This is information on a product in full production.
May 2012 Doc ID 10891 Rev 6 1/38
1
VN750-E
High-side driver
Datasheet − production data
Features
■ECOPACK®: lead free and RoHS compliant
■Automotive Grade: compliance with AEC
guidelines
■CMOS compatible input
■On-state open-load detection
■Off-state open-load detection
■Shorted load protection
■Undervoltage and overvoltage shutdown
■Protection against loss of ground
■Very low standby current
■Reverse battery protection
Description
The VN750-E is a monolithic device designed in
STMicroelectronics® VIPower® M0-3 technology
intended for driving any kind of load with one side
connected to ground.
Active VCC pin voltage clamp protects the device
against low energy spikes (see ISO7637 transient
compatibility table). Active current limitation
combined with thermal shutdown and automatic
restart help protect the device against overload.
The device detects open load condition in
on-state and off-state. Output shorted to VCC is
detected in the off-state. Device automatically
turns off in case of ground pin disconnection.
Type RDS(on) IOUT VCC
VN750-E
VN750PT-E
VN750B5-E
VN750-12-E
60 mΩ6 A 36 V 0%.4!7!44
INLINE
'!0'2)
33$ .
'!0'2)
0%.4!7 !44
'!0'2)
00! +
'!0'2)
Table 1. Device summary
Package Order codes
Tube Tape and reel
PENTAWATT VN750-E -
P2PAK VN750B5-E VN750B5TR-E
PPAK VN750PT-E VN750PTTR-E
PENTAWATT in-line VN750-12-E -
www.st.com
Contents VN750-E
2/38 Doc ID 10891 Rev 6
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
2.5.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16
2.5.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17
2.6 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.7 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.8 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.9 PPAK/P2PAK maximum demagnetization energy (VCC=13.5V) . . . . . . . 19
3 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1 P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2.1 PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.3 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.5 PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.6 P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.7 PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
VN750-E List of tables
Doc ID 10891 Rev 6 3/38
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7. Electrical transient requirements on VCC pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. Electrical transient requirements on VCC pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Electrical transient requirements on VCC pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. P2PAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 11. PPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 12. PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 13. PENTAWATT (in-line) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 14. P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 15. PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
List of figures VN750-E
4/38 Doc ID 10891 Rev 6
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 12. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 13. On-state resistance Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 14. On-state resistance Vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 15. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 16. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 17. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 18. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 19. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 20. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 21. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 22. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 23. Ilim Vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 26. PPAK /P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 27. P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 28. P2PAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . 20
Figure 29. P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 30. P2PAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 31. PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 32. PPAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . 23
Figure 33. PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 34. PPAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 35. PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 36. PENTAWATT (in-line) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 37. P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 38. PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 39. PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 40. P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 41. P2PAK tape and reel (suffix “13TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 42. PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 43. PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 44. PPAK tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
VN750-E Block diagram and pin description
Doc ID 10891 Rev 6 5/38
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
Table 2. Suggested connections for unused and not connected pins
Connection/pin Status N.C. Output Input
Floating X X X X
To ground X Through 10 KΩ resistor
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Electrical specifications VN750-E
6/38 Doc ID 10891 Rev 6
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
Stress values that exceed those listed in the “Absolute maximum ratings” table can cause
permanent damage to the device. These are stress ratings only, and operation of the device
at these, or any other conditions greater than those, indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality documents.
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,
6
,
,1
9
,1
9
&&
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67$7
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Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
PENTAWATT P2PAK PPAK
VCC DC supply voltage 41 V
- VCC Reverse DC supply voltage - 0.3 V
- Ignd DC reverse ground pin current - 200 mA
IOUT DC output current Internally limited A
- IOUT Reverse DC output current - 6 A
IIN DC input current +/- 10 mA
ISTAT DC status current +/- 10 mA
VESD
Electrostatic discharge
(human body model: R=1.5 KΩ;
C=100pF)
- Input
- Status
- Output
- VCC
4000
4000
5000
5000
V
V
V
V
VN750-E Electrical specifications
Doc ID 10891 Rev 6 7/38
2.2 Thermal data
2.3 Electrical characteristics
Values specified in this section are for 8 V<VCC<36 V; -40 °C< Tj <150 °C, unless otherwise
stated.
EMAX
Maximum switching energy
(L=2.46 mH; RL=0 Ω; Vbat=13.5 V;
Tjstart=150 °C; IL=9 A)
138 138 mJ
Ptot Power dissipation TC=25°C 60 W
TjJunction operating temperature Internally limited °C
TcCase operating temperature - 40 to 150 °C
Tstg Storage temperature - 55 to 150 °C
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
PENTAWATT P2PAK PPAK
Table 4. Thermal data
Symbol Parameter Max. value Unit
PENTAWATT P2PAK PPAK
Rthj-case Thermal resistance junction-case 2.1 2.1 2.1 °C/W
Rthj-lead Thermal resistance junction-lead - - - °C/W
Rthj-amb Thermal resistance junction-ambient 62.1 52.1(1)
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick). Horizontal
mounting and no artificial air flow.
77.1(1) °C/W
62.1 37(2)
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick). Horizontal
mounting and no artificial air flow.
44(2) °C/W
Table 5. Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
Power
VCC Operating supply voltage 5.5 13 36 V
VUSD Undervoltage shutdown 3 4 5.5 V
VUSDhyst
Undervoltage shutdown
hysteresis 0.5 V
VOV Overvoltage shutdown 36 V
RON On-state resistance IOUT=2 A; Tj=25 °C; VCC> 8 V
IOUT=2 A; VCC>8 V
60
120
mΩ
mΩ
Electrical specifications VN750-E
8/38 Doc ID 10891 Rev 6
ISSupply current
Off-state; VCC=13 V; VIN=VOUT=0 V
Off-state; VCC=13 V; VIN=VOUT=0 V;
Tj=25 °C
On-state; VCC=13 V; VIN=5 V;
IOUT=0 A
10
10
2
25
20
3.5
µA
µA
mA
IL(off1) Off-state output current VIN=VOUT=0 V 0 50 µA
IL(off2) Off-state output current VIN=0V; VOUT=3.5 V -75 0 µA
IL(off3) Off-state output current VIN=VOUT=0 V; Vcc=13 V; Tj =125 °C 5 µA
IL(off4) Off-state output current VIN=VOUT=0 V; Vcc=13 V; Tj =25 °C 3 µA
Switching (VCC=13 V)
td(on) Turn-on delay time RL=6.5 Ω from VIN rising edge to
VOUT=1.3 V 40 µs
td(off) Turn-off delay time RL=6.5 Ω from VIN falling edge to
VOUT=11.7 V 30 µs
dVOUT/dt(on) Turn-on voltage slope RL=6.5 Ω from VOUT=1.3 V to
VOUT=10.4 V See Figure 21. V/µs
dVOUT/dt(off) Turn-off voltage slope RL=6.5 Ω from VOUT=11.7 V to
VOUT=1.3 V See Figure 22. V/µs
Input pin
VIL Input low level 1.25 V
IIL Low level input current VIN=1.25 V 1 µA
VIH Input high level 3.25 V
IIH High level input current VIN=3.25 V 10 µA
Vhyst Input hysteresis voltage 0.5 V
VICL Input clamp voltage IIN=1 mA
IIN=-1 mA 66.8
-0.7
8V
V
VCC output diode
VFForward on voltage -IOUT=1.3 A; Tj=150 °C 0.6 V
Status pin
VSTAT Status low output voltage ISTAT=1.6 mA 0.5 V
ILSTAT Status leakage current Normal operation; VSTAT=5 V 10 µA
CSTAT
Status pin input
capacitance Normal operation; VSTAT=5 V 100 pF
VSCL Status clamp voltage ISTAT=1mA
ISTAT=-1mA
66.8
-0.7
8V
V
Protections(1)
TTSD Shutdown temperature 150 175 200 °C
Table 5. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
VN750-E Electrical specifications
Doc ID 10891 Rev 6 9/38
Figure 4. Status timings
TRReset temperature 135 °C
Thyst Thermal hysteresis 7 15 °C
tSDL
Status delay in overload
condition Tj>Tjsh 20 ms
Ilim Current limitation 9V<V
CC<36 V
5V<V
CC<36 V
6915
15
A
A
Vdemag
Turn-off output clamp
voltage IOUT=2 A; VIN=0 V; L=6 mH VCC-41 VCC-48 VCC-55 V
Open-load detection
IOL
Open-load on state
detection threshold VIN= 5 V 50 200 mA
tDOL(on)
Open-load on state
detection delay IOUT= 0 A 200 µs
VOL
Open-load off state
voltage detection
threshold
VIN= 0 V 1.5 3.5 V
tDOL(off)
Open-load detection
delay at turn-off 1000 µs
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device operates under abnormal conditions this software must
limit the duration and number of activation cycles.
Table 5. Electrical characteristics (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
6
).
6
34!4
T
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6
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6
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T
$/,ON
4
J
4
JSH
9
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6
34!4
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Electrical specifications VN750-E
10/38 Doc ID 10891 Rev 6
Figure 5. Switching time waveforms
Table 6. Truth table
Conditions Input Output Status
Normal operation L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Over temperature L
H
L
L
H
L
Undervoltage L
H
L
L
X
X
Overvoltage L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Table 7. Electrical transient requirements on VCC pin (part 1/3)
ISO T/R 7637/1
test pulse
Test levels
I II III IV Delays and
impedance
1 -25 V -50 V -75 V -100 V 2 ms 10 Ω
2 +25 V +50 V +75 V +100 V 0.2 ms 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs 50 Ω
W
W
9287
9,1
G9287 GW
RQ
WGRII
G9287 GW
RII
WGRQ
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VN750-E Electrical specifications
Doc ID 10891 Rev 6 11/38
3b +25 V +50 V +75 V +100 V 0.1 µs 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Ω
Table 8. Electrical transient requirements on VCC pin (part 2/3)
ISO T/R 7637/1
test pulse
Test levels results
I II III IV
1CCCC
2CCCC
3aCCCC
3bCCCC
4CCCC
5CEEE
Table 9. Electrical transient requirements on VCC pin (part 3/3)
Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
EOne or more functions of the device is not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Table 7. Electrical transient requirements on VCC pin (p art 1/3) (continued)
ISO T/R 7637/1
test pulse
Test levels
I II III IV Delays and
impedance
Electrical specifications VN750-E
12/38 Doc ID 10891 Rev 6
Figure 6. Waveforms
OPEN LOAD without external pull-up
STATUS
INPUT
NORMAL OPERATION
UNDERVOLTAGE
V
CC
V
USD
V
USDhyst
INPUT
OVERVOLTAGE
V
CC
V
CC
>V
OV
STATUS
INPUT
STATUS
STATUS
INPUT
STATUS
INPUT
OPEN LOAD with external pull-up
undefined
LOAD VOLTAGE
V
CC
<V
OV
LOAD VOLTAGE
LOAD VOLTAGE
LOAD VOLTAGE
LOAD VOLTAGE
OVERTEMPERATURE
INPUT
STATUS
T
TSD
T
R
T
j
LOAD CURRENT
V
OUT
>V
OL
V
OL
VN750-E Electrical specifications
Doc ID 10891 Rev 6 13/38
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
Figure 9. Input clamp voltage Figure 10. Status leakage current
Figure 11. Status low output voltage Figure 12. Status clamp voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
-1
-0.5
0
0.5
1
1.5
2
2.5
3
IL(off1) (uA)
Off state
Vcc=36V
Vin=Vout=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
1
2
3
4
5
6
7
Iih (uA)
Vin=3.25V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vicl (V)
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.01
0.02
0.03
0.04
0.05
Ilstat (uA)
Vstat=5V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
0.1
0.2
0.3
0.4
0.5
0.6
Vstat (V)
Istat=1.6mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vscl (V)
Istat=1mA
Electrical specifications VN750-E
14/38 Doc ID 10891 Rev 6
Figure 13. On-state resistance Vs Tcase Figure 14. On-state resistance Vs VCC
Figure 15. Open-load on-state detection
threshold Figure 16. Input high level
Figure 17. Input low level Figure 18. Input hysteresis voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
20
40
60
80
100
120
140
Ron (mOhm)
Iout=2A
Vcc=8V; 13V; 36V
5 10152025303540
Vcc (V)
20
30
40
50
60
70
80
90
100
110
120
Ron (mOhm)
Iout=2A
Tc= - 40°C
Tc= 25°C
Tc= 125°C
Tc= 150°C
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
20
40
60
80
100
120
140
160
180
200
220
Iol (mA)
Vcc=13V
Vin=5 V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Vih (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
Vil (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Vhyst (V)
VN750-E Electrical specifications
Doc ID 10891 Rev 6 15/38
Figure 19. Overvoltage shutdown Figure 20. Open-load off-state vo ltage
detection threshold
Figure 21. Turn-on voltage slope Figure 22. Turn-off voltage slope
Figure 23. Ilim Vs Tcase
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
30
32
34
36
38
40
42
44
46
48
50
Vov (V)
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
1
1.5
2
2.5
3
3.5
4
4.5
5
Vol (V)
Vin=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
100
200
300
400
500
600
700
800
900
1000
dVout/dt/(on) (V/ms)
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
50
100
150
200
250
300
350
400
450
500
dVout/dt(off) (V/ms)
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
2
4
6
8
10
12
14
16
18
20
Ilim (A)
Vcc=13V
Electrical specifications VN750-E
16/38 Doc ID 10891 Rev 6
Figure 24. Application schematic
2.5 GND protection network against reverse battery
2.5.1 Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to size the RGND resistor.
1. RGND ≤ 600mV / (IS(on)max).
2. RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC<0: during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in case of several high
side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (2.5.2: Solution 2: diode (DGND) in
the ground line).
6
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VN750-E Electrical specifications
Doc ID 10891 Rev 6 17/38
2.5.2 Solution 2: diode (DGND) in the ground line
A resistor (RGND=1 kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (≈600mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift does not vary if more than one HSD shares the same diode/resistor
network.
Series resistor in input and status lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
The safest configuration for unused input and status pin is to leave them unconnected.
2.6 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
2.7 Microcontroller I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with from latching-up limit of µC
I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
5kΩ ≤ Rprot ≤ 65 kΩ.
Recommended values: Rprot =10 kΩ.
2.8 Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
output pin and a positive supply voltage (VPU) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1. no false open-load indication when load is connected: in this case we have to avoid
VOUT to be higher than VOlmin; this results in the following condition
VOUT=(VPU/(RL+RPU))RL<VOlmin.
2. no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU<(VPU–VOLmax)/IL(off2).
Electrical specifications VN750-E
18/38 Doc ID 10891 Rev 6
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pull-
up resistor RPU should be connected to a supply that is switched off when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics
section.
Figure 25. Open-load detection in off-state
VOL
V batt. VPU
RPU
RL
R
DRIVER
+
LOGIC
+
-
INPUT
STATUS
VCC
OUT
GROUND
IL(off2)
VN750-E Electrical specifications
Doc ID 10891 Rev 6 19/38
2.9 PPAK/P2PAK maximum demagnetization energy (VCC=13.5V)
Figure 26. PPAK /P2PAK maximum turn-off current versus inductance
Note: Values are generated with RL =0
Ω.
In case of repetitive pulses, Tjstart (at the beginning of
each demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
#4JSTART #REPETITIVEPULSE
!4JSTART #SINGLEPULSE
"4JSTART #REPETITIVEPULSE
$EMAGNETIZATION $EMAGNETIZATION $EMAGNETIZATION
T
6).),
/P+
,/0$;$
$
%
&
'!0'2)
Package and PCB thermal data VN750-E
20/38 Doc ID 10891 Rev 6
3 Package and PCB thermal data
3.1 P2PAK thermal data
Figure 27. P2PAK PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.97 cm2, 8 cm2).
Figure 28. P2PAK Rthj-amb Vs. PCB copper area in open box free air condition
GAPGRI00194
0#"#UHEATSINKAREACM>
24(J?AMB#7
4J4AMB#
'!0'2)
VN750-E Package and PCB thermal data
Doc ID 10891 Rev 6 21/38
Figure 29. P2PAK thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
where δ = tP/T
Figure 30. P2PAK thermal fitting model of a single channel
4IMES
=7+&:
CM
CM
'!0'2)
ZTHδRTH δZTHtp 1δ–()+⋅=
GAPGRI00197
Package and PCB thermal data VN750-E
22/38 Doc ID 10891 Rev 6
3.2 PPAK thermal data
Figure 31. PPAK PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.44 cm2, 8 cm2).
Table 10. P2PAK thermal parameter
Area/island (cm2)0.56
R1 (°C/W) 0.15
R2 (°C/W) 0.7
R3 (°C/W) 0.7
R4 (°C/W) 4
R5 (°C/W) 9
R6 (°C/W) 37 22
C1 (W·s/°C) 0.0006
C2 (W·s/°C) 0.0025
C3 (W·s/°C) 0.055
C4 (W·s/°C) 0.4
C5 (W·s/°C) 2
C6 (W·s/°C) 3 5
GAPGRI00172
VN750-E Package and PCB thermal data
Doc ID 10891 Rev 6 23/38
Figure 32. PPAK Rthj-amb Vs. PCB copper area in open box free air condition
Figure 33. PPAK thermal impedance junction ambient single pulse
0#"#UHEATSINKAREACM>
24(J?AMB #7
'!0'2)
4 IME S
:4 (#7
CM
CM
'!0'2)
Package and PCB thermal data VN750-E
24/38 Doc ID 10891 Rev 6
Equation 2: pulse calculation formula
where δ = tP/T
Figure 34. PPAK thermal fitting model of a single channel
Table 11. PPAK thermal parameter
Area/island (cm2)0.56
R1 (°C/W) 0.15
R2 (°C/W) 0.7
R3 (°C/W) 1.6
R4 (°C/W) 2
R5 (°C/W) 15
R6 (°C/W) 61 24
C1 (W·s/°C) 0.0006
C2 (W·s/°C) 0.0025
C3 (W·s/°C) 0.08
C4 (W·s/°C) 0.3
C5 (W·s/°C) 0.45
C6 (W·s/°C) 0.8 5
ZTHδRTH δZTHtp 1δ–()+⋅=
GAPGRI00200
VN750-E Package and packing information
Doc ID 10891 Rev 6 25/38
4 Package and packing information
4.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.2 PENTAWATT mechanical data
Figure 35. PENTAWATT package dimensions
Table 12. PENTAWATT mechanical data
Dim. mm
Min. Typ. Max.
A4.8
C1.37
D2.4 2.8
Package and packing information VN750-E
26/38 Doc ID 10891 Rev 6
D1 1.2 1.35
E0.35 0.55
F 0.8 1.05
F1 1 1.4
G 3.2 3.4 3.6
G1 6.6 6.8 7
H2 10.4
H3 10.05 10.4
L 17.85
L1 15.75
L2 21.4
L3 22.5
L5 2.6 3
L6 15.1 15.8
L7 6 6.6
M4.5
M1 4
Diam. 3.65 3.85
Table 12. P ENTAWATT mechanical data (continued)
Dim. mm
Min. Typ. Max.
VN750-E Package and packing information
Doc ID 10891 Rev 6 27/38
4.2.1 PENTAWATT (in-lin e) mechan ical data
Figure 36. PENTAWATT (in-line) package dimensions
Table 13. PENTAWATT (in-line) mechanical data
Symbol millimeters
Min Typ Max
A 4.3 4.8
C1.17 1.37
D2.4 2.8
E0.35 0.55
F 0.8 1.05
F2 1.1 1.4
F3 1.25 1.55
G 3.2 3.6
G1 6.6 7
H1 9.3 9.7
H2 10.4
H3 10.05 10.4
L2 23.05 23.8
L3 25.3 26.1
Package and packing information VN750-E
28/38 Doc ID 10891 Rev 6
L4 0.9 2.9
L5 2.6 3
L6 15.1 15.8
L7 6 6.6
V4 90°
Diam. 3.65 3.85
Table 13. PENTAWATT (in-line) mechanical data (continued)
Symbol millimeters
Min Typ Max
VN750-E Package and packing information
Doc ID 10891 Rev 6 29/38
4.3 P2PAK mechanical data
Figure 37. P2PAK package dimensions
P010R
Package and packing information VN750-E
30/38 Doc ID 10891 Rev 6
Table 14. P2PAK mechanical data
Dim. mm
Min. Typ. Max.
A4.30 4.80
A1 2.40 2.80
A2 0.03 0.23
b0.80 1.05
c0.45 0.60
c2 1.17 1.37
D8.95 9.35
D2 8.00
E 10.00 10.40
E1 8.50
e3.20 3.60
e1 6.60 7.00
L 13.70 14.50
L2 1.25 1.40
L3 0.90 1.70
L5 1.55 2.40
R0.40
V2 0º 8º
Package weight 1.40 Gr. (typ)
VN750-E Package and packing information
Doc ID 10891 Rev 6 31/38
4.4 PPAK mechanical data
Figure 38. PPAK package dimensions
'!0'2)
Package and packing information VN750-E
32/38 Doc ID 10891 Rev 6
Table 15. PPAK mechanical data
Dim. mm
Min. Typ. Max.
A2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B0.40 0.60
B2 5.20 5.40
C0.45 0.60
C2 0.48 0.60
D1 5.1
D6.00 6.20
E6.40 6.60
E1 4.7
e1.27
G4.90 5.25
G1 2.38 2.70
H9.35 10.10
L2 0.8 1.00
L4 0.60 1.00
L5 1
L6 2.80
R0.2
V2 0º 8º
Package weight Gr. 0.3
VN750-E Package and packing information
Doc ID 10891 Rev 6 33/38
4.5 PENTAWATT packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 39. PENTAWATT tube shipment (no suffix)
4.6 P2PAK packi ng inf or ma tion
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 40. P2PAK tube shipment (no suffix)
!LLDIMENSIONSAREINMM
"ASE1TY
"ULK1TY
4UBELENGTH
!
"
#
&
%
$
'!0'2)
!LLDIMENSIONSAREINMM
"ASE1TY
"ULK1TY
4UBELENGTH
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Package and packing information VN750-E
34/38 Doc ID 10891 Rev 6
Figure 41. P2PAK tape and reel (suffix “13TR”)
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
GAPGRI00203
VN750-E Package and packing information
Doc ID 10891 Rev 6 35/38
4.7 PPAK packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).
Figure 42. PPAK suggested pad layout
Figure 43. PPAK tube shipment (no suffix)
'!0'2)
$
&
%
'!0'2)
All dimensions are in mm.
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A6
B21.3
C (± 0.1) 0.6
Package and packing information VN750-E
36/38 Doc ID 10891 Rev 6
Figure 44. PPAK tape a nd reel
All dimensions are in mm.
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 2.75
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
REEL DIMENSIONS
GAPGRI00204
VN750-E Revision history
Doc ID 10891 Rev 6 37/38
5 Revision history
Table 16. Document revision history
Date Revision Changes
07-Oct-2004 1 Initial release.
24-Nov-2008 2
Document reformatted and restructured.
Added content, list of figures and tables.
Added ECOPACK® packages information.
Updated Figure 41: P2PAK tape and reel (suffix “13TR”):
– changed component spacing (P) in tape dimensions table from 16
mm to 12 mm.
12-May-2009 3
Removed SO-8 package into the following tables:
Ta b l e 1 , Ta bl e 3 and Ta b le 4 .
Figure 2: Removed SO-8 package top view.
Removed SO-8 package information in the following sections:
Section Note:: Values are generated with RL =0 W.In case of
repetitive pulses, Tjstart (at beginning of each demagnetization) of
every pulse must not exceed the temperature specified above for
curves A and B. andSection 4: Package and packing information
Modified Section 2.1: Absolute maximum ratings and Section 4.1:
ECOPACK® packages.
23-Nov-2009 4
Updated features list.
Added PENTAWATT in-line package into the document:
– Updated Table 1: Device summary
– Added Section 4.2.1: PENTAWATT (in-line) mechanical data.
17-Nov-2010 5
Updated following tables:
–Table 3: Absolute maximum ratings
–Table 4: Thermal data
11-May-2012 6 – Update entire document following ST template.
– Update Ta bl e 1 5 and Figure 38.
VN750-E
38/38 Doc ID 10891 Rev 6
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