CREAT BY ART
- Low profile package
- Ideal for automated placement
- Glass passivated junction
- Built-in strain relief
- Excellent clamping capability
- Typical IR less than 1μA above 10V
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
SYMBOL UNIT
P
PK
Watts
T
JO
C
T
STG O
C
PART NO.
Note 1: "xxxx" defines voltage from 220V (P4SMA220) to 400V (P4SMA400A)
PART NO.
P4SMA400A
P4SMA400A
Document Number: DS_D1401014 Version: D14
P4SMA HV SERIES
Taiwan Semiconductor
Suface Mount Transient Volta
g
e Su
pp
ressor
FEATURES
- Fast response time: Typically less than
1.0ps from 0 volt to BV min
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
DO-214AC (SMA)
MECHANICAL DATA
Case: DO-214AC (SMA)
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER VALUE
Peak Power Dissipation at T
A
=25℃, Tp=1ms (Note 1) 400
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
40 A
Maximum Instantaneous Forward Voltage at 25 A for
Unidirectional Only V
F
5Volts
ORDERING INFORMATION
PACKING COD E GREEN COMPOUND C OD E PACKAGE PACKING
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Non-repetitive Current Pulse Per Fig. 3 and Derated above T
A
=25℃ Per Fig. 2
1,800 / 7" Plastic reel
R2 SMA 7,500 / 13" Paper reel
M2 SMA
EXAMPLE
PREFERRED P/N PACKING CODE GREEN COMPOUND C OD E DESCRIPTION
7,500 / 13" Plastic reel
P4SMAxxxx
(Note 1)
R3
Suffix "G"
SMA
P4SMA400A R3 R3
P4SMA400A R3G R3 G Green compound
Document Number: DS_D1401014 Version: D14
P4SMA HV SERIES
Taiwan Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted)
0
25
50
75
100
125
0 25 50 75 100 125 150 175 200
PEAK PULSE POWER(PPP) OR CURRENT (IPP) A
DERATING IN PERCENTAGE (%)
TA, AMBIENT TEMPERATURE (oC)
FIG.2 PULSE DERATING CURVE
0
10
20
30
40
50
1 10 100
IFSM, PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 4 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT UNIDIRECTIONAL ONLY
8.3ms Single Half Sine Wave
JEDEC Method
0
20
40
60
80
100
120
140
00.511.522.533.54
PEAK PULSE CURRENT (%)
t, TIME ms
FIG. 3 CLAMPING POWER PULSE WAVEFORM
td
Peak Value
IPPM
tr=10 μsec
Half Value-IPPM/2
10/1000 μsec, WAVEFORM
as DEFINED by R.E.A.
PULSE WIDTH(td) is DEFINED
as the POINT WHERE the PEAK
CURRENT DECAYS to 50% OF IPPM
10
100
1000
10000
100000
1 10 100
CJ, JUNCTION CAPACITANCE (pF) A
V(BR), BREAKDOWN VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
VR=0
MEASURED at
STAND-OFF
VOLTAGE,Vwm
0.1
1
10
100
0.1 1 10 100 1000 10000
PPPM, PEAK PULSE POWER, KW
tp, PULSE WIDTH, (μS)
FIG. 1 PEAK PULSE POWER RATING CURVE
NON-REPETITIVE
PULSE WAVEFORM
SHOWN in FIG.3
Test Stand-Off Maximum Maximum Maximum Maximum
Current Voltage Reverse Leakage Peak Pulse Clamping Voltag
e
Temperature
IT V
WM
@ V
WM
Current IPPM @ IPPM Coefficient
Min Max (mA) (V) ID (μA) (A) (Note 2) Vc (V) of VBR (%/℃)
P4SMA220A SEJ 209 231 1 185 1 1.3 328 0.108
P4SMA250A SGJ 237 263 1 214 1 1.2 344 0.108
P4SMA300A SKJ 285 315 1 256 1 1.0 414 0.108
P4SMA350A SMJ 332 368 1 300 1 0.9 482 0.108
P4SMA400A SPJ 380 420 1 342 1 0.8 548 0.108
Notes:
1. V
BR
measure after I
T
applied for 300 μs, I
T
=square wave pulse or equivalent.
2. Surge current waveform per Figure. 3 and derate per Figure. 2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
Document Number: DS_D1401014 Version: D14
P4SMA HV SERIES
Taiwan Semiconductor
Device
Device
Marking
Code
Breakdown Voltage
VBR (V)
(Note 1)
Min Max Min Max
A 1.27 1.58 0.050 0.062
B 4.06 4.60 0.160 0.181
C 2.29 2.83 0.090 0.111
D 1.99 2.50 0.078 0.098
E 0.90 1.41 0.035 0.056
F 4.95 5.33 0.195 0.210
G 0.00 0.20 0.000 0.008
H 0.15 0.31 0.006 0.012
P/N = Device Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1401014 Version: D14
0.066
0.060
0.155
0.095
0.215
D2.41
E5.45
MARKING DIAGRAM
P4SMA HV SERIES
Taiwan Semiconductor
Unit (inch)
A1.68
B1.52
C3.93
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAY OUT
Symbol Unit (mm)
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1401014 Version: D14
P4SMA HV SERIES
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
