MS5806-02BA Miniature Altimeter Modu le
DA5806-02BAxx_007 ww.meas-spec.com February 25th, 2014
000058061951 ECN2205 1/18
High resolution module, 20cm
Fast conversion down to 1 ms
Low power, 1 µA (standby < 0.15 µA)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Supply voltage 1.8 to 3.6 V
Operati n g ra n g e: 300 to 1100 mbar, -40 to +85 °C
Extended Pressure Range: 10 to 2000mbar
I2C or SPI interface (Mode 0, 3)
No external components (Internal oscillator)
Excell ent long term stability
Hermetically sealable for outdoor devices
DESCRIPTION
The MS5806-02BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI
and I2C bus interface. It is optimized for altimeters and variometers with an altitude resolution of 20cm. The
sensor module includes a high linearity pressure sensor and an ultra low power 24 bit ΔΣ ADC with internal
factory calibrated coefficients. It provides a precise digital 24 Bit pressure and temperature value and different
operation modes that allow the user to optimize for conversion speed and current consumption. A high
resolution temperature output allows the implementation of an altimeter/thermometer function without any
additional sensor. The MS5806-02BA can be interfaced to virtually any microcontroller. The communication
protocol is simple, without the need of programming internal registers in the device. The gel protection and
antimagnetic stainless steel cap allows the use in 100m water resistant altimeter/compass watches. This new
sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland
proven experience and know-how in high volume manufacturing of altimeter modules, which has been widely
used for over a decade. The sensing principle employed leads to very low hysteresis and high stability of both
pressure and temperature signal.
FEATURES
FIELD OF APPL ICATION TECHNICAL DATA
Mobile altimeter / barometer systems
Sensor Performances (VDD = 3 V)
Bike computers
Pressure
Min
Typ
Max
Adventure or multi-mode watches
Range
10
2000
Variometers
ADC
24
Dataloggers
Resolution (1)
0.13 / 0.084 / 0.054
/ 0.036 / 0.024
mbar
FUNCTIONAL BLOCK DIAGRAM
Note: the communicat i on protoc ol is defi ned by hardware
(I2c: version 52 and SPI: version 42)
Accuracy 25°C,
750 to 1100 mbar
-1.5 +1.5 mbar
Accuracy -20°C to + 85°C,
300 to 1100 mbar (2)
-2.5 +2.5 mbar
Response time
0.5 / 1.1 / 2.1 /
4.1 / 8.22
ms
Long term stabilit y
+1
Temperature
Min
Typ
Max
Range
-40
+85
Resolution
<0.01
Accuracy at 25°C
-0.8
+0.8
Notes: (1) Oversampling Rat i o: 256 / 512 / 1024 / 2048 / 4096
(2) Wit h autozero at one pressure point
VDD
GND
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
MS5806-02BA Miniature Altimeter Modu le
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000058061951 ECN2205 2/18
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Supply voltage
VDD
-0.3
+3.6
V
Storage temperature
TS
-40
+85
°C
Overpressure
Pmax
ISO 2281
10
bar
Maximum Soldering
Temperature
Tmax 40 sec max 250 °C
ESD rating
Human Body
Model
-4 +4 kV
Latch up
JEDEC standard
No 78
-100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Operating Supply voltage
VDD
1.8
3.0
3.6
V
Operating Temperature
T
-40
+25
+85
°C
Supply current
(1 sample per sec.) IDD
OSR 4096
2048
1024
512
256
12.5
6.3
3.2
1.7
0.9
µA
Peak supply current
during conversion
1.4
mA
Standby supply current
at 25°c
0.02
0.14
µA
VDD Capacitor
From VDD to GND
100
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output Word
24
bit
Conversion time tc
OSR 4096
2048
1024
512
256
7.40
3.72
1.88
0.95
0.48
8.22
4.13
2.08
1.06
0.54
9.04
4.54
2.28
1.17
0.60
ms
MS5806-02BA Miniature Altimeter Modu le
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PERFORMANCE SPECIFICATIONS (CONT INUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
300
1100
mbar
Extended Pressure Range
Pext
Linear Range of ADC
10
2000
mbar
Absolute Accuracy, no autozero
at 25°C, 700..1100 mbar
at 0..50°C, 300..1100 mbar
at -20..85°C , 300.. 1100 mbar
-1.5
-2.0
-3.5
+1.5
+2.0
+3.5
mbar
Absolute Accuracy, autozero at
one pressure poi nt
at 25°C, 700..1100 mbar
at 0..50°C, 300..1100 mbar
at -20..85°C , 300.. 1100 mbar
-0.5
-1.0
-2.5
+0.5
+1.0
+2.5
mbar
Maximum error with supply
voltage (1)
VDD = 1.8 V … 3.6 V +/- 3 mbar
Maximum error with supply
voltage compensation (1) (2) VDD = 2.2 V … 3.0 V +/-0.6 mbar
Long-term stability
+1
mbar/yr
Resolution RMS
OSR 4096
2048
1024
512
256
0.024
0.036
0.054
0.084
0.130
mbar
(1) With autozero at 3V point
(2) With voltage compensation for accumulator application
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Absolute Accuracy 700 ... 1100mbar
-20..85°C
-0.8
-2.0
+0.8
+2.0
°C
Maximum error with supply
voltage(1)
VDD = 1.8 V … 3.6 V +/- 0.5 °C
Resolution RMS
OSR 4096
2048
1024
512
256
0.002
0.003
0.005
0.008
0.012
°C
(1) With autozero at 3V point
MS5806-02BA Miniature Altimeter Modu le
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PERFORMANCE SPECIFICATIONS (CONT INUED)
DIGITAL INPUTS (CSB, DIN, SCLK, SDA, SCL)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Serial data cloc k
SCLK
SPI protocol
10
MHz
Input high volta ge
VIH
Pins CSB
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage cur rent
Ileak25°C
at 25°c
0.15
µA
Load capacitan ce
CIN
8
pF
DIGITAL OUTPUTS (DOUT, SDA, SCL)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output high voltage
VOH
Isource = 0.6 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 0.6 mA
0% VDD
20% VDD
V
Load capacitance
CLOAD
16
pF
MS5806-02BA Miniature Altimeter Modu le
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PERFORMANCE CHARACTE RISTICS
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
0200 400 600 800 1000 1200
Pr essure er ro r [ mbar]
Pressure [mbar]
Absol ut e pressur e accuracy wit h 2nd order com pensati on
Typical
85°C
25°C
0°C
-20°C
-2.0
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
-20 020 40 60 80
Pr essure er ro r [ mbar]
T emperatur e [°C]
Pressure accuracy vs t emper at ure
Typical
1200mbar
2nd order
900 mbar
2nd order
600mbar
2nd order
1200mbar
1st order
900mbar
1st order
600mbar
1st order
TEM PERAT U RE ER RO R VS TEM PER ATUR E AND EXTENDED PRESSURE RANGE (TYPICAL ERROR)
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
12.0
-40 -20 020 40 60 80
T emper atur e er ro r [ °C]
T emperatur e [°C]
Temperat ure accuracy vs tem perature
Typical
900mb ar 2nd
order
900mb ar 1st
order
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
0200 400 600 800 1000 1200 1400 1600 1800 2000
Pr essure er ror [mb ar]
Pressure [mbar ]
Absol ute pr essure accur acy wit h 2nd order compensat i on
Typical in ext ended pressure r ange
85
-25
25
PRESSURE AND PSRR TEMPERATURE VS SUPPLY VOLTAGE
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
1.8 22.2 2.4 2.6 2.8 33.2 3.4 3.6
Pressure error [mbar]
Supply v olta ge [V]
Pressure err or vs suppl y vol t age at 25°C
Typical
1000 mbar
compensation
MS5806-02BA Miniature Altimeter Modu le
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FUNCTION AL DESCRIPTION
§
Figure 1: Block diagr am of MS5806-02BA
GENERAL
The MS5806-02BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5806-02BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every m odule is indi viduall y factor y calibrated at t wo t em peratures and two press ures. As a result, 6 c oeff icients
necessary to compensate for process variations and temperature variations are calculated and stored in the
128-bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the
microcontroller software and used in the program converting D1 and D2 into compensated pressure and
temperature values.
The 2 coefficients W0 and W7 are for factory configuration and CRC.
SERIAL INTERFACE
The MS5806-02BA has built in two types of serial interfaces: SPI and I2C.
The pin PS is factory connected to GND or VCC to define the Protocol Select:
Module ref
Mode
Pins used
MS5806-02BA52
I2C
SDA, SCL, CSB
MS5806-02BA42
SPI
SDI, SDO, SCLK, CSB
SPI MODE
The ext ernal m icrocontroll er clock s in the data throu gh the i nput SCL K (Seria l CLoc K) and SDI (Serial Data In) .
In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor
responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the
interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the
command is sent or after the end of the command execution (for example end of conversion). The best noise
performance from the module is obtain ed when t he SPI bus is qui et a nd witho ut c ommunication to ot her de vices
during the ADC conversion in progress.
VDD
GND
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interfa ce IC
PGA
CSB
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I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta).
The sens or res ponds on th e sam e pin SDA which is bidirec tiona l for the I2C bus i nterfac e. So th is inter fac e type
uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In
I2C-Mode the com plement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to
use two sensors with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND
(do not leave unconnected!).
Pin CSB
Address (7 bits)
High
0x76 (1110110 b)
Low
0x77 (1110111 b)
COMMANDS
The MS5806-02BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Command by te
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name
PRM
COV
-
Typ
Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read 1 0 1 0 Ad2 Ad1 Ad0 0 0xA0 to
0xAE
Figure 2: Comm and stru cture
PRM
PROM read bit
COV
Conversion selection bit
Typ
D1 or D2 selection bit (Conversion mode)
ADx / OS x
Address PROM or OSR configuration
Stop
Stop bit
Figure 2a: Bit description
MS5806-02BA Miniature Altimeter Modu le
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PRESSURE AND TEMPERATU RE C ALCUL ATION
Size [1]
[bit] min max
C1
Pressure sensitivity | SENST1 unsigned int 16 16 065535 46372
C2
Pressure offset | OFFT1 unsigned int 16 16 065535 43981
C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 065535 29059
C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 065535 27842
C5
Reference temperature | TREF unsigned int 16 16 065535 31553
C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 065535 28165
D1
Digital pressure value unsigned int 32 24 016777216 6465444
D2
Digital temperature value unsigned int 32 24 016777216 8077636
dT
Difference between actual and reference temperature [2]
dT = D2 - TREF = D2 - C5 * 28
signed int 32 25 -16776960 16777216 68
2000
= 20.00 °C
OFF
Offset at actual temperature [3]
OFF = OFFT1 + TCO * dT = C2 * 217 + (C4 * dT) / 26
signed int 64 41 -17179344900 25769410560 5764707214
SENS
Sensitivity at actual temperature [4]
SENS = SENST1 + TCS * dT = C1 * 216 + (C3 * dT) / 27
signed int 64 41 -8589672450 12884705280 3039050829
110002
= 1100.02 mbar
Notes
[1]
[2]
[3]
[4]
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
120000
1000
58
P
Recommended
variable type
Descript ion | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
P = D1 * SENS - OFF = (D1 * SENS / 221 - OFF) / 2 15
min and max have to be defined
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Start
Maximum values for calculation results:
PMIN = 10mbar PMAX = 2000mbar
TMIN = -40°C TMAX = 85°C TREF = 20°C
Read calibration data (factory calibrated) f r om PROM
Read digital pressure and temperature data
Calculate temperature
Calculate temperature compensated pressure
Display pressure and temperature value
Figure 3: Flow chart for pressure and temperature reading and software compensation.
MS5806-02BA Miniature Altimeter Modu le
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000058061951 ECN2205 9/18
SECOND ORDER TEMPERATURE CO MPENS ATIO N
Figure 4: Flow chart for pressure and temperature to the optimum accuracy.
PRESSURE COMPENSATION WITH SUPPLY VOL T AGE
It is recommended to use this formula only in the specified voltage range.
During the ADC conversion, the power supply VDD must be stable.
Calculate pressure vs. Supply voltage
P [mbar]
Power supply compensation from 2.2V to 3.0V
P = P + ((3.0-V
DD
) * C7 / 2
6
)
Figure 5: Flow chart for pressure compensation VS supply voltage.
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SPI INTERFACE (MS5806-02BA42 ONLY)
RESET SEQUENCE
The Res et s e que nce s ha ll be s en t o nc e af ter po wer -on to make sur e that th e c a li bratio n PRO M ge ts lo ad ed into
the internal register. It can be also used to reset the device ROM from an unknown condition
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
2.8ms RELOAD
Figure 6a: Reset command sequence SPI mode 3
Figure 6: Reset command sequence SPI mode 0
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CONVERSION SEQUENC E
The conver sion com m and is used to init iate uncom pens ated press ure (D1) or uncom pens ated tem perature ( D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the con version, using ADC read comm and the result is clock ed out with the MSB f irst. If the convers ion is
not execut ed bef ore the ADC r ead comm and, or the A DC read c omm and is r epeated, it wil l give 0 as the o ut put
result. If the ADC read c ommand is s ent during c onversion the r esult will be 0, the con version will not stop and
the final resu lt will be wrong. Convers ion sequenc e sent duri ng the alread y started c onversion proc ess will yield
incorrect result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
8.22ms ADC CONVERSION
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibrati on PROM and to c alculate the calibration coefficients. T here are in tota l 8 address es resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 conta ins t he ser ial co de and CRC. T he comm and s equence is 8 b its l ong with a 16 bit resul t whic h is
clocked with the MSB first.
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
Figure 8: ADC Read sequence
Figure 9: PROM Read sequence, address = 011 (Coefficient 3)
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I2C INTERFACE (MS5806-02BA52 ONLY)
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5806-02BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
not have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time except when the power on did not work it could be possible that the
acknowledge blocks the SDA. When SDA is blocked by an undefined state the only way to get the
MS5806-02BA to work is to send a power on reset.
1
1
1
0
1
1
CSB
0
0
0
0
0
1
1
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 10: I2C Reset Command
CONVERSION SEQUENC E
A convers ion can be started b y sendin g the comm and to MS5806-02BA. W hen command is sent to the s ystem
it stays busy until conver sio n is don e. When convers io n is f inis he d the d ata c a n b e ac ces s ed b y sendi ng a R ead
command, when an acknowledge appears from the MS5806-02BA, you may then send 24 SCLK cycles to get
all result bits. Every 8 bit the system waits for an acknowledge signal.
1
1
1
0
1
1
CSB
0
0
0
1
0
0
1
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
cmd byte
Device Address
Device Address
Figure 11: I2C Command to initiate a pressure conversion (OSR=4096, typ=D1)
1
1
1
0
1
1
CSB
0
0
0
0
0
0
0
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 12: I2C ADC read sequence
Figure 13: I2C pressure response (D1) on 24 bit from MS5806-02BA
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PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
1
1
1
0
1
1
CSB
0
0
1
0
1
0
0
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 14: I2C Command to read memory address= 011 (Coefficient 3)
Figure 15: I2C answer from MS5806-02BA
CYCLIC REDUNDANCY CHECK (CRC)
MS5806-02BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
A
d
d
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
16 bit reserved for manufacturer
1
Coefficient 1 (16 bit unsigned)
2
Coefficient 2 (16 bit unsigned)
3
Coefficient 3 (16 bit unsigned)
4
Coefficient 4 (16 bit unsigned)
5
Coefficient 5 (16 bit unsigned)
6
Coefficient 6 (16 bit unsigned)
7 - - - -
Coefficient 7
(8 bit unsigned)
CRC
Figure 16: Memory PROM mapping
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APPLICATION CIRCUIT
The MS5806-02BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter
applicat ions. It is desig ne d for low-voltage systems with a supply voltage of 3 V.
SPI protoco l communication
I2C protocol communication
Figure 17: Typical application circuit with SPI / I2C pr oto col c ommunication
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PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
Figure 18: P in conf igur ation and package outlines, recommended PCB footprint
PIN
NAME: I2C - SPI
TYPE
FUNCTION
1
SDI SDA
I
Serial Data Input
2
CSB
I
Chip Select (Active low)
3
VDD
P
Positive Supply Voltage
4
GND
G
Ground
5
SCLK – SCL
I
Serial Data Clock
6
SDO - NU
O
Serial Data Out
RECOMMENDED PAD LAYOUT
Figure 19: Pin configuration and package outlines, recommended PCB footprint
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SHIPPING PAC KA GE
Figure 20: Tape & reel
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MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5806-02BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacu um. Due to the l o w str ess as sembl y the sens or does not show pressur e hyst eres is ef fects.
It is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
SEALING WITH O-RINGS
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5806-02BA provides the possibility to seal with an O-ring. The protective cap of the
MS5806-02BA is made of special anticorrosive stainless steel with a polished surface. In addition to this the
MS5806-02BA is filled with silico ne gel cover ing the s ens or and t he b onding wires . The O -ring ( or O-ri ngs) s hall
be placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can
move in vertical direction.
CLEANING
The MS5806-02BA has been manufactured under cleanroom conditions. It is therefore recommended to
assem ble the sens or under class 10 ’000 or b etter co nditions . Should this not be poss ible, it is recomm ended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The
MS5806-02BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor
must be placed as close as possible to the MS5806-02BA VDD pin. This capacitor will stabilize the power
supply during data conversion and thus, provide the highest possible accuracy.
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ORDERING INFORMATION
Product Code
Product
Art. No
Delivery Form
MS5806-02BA52
MS5806-02BA I2C Miniature Altimeter Module
MS580602BA52-51
Tape& reel TOP-UP
MS5806-02BA42
MS5806-02BA SPI Miniature Altimeter Module
MS580602BA42-51
Tape& reel TOP-UP
FACTORY CONTACT S
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: pfg.cs.amerameas-spec.com
Website: www.meas-spec.com
MEAS Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: sales.chameas-spec.com
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.
No. 26 Langshan Road
Shenzhen High-Tech Park (North)
Nanshan District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asiaameas-spec.com
Website: www.meas-spec.com
The information i n this sheet has been carefully reviewed and is believed to be accurate; however, no respons i bi lit y is assumed for
inaccuracies. Furtherm ore, this i nformation does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurem ent Specialt i es, Inc. reserves the right to make changes without f urt her notice to any product herein. Measurement
Specialti es, Inc. makes no warranty, represent ation or guarant ee regarding the sui t abi lit y of its product for any particular purpose, nor does
Measurement Specialti es, Inc. assume any liabilit y arising out of the applicat i on or use of any product or circuit and specifically disclaims
any and all liabilit y, includi ng without limitation consequential or incidental damages. Typical paramet ers can and do vary in different
applicat i ons. All operat i ng parameters must be validated for each customer applic at i on by customer’s techni c al experts. Measurem ent
Specialti es, Inc. does not convey any lic ense under its patent rights nor the rights of others.
Mouser Electronics
Authorized Distributor
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