BM2P249Q-Z - ROHM SEMICONDUCTOR

Datasheet

○Product structure : Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays

1/19 TSZ02201-0F1F0A200230-1-2

19.Oct.2016.Rev.002

TSZ22111・14・001

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AC/DC Convertor IC

PWM type DC/DC converter IC

Integrated Switching MOSFET for non-Isolated type

BM2P249Q

General

The PWM type DC/DC converter series for AC/DC

provides an optimum system for all products that

include an electrical outlet. It enables simpler design of

a high effective converter specializing in 100kHz

on-isolated devices.

This series has a built-in HV starter circuit that

tolerates 650V, and it contributes to low power

consumption. With a current detection resistor as

internal device, it can be designed as small power

supply. Since current mode control is utilized, current

is restricted in each cycle and excellent performance is

demonstrated in bandwidth and transient response.

The switching frequency is fixed to 100 kHz. At light

load, the switching frequency is reduced and high

efficiency is achieved. A frequency hopping function is

also on chip, and it contributes to low EMI. In addition,

a built-in super junction MOSFET which tolerates 650V

makes the design easy.

Features

 PWM frequency: 100kHz

 PWM current mode method

 Frequency hopping function

 Burst operation at light load

 Frequency reduction function

 Built-in 650V start circuit

 Built-in 650V switching MOSFET

 VCC pin under voltage protection

 VCC pin over voltage protection

 Over current limiter function per cycle

 Soft start function

Basic Specification

■Power Supply Voltage Operation Range:

VCC: 8.00V to 26.50V

DRAIN: to 650V

■Normal Operation Current 0.60mA (Typ.)

■Burst Operation Current 0.35mA(Typ.)

■Oscillation Frequency 100kHz(Typ.)

■Operation Temperature Range - 40 oC to +105 oC

■MOSFET ON resistor: 9.5Ω (Typ.)

Package

DIP7K: 9.20mm×6.35mm×4.30mm pitch 2.54mm

(Typ.) (Typ.) (Max.) (Typ.)

Application

Households such as LED lights, air conditioners, and

cleaners, etc.).

Application circuit

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Datasheet

BM2P249Q

TSZ02201-0F1F0A200230-1-2

19.Oct.2016.Rev.002

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TSZ22111・15・001

●Pin Descriptions

NO. 端子名 I/O 機能 ESD Diode

VCC GND_IC

1 - - - - -

2 - - - - -

3 GND_IC I/O GND pin ✔ -

4 - - - - -

5 VCC I Power Supply input pin - ✔

6 DRAIN I/O MOSFET DRAIN pin - ✔

7 DRAIN I/O MOSFET DRAIN pin - ✔

●Block Diagram

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Datasheet

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TSZ02201-0F1F0A200230-1-2

19.Oct.2016.Rev.002

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TSZ22111・15・001

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit Conditions

Maximum applied voltage 1 Vmax1 -0.3～650 V DRAIN

Maximum applied voltage 2 Vmax2 -0.3～32.0 V VCC

DRAIN current DC IDD1 1.30 A Consecutive operation

Allowable dissipation Pd 1.00 W

Operating temperature range Topr -40 ～ +105 oC Surrounding temperature

Maximum Junction Temperature T

+150 oC

Storage temperature range Tstr -55 ～ +150 oC

(Note1) Derate by 8mW/°C when operating above Ta = 25°C when mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the

absolute maximum ratings.

Recommended operating condition (Ta=25℃)

Parameter Symbol Rating Unit Conditions

Power supply voltage range 1 VDRAIN ~650 V DRAIN

Power supply voltage range 2 VCC 8.00～26.50 V

VCC

Electrical Characteristics in MOSFET part (Unless otherwise no ted, Ta=25℃ VCC=15V)

Parameter Symbol Specifications Unit Conditions

Minimum Standard Maximum

Voltage between DRAIN and

SOURCE V(BR)DDS 650 - - V ID=1mA / VGS=0V

DRAIN leak current IDSS - 0 100 uA VDS=650V / VGS=0V

ON resistor RDS

(

)

- 9.5 12.5 Ω I

D=0.25A / VGS=10V

Electrical Characteristics in Start circu its part (Unless otherwise noted, Ta=25℃ VCC=15V)

Parameter Symbol Specifications Unit Conditions

Minimum Standard Maximum

Start current 1 ISTART1 0.150 0.300 2.800 mA VCC= 0V

Start current 2 ISTART2 1.000 3.000 6.000 mA VCC=10V

OFF current ISTART3 - 10 20 uA After UVLO is released

Start current switching voltage VSC 0.400 0.800 1.300 V

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Electrical Characteristics in Control IC part (Unless otherwise noted, Ta=25℃ VCC=15V)

Parameter Symbol

Specifications Unit Conditions

Minimum Standard Maximum

[Circuit current]

Circuit current (ON) 1a ION1a - 600 900 μA At pulse operation

Drain = open

Circuit current (ON) 2 ION2 200 350 450 μA At burst operation

[VCC pin protection function]

VCC UVLO voltage 1 VUVLO1 8.10 8.80 9.50 V At VCC rising

VCC UVLO voltage 2 VUVLO2 6.60 7.30 8.00 V At VCC dropping

VCC UVLO hysteresis VUVLO3 - 1.50 - V VUVLO3= VUVLO1- VUVLO2

VCC recharge start voltage VCHG1 7.00 7.70 8.40 V

VCC recharge stop voltage VCHG2 7.40 8.10 8.80 V

VCC recharge hysteresis VCHG3 0.20 0.40 0.70 V

VCC control voltage VCNT 24.50 24.80 25.10 V

VCC OVP voltage 1 VOVP1 26.50 28.52 30.50 V At VCC rising

VCC OVP voltage 2 VOVP2 25.26 27.28 29.26 V At VCC dropping

VCC OVP hysteresis VOVP3 - 1.24 - V

VCC OVP timer TCOMP 50 100 150 us

Over temperature protection 1 TSD1 120 150 - C Control IC part

At temperature rising

Over temperature protection 2 TSD2 - 85 - C Control IC part

At temperature dropping

Over temperature protection

hysteresis TSD3 - 65 - C

[PWM type DC/DC driver block]

Oscillation frequency 1 FSW1 94 100 106 KHz

Oscillation frequency 2 FSW2 23 38 53 KHz

Frequency hopping width FDEL - 6.0 - KHz

Maximum duty Dmax 35 40 45 %

FB OLP ON detection timer TFOLP1 40 64 88 ms

FB OLP OFF detection timer TFOLP2 332 512 692 ms

[Over current detection block]

Over current detection current IPEAK 0.700 0.800 0.900 A

Dynamic over current detection

voltage IDPEAK 1.900 2.200 2.500 A

Dynamic over current enforced

OFF time TDPEAK 64 128 170 us

Leading Edge Blanking time TLEB - (150) - ns *1

MIN ON width TMINON - (400) - ns *1

*1 Design guarantee data

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Description of Blocks

(1)Back con verter

This is the IC for exclusive use of non-isolated type back converter.

(1-1) when the MOSFET for switching is ON

When the MOSFET turns ON, current IL flows to coil L and energy is stored. At this moment, the voltage of GND_IC

becomes the voltage near DRAIN pin, and the diode D1 is OFF.

IL ＝ (VIN-VOUT) / L * Ton

GND

VOUT

Input

Filter

DRAIN

VCC

GND_IC

6DRAIN

ON Curent IL

Figure 1. Back converter operation (MOSFET=ON)

(1-2) when the MOSFET for switching is OFF

When the MOSFET turns OFF, the energy stored in coil is output via diode. At the moment, the MOSFET is OFF.

IL ＝ (VOUT) / L * Toff

GND

VOUT

Input

Filter

DRAIN

VCC

GND_IC

6DRAIN

OFF Curent IL

Figure 2. Back converter operation (MOSFET=OFF)

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(2) Start sequences (start-up operation, ligh t load operation, over load protection function)

Start sequences are shown in Figure 3. See the sections below for detailed descriptions.

DRAIN-GND

VCC - GND_IC

VOUT - GND

IOUT

NORMAL

LOAD

LIGHT

LOAD

OVER

LOAD

SWITCHING

Internal 64ms

64ms

OVER

LOAD

64ms

512ms

OLP setting

BURST

MODE

CDEF GHI J K

VCHG1

VCHG2

VUVLO1

VUVLO2

Figure 3. Start sequences timing chart

A: Input voltage is applied to the DRAIN pin and the VCC pin voltage rises.

B: If the VCC pin voltage exceeds VUVLO1, the IC starts to operate. And if the IC judges the other protection functions as

normal condition, it starts switching operation. The soft start function limits the over current limiter value to prevent

any excessive voltage or current rising. When the switching operation starts, the VOUT rises.

C: Till the secondary input voltage becomes constant value from starting-up, the VCC pin voltage drops by the VCC pin

consumption current.

D: After switching starts, it is necessary that the output voltage is set to rating voltage within TFOLP (64ms typ.).

E: At light load, the IC starts burst operation to restrict the consumption power.

F: When the load exceeds a certain electric power, the IC starts over load operation.

G: If the setting over load status lasts for T FOLP (64ms typ.), switching is turned OFF.

H: When the VCC pin voltage becomes less than VCHG1, recharge operation is started.

I: When the VCC pin voltage becomes more than VCHG2, recharge operation is stopped.

J: After T OLPST (512ms typ.), the over load protection circuit starts switching.

K: Same as G

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(3) Stop sequences

Stop sequences are shown in Figure 4.

DRAIN-GND

VCC-GND_IC

VOUT-GND

IOUT

NORMAL

LOAD

OVER

LOAD

SWITCHING

64ms

ABCDEF

AC VOLTAGE 0.0V

VUVLO1

VUVLO2

VCHG2

VCHG1

Figure 4. Stop sequences timing chart

A: Normal operation

B: The input AC voltage is stopped. The DRAIN voltage starts to drop.

C: If the DRAIN voltage drops below a certain voltage, it becomes MAX duty and over load protection operates.

D: If the output voltage drops, the VCC pin voltage, too. And recharge operation is started.

E: The recharge operation is stopped.

F: If the DRAIN voltage drops below a certain voltage, the VCC pin voltage lowers below UVLO in order to stop

recharge operation.

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TSZ02201-0F1F0A200230-1-2

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TSZ22111・15・001

(4) Start circuit

This IC enables low standby electric power and high-speed startup because it has a built-in start circuit. The

consumption current after startup is only idling current IDSS (typ=10uA). The startup current flows from the DRAIN pin.

Figure 5. Start circuit

Figure 6. Start up current vs. VCC voltage

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(5) VCC pin protection function

This IC has the internal protection function at the VCC pin shown in below.

1) Under voltage protection function UVLO (Under Voltage Locked Out)

2) Over voltage protection function VCC OVP (Over Voltage Protection)

3) VCC recharge function

(5-1) VCC UVLO / VCC OVP function

VCC UVLO function and VCC OVP function are auto recovery type comparators that have voltage hysteresis. VCC OVP

has an internal mask time. If the condition that the VCC pin voltage is higher than VOVP1 lasts for TCOMP (100us typ.), it

performs detection. The recovery requirements are that the VCC pin voltage is lower than VOVP2

(5-2)VCC recharge function

If the VCC pin drops to VCHC1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the

VCC charge function operates. At that time, the VCC pin is charged from DRAIN pin through start circuit. When the

VCC pin voltage raises to VCHG2 or above, charge is stopped.

Figure 7. VCC UVLO / VCC OVP / VCC Recharge Function timing chart

A: Input voltage is applied to the DRAIN pin and the VCC pin voltage rises.

B: When the VCC pin voltage becomes higher than VUVLO1, the IC starts operating. And if the IC judges the other

protection functions as normal condition, it starts switching operation. The soft start function limits the over current

limiter value to prevent any excessive voltage or current rising. When the switching operation starts, the VOUT rises.

C: When the VCC pin voltage becomes higher than VOVP1, VCC OVP timer operates.

D: When the condition that the VCC pin voltage is higher than VOVP1 lasts for TLATCH (typ=100us), the IC detects VCC

OVP and stops switching.

E: When the VCC pin voltage becomes higher than VOVP2, VCC OVP is released.

F: When the input power supply is turned OFF, the DRAIN pin voltage drops.

G: When the VCC pin voltage becomes less than VCHG1, recharge function is started.

H: When the VCC pin voltage becomes higher than VCHG2, recharge function is stopped.

I: When the VCC pin voltage becomes lower than VCHG1, recharge function is started. However the supply to the VCC

pin decrease and the VCC pin voltage drops because of low DRAIN voltage.

J: When the VCC pin voltage becomes lower than VUVLO2, VCC UVLO function starts operating.

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TSZ22111・15・001

(6) DC/DC driver

This performs current mode PMW control. An internal oscillator sets a fixed switching frequency FSW (typ=100 kHz).

This IC has a built-in switching frequency hopping function. The maximum duty is Dmax (40% typ). To achieve the low

consumption power at light load, it also has an internal burst mode circuit and a frequency reduction circuit.

(6-1) Setting of the output voltage

Adopting the non-isolated type without photo coupler, the VCC voltage should be set to rating value.

The VCC voltage means the voltage between the VCC pin and GND_IC pin. The output voltage VOUT is defined by

the formula below. The voltage when the MOSFET is OFF is shown in Figure 8.

VOUT = V

CNT ＋ VFD2 – VFD1

VFD1：Forward voltage of diode D1 VFD2：Forward voltage of diode D2

Figure 8. Back converter circuit (At MOSFET turned OFF)

At light load, the output voltage may rise because the VCC voltage is difference from the output voltage. In this case, it

is necessary that the output pin is connected to resistor and the voltage should be lowered. The circuit diagram is

shown in Figure 9.

Figure 9. Voltage rising measure circuit at light load

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This IC has a few external parts by fixing the VCC voltage and it enables simpler design. If you adjust the output

voltage which is out of lineup, it can become the variable voltage by adding zener diodes. However it is necessary to

consider the dispersion of the diodes.

The output voltage VOUT is defined by the formula below. The voltage when the MOSFET is OFF is shown in Figure

10.

VOUT = V

CNT ＋ VFD2 – VFD1 ＋ VZD1

VFD1: Forward voltage of diode D1

VFD2: Forward voltage of diode D2

VZD1: Zener diode ZD1 voltage

Figure 10. Back converter output dispersion circuit (MOSFET is OFF)

(6-2) Frequency reduction circuit

mode1: burst operation

mode2: frequency reduction operation (It reduces the frequency)

mode3: fixed frequency operation (It operates in max frequency)

mode4: over load operation (pulse operation is stopped and burst operation is started.)

Figure 11. State transition of switching frequency

(6-3) Frequency hopping function

Frequency hopping function achieves low EMI by change the frequency at random. The wave width of frequency’s

upper limit is +-6% for basic frequency,

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(6-4) PWM error amplifier and PWM comparator

The internal error amplifier achieves the reduction of external parts. In addition, this IC adopts current mode method. It

makes the design easy.

(6-5) Over current limiter

This IC has an internal over current limiter per switching cycle. This function monitors the coil current and if it exceeds

a certain current, the IC stops switching. Additionally, an internal current detection resistor contributes to reduction of

parts and improvement of efficiency. The peak current by which the IC switches to the over load mode is determined by

the formula below.

Peak current = IPEAK + (VDRAIN –VOUT) / L * Tdelay

IPEAK: Over current limiter internal the IC

VDRAIN: DRAIN voltage

VOUT: Output voltage

L: Coil value

Tdelay: Delay time after detection of over current limiter

(6-6) Dynamic over current limiter

This IC has a built-in dynamic over current limiter circuit. When the coil current exceeds IDPEAK1 (2.200A typ.) in

succession twice, it stops pulse operation for TDPEAK (128us typ.).

Figure 12. State transition of switching frequency

A: Normal operation

B: When the condition that IL is higher than IDPEAK1 is detected in succession twice, the IC stops DC/DC operation.

C: After TDPEAK (typ=128us), the IC restarts DC/DC operation.

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(6-7) Soft start operation

At starting up, this function controls the over current limiter value in order to prevent any excessive voltage or current

rising. The details are shown in Figure 13. The IC enables the soft start operation by changing the over current limiter

value with time.

Figure 13. Soft start operation

(7) Output over load protection function (O LP comparator)

Output over protection function monitors load status and stops switching at over load. In the over load condition, the

output voltage lowers, so the IC stops switching by judging the status as over load, if a state with more than of electric

power set in the IC inside continues for TFOLP1 (64ms typ). The recovery after detection of FBOLP is TFOLP2 (512ms typ)

later.

(8) Temperature protection circuit

Temperature protection circuit stops the oscillation of DC/DC if the IC becomes more than a certain temperature.

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Operation mode of protection circuits

The operation mode of protection functions are shown in Table 1.

Table 1. The operation mode of protection functions

Function

VCC pin

Under voltage

protection

VCC pin

Over voltage

protection

Over temperature

protection

Over power

protection

Detection 7.30V

(at rising voltage)

28.52V

(at rising voltage)

150℃

(at rising

temperature)

more than the

current detected

by over current

detection

Release 8.80V

(at falling voltage)

27.28 V

(at falling voltage)

85 oC

(at falling

temperature)

under over current

detection

Detection timer - 100us 100us 64ms

Release timer - - - 512ms

Type Auto recovery Auto recovery Auto recovery Auto recovery

Timer reset

condition 1 - VCC UVLO

detection

VCC UVLO

detection

VCC UVLO

detection

Timer reset

condition 2 -

release condition

detection condition

release condition

detection condition

release condition

detection condition

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Thermal loss

The thermal design should set operation for the following conditions.

1. The ambient temperature Ta must be 105 oC or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement characteristics are as follows.

(PCB: 70mm×70mm×1.6mm mounted on glass epoxy substrate)

Figure 14. Thermal Abatement Characteristics

I/O Equivalent Circuit Diagram

7 6 5

GND_IC

VCC

DRAIN

GND_IC

DRAIN

GND_IC

Internal

MOSFET

1 2 3 4Non ConnectionNon Connection

DRAIN

GND_IC

Internal

MOSFET

DRAIN

Non Connection

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 25 50 75 100 125 150

Pd[W]

Ta[℃]

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Figure Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be

powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the

OFF state even if the TJ falls below the TSD threshold.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

16. Over Curren t Pro t ection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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Ordering Information

B M 2 P 2 4 9 Q -

Product name

Package

Blank: DIP7K Packaging and forming specification

Blank: embossed tape reel form

Physical Dimension Tape and Reel Information

DIP7K

Making Diagram

DIP7K

BM2P249Q

21 43

67 5

Part Number Marking

LOT Number

∗

Order quantity needs to be multiple of the minimum quantity.

TubeContainer

Quantity

Direction of feed 2000pcs

Direction of products is fixed in a container tube

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TSZ22111・15・001

date Rev. NO. Revision Point

2016/7/11 001 New release

2016/10/19 002 P3 Start current 1 limit change

P4 Oscillation frequency 2 limit change

Notice-PGA-E Rev.003

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or

concerning such information.

Datasheet

Part Number bm2p249q

Package DIP7

Unit Quantity 2000

Minimum Package Quantity 2000

Packing Type Tube

Constitution Materials List inquiry

RoHS Yes

bm2p249q - Web Page

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