) Equation 1: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Figure 30. P2PAK thermal fitting model of a single channel GAPGRI00197 Doc ID 10891 Rev 6 21/38 Package and PCB thermal data Table 10. 3.2 VN750-E P2PAK thermal parameter Area/island (cm2) 0.5 R1 (C/W) 0.15 R2 (C/W) 0.7 R3 (C/W) 0.7 R4 (C/W) 4 R5 (C/W) 9 R6 (C/W) 37 C1 (W*s/C) 0.0006 C2 (W*s/C) 0.0025 C3 (W*s/C) 0.055 C4 (W*s/C) 0.4 C5 (W*s/C) 2 C6 (W*s/C) 3 6 22 5 PPAK thermal data Figure 31. PPAK PC board GAPGRI00172 Note: 22/38 Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness = 2 mm, Cu thickness=35 m, Copper areas: 0.44 cm2, 8 cm2). Doc ID 10891 Rev 6 VN750-E Package and PCB thermal data Figure 32. PPAK Rthj-amb Vs. PCB copper area in open box free air condition 24(J?AMB #7 0#" #U HEATSINK AREA CM> '!0'2) Figure 33. PPAK thermal impedance junction ambient single pulse :4 ( #7 CM CM 4 IME S '!0'2) Doc ID 10891 Rev 6 23/38 Package and PCB thermal data VN750-E Equation 2: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Figure 34. PPAK thermal fitting model of a single channel GAPGRI00200 Table 11. 24/38 PPAK thermal parameter Area/island (cm2) 0.5 R1 (C/W) 0.15 R2 (C/W) 0.7 R3 (C/W) 1.6 R4 (C/W) 2 R5 (C/W) 15 R6 (C/W) 61 C1 (W*s/C) 0.0006 C2 (W*s/C) 0.0025 C3 (W*s/C) 0.08 C4 (W*s/C) 0.3 C5 (W*s/C) 0.45 C6 (W*s/C) 0.8 Doc ID 10891 Rev 6 6 24 5 VN750-E Package and packing information 4 Package and packing information 4.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 4.2 PENTAWATT mechanical data Figure 35. PENTAWATT package dimensions Table 12. PENTAWATT mechanical data mm Dim. Min. Typ. Max. A 4.8 C 1.37 D 2.4 Doc ID 10891 Rev 6 2.8 25/38 Package and packing information Table 12. VN750-E PENTAWATT mechanical data (continued) mm Dim. Min. Typ. D1 1.2 1.35 E 0.35 0.55 F 0.8 1.05 F1 1 1.4 G 3.2 3.4 3.6 G1 6.6 6.8 7 H2 H3 10.4 10.05 10.4 L 17.85 L1 15.75 L2 21.4 L3 22.5 L5 2.6 3 L6 15.1 15.8 L7 6 6.6 M 4.5 M1 4 Diam. 26/38 Max. 3.65 Doc ID 10891 Rev 6 3.85 VN750-E 4.2.1 Package and packing information PENTAWATT (in-line) mechanical data Figure 36. PENTAWATT (in-line) package dimensions Table 13. PENTAWATT (in-line) mechanical data millimeters Symbol Min Typ Max A 4.3 4.8 C 1.17 1.37 D 2.4 2.8 E 0.35 0.55 F 0.8 1.05 F2 1.1 1.4 F3 1.25 1.55 G 3.2 3.6 G1 6.6 7 H1 9.3 9.7 H2 10.4 H3 10.05 10.4 L2 23.05 23.8 L3 25.3 26.1 Doc ID 10891 Rev 6 27/38 Package and packing information Table 13. VN750-E PENTAWATT (in-line) mechanical data (continued) millimeters Symbol Min Max L4 0.9 2.9 L5 2.6 3 L6 15.1 15.8 L7 6 6.6 V4 Diam. 28/38 Typ 90 3.65 Doc ID 10891 Rev 6 3.85 VN750-E 4.3 Package and packing information P2PAK mechanical data Figure 37. P2PAK package dimensions P010R Doc ID 10891 Rev 6 29/38 Package and packing information VN750-E P2PAK mechanical data Table 14. mm Dim. Min. Max. A 4.30 4.80 A1 2.40 2.80 A2 0.03 0.23 b 0.80 1.05 c 0.45 0.60 c2 1.17 1.37 D 8.95 9.35 D2 E 8.00 10.00 E1 10.40 8.50 e 3.20 3.60 e1 6.60 7.00 L 13.70 14.50 L2 1.25 1.40 L3 0.90 1.70 L5 1.55 2.40 0.40 R V2 0 Package weight 30/38 Typ. 8 1.40 Gr. (typ) Doc ID 10891 Rev 6 VN750-E 4.4 Package and packing information PPAK mechanical data Figure 38. PPAK package dimensions '!0'2) Doc ID 10891 Rev 6 31/38 Package and packing information Table 15. VN750-E PPAK mechanical data mm Dim. Min. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 B 0.40 0.60 B2 5.20 5.40 C 0.45 0.60 C2 0.48 0.60 D1 5.1 D 6.00 6.20 E 6.40 6.60 E1 4.7 e 1.27 G 4.90 5.25 G1 2.38 2.70 H 9.35 10.10 L2 0.8 L4 0.60 L5 1 2.80 R 0.2 0 Package weight 8 Gr. 0.3 Doc ID 10891 Rev 6 1.00 1.00 L6 V2 32/38 Typ. VN750-E 4.5 Package and packing information PENTAWATT packing information The devices can be packed in tube or tape and reel shipments (see the Device summary on page 1). Figure 39. PENTAWATT tube shipment (no suffix) "ASE 1TY "ULK 1TY 4UBE LENGTH ! " # % & !LL DIMENSIONS ARE IN MM $ '!0'2) 4.6 P2PAK packing information The devices can be packed in tube or tape and reel shipments (see the Device summary on page 1). Figure 40. P2PAK tube shipment (no suffix) % & "ASE 1TY "ULK 1TY 4UBE LENGTH ! " # !LL DIMENSIONS ARE IN MM $ Doc ID 10891 Rev 6 '!0'2) 33/38 Package and packing information VN750-E Figure 41. P2PAK tape and reel (suffix "13TR") REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing All dimensions are in mm. W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 12 1.5 1.5 11.5 6.5 2 End Start Top cover tape No components Components No components 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed GAPGRI00203 34/38 Doc ID 10891 Rev 6 VN750-E 4.7 Package and packing information PPAK packing information The devices can be packed in tube or tape and reel shipments (see the Device summary on page 1). Figure 42. PPAK suggested pad layout '!0'2) Figure 43. PPAK tube shipment (no suffix) $ & % Base Q.ty 75 Bulk Q.ty 3000 Tube length ( 0.5) 532 A 6 B 21.3 C ( 0.1) 0.6 '!0'2) All dimensions are in mm. Doc ID 10891 Rev 6 35/38 Package and packing information VN750-E Figure 44. PPAK tape and reel REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 16 4 8 1.5 1.5 7.5 2.75 2 End Start Top cover tape No components Components No components 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed GAPGRI00204 36/38 Doc ID 10891 Rev 6 VN750-E 5 Revision history Revision history Table 16. Document revision history Date Revision 07-Oct-2004 1 Initial release. 2 Document reformatted and restructured. Added content, list of figures and tables. Added ECOPACK(R) packages information. Updated Figure 41: P2PAK tape and reel (suffix "13TR"): - changed component spacing (P) in tape dimensions table from 16 mm to 12 mm. 3 Removed SO-8 package into the following tables: Table 1, Table 3 and Table 4. Figure 2: Removed SO-8 package top view. Removed SO-8 package information in the following sections: Section Note:: Values are generated with RL =0 W.In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. andSection 4: Package and packing information Modified Section 2.1: Absolute maximum ratings and Section 4.1: ECOPACK(R) packages. 23-Nov-2009 4 Updated features list. Added PENTAWATT in-line package into the document: - Updated Table 1: Device summary - Added Section 4.2.1: PENTAWATT (in-line) mechanical data. 17-Nov-2010 5 Updated following tables: - Table 3: Absolute maximum ratings - Table 4: Thermal data 11-May-2012 6 - Update entire document following ST template. - Update Table 15 and Figure 38. 24-Nov-2008 12-May-2009 Changes Doc ID 10891 Rev 6 37/38 VN750-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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