○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
. 1/15
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
TSZ22111・14・001
www.rohm.com
Voltage Detector IC Series
Low Voltage Standard
CMOS Voltage Detector ICs
BU48xx series BU49xx series
●General Description
ROHM standard CMOS reset IC series is a high-accuracy,
low current consumption reset IC series. The lineup was
established with two output types (Nch open drain and
CMOS output) and detection voltage range from 0.9V to
4.8V in increments of 0.1V, so that the series may be
selected according to the application at hand.
●Features
Ultra-low current consumption
High accuracy detection, Ultra-low voltage detection
Two output types (Nch open drain and CMOS output)
Wide operating temperature range
Very small and low height package
Package SSOP5 and SOP4 is similar to SOT-23-5 and
SC-82 respectively (JEDEC)
●Key Specifications
Detection voltage: 0.9V to 4.8V
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.55µA (Typ.)
Operating temperature range: -40°C to +125°C
●Package
SSOP5 2.90mm x 2.80mm x 1.25mm
SOP4 2.00mm x 2.10mm x 0.95mm
VSOF5 1.60mm x 1.60mm x 0.60mm
●Applications
All electronic devices that use micro controllers and logic
circuits
●Typical Application Circuit
（Open Drain Output type）
BU48xx series
（CMOS Output type）
BU49xx series
VDD1
BU48xx
VDD2
GND
CL
(Capacitor for
noise filtering)
RL
CIN
RST
Micro
controller
VDD1
BU49xx
CIN
GND
CL
(Capacitor for
noise filtering)
RST
Micro
controller
Datashee
t
2/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Connection Diagram & Pin Descriptions
SSOP5 SOP4
TOP VIEW TOP VIEW
VSOF5
TOP VIEW
●Ordering Information
B U x x x x x - T R
Part Output Type Reset Voltage Value Package Packaging and
Number 48 : Open Drain 09 : 0.9V G : SSOP5 forming specification
49 : CMOS 0.1V step F : SOP4 TR : Embossed tape
48 : 4.8V FVE : VSOF5 and reel
PIN
No.
Symbol
Function
PIN
No.
Symbol
Function
1
VOUT
Reset output
1
VOUT
Reset output
2
VDD
Power supply voltage
2
VDD
Power supply voltage
3
GND
GND
3
N.C.
Unconnected terminal
4
N.C.
Unconnected terminal
4
GND
GND
5
N.C.
Unconnected terminal
PIN
No.
Symbol
Function
1
VOUT
Reset output
2
SUB
Substrate*
3
N.C.
Unconnected terminal
4
VDD
Power supply voltage
5
GND
GND
*Connect the substrate to VDD
VDD
VOUT
SUB
N.C
.
GND
4
3
2
1
5
Marking
Lot. No
VOUT
VDD
N.C.
GND
1
2
3
4
Marking
Lot. No
VOUT
VDD
GND
N.C.
N.C.
Lot. No
Marking
3/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Lineup
Output Type
Open Drain
CMOS
Detection Voltage
Marking
Part Number
Marking
Part Number
4.8V
JR
BU4848
LH
BU4948
4.7V
JQ
BU4847
LG
BU4947
4.6V
JP
BU4846
LF
BU4946
4.5V
JN
BU4845
LE
BU4945
4.4V
JM
BU4844
LD
BU4944
4.3V
JL
BU4843
LC
BU4943
4.2V
JK
BU4842
LB
BU4942
4.1V
JJ
BU4841
LA
BU4941
4.0V
JH
BU4840
KZ
BU4940
3.9V
JG
BU4839
KY
BU4939
3.8V
JF
BU4838
KX
BU4938
3.7V
JE
BU4837
KW
BU4937
3.6V
JD
BU4836
KV
BU4936
3.5V
JC
BU4835
KU
BU4935
3.4V
JB
BU4834
KT
BU4934
3.3V
JA
BU4833
KS
BU4933
3.2V
HZ
BU4832
KR
BU4932
3.1V
HY
BU4831
KQ
BU4931
3.0V
HX
BU4830
KP
BU4930
2.9V
HW
BU4829
KN
BU4929
2.8V
HV
BU4828
KM
BU4928
2.7V
HU
BU4827
KL
BU4927
2.6V
HT
BU4826
KK
BU4926
2.5V
HS
BU4825
KJ
BU4925
2.4V
HR
BU4824
KH
BU4924
2.3V
HQ
BU4823
KG
BU4923
2.2V
HP
BU4822
KF
BU4922
2.1V
HN
BU4821
KE
BU4921
2.0V
HM
BU4820
KD
BU4920
1.9V
HL
BU4819
KC
BU4919
1.8V
HK
BU4818
KB
BU4918
1.7V
HJ
BU4817
KA
BU4917
1.6V
HH
BU4816
JZ
BU4916
1.5V
HG
BU4815
JY
BU4915
1.4V
HF
BU4814
JX
BU4914
1.3V
HE
BU4813
JW
BU4913
1.2V
HD
BU4812
JV
BU4912
1.1V
HC
BU4811
JU
BU4911
1.0V
HB
BU4810
JT
BU4910
0.9V
HA
BU4809
JS
BU4909
4/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD
-0.3 to +7
V
Output Voltage
Nch Open Drain Output
VOUT
GND-0.3 to +7
V
CMOS Output
GND-0.3 to VDD+0.3
Output Current
Io
70
mA
Power
Dissipation
SSOP5 *1*4
Pd
540
mW
SOP4 *2*4
400
VSOF5 *3*4
210
Operation Temperature Range
Topt
-40 to +125
°C
Ambient Storage Temperature
Tstg
-55 to +125
℃
*1 When used at temperatures higher than Ta=25℃, the power is reduced by 5.4mW per 1℃ above 25℃.
*2 When used at temperatures higher than Ta=25℃, the power is reduced by 4.0mW per 1℃ above 25℃.
*3 When used at temperatures higher than Ta=25℃, the power is reduced by 2.1mW per 1℃ above 25℃.
*4 When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.
●Electrical Characteristics
Parameter
Symbol
Condition
Limits
Unit
Min.
Typ.
Max.
Detection Voltage
VDET
VDD=HL , Ta=25℃,RL=470kΩ
VDET(T)
×0.99
VDET(T)
VDET(T)
×1.01
V
VDET=1.8V
Ta=+25°C
1.782
1.8
1.818
Ta=-40°C to 85°C
1.741
-
1.860
Ta=85°C to 125°C
1.718
-
1.883
VDET=2.5V
Ta=+25°C
2.475
2.5
2.525
Ta=-40°C to 85°C
2.418
-
2.584
Ta=85°C to 125°C
2.386
-
2.615
VDET=3.0V
Ta=+25°C
2.970
3.0
3.030
Ta=-40°C to 85°C
2.901
-
3.100
Ta=85°C to 125°C
2.864
-
3.139
VDET=3.3V
Ta=+25°C
3.267
3.3
3.333
Ta=-40°C to 85°C
3.191
-
3.410
Ta=85°C to 125°C
3.150
-
3.452
VDET=4.2V
Ta=+25°C
4.158
4.2
4.242
Ta=-40°C to 85°C
4.061
-
4.341
Ta=85°C to 125°C
4.009
-
4.394
Detection Voltage
Temperature Coefficient
VDET/∆T
Ta=-40℃ to 125℃ *1
-
±30
-
ppm/℃
Hysteresis Voltage
∆VDET
VDD=LHL
Ta=-40℃ to 125℃
RL=470kΩ
VDET≤1.0V
VDET
×0.03
VDET
×0.05
VDET
×0.08
V
VDET≥1.1V
VDET
×0.03
VDET
×0.05
VDET
×0.07
*1 Guaranteed by design.(Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
5/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
Unless Otherwise Specified Ta=-25 to 125℃
Parameter
Symbol
Condition
Limit
Unit
Min.
Typ.
Max.
Circuit Current when ON
IDD1
VDD=VDET-0.2V
VDET=0.9-1.3V
-
0.15
0.88
µA
VDET=1.4-2.1V
-
0.20
1.05
VDET=2.2-2.7V
-
0.25
1.23
VDET=2.8-3.3V
-
0.30
1.40
VDET=3.4-4.2V
-
0.35
1.58
VDET=4.3-4.8V
-
0.40
1.75
Circuit Current when OFF
IDD2
VDD=VDET+2.0V
VDET=0.9-1.3V
-
0.30
1.40
µA
VDET=1.4-2.1V
-
0.35
1.58
VDET=2.2-2.7V
-
0.40
1.75
VDET=2.8-3.3V
-
0.45
1.93
VDET=3.4-4.2V
-
0.50
2.10
VDET=4.3-4.8V
-
0.55
2.28
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=25 to 125℃, RL=470kΩ
0.70
-
-
V
VOL≤0.4V, Ta=-40 to 25℃, RL=470kΩ
0.90
-
-
‘Low’ Output Voltage (Nch)
VOL
VDD=0.85V, ISINK = 20 µA
-
-
0.05
V
VDD=1.5V, ISINK = 1 mA, VDET=1.7-4.8V
-
-
0.5
V
VDD=2.4V, ISINK = 4 mA, VDET=2.7-4.8V
-
-
0.5
‘High’ Output Voltage (Pch)
(only BU49xx)
VOH
VDD=4.8V,ISOURCE=1.7mA,
VDET=0.9V to 3.9V
VDD-0.5
-
-
V
VDD=6.0V,ISOURCE=2.0mA,
VDET=4.0V to 4.8V
VDD-0.5
-
-
Output Leak Current when
OFF
(only BU48xx)
Ileak
VDD=VDS=7V
Ta=-40℃ to 85℃
-
0
0.1
µA
VDD=VDS=7V
Ta=85℃ to 125℃
-
0
1
* This product is not designed for protection against radioactive rays.
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
●Block Diagrams
Vref
VOUT
VDD
GND
Fig.1 BU48xx Series
Vref
VOUT
VDD
GND
Fig.2 BU49xx Series
6/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves
Fig.3 Circuit Current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0 1 2 3 4 5 6 7
VDD SUPPLY VOLTAGE ：VDD[V]
CIRCUIT CURRENT ： IDD[μA]
【BU4816F】
0
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]
"LOW" OUTPUT CURRENT ： I
OL[mA]
VDD=1.2V
【BU4816F】
Fig.4 “LOW” Output Current
0
5
10
15
20
25
0 1 2 3 4 5 6
DRAIN-SOURCE VOLTAGE ： VDS[V]
"HIGH" OUTPUT CURRENT ：
IOH[mA]
【BU4916F】
VDD=6.0V
VDD=4.8V
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
0
1
2
3
4
5
6
7
0 1 2 3 4 5 6 7
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE
： V
OUT[V]
【BU4816F】
【BU4816】
【BU4916】
【BU4916】
【BU4816】
【BU4916】
【BU4816】
【BU4916】
7/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.1
0.2
0.3
0.4
0.5
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN ON ： I DD1[μA ]
【BU4816F】
Fig.9 Circuit Current when ON
Fig.10 Circuit Current when OFF
0.0
0.2
0.4
0.6
0.8
1.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN OFF ： IDD2[μA ]
【BU4816F】
Fig.8 Detecting Voltage
Release Voltage
1.0
1.5
2.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
DETECTION VOLTAGE
： V
DET
[V]
Low to high(VDET+ΔVDET)
High to low(VDET)
【BU4816F】
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5 2.0 2.5
VDD SUPPLY VOLTAGE ： VDD[V]
OUTPUT VOLTAGE
： V
OUT[V]
【BU4816F】
Fig.7 Operating Limit Voltage
【BU4816】
【BU4916】
【BU4816】
【BU4916】
【BU4816】
【BU4916】
【BU4816】
【BU4916】
8/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.2
0.4
0.6
0.8
1.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
MINIMUM OPERATING VO LTAGE ： V OPL [V]
【BU4816F】
Fig.11 Operating Limit Voltage
【BU4816】
【BU4916】
9/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Application Information
Explanation of Operation
For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU48xx series uses an open drain output
type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this
case becomes VDD or the voltage of the other power supply].
Fig.12 (BU48xx type internal block diagram) Fig.13 (BU49xx type internal block diagram)
Reference Data
Examples of Output rising value(tPLH)and Output falling value(tPHL)
Part Number
tPLH[µs]
tPHL[µs]
BU4845
23.3
275.9
BU4945
3.5
354.3
VDD=4.3V5.1V
VDD=5.1V4.3V
* This data is for reference only.
This figure will vary with the application, so please confirm actual operation conditions before use.
Timing Waveforms
Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.12 and 13). ①When the power supply is turned on, the output is unsettled
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted
when the rise time of VDD is faster than tPHL.
②When VDD is greater than VOPL but less than the reset release
voltage (VDET + VDET), output (VOUT) voltages will switch to L.
③If VDD exceeds the reset release voltage (VDET + VDET), then
VOUT switches from L to H (with a delay of tPLH).
④If VDD drops below the detection voltage (VDET) when the
power supply is powered down or when there is a power
supply fluctuation, VOUT switches to L (with a delay of tPHL).
⑤The potential deference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The
system is designed such that the output does not flip-flop with
power supply fluctuations within this hysteresis width,
preventing malfunctions due to noise.
Q1
Vref
R1
R2
R3
VOUT
VDD
GND
RL
VDD
RESET
Q2
Q1
Vref
R1
R2
R3
VOUT
VDD
GND
RESET
VDD
VDET+ΔVDET
VDET
VOPL
0V
tPHL
①
②
VOUT
tPLH
tPHL
tPLH
③
④
VOL
VOH
⑤
Fig.14 Timing Waveforms
10/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Circuit Applications
1) Examples of a common power supply detection reset circuit
Application examples of BU48xx series
(Open Drain output type) and BU49xx series
(CMOS output type) are shown below.
CASE1:The power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection (V DD1).
Use the Open Drain Output Type (BU48xx series).
Attach a load resistance (RL) between the output and
VDD2. (As shown Fig.15)
CASE2:The power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BU43xx series) or Open Drain
Output Type (BU48xx series). Attach a load
resistance (RL) between the output and VDD1.
(As shown Fig.16)
When a capacitance CL for noise filtering for setting the
output delay time is connected to the VOUT pin (the reset
signal input terminal of the microcontroller), please take
into account the waveform of the rise and fall of the output
voltage (VOUT).
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU48xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
VDD1
BU48xx
VDD2
GND
CL
(Capacitor for
noise filtering)
RL
CIN
RST
Micro
controller
CL
(Capacitor for
noise filtering)
VDD1
BU49xx
CIN
GND
RST
Micro
controller
Fig.15 Open Drain Output type
Fig.16 CMOS Output type
VDD1
VDD3
GND
RST
microcontroller
RL
VDD2
BU48Exxx
NO.1
BU48xx
NO.2
Fig.17
11/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
3) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC is connected through resistor
dividers, it is possible that a through current will momentarily flow into the circuit when the output logic
switches, resulting in malfunctions (such as output oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when
the output level switches from “High” to “Low” or vice versa.)
Fig.18
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and
the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage
decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this
time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a
result, the output switches from “Low” to “High”, which again causes the through current to flow and the
voltage drop. This process is repeated, resulting in oscillation.
Consider the use of BD48xx when the power supply input it with resistor dividers.
Fig.19 Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
VOUT
R2
VDD
BU48xx
BU49xx
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
Through
Current
0.001
0.01
0.1
1
10
345678910
IDD-peak[mA]
VDD[V]
VDD - IDD Peak Current Ta=25°C
BU49xx,BU43xx
BU48xx,BU42xx
BD52xx
BD53xx
Temp - IDD(BU42xx)
0.0
0.5
1.0
1.5
2.0
2.5
-50 -30 -10 10 30 50 70 90 110 130
Temp
IDD peak Current[mA]
VDD3V
VDD6V
VDD7V
VDD4V
12/15
BU48xx series BU49xx series
TSZ02201-0R7R0G300060-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
02.Nov.2015 Rev.012
www.rohm.com
TSZ22111・15・001
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) The recommended value of RL Resistor is over 10kΩ for VDET=1.5V to 4.8V, and over 100kΩ for VDET=0.9V to 1.4V.
11) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.
12) External parameters
The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
13) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
14) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
15) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary elec tronic eq uipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted pro ducts in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depen ding on ambient temperatur e. When used in sealed area, confirm that it is the us e in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant co ndition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flu x may negatively affect prod uct
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall no t be in any way responsible or liable for any d amag es, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to s ea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, sold erability of products out of recommende d storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Pr oducts of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduc ed, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
