FUNCTIONAL BLOCK DIAGRAMS
1.3V
V
OUT
V
BATT
V
CC
WATCHDOG
INPUT (WDI)
POWER FAIL
INPUT (PFI) POWER FAIL
OUTPUT (PFO)
RESET
WATCHDOG
TIMER
BATT ON
OSC IN
OSC SEL
WATCHDOG
OUTPUT (WDO)
RESET
LOW LINE
LL
IN
RESET GENERATOR
WATCHDOG
TRANSITION DETECTOR
TIMEBASE FOR RESET
AND WATCHDOG
ADM8696
1.3V
WATCHDOG
INPUT (WDI)
POWER FAIL
INPUT (PFI) POWER FAIL
OUTPUT (PFO)
RESET
WATCHDOG
TIMER
OSC IN
OSC SEL
RESET
LOW LINE
WATCHDOG
OUTPUT (WDO)
LL
IN
RESET GENERATOR
TIMEBASE FOR RESET
AND WATCHDOG
WATCHDOG
TRANSITION DETECTOR
ADM8697
CE
IN
CE
OUT
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
Microprocessor
Supervisory Circuits
ADM8696/ADM8697
FEATURES
Upgrade for ADM696/ADM697, MAX696/MAX697
Specified Over Temperature
Adjustable Low Line Voltage Monitor
Power OK/Reset Time Delay
Reset Assertion Down to 1 V VCC
Watchdog Timer—100 ms, 1.6 s, or Adjustable
Low Switch On Resistance
0.7 V Normal, 7 V in Backup
400 nA Standby Current
Automatic Battery Backup Switching (ADM8696)
Fast On-Board Gating of Chip Enable Signals (ADM8697)
Voltage Monitor for Power Fail or Low Battery Warning
Also Available in TSSOP Package
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 World Wide Web Site: http://www.analog.com
Fax: 617/326-8703
The ADM8696/ADM8697 is fabricated using an advanced
epitaxial CMOS process combining low power consumption
(0.7 mW), extremely fast Chip Enable gating (2 ns) and high re-
liability. RESET assertion is guaranteed with V
CC
as low as 1 V.
In addition, the power switching circuitry is designed for mini-
mal voltage drop thereby permitting increased output current drive
of up to 100 mA without the need for an external pass transistor.
GENERAL DESCRIPTION
The ADM8696/ADM8697 supervisory circuits offer complete
single chip solutions for power supply monitoring and battery
control functions in microprocessor systems. These functions
include µP reset, backup battery switchover, watchdog timer,
CMOS RAM write protection and power failure warning.
The ADM8696/ADM8697 are available in 16-pin DIP and small
outline packages (including TSSOP) and provide the following
functions:
1. Power-On Reset output during power-up, power-down and
brownout conditions. The RESET voltage threshold is
adjustable using an external voltage divider. The RESET out-
put remains operational with V
CC
as low as 1 V.
2. A Reset pulse if the optional watchdog timer has not been
toggled within specified time.
3. Separate watchdog timeout and low line status outputs.
4. Adjustable reset and watchdog timeout periods.
5. A 1.3 V threshold detector for power fail warning, low battery
detection or to monitor a power supply other than V
CC
.
6. Battery backup switching for CMOS RAM, CMOS micro-
processor or other low power logic (ADM8696).
7. Write protection of CMOS RAM or EEPROM (ADM8697).
©1997-2010 Analog Devices, Inc. All rights reserved.
REV. A
APPLICATIONS
Microprocessor Systems
Computers
Controllers
Intelligent Instruments
Automotive Systems
Critical µP Power Monitoring
Qualified for Automotive Applications
ADM8696/ADM8697–SPECIFICATIONS
P
arameter Min Typ Max Units Test Conditions/Comments
V
CC
Operating Voltage Range 3.0 5.5 V
V
BATT
Operating Voltage Range 2.0 V
CC
– 0 3 V
BATTERY BACKUP SWITCHING (ADM8696)
V
OUT
Output Voltage V
CC
– 0.005 V
CC
– 0.0025 V I
OUT
= 1 mA
V
CC
– 0.2 V
CC
– 0.125 V I
OUT
100 mA
V
OUT
in Battery Backup Mode V
BATT
– 0.005 V
BATT
– 0.002 V I
OUT
= 250 µA, V
CC
< V
BATT
– 0.2 V
Supply Current (Excludes I
OUT
) 115 200 µAI
OUT
= 100 mA
Supply Current in Battery Backup Mode 0.4 1 µAV
CC
= 0 V, V
BATT
= 2.8 V
Battery Standby Current 5.5 V > V
CC
> V
BATT
+ 0.2 V
(+ = Discharge, – = Charge) –0.1 +0.02 µA
Battery Switchover Threshold 70 mV Power-Up
V
CC
– V
BATT
50 mV Power-Down
Battery Switchover Hysteresis 20 mV
BATT ON Output Voltage 0.3 V I
SINK
= 3.2 mA
BATT ON Output Short Circuit Current 30 mA BATT ON = V
OUT
= 2.4 V Sink Current
0.5 2.5 25 µA BATT ON = V
OUT
, V
CC
= 0 V, Source Current
RESET AND WATCHDOG TIMER
Low Line Threshold (LL
IN
) 1.25 1.3 1.35 V
Reset Timeout Delay 35 50 70 ms OSC SEL = HIGH
Watchdog Timeout Period, Internal Oscillator 1.0 1.6 2.25 s Long Period
70 100 140 ms Short Period
Watchdog Timeout Period, External Clock 4032 4063 4097 Cycles Long Period
960 1011 1025 Cycles Short Period
Minimum WDI Input Pulse Width 50 ns V
IL
= 0.8, V
IH
= 3.75 V, V
CC
= 5 V
100 ns V
IL
= 0.8, V
IH
= 3.5 V, V
CC
= 5 V
100 ns V
IL
= 0.8, V
IH
= 2.6 V, V
CC
= 3 V
RESET Output Voltage @ V
CC
= +1 V 4 20 mV I
SINK
= 10 µA, V
CC
= 1 V
RESET, RESET Output Voltage 0.1 0.4 V I
SINK
= 400 µA, V
CC
= 2 V, V
BATT
= 0 V
0.1 0.4 V I
SINK
= 3.2 mA, 3 V < V
CC
< 5.5 V
3.5 V I
SOURCE
= 1 µA, V
CC
= 5 V
2.7 V I
SOURCE
= 1 µA, V
CC
= 3 V
LOW LINE, WDO Output Voltage 0.4 V I
SINK
= 3.2 mA,
3.5 V I
SOURCE
= 1 µA, V
CC
= 5 V
2.7 V I
SOURCE
= 1 µA, V
CC
= 3 V
Output Short Circuit Source Current 1 10 25 µAV
CC
= 5 V
WDI Input Threshold
1
Logic Low 0.8 V
Logic High 3.5 V V
CC
= 5 V
1.2 V V
CC
= 3 V
WDI Input Current 1 10 µA WD1 = V
OUT
, (V
CC
)
–10 –1 µA WD1 = 0 V
POWER FAIL DETECTOR
PFI Input Threshold 1.2 1.3 1.4 V
PFI–LL
IN
Threshold Difference –50 ±15 +50 mV
PFI Input Current –25 ±0.01 +25 nA
LL
IN
Input Current –50 ±0.01 +50 nA
PFO Output Voltage 0.4 V I
SINK
= 3.2 mA
3.5 V I
SOURCE
= 1 µA
2.7 V I
SOURCE
= 1 µA, V
CC
= 3 V
PFO Short Circuit Source Current 1 10 25 µA PFI = Low, PFO = 0 V
CHIP ENABLE GATING (ADM8697)
CE
IN
Threshold 0.8 V V
IL
3.0 V V
IH
1.2 V V
CC
= 3 V
CE
IN
Pull-Up Current 3 µA
CE
OUT
Output Voltage 0.4 V I
SINK
= 3.2 mA
V
CC
– 0.5 V I
SOURCE
= 800 µA
CE Propagation Delay 2 7 ns V
CC
= 5.0 V
4nsV
CC
= 3.0 V
OSCILLATOR
OSC IN Input Current ±2µA
OSC SEL Input Pull-Up Current 5 µA
OSC IN Frequency Range 0 500 kHz OSC SEL = 0 V
OSC IN Frequency with Ext. Capacitor 4 kHz OSC SEL = 0 V, C
OSC
= 47 pF
NOTE
1
WDI is a three-level input internally biased to 38% of V
CC
and has an input impedance of approximately 5 M.
Specifications subject to change without notice.
–2–
(V
CC
= Full Operating Range, V
BATT
= +2.8 V, T
A
= T
MIN
to T
MAX
unless otherwise noted.)
REV. A
ADM8696/ADM8697
–3–
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
V
BATT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
All Other Inputs . . . . . . . . . . . . . . . . . . –0.3 V to V
OUT
+ 0.5 V
Input Current
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
V
BATT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Power Dissipation, N-16 DIP . . . . . . . . . . . . . . . . . . . 600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 135°C/W
Power Dissipation, RU-16 TSSOP . . . . . . . . . . . . . . . 500 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W
Power Dissipation, R-16 SOIC . . . . . . . . . . . . . . . . . .600 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110°C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . .–40°C to +85°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum ratings for
extended periods of time may affect device reliability.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADM8696/ADM8697 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
TOP VIEW
(Not to Scale)
ADM8696
GND
VBATT
VOUT
PFI
PFO
WDO
VCC
RESET
BATT ON
LOW LINE
OSC IN
OSC SEL
RESET
LL IN
NC
WDI
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
TOP VIEW
(Not to Scale)
ADM8697
LL
IN
TEST
NC
PFI
PFO
WDO
V
CC
RESET
GND
LOW LINE
OSC IN
OSC SEL
RESET
CE
IN
CE
OUT
WDI
REV. A
ADM8696/ADM8697
–4–
PIN FUNCTION DESCRIPTION
Pin No.
Mnemonic ADM8696 ADM8697 Function
V
CC
3 3 Power Supply Input +3 V to +5 V.
V
BATT
1 Backup Battery Input.
V
OUT
2 Output Voltage, V
CC
or V
BATT
is internally switched to V
OUT
depending on which is at
the highest potential. When V
CC
is higher than V
BATT
and LL
IN
is higher than the reset
threshold, V
CC
is switched to V
OUT
. When V
CC
is lower than V
BATT
and LL
IN
is below the
reset threshold, V
BATT
is switched to V
OUT
. V
OUT
can supply up to 100 mA to power CMOS
RAM. Connect V
OUT
to V
CC
if V
OUT
and V
BATT
are not used.
GND 4 5 0 V. Ground reference for all signals.
RESET 15 15 Logic Output. RESET goes low whenever LL
IN
falls below 1.3 V and remains low for 50 ms
after LL
IN
goes above 1.3 V. RESET also goes low for 50 ms if the watchdog timer is en-
abled but not serviced within its timeout period. The RESET pulse width can be adjusted as
shown in Table I.
WDI 11 11 Watchdog Input, WDI is a three level input. If WDI remains either high or low for longer
than the watchdog timeout period, RESET pulses low and WDO goes low. The timer resets
with each transition at the WDI input. The watchdog timer is disabled when WDI is left
floating or is driven to midsupply.
PFI 9 9 Power Fail Input. PFI is the noninverting input to the Power Fail Comparator when PFI is
less than 1.3 V, PFO goes low. Connect PFI to GND or V
OUT
when not used. See Figure 1.
PFO 10 10 Power Fail Output. PFO is the output of the Power Fail Comparator. It goes low when PFI
is less than 1.3 V. The comparator is turned off and PFO goes low when V
CC
is below
V
BATT
.
CE
IN
13 Logic Input. The input to the CE gating circuit. Connect to GND or V
OUT
if not used.
CE
OUT
12 Logic Output. CE
OUT
is a gated version of the CE
IN
signal. CE
OUT
tracks CE
IN
when LL
IN
is above 1.3 V. If LL
IN
is below 1.3 V, CE
OUT
is forced high.
BATT ON 5 Logic Output. BATT ON goes high when V
OUT
is internally switched to the V
BATT
input.
It goes low when V
OUT
is internally switched to V
CC
. The output typically sinks 7 mA and
can directly drive the base of an external PNP transistor to increase the output current above
the 100 mA rating of V
OUT
.
LOW LINE 6 6 Logic Output. LOW LINE goes low when LL
IN
falls below 1.3 V. It returns high as soon as
LL
IN
rises above 1.3 V.
RESET 16 16 Logic Output. RESET is an active high output. It is the inverse of RESET.
OSC SEL 8 8 Logic Oscillator Select Input. When OSC SEL is unconnected or driven high, the internal
oscillator sets the reset time delay and watchdog timeout period. When OSC SEL is low, the
external oscillator input, OSC IN, is enabled. OSC SEL has a 3 µA internal pull-up. See
Table I and Figure 4.
OSC IN 7 7 Logic Oscillator Input. When OSC SEL is low, OSC IN can be driven by an external clock
to adjust both the reset delay and the watchdog timeout period. The timing can also be
adjusted by connecting an external capacitor to this pin. See Table I and Figure 4. When
OSC SEL is high or floating, OSC IN selects between fast and slow watchdog timeout periods.
WDO 14 14 Logic Output. The Watchdog Output, WDO, goes low if WDI remains either high or low
for longer than the watchdog timeout period. WDO is set high by the next transition at
WDI. If WDI is unconnected or at midsupply, WDO remains high. WDO also goes high
when LOW LINE goes low.
NC 12 2 No Connect. It should be left open.
LL
IN
13 4 Voltage Sensing Input. The voltage on the low line input, LL
IN
, is compared with a 1.3 V
reference voltage. This input is normally used to monitor the power supply voltage. The
output of the comparator generates a LOW LINE output signal. It also generates a
RESET/RESET output. The comparator output also controls the battery switchover circuitry.
TEST 1 This is a special test pin using during device manufacture. It should be connected to GND.
REV. A
ADM8696/ADM8697
–5–
Low Line RESET OUTPUT
RESET is an active low output that provides a RESET signal to
the microprocessor whenever the Low Line Input (LL
IN
) is be-
low 1.3 V. The LL
IN
input is normally used to monitor the
power supply voltage. An internal timer holds RESET low for
50 ms after the voltage on LL
IN
rises above 1.3 V. This is in-
tended as a power-on RESET signal for the processor. It allows
time for the power supply and microprocessor to stabilize. On
power-down, the RESET output remains low, with V
CC
as low
as 1 V. This ensures that the microprocessor is held in a stable
shutdown condition.
The LL
IN
comparator has approximately 12 mV of hysteresis
for enhanced noise immunity.
In addition to RESET, an active high RESET output is also
available. This is the complement of RESET and is useful for
processors requiring an active high RESET.
t1
t1 = RESET TIME
V1 = RESET VOLTAGE THRESHOLD LOW
V2 = RESET VOLTAGE THRESHOLD HIGH
HYSTERESIS = V2–V1
V2 V2
V1 V1
t1
LLIN
LOW LINE
RESET
Figure 2. Power-Fail Reset Timing
Watchdog Timer RESET
The watchdog timer circuit monitors the activity of the micro-
processor in order to check that it is not stalled in an indefinite
loop. An output line on the processor is used to toggle the
Watchdog Input (WDI) line. If this line is not toggled within
the selected timeout period, a RESET pulse is generated. The
ADM8696/ADM8697 may be configured for either a fixed
“short” 100 ms or a “long” 1.6 second timeout period or for an
adjustable timeout period. If the “short” period is selected,
some systems may be unable to service the watchdog timer im-
mediately after a reset, so a “long” timeout is automatically ini-
tiated directly after a reset is issued. The watchdog timer is
restarted at the end of Reset, whether the Reset was caused by
lack of activity on WDI or by LL
IN
falling below the reset
threshold.
The normal (short) timeout period becomes effective following
the first transition of WDI after RESET has gone inactive. The
watchdog timeout period restarts with each transition on the
WDI pin. To ensure that the watchdog timer does not time out,
either a high-to-low or low-to-high transition on the WDI pin
must occur at or less than the minimum timeout period. If WDI
remains permanently either high or low, reset pulses will be is-
sued after each timeout period (1.6 s). The watchdog monitor
can be deactivated by floating the Watchdog Input (WDI) or by
connecting it to midsupply.
CIRCUIT INFORMATION
Battery Switchover Section (ADM8696)
The battery switchover circuit is designed to switch over to
battery backup in the event of a power failure. When LL
IN
is below the reset threshold and V
CC
is below V
BATT
, then
V
BATT
is switched to V
OUT
.
During normal operation, with V
CC
higher than V
BATT
, V
CC
is
internally switched to V
OUT
via an internal PMOS transistor
switch. This switch has a typical on resistance of 0.7 and can
supply up to 100 mA at the V
OUT
terminal. V
OUT
is normally
used to drive a RAM memory bank which may require instanta-
neous currents of greater than 100 mA. If this is the case, then
a bypass capacitor should be connected to V
OUT
. The capacitor
will provide the peak current transients to the RAM. A capaci-
tance value of 0.1 µF or greater may be used.
If the continuous output current requirement at V
OUT
exceeds
100 mA or if a lower V
CC
–V
OUT
voltage differential is desired,
an external PNP pass transistor may be connected in parallel
with the internal transistor. The BATT ON output can directly
drive the base of the external transistor.
A 7 MOSFET switch connects the V
BATT
input to V
OUT
dur-
ing battery backup. This MOSFET has very low input-to-out-
put differential (dropout voltage) at the low current levels
required for battery backup of CMOS RAM or other low power
CMOS circuitry. The supply current in battery backup is typi-
cally 0.4 µA.
The ADM8696 operates with battery voltages from 2.0 V to
V
CC
–0.3 V). High value capacitors, either standard electrolytic
or the farad-size double layer capacitors, can also be used for
short-term memory backup. A small charging current of typi-
cally 10 nA (0.1 µA max) flows out of the V
BATT
terminal. This
current is useful for maintaining rechargeable batteries in a fully
charged condition. This extends the life of the backup battery
by compensating for its self-discharge current. Also note that
this current poses no problem when lithium batteries are used
for backup since the maximum charging current (0.1 µA) is safe
for even the smallest lithium cells.
If the battery switchover section is not used, V
BATT
should be
connected to GND and V
OUT
should be connected to V
CC
.
V
BATT
V
CC
BATT ON
(ADM8691, ADM8693,
ADM8695, ADM8696)
V
OUT
700
mV
100
mV
GATE DRIVE
INTERNAL
SHUTDOWN SIGNAL
WHEN
V
BATT
> (V
CC
+ 0.7V)
Figure 1. Battery Switchover Schematic
REV. A
ADM8696/ADM8697
–6–
Table I. ADM8696, ADM8697 Reset Pulse Width and Watchdog Timeout Selections
Watchdog Timeout Period Reset Active Period
OSC SEL OSC IN Normal Immediately After Reset
Low External Clock Input 1024 CLKS 4096 CLKS 512 CLKS
Low External Capacitor 400 ms × C/47 pF 1.6 s × C/47 pF 200 ms × C/47 pF
Floating or High Low 100 ms 1.6 s 50 ms
Floating or High Floating or High 1.6 s 1.6 s 50 ms
NOTE
With the OSC SEL pin low, OSC IN can be driven by an external clock signal, or an external capacitor can be connected between OSC IN and GND. The nominal
internal oscillator frequency is 10.24 kHz. The nominal oscillator frequency with external capacitor is: F
OSC
(Hz) = 184,000/C (pF).
WDI
t
1
= RESET TIME
t
2
= NORMAL (SHORT) WATCHDOG TIMEOUT PERIOD
t
3
= WATCHDOG TIMEOUT PERIOD IMMEDIATELY FOLLOWING A RESET
t
1
WDO
RESET
t
2
t
3
t
1
t
1
Figure 3. Watchdog Timeout Period and Reset Active Time
The watchdog timeout period defaults to 1.6 s and the reset
pulse width defaults to 50 ms, but these times to be adjusted as
shown in Table I. Figure 4 shows the various oscillator configu-
rations that can be used to adjust the reset pulse width and
watchdog timeout period.
The internal oscillator is enabled when OSC SEL is high or
floating. In this mode, OSC IN selects between the 1.6 second
and 100 ms watchdog timeout periods. In either case, immedi-
ately after a reset the timeout period is 1.6 s. This gives the mi-
croprocessor time to reinitialize the system. If OSC IN is low,
the 100 ms watchdog period becomes effective after the first
transition of WDI. The software should be written such that the
I/O port driving WDI is left in its power-up reset state until the
initialization routines are completed and the microprocessor is
able to toggle WDI at the minimum watchdog timeout period of
70 ms.
OSC IN
OSC SEL
ADM869x
CLOCK
0 TO 500kHz 7
8
Figure 4a. External Clock Source
C
OSC
OSC IN
OSC SEL
ADM869x
7
8
Figure 4b. External Capacitor
NC
NC OSC IN
OSC SEL
ADM869x
7
8
Figure 4c. Internal Oscillator (1.6 s Watchdog)
NC
OSC IN
OSC SEL
ADM869x
7
8
Figure 4d. Internal Oscillator (100 ms Watchdog)
Watchdog Output (WDO)
The Watchdog Output WDO provides a status output that goes
low if the watchdog timer “times out” and remains low until set
high by the next transition on the watchdog input. WDO is also
set high when LL
IN
goes below the reset threshold.
REV. A
ADM8696/ADM8697
–7–
can be chosen such that the voltage at PFI falls below 1.3 V
several milliseconds before the +5 V power supply falls below
the reset threshold. PFO is normally used to interrupt the
mi croprocessor so that data can be stored in RAM and the shut-
down procedure executed before power is lost.
ADM869x
POWER
FAIL
INPUT
R2
INPUT
POWER
POWER
FAIL
OUTPUT
R1 PFO
1.3V
Figure 7. Power Fail Comparator
Table II. Input and Output Status In Battery Backup Mode
Signal Status
V
OUT
(ADM8696) V
OUT
is connected to V
BATT
via an
internal PMOS switch.
RESET Logic low.
RESET Logic high. The open circuit output voltage is
equal to V
OUT
.
LOW LINE Logic low.
BATT ON (ADM8696) Logic high. The open circuit volt-
age is equal to V
OUT
.
WDI WDI is ignored. It is internally disconnected
from the internal pull-up resistor and does not
source or sink current as long as its input voltage
is between GND and V
OUT
. The input voltage
does not affect supply current.
WDO Logic high. The open circuit voltage is equal to
V
OUT
.
PFI The Power Fail Comparator is turned off and
has no effect on the Power Fail Output.
PFO Logic low.
CE
IN
CE
IN
is ignored. It is internally disconnected
from its internal pull-up and does not source or
sink current as long as its input voltage is be-
tween GND and V
OUT
. The input voltage does
not affect supply current.
CE
OUT
Logic high. The open circuit voltage is equal to
V
OUT
.
OSC IN OSC IN is ignored.
OSC SEL OSC SEL is ignored.
CE Gating and RAM Write Protection (ADM8697)
The ADM8697 contains memory protection circuitry that
ensures the integrity of data in memory by preventing write
operations when LL
IN
is below the threshold voltage. When
LL
IN
is greater than 1.3 V, CE
OUT
is a buffered replica of CE
IN
,
with a 2 ns propagation delay. When LL
IN
falls below the 1.3 V
threshold, an internal gate forces CE
OUT
high, independent of
CE
IN
.
CE
OUT
typically drives the CE, CS or Write input of battery
backed up CMOS RAM. This ensures the integrity of the data
in memory by preventing write operations when V
CC
is at an in-
valid level.
ADM8697
LLIN LOW = 0
LLIN OK = 1
CEIN CEOUT
Figure 5. Chip Enable Gating
t
1
= RESET TIME
V1 = RESET VOLTAGE THRESHOLD LOW
V2 = RESET VOLTAGE THRESHOLD HIGH
HYSTERESIS = V2–V1
V2 V2
V1 V1
LL
IN
LOW LINE
RESET
CE
OUT
t
1
t
1
CE
IN
Figure 6. Chip Enable Timing
Power Fail Warning Comparator
An additional comparator is provided for early warning of fail-
ure in the microprocessor’s power supply. The Power Fail Input
(PFI) is compared to an internal +1.3 V reference. The Power
Fail Output (PFO) goes low when the voltage at PFI is less than
1.3 V. Typically PFI is driven by an external voltage divider
which senses either the unregulated dc input to the system’s 5 V
regulator or the regulated 5 V output. The voltage divider ratio
REV. A
ADM8696/ADM8697–Typical Performance Curves
–8–
53
4920 120
52
50
40
51
1008060
V
CC
= +5V
TEMPERATURE –
°
C
RESET ACTIVE TIME – ms
Figure 11. RESET Active Time vs. Temperature
10
90
100
0%
A4 3.36 V
500ms
1V
1V
Figure 12.
RESET
Output Voltage vs. Supply Voltage
5.5
3.0
2.0
10 100 100001000
4.5
2.5
3.5
4.0
5.0
TIME DELAY – ms
VCC – Volts
TA = +25°C
Figure 13.
RESET
Timeout Delay vs. V
CC
I
OUT
– mA
V
OUT
– Volts
5
4.9410 10020 30 40 50 60 70 80 90
4.99
4.98
4.97
4.96
4.95
Figure 8. V
OUT
vs. I
OUT
Normal Operation
I
OUT
– µA
2.8
2.786
150 1050250 350 450 550 650 750 850 950
2.798
2.794
2.792
2.79
2.788
2.796
V
OUT
– Volts
Figure 9. V
OUT
vs. I
OUT
Battery Backup
1.29
20 120
1.32
1.30
40
1.31
1008060
PFI INPUT THRESHOLD – V
TEMPERATURE –
°
C
Figure 10. PFI Input Threshold vs. Temperature
REV. A
ADM8696/ADM8697
–9–
APPLICATIONS INFORMATION
Increasing the Drive Current (ADM8696)
If the continuous output current requirements at V
OUT
exceeds
100 mA or if a lower V
CC
–V
OUT
voltage differential is desired,
an external PNP pass transistor may be connected in parallel
with the internal transistor. The BATT ON output (ADM8696)
can directly drive the base of the external transistor.
BATTERY
+5V
INPUT
POWER 0.1µF
PNP
TRANSISTOR
0.1µF
V
OUT
V
CC
BATT
ON
V
BATT
ADM8696
Figure 14. Increasing the Drive Current
Using a Rechargeable Battery for Backup (ADM8696)
If a capacitor or a rechargeable battery is used for backup, the
charging resistor should be connected to V
OUT
since this elimi-
nates the discharge path that would exist during power-down if
the resistor is connected to V
CC
.
V
OUT
V
CC
RECHARGABLE
BATTERY
+5V
INPUT
POWER
0.1µF
0.1µF
V
BATT
ADM8696
R
R
V
OUT
– V
BATT
I =
Figure 15. Rechargeable Battery
Adding Hysteresis to the Power Fail Comparator
For increased noise immunity, hysteresis may be added to the
power fail comparator. Since the comparator circuit is nonin-
verting, hysteresis can be added by connecting a resistor be-
tween the PFO output and the PFI input as shown in Fig-
ure 16. When PFO is low, resistor R3 sinks current from the
summing junction at the PFI pin. When PFO is high, the series
combination of R3 and R4 source current into the PFI summing
junction. This results in differing trip levels for the comparator.
Alternate Watchdog Input Drive Circuits
The watchdog feature can be enabled and disabled under pro-
gram control by driving WDI with a three-state buffer (Figure
17a). When three-stated, the WDI input will float, thereby dis-
abling the watchdog timer.
This circuit is not entirely foolproof and it is possible a software
fault could erroneously three-state the buffer. This would pre-
vent the ADM869x from detecting that the microprocessor is no
longer operating correctly. In most cases, a better method is to
ADM869x
R2
1.3V
R1
PFO
7805
R4
R3
+7V TO +15V
INPUT
POWER
+5V
PFI
VCC
TO
µP NMI
VH = 1.3V (1+ ––– + ––– )
VL = 1.3V (1+ ––– – ––––––––––––– )
ASSUMING R4 < < R3 THEN
HYSTERESIS VH – VL = 5V (––– )
R1
R2
R1
R3
R1
R2
R1
R2
R1 (5V – 1.3V)
1.3V (R3 + R4)
Figure 16. Adding Hysteresis to the Power Fail Comparator
extend the watchdog period rather than disabling the watchdog.
This may be done under program control using the circuit
shown in Figure 17b. When the control input is high, the OSC
SEL pin is low and the watchdog timeout is set by the external
capacitor. A 0.01 µF capacitor sets a watchdog timeout delay of
100 s. When the control input is low, the OSC SEL pin is
driven high, selecting the internal oscillator. The 100 ms or the
1.6 s period is chosen, depending on which diode in Fig-
ure 17b is used. With D1 inserted, the internal timeout is set at
100 ms while with D2 inserted the timeout is set at 1.6 s.
Figure 17a. Programming the Watchdog Input
OSC IN
OSC SEL
ADM869x
CONTROL
INPUT*
D1 D2
*LOW = INTERNAL TIMEOUT
HIGH = EXTERNAL TIMEOUT
Figure 17b. Programming the Watchdog Input
REV. A
ADM8696/ADM8697
–10–
TYPICAL APPLICATIONS
ADM8696
Figure 18 shows the ADM8696 in a typical power monitoring,
battery backup application. V
OUT
powers the CMOS RAM.
Under normal operating conditions with V
CC
present, V
OUT
is
internally connected to V
CC
. If a power failure occurs, V
CC
will
decay and V
OUT
will be switched to V
BATT
, thereby maintaining
power for the CMOS RAM.
Power Fail RESET
The V
CC
power supply is also monitored by the Low Line In-
put, LL
IN
. A RESET pulse is generated when LL
IN
falls below
1.3 V. RESET will remain low for 50 ms after LL
IN
returns
above 1.3 V. This allows for a power-on reset and prevents re-
peated toggling of RESET if the V
CC
power supply is unstable.
Resistors R3 and R4 should be chosen to give the desired V
CC
reset threshold.
Watchdog Timer
The Watchdog Timer Input (WDI) monitors an I/O line from
the µP system. This line must be toggled once every 1.6 s to
verify correct software execution. Failure to toggle the line indi-
cates that the µP system is not correctly executing its program
and may be tied up in an endless loop. If this happens, a reset
pulse is generated to initialize the processor.
If the watchdog timer is not needed the WDI input should be
left floating.
Power Fail Detector
The Power Fail Input, PFI, monitors the input power supply via
a resistive divider network R1 and R2. This input is intended as
an early warning power fail input. The voltage on the PFI input
is compared with a precision 1.3 V internal reference. If the in-
put voltage drops below 1.3 V, a power fail output (PFO) signal
is generated. This warns of an impending power failure and may
be used to interrupt the processor so that the system may be
shut down in an orderly fashion. The resistors in the sensing
network are ratioed to give the desired power fail threshold volt-
age V
T
. The threshold should be set at a higher voltage than the
RESET threshold so there is sufficient time available to com-
plete the shutdown procedure before the processor is RESET
and power is lost.
ADM8696
R2
R1
PFO
+5V
VCC
CMOS RAM
POWER
I/O LINE
µP NMI
µP SYSTEM
µP POWER
VOUT
WDI
GND
PFI
VBATT
BATTERY
RESET µP RESET
+
R4
R3
LLIN
RESET
Figure 18a. ADM8696 Typical Application Circuit A
Figure 18b shows a similar application for the ADM8696 but in
this case the PFI input monitors the unregulated input to the
7805 voltage regulator. This gives an earlier warning of an im-
pending power failure. It is useful with processors operating at
low speeds or where there are a significant number of house-
keeping tasks to be completed before the power is lost.
ADM8696
R2
R1
PFO
INPUT
POWER
V
CC
V
OUT
GND
PFI
V
BATT
0.1µF
3V
BATTERY
RESET
OSC IN
OSC SEL
SYSTEM STATUS
INDICATORS
LOW LINE
CMOS RAM
I/O LINE
NMI
RESET
A0–A15
µP
BATT
ON
NC
V
CC
LL
IN
WDI
µP
POWER
RESET
R4
R3
7805
WDO
0.1µF
Figure 18b. ADM8696 Typical Application Circuit B
This application also shows an optional external transistor that
may be used to provide in excess of 100 mA current on V
OUT
.
When V
CC
is higher than V
BATT
, the BATT ON output goes
low, providing 25 mA of base drive for the external PNP transis-
tor. The maximum current available is dependent on the power
rating of the external transistor.
RAM Write Protection
The ADM8697 CE
OUT
line drives the Chip Select inputs of the
CMOS RAM. CE
OUT
follows CE
IN
as long as LL
IN
is above the
reset threshold. If LL
IN
falls below the reset threshold, CE
OUT
goes high, independent of the logic level at CE
IN
. This prevents
the microprocessor from writing erroneous data into RAM dur-
ing power-up, power-down, brownouts and momentary power
interruptions.
REV. A
ADM8696/ADM8697
Rev. A | Page 11 of 13
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSION
S
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
COMPLIANT TO JEDEC STANDARDS MS-001-AB
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
16
18
9
0.100 (2.54)
BSC
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
0.210 (5.33)
MAX
SEATING
PLANE
0.015
(0.38)
MIN
0.005 (0.13)
MIN
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.060 (1.52)
MAX
0.430 (10.92)
MAX
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
GAUGE
PLANE
Figure 19. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches and (millimeters)
16 9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 20. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013- AA
032707-B
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0.75 (0.0295)
0.25 (0.0098)
45°
1.27 (0.0500)
0.40 (0.0157)
C
OPLANARITY
0.10 0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
16 9
8
1
1.27 (0.0500)
BSC
Figure 21. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
ADM8696/ADM8697
Rev. A | Page 12 of 13
ORDERING GUIDE
Model1,2 Notes Temperature Range Package Description Package Option
ADM8696AN −40°C to + 85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADM8696ANZ −40°C to + 85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADM8696ARW −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8969ARW-REEL −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8696ARWZ −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8696ARWZ-REEL −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8696ARU −40°C to + 85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADM8696ARU-REEL −40°C to + 85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADM8697AN −40°C to + 85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADM8697ANZ −40°C to + 85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADM8697ARW −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8697ARW-REEL −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8697ARWZ −40°C to + 85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
ADM8697ARU 3 −40°C to + 85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADM8697ARU-REEL 3 −40°C to + 85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
3 Contact sales for availability and quotation.
AUTOMOTIVE PRODUCTS
The ADM8696/ADM8697 models are available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available
for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information
and to obtain the specific Automotive Reliability reports for these models.
12 of 13
Rev. A | Page
ADM8696/ADM8697
REVISION HISTORY
6/10—Rev. 0 to Rev. A
Changes to Ordering Guide ........................................................... 12
©1997-2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09139-0-6/10(A)
13 of 13