(0.80 mm) .0315" QRM8 SERIES
QRM8–078–05.0–L–D–A
QRM8–026–02.0–L–D–A
QRM8–036–05.0–L–D–DP–A–K
Integral
ground/power
plane
Choice of
stack heights
Increased wipe for
rugged applications
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(0.80) .0315
(1.00)
.039
DIA
01
02
(4.60)
.181
No. of Banks x (24.80) .976 + (1.77) .070
No. of Banks x (24.80) .976 - (1.10) .043
No. of Banks x (24.80) .976 + (3.55) .140
A
B
(1.32)
.052
(3.67)
.145
(3.18)
.125
(2.20)
.087
(1.89)
.074
For complete specifications and
recommended PCB layouts see
www.samtec.com?QRM8
Insulator Material:
Black LCP
Terminal & Ground
Plane Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2.2 A per pin
(2 pins powered)
Ground:
8.5 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
215 VAC
RoHS Compliant:
Ye s
Board Mates:
QRF8
Cable Mates:
EQRD
–GP OPTION
SLIM BODY GROUND PLANE HEADER
–GP
= Guide Post
(Requires –GP on
mating connector)
–K
= (5.00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
–TR
= Tape & Reel
(–018, –026,
–036, –052 only)
–D
= Single-
Ended
–D–DP
= Differential
Pair
QRM8 PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–026, –052, –078
(52 total pins per bank = –D)
–018, –036, –054
(18 pairs per bank = –D–DP)
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
LEAD
STYLE TYPE AOTHER
OPTION
–02.0
= 2 mm
Body Height
(Not available
with –054 &
–078 positions)
–05.0
= 5 mm
Body Height
–07.0
= 7 mm
Body Height
LEAD
STYLE A B
–02.0 (4.81)
.189
(6.12)
.241
–05.0 (7.81)
.307
(9.12)
.359
–07.0 (9.78)
.385
(11.12)
.438
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
(1.20 mm)
.047"
NOMINAL
WIPE
SPECIFICATIONS
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (018-026)
(0.15 mm) .006" max (036-078)*
*(.004” stencil solution
may be available; contact
IPG@samtec.com)
FILE NO. E111594
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
• Edge Rate®
contacts
• Increased contact
wipe
• 10 year MFG
• Guide post option
MATED HEIGHT*
QRM8
LEAD
STYLE
QRF8 LEAD STYLE
–05.0 –07.0
–02.0 (7.00)
.276
(9.00)
.354
–05.0 (10.00)
.394
(12.00)
.472
–07.0 (12.00)
.472
(14.00)
.551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances.
Gbps
28
HIGH-SPEED CHANNEL PERFORMANCE
QRM8-DP/QRF8-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
POWER/SIGNAL
APPLICATION
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
ALSO AVAILABLE
(MOQ Required)
• Other platings
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
F-219
