AR0130CS 1/3inch CMOS Digital Image Sensor Description ON Semiconductor AR0130 is a 1/3-inch CMOS digital image sensor with an active-pixel array of 1280H x 960V. It captures images with a rolling-shutter readout. It includes sophisticated camera functions such as auto exposure control, windowing, and both video and single frame modes. It is programmable through a simple two-wire serial interface. The AR0130 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications, including gaming systems, surveillance, and HD video. www.onsemi.com Table 1. KEY PERFORMANCE PARAMETERS Parameter PLCC48 11.43 y 11.43 CASE 776AL Typical Value Optical Format 1/3-inch (6 mm) Active Pixels 1280 (H) x 960 (V) = 1.2 Mp Pixel Size 3.75 mm Color Filter Array Monochrome, RGB Bayer Shutter Type Electronic Rolling Shutter Input Clock Range 6 - 50 MHz Output Clock Maximum 74.25 MHz Output Parallel 12-bit Max. Frame Rates 1.2 Mp (Full FOV) 720p HD (Reduced FOV) VGA (Full FOV) VGA (Reduced FOV) 800 x 800 (Reduced FOV) 45 fps 60 fps 45 fps 60 fps 60 fps Responsivity at 550 nm Monochrome RGB Green 6.5 V/lux-sec 5.6 V/lux-sec SNRMAX 44 dB Dynamic Range 82 dB Supply Voltage I/O Digital Analog 1.8 or 2.8 V 1.8 V 2.8 V Power Consumption 270 mW (1280 x 720 60 fps) Operating Temperature -30C to + 70C (Ambient) -30C to + 80C (Junction) Package Options PLCC ILCC48 10 y 10 CASE 847AC ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Features * Superior Low-light Performance Both in * * * * * * * * * VGA Mode and HD Mode Excellent Near IR Performance HD Video (720p60) On-chip AE and Statistics Engine Auto Black Level Calibration Context Switching Progressive Scan Supports 2:1 Scaling Internal Master Clock Generated by On-chip Phase Locked Loop (PLL) Oscillator Parallel Output Applications * Gaming Systems * Video Surveillance * 720p60 Video Applications 10 x 10 mm 48-pin iLCC Bare Die (c) Semiconductor Components Industries, LLC, 2016 January, 2019 - Rev. 15 1 Publication Order Number: AR0130CS/D AR0130CS ORDERING INFORMATION Table 2. ORDERABLE PART NUMBERS Part Number Base Description Variant Description AR0130CSSC00SPBA0-DP1 RGB Bayer 48-Pin PLCC Dry Pack with Protective Film AR0130CSSC00SPBA0-DR1 RGB Bayer 48-Pin PLCC Dry Pack without Protective Film AR0130CSSC00SPCA0-DPBR1 RGB Bayer 48-Pin iLCC Dry Pack with Protective Film, Double Side BBAR Glass AR0130CSSC00SPCA0-DRBR1 RGB Bayer 48-Pin iLCC Dry Pack without Protective Film, Double Side BBAR Glass AR0130CSSC00SPCAH-GEVB RGB Bayer headboard iLCC AR0130CSSC00SPCAH-S115-GEVB RGB Bayer headboard iLCC AR0130CSSC00SPCAH-S213A-GEVB RGB Bayer headboard iLCC AR0130CSSC00SPCAW-GEVB RGB Bayer headboard iLCC AR0130CSSM00SPCA0-DRBR1 Monochrome 48-Pin iLCC AR0130CSSM00SPCAH-S213A-GEVB Monochrome headboard iLCC See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention used for image sensors. For reference Dry Pack without Protective Film, Double Side BBAR Glass documentation, including information on evaluation kits, please visit our web site at www.onsemi.com. GENERAL DESCRIPTION The ON Semiconductor AR0130 can be operated in its default mode or programmed for frame size, exposure, gain, and other parameters. The default mode output is a 960p-resolution image at 45 frames per second (fps). It outputs 12-bit raw data over the parallel port. The device may be operated in video (master) mode or in single frame trigger mode. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a synchronized pixel clock in parallel mode. The AR0130 includes additional features to allow application-specific tuning: windowing and offset, adjustable auto-exposure control, and auto black level correction. Optional register information and histogram statistic information can be embedded in first and last 2 lines of the image frame. FUNCTIONAL OVERVIEW The AR0130 is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally enabled to generate all internal clocks from a single master input clock running between 6 and 50 MHz The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor. www.onsemi.com 2 AR0130CS OTPM Power Trigger Two-wire Serial Interface Active Pixel Sensor (APS) Array Timing and Control (Sequencer) Memory External Clock Auto Exposure and Stats Engine Pixel Data Path (Signal Processing) Analog Processing and A/D Conversion PLL Parallel Output Control Registers Figure 1. Block Diagram columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an analog-to-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization signals. User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 1.2 Mp Active- Pixel Sensor array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the www.onsemi.com 3 1.5 kW 2,3 1.5 kW 2 AR0130CS Digital Digital I/O Core Power1 Power1 PLL Analog Analog Power1 Power1 Power1 VDD_IO VDD_PLL Master Clock (6 - 50 MHz) VDD VAA VAA_PIX DOUT [11:0] EXTCLK PIXCLK LINE_VALID FRAME_VALID SADDR SDATA SCLK TRIGGER OE_BAR STANDBY RESET_BAR From Controller To Controller Reserved VDD_IO VDD VDD_PLL VAA DGND AGND Digital Ground Analog Ground VAA_PIX Notes: 1. All power supplies must be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed. 3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times. 4. ON Semiconductor recommends that VDD_SLVS pad (only available in bare die) is left unconnected. 5. ON Semiconductor recommends that 0.1 mF and 10 mF decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Check the AR0130 demo headboard schematics for circuit recommendations. 6. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized. 7. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage current. Figure 2. Typical Configuration: Parallel Pixel Data Interface Table 3. PAD DESCRIPTIONS Name Type Description STANDBY Input VDD_PLL Power Standby-mode enable pin (active HIGH). PLL power. VAA Power Analog power. EXTCLK Input VDD_SLVS Power External input clock. Digital power (do not connect). DGND Power Digital ground. VDD Power Digital power. AGND Power Analog ground. SADDR Input Two-Wire Serial Interface address select. SCLK Input Two-Wire Serial Interface clock input. SDATA I/O Two-Wire Serial Interface data I/O. www.onsemi.com 4 AR0130CS Table 3. PAD DESCRIPTIONS Name Type Description VAA_PIX Power Pixel power. LINE_VALID Output Asserted when DOUT line data is valid. FRAME_VALID Output Asserted when DOUT frame data is valid. PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock. VDD_IO Power I/O supply power. DOUT8 Output Parallel pixel data output. DOUT9 Output Parallel pixel data output. DOUT10 Output Parallel pixel data output. DOUT11 Output Parallel pixel data output (MSB) Reserved Input DOUT4 Output Parallel pixel data output. DOUT5 Output Parallel pixel data output. DOUT6 Output Parallel pixel data output. DOUT7 Output Parallel pixel data output. TRIGGER Input Exposure synchronization input. OE_BAR Input Output enable (active LOW). DOUT0 Output Parallel pixel data output (LSB) DOUT1 Output Parallel pixel data output. DOUT2 Output Parallel pixel data output. DOUT3 Output Parallel pixel data output. RESET_BAR Input FLASH Output NC Input Connect to DGND. Asynchronous reset (active LOW). All settings are restored to factory default. Flash control output. Do not connect. www.onsemi.com 5 DGND EXTCLK VDD_PLL DOUT6 DOUT5 DOUT4 DOUT3 DOUT2 DOUT1 DOUT0 DGND NC AR0130CS 6 5 4 3 2 1 48 47 46 45 44 43 10 39 AGND DOUT11 11 38 VAA_PIX VDD_IO 12 37 VAA_PIX PIXCLK 13 36 VAA VDD 14 35 AGND SCLK 15 34 VAA SDATA 16 33 NC RESET_BAR 17 32 NC VDD_IO 18 31 NC 19 20 21 22 23 24 25 26 27 28 29 30 DGND DOUT10 LINE_VALID VAA FRAME_VALID 40 TRIGGER 9 FLASH DOUT9 RESERVED NC SADDR 41 OE_BAR DOUT8 STANDBY NC 8 NC 42 NC 7 VDD DOUT7 Figure 3. 48-Pin iLCC Pinout Diagram www.onsemi.com 6 AGND VAA VAA VAA AGND AGND VDD_PLL DGND VDD VDD DGND DGND AR0130CS AGND VDD_IO VAA_PIX VDD_IO VAA_PIX SCLK SADDR AGND EXTCLK AGND PIXCLK NC FLASH NC SDATA NC VDD FRAME_VALID TRIGGER LINE_VALID Figure 4. 48-Pin PLCC Pinout Diagram www.onsemi.com 7 RESET_BAR Top View STANDBY DOUT0 DOUT1 DOUT2 DOUT3 DOUT4 DOUT5 DOUT6 Reserved DOUT7 DOUT10 DOUT8 OE_BAR DOUT9 DOUT11 AR0130CS PIXEL DATA FORMAT Pixel Array Structure format is 1280 x 960, the additional active columns and active rows are included for use when horizontal or vertical mirrored readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is always performed for monochrome or color versions. The active area is surrounded with optically transparent dummy pixels to improve image uniformity within the active area. Not all dummy pixels or barrier pixels can be read out. The AR0130 pixel array is configured as 1412 columns by 1028 rows, (see Figure 5). The dark pixels are optically black and are used internally to monitor black level. Of the right 108 columns, 64 are dark pixels used for row noise correction. Of the top 24 rows of pixels, 12 of the dark rows are used for black level correction. There are 1296 columns by 976 rows of optically active pixels. While the sensor's 1412 1028 2 Light Dummy + 4 Barrier + 24 Dark + 4 Barrier + 6 Dark Dummy 2 Light Dummy + 4 Barrier + 100 Dark + 4 Barrier 1296 x 976 (1288 x 968 Active) 4.86 x 3.66 mm2 (4.83 x 3.63 mm2) 2 Light Dummy + 4 Barrier + 6 Dark Dummy 2 Light Dummy + 4 Barrier Dark Pixel Light Dummy Pixel Barrier Pixel Active Pixel Figure 5. Pixel Array Description ... Column Readout Direction Row Readout Direction Active Pixel (0, 0) Array Pixel (112, 44) ... R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B R G R G R G R G G B G B G B G B Figure 6. Pixel Color Pattern Detail (Top Right Corner) Default Readout Order By convention, the sensor core pixel array is shown with the first addressable (logical) pixel (0,0) in the top right corner (see Figure 6). This reflects the actual layout of the array on the die. Also, the physical location of the first pixel data read out of the sensor in default condition is that of pixel (112, 44). www.onsemi.com 8 AR0130CS When the sensor is imaging, the active surface of the sensor faces the scene as shown in Figure 7. When the image is read out of the sensor, it is read one row at a time, with the rows and columns sequenced as shown in Figure 7. Lens Scene Sensor (rear view) Order Column Readout Order Pixel (0,0) Figure 7. Imaging a Scene www.onsemi.com 9 AR0130CS OUTPUT DATA FORMAT The AR0130 image data is read out in a progressive scan. Valid image data is surrounded by horizontal and vertical blanking (see Figure 8). The amount of horizontal row time (in clocks) is programmable through R0x300C. The amount of vertical frame time (in rows) is programmable through R0x300A. LINE_VALID (LV) is HIGH during the shaded region of Figure 8. Optional Embedded Register setup information and Histogram statistic information are available in first 2 and last row of image data. 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 P0,0 P 0,1 P 0,2 .....................................P 0,n-1 P0,n P1,0 P 1,1 P 1,2 .....................................P 1,n-1 P1,n HORIZONTAL VALID IMAGE BLANKING 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 Pm-1,0 P m-1,1 .....................................P m-1,n-1 Pm-1,n Pm,0 P m,1 .....................................P m,n-1 Pm,n 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 VERTICAL/HORIZONTAL VERTICAL BLANKING BLANKING 00 00 00 .................. 00 00 00 00 00 00 .................. 00 00 00 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 Figure 8. Spatial Illustration of Image Readout Readout Sequence 968 rows of 1288 columns each. The FV and LV signals indicate the boundaries between frames and lines, respectively. PIXCLK can be used as a clock to latch the data. For each PIXCLK cycle, with respect to the falling edge, one 12-bit pixel datum outputs on the DOUT pins. When both FV and LV are asserted, the pixel is valid. PIXCLK cycles that occur when FV is de-asserted are called vertical blanking. PIXCLK cycles that occur when only LV is de-asserted are called horizontal blanking. Typically, the readout window is set to a region including only active pixels. The user has the option of reading out dark regions of the array, but if this is done, consideration must be given to how the sensor reads the dark regions for its own purposes. Parallel Output Data Timing The output images are divided into frames, which are further divided into lines. By default, the sensor produces Figure 9. Default Pixel Output Timing www.onsemi.com 10 AR0130CS LV and FV of FV by 6 PIXCLKs. Normally, LV will only be asserted if FV is asserted; this is configurable as described below. The timing of the FV and LV outputs is closely related to the row time and the frame time. FV will be asserted for an integral number of row times, which will normally be equal to the height of the output image. LV will be asserted during the valid pixels of each row. The leading edge of LV will be offset from the leading edge LV Format Options The default situation is for LV to be de-asserted when FV is de-asserted. By configuring R0x306E[1:0], the LV signal can take two different output formats. The formats for reading out four lines and two vertical blanking lines are shown in Figure 10. FV Default LV FV Continuous LV LV Figure 10. LV Format Options The timing of an entire frame is shown in Figure 11: "Line Timing and FRAME_VALID/LINE_VALID Signals". Frame Time The pixel clock (PIXCLK) represents the time needed to sample 1 pixel from the array. The sensor outputs data at the maximum rate of 1 pixel per PIXCLK. One row time (tROW) is the period from the first pixel output in a row to the first pixel output in the next row. The row time and frame time are defined by equations in Table 4. Figure 11. Line Timing and FRAME_VALID/LINE_VALID Signals Table 4. FRAME TIME (Example Based on 1280 x 960, 45 Frames Per Second) Name Equation A Parameter Active data time Context A: R0x3008 - R0x3004 + 1 Context B: R0x308E - R0x308A + 1 1280 pixel clocks = 17.23 ms P1 Frame start blanking 6 (fixed) 6 pixel clocks = 0.08 ms P2 Frame end blanking 6 (fixed) 6 pixel clocks = 0.08 ms Q Horizontal blanking R0x300C - A 370 pixel clocks = 4.98 ms A+Q (tROW) Line (Row) time R0x300C 1650 pixel clocks = 22.22 ms V Vertical blanking Context A: (R0x300A-(R0x3006-R0x3002+1)) x (A + Q) Context B: ((R0x30AA-(R0x3090-R0x308C+1)) x (A + Q) 49,500 pixel clocks = 666.66 ms www.onsemi.com 11 Timing at 74.25 MHz AR0130CS Table 4. FRAME TIME (Example Based on 1280 x 960, 45 Frames Per Second) Parameter Name Equation Timing at 74.25 MHz Nrows x (tROW) Frame valid time Context A: ((R0x3006-R0x3002+1)*(A+Q))-Q+P1+P2 Context B: ((R0x3090-R0x308C+1)*(A+Q))-Q+P1+P2 1,583,642 pixel clocks = 21.33 ms F Total frame time V + (Nrows x (A + Q)) 1,633,500 pixel clocks = 22.22 ms Sensor timing is shown in terms of pixel clock cycles (see Figure 8). The recommended pixel clock frequency is 74.25 MHz. The vertical blanking and the total frame time equations assume that the integration time (coarse integration time plus fine integration time) is less than the number of active lines plus the blanking lines: WindowHeight ) VerticalBlanking control is programmed with 2000 rows and the fine shutter width total is zero. For Master mode, if the integration time registers exceed the total readout time, then the vertical blanking time is internally extended automatically to adjust for the additional integration time required. This extended value is not written back to the frame_length_lines register. The frame_length_lines register can be used to adjust frame-to-frame readout time. This register does not affect the exposure time but it may extend the readout time. (eq. 1) If this is not the case, the number of integration lines must be used instead to determine the frame time, (see Table 5). In this example, it is assumed that the coarse integration time Table 5. FRAME TIME: LONG INTEGRATION TIME Parameter F' NOTE: Name Total frame time (long integration time) Equation Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2 Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2 Timing at 74.25 MHz 3,300,012 pixel clocks = 44.44 ms The AR0130 uses column parallel analog-digital converters; thus short line timing is not possible. The minimum total line time is 1390 columns (horizontal width + horizontal blanking). The minimum horizontal blanking is 110. * Number of Lines of Integration (Auto Exposure Exposure Total integration time is the result of Coarse_Integration_Time and Fine_Integration_Time registers, and depends also on whether manual or automatic exposure is selected. The actual total integration time, tINT is defined as: t INT + t INTCoarse * 410 * t INTFine * (eq. 1) = (number of lines of integration x line time) - (410 pixel clocks of conversion time overhead) - (number of pixels of integration x pixel time) where: * Number of Lines of Integration (Auto Exposure Control: Enabled) When automatic exposure control (AEC) is enabled, the number of lines of integration may vary from frame to frame, with the limits controlled by R0x311E (minimum auto exposure time) and R0x311C (maximum auto exposure time). Control: Disabled) If AEC is disabled, the number of lines of integration equals the value in R0x3012 (context A) or R0x3016 (context B). Number of Pixels of Integration The number of fine shutter width pixels is independent of AEC mode (enabled or disabled): Context A: the number of pixels of integration equals the value in R0x3014. Context B: the number of pixels of integration equals the value in R0x3018. Typically, the value of the Coarse_Integration_Time register is limited to the number of lines per frame (which includes vertical blanking lines), such that the frame rate is not affected by the integration time. For more information on coarse and fine integration time settings limits, please refer to the Register Reference document. www.onsemi.com 12 AR0130CS REAL-TIME CONTEXT SWITCHING In the AR0130, the user may switch between two full register sets (listed in Table 6) by writing to a context switch change bit in R0x30B0[13]. This context switch will change all registers (no shadowing) at the frame start time and have the new values apply to the immediate next exposure and readout time. Table 6. REAL-TIME CONTEXT-SWITCHABLE REGISTERS Register Number Context A Context B Y_Addr_Start R0x3002 R0x308C X_Addr_Start R0x3004 R0x308A Y_Addr_End R0x3006 R0x3090 X_Addr_End R0x3008 R0x308E Coarse_Integration_Time R0x3012 R0x3016 Fine_Integration_Time R0x3014 R0x3018 Y_Odd_Inc R0x30A6 R0x30A8 Green1_Gain (GreenR) R0x3056 R0x30BC Blue_Gain R0x3058 R0x30BE Red_Gain R0x305A R0x30C0 Green2_Gain (GreenB) R0x305C R0x30C2 Global_Gain R0x305E R0x30C4 Analog Gain R0x30B0[5:4] R0x30B0[9:8] R0x300A R0x30AA R0x3032[1:0] R0x3032[5:4] Register Description Frame_Length_Lines Digital_Binning www.onsemi.com 13 AR0130CS FEATURES new frame. This bit is a self-resetting bit and also returns to "0" during two-wire serial interface reads. See the AR0130 Register Reference for additional details. Reset The AR0130 may be reset by using RESET_BAR (active LOW) or the reset register. Clocks Hard Reset of Logic The RESET_BAR pin can be connected to an external RC circuit for simplicity. The recommended RC circuit uses a 10 kW resistor and a 0.1 mF capacitor. The rise time for the RC circuit is 1 ms maximum. PLL-Generated Master Clock The PLL contains a prescaler to divide the input clock applied on EXTCLK, a VCO to multiply the prescaler output, and two divider stages to generate the output clock. The clocking structure is shown in Figure 12. PLL control registers can be programmed to generate desired master clock frequency. NOTE: The PLL control registers must be programmed while the sensor is in the software Standby state. The effect of programming the PLL divisors while the sensor is in the streaming state is undefined. The AR0130 requires one clock input (EXTCLK). Soft Reset of Logic Soft reset of logic is controlled by the R0x301A Reset register. Bit 0 is used to reset the digital logic of the sensor while preserving the existing two-wire serial interface configuration. Furthermore, by asserting the soft reset, the sensor aborts the current frame it is processing and starts a PLL Input Clock EXTCLK PLL Output Clock SYSCLK Pre PLL PLL PLL Output PLL Output Div 1 Div 2 Div Multiplier (PFD) (VCO) Pre_pll_clk_div pll_multiplier vt_sys_clk_div PIXCLK vt_pix_clk_div Figure 12. PLL-Generated Master Clock PLL Setup 4. Set R0x301A[2]=1 to enable streaming and to switch from EXTCLK to the PLL-generated clock. The PLL is enabled by default on the AR0130. To Configure and Use the PLL: 1. Bring the AR0130 up as normal; make sure that fEXTCLK is between 6 and 50MHz and ensure the sensor is in software standby (R0x301A[2]= 0). PLL control registers must be set in software standby. 2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_div, and vt_pix_clk_div based on the desired input (fEXTCLK) and output (fPIXCLK ) frequencies. Determine the M, N, P1, and P2 values to achieve the desired fPIXCLK using this formula: fPIXCLK= (fEXTCLK x M) / (N x P1 x P2) where M = PLL_Multiplier (R0x3030) N = Pre_PLL_Clk_Div (R0x302E) P1 = Vt_Sys_Clk_Div (R0x302C) P2 = Vt_PIX_Clk_Div (R0x302A) NOTES: 1. The PLL can be bypassed at any time (sensor will run directly off EXTCLK) by setting R0x30B0[14]=1. However, only the parallel data interface is supported with the PLL bypassed. The PLL is always bypassed in software standby mode. To disable the PLL, the sensor must be in standby mode (R0x301A[2] = 0) 2. The following restrictions apply to the PLL tuning parameters: 32 M 255 1 N 63 1 P1 16 4 P2 16 Additionally, the VCO frequency, defined as fVCO = fEXTCLK x M / N must be within 384 -768 MHz and the EXTCLK 3. Wait 1 ms to ensure that the VCO has locked. www.onsemi.com 14 AR0130CS must be within 2 MHz fEXTCLK / N 24 Mhz The user can utilize the Register Wizard tool accompanying DevWare to generate PLL settings given a supplied input clock and desired output frequency. Soft Standby Soft Standby is a low power state that is controlled through register R0x301A[2]. Depending on the value of R0x301A[4], the sensor will go to standby after completion of the current frame readout (default behavior) or after the completion of the current row readout. When the sensor comes back from Soft Standby, previously written register settings are still maintained. A specific sequence needs to be followed to enter and exit from Soft Standby. To Enter Soft Standby: 1. R0x301A[12] = 1 if serial mode was used 2. Set R0x301A[2] = 0 3. External clock can be turned off to further minimize power consumption (Optional) To Exit Soft Standby: 1. Enable external clock if it was turned off 2. R0x301A[2] = 1 3. R0x301A[12] = 0 if serial mode is used Spread-Spectrum Clocking To facilitate improved EMI performance, the external clock input allows for spread spectrum sources, with no impact on image quality. Limits of the spread spectrum input clock are: * 5% maximum clock modulation * 35 KHz maximum modulation frequency * Accepts triangle wave modulation, as well as sine or modified triangle modulations. Stream/Standby Control The sensor supports two standby modes: Hard Standby and Soft Standby. In both modes, external clock can be optionally disabled to further minimize power consumption. If this is done, then the "Power-Up Sequence" on page 44 must be followed. FV EXTCLK 50 E X T C L K s S DAT A Register Writes Valid Register Writes Not Valid 750 E X T C L K s S T AN DB Y Figure 13. Enter Standby Timing www.onsemi.com 15 AR0130CS 28 rows + CIT FV EXTCLK S DAT A Register Writes Not Valid Register Writes Valid 10 E X T C L K s S T AN DB Y 1ms T R IG G E R Figure 14. Exit Standby Timing from the frame_length_lines register. The minimum vertical blanking is 26 lines. Hard Standby Hard Standby puts the sensor in lower power state; previously written register settings are still maintained. A specific sequence needs to be followed to enter and exit from Hard Standby. To Enter Hard Standby: 1. R0x301A[8] = 1 2. R0x301A[12] = 1 if serial mode was used 3. Assert STANDBY pin 4. External clock can be turned off to further minimize power consumption (Optional) To Exit Hard Standby: 1. Enable external clock if it was turned off 2. De-assert STANDBY pin 3. Set R0x301A[8] = 0 The actual imager timing can be calculated using Table 4 and Table 5, which describe the Line Timing and FV/LV signals. Readout Modes Digital Binning By default, the resolution of the output image is the full width and height of the FOV as defined above. The output resolution can be reduced by digital binning. For RGB and monochrome mode, this is set by the register R0x3032. For Context A, use bits [1:0], for Context B, use bits [5:4]. Available settings are: 00 = No binning 01 = Horizontal binning 10 = Horizontal and vertical binning Window Control Registers x_addr_start, x_addr_end, y_addr_start, and y_addr_end control the size and starting coordinates of the image window. The exact window height and width out of the sensor is determined by the difference between the Y address start and end registers or the X address start and end registers, respectively. The AR0130 allows different window sizes for context A and context B. Binning gives the advantage of reducing noise at the cost of reduced resolution. When both horizontal and vertical binning are used, a 2x improvement in SNR is achieved therefore improving low light performance Bayer Space Resampling All of the pixels in the FOV contribute to the output image in digital binning mode. This can result in a more pleasing output image with reduced subsampling artifacts. It also improves low-light performance. For RGB mode, resampling can be enabled by setting of register 0x306E[4] = 1. Blanking Control Horizontal blank and vertical blank times are controlled by the line_length_pck and frame_length_lines registers, respectively. * Horizontal blanking is specified in terms of pixel clocks. It is calculated by subtracting the X window size from the line_length_pck register. The minimum horizontal blanking is 110 pixel clocks. * Vertical blanking is specified in terms of numbers of lines. It is calculated by subtracting the Y window size Mirror Column Mirror Image By setting R0x3040[14] = 1, the readout order of the columns is reversed, as shown in Figure 15. The starting color, and therefore the Bayer pattern, is preserved when mirroring the columns. www.onsemi.com 16 AR0130CS When using horizontal mirror mode, the user must retrigger column correction. Please refer to the column correction section to see the procedure for column correction retriggering. Bayer resampling must be enabled, by setting bit 4 of register 0 x 306E[4] = 1. LV Normal readout G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0] DOUT[11:0] Reverse readout G2[11:0] R2[11:0] G1[11:0] R1[11:0] G0[11:0] R0[11:0] DOUT[11:0] Figure 15. Six Pixels In Normal and Column Mirror Readout Modes imaging array. When using horizontal mirror mode, the user must retrigger column correction. Please refer to the column correction section to see the procedure for column correction retriggering. Row Mirror Image By setting R0x3040[15] = 1, the readout order of the rows is reversed as shown in Figure 16. The starting Bayer color pixel is maintained in this mode by a 1-pixel shift in the FV Normal readout Row0 [11:0] Row1 [11:0] Row2 [11:0] Row3 [11:0] Row4 [11:0] Row5 [11:0] DOUT[11:0] Reverse readout DOUT[11:0] Row5 [11:0] Row4 [11:0] Row3 [11:0] Row2 [11:0] Row1 [11:0] Row0[11:0] Figure 16. Six Rows In Normal and Row Mirror Readout Modes * read_mode Maintaining a Constant Frame Rate Maintaining a constant frame rate while continuing to have the ability to adjust certain parameters is the desired scenario. This is not always possible, however, because register updates are synchronized to the read pointer, and the shutter pointer for a frame is usually active during the readout of the previous frame. Therefore, any register changes that could affect the row time or the set of rows sampled causes the shutter pointer to start over at the beginning of the next frame. By default, the following register fields cause a "bubble" in the output rate (that is, the vertical blank increases for one frame) if they are written in video mode, even if the new value would not change the resulting frame rate. The following list shows only a few examples of such registers; a full listing can be seen in the AR0130 Register Reference. * x_addr_start * x_addr_end * y_addr_start * y_addr_end * frame_length_lines * line_length_pclk * coarse_integration_time * fine_integration_time The size of this bubble is (Integration_Time x tROW), calculating the row time according to the new settings. The Coarse_Integration_Time and Fine_Integration_Time fields may be written to without causing a bubble in the output rate under certain circumstances. Because the shutter sequence for the next frame often is active during the output of the current frame, this would not be possible without special provisions in the hardware. Writes to these registers take effect two frames after the frame they are written, which allows the integration time to increase without interrupting the output or producing a corrupt frame (as long as the change in integration time does not affect the frame time). Synchronizing Register Writes to Frame Boundaries Changes to most register fields that affect the size or brightness of an image take effect on the frame after the one during which they are written. These fields are noted as "synchronized to frame boundaries" in the AR0130 Register Reference. To ensure that a register update takes effect on the next frame, the write operation must be completed after the leading edge of FV and before the trailing edge of FV. www.onsemi.com 17 AR0130CS As a special case, in single frame mode, register writes that occur after FV but before the next trigger will take effect immediately on the next frame, as if there had been a Restart. However, if the trigger for the next frame occurs during FV, register writes take effect as with video mode. Fields not identified as being frame-synchronized are updated immediately after the register write is completed. The effect of these registers on the next frame can be difficult to predict if they affect the shutter pointer. Continuous Trigger In certain applications, multiple sensors need to have their video streams synchronized (E.g. surround view or panorama view applications). The TRIGGER pin can also be used to synchronize output of multiple image sensors together and still get a video stream. This is called continuous trigger mode. Continuous trigger is enabled by holding the TRIGGER pin high. Alternatively, the TRIGGER pin can be held high until the stream bit is enabled (R0x301A[2]=1) then can be released for continuous synchronized video streaming. If the TRIGGER pins for all connected AR0130 sensors are connected to the same control signal, all sensors will receive the trigger pulse at the same time. If they are configured to have the same frame timing, then the usage of the TRIGGER pin guarantees that all sensors will be synchronized within 1 PIXCLK cycle if PLL is disabled, or 2 PIXCLK cycles if PLL is enabled. With continuous trigger mode, the application can now make use of the video streaming mode while guaranteeing that all sensor outputs are synchronized. As long as the initial trigger for the sensors takes place at the same time, all subsequent video streams will be synchronous. Restart To restart the AR0130 at any time during the operation of the sensor, write a "1" to the Restart register (R0x301A[1] = 1). This has two effects: first, the current frame is interrupted immediately. Second, any writes to frame-synchronized registers and the shutter width registers take effect immediately, and a new frame starts (in video mode). The current row completes before the new frame is started, so the time between issuing the Restart and the beginning of the next frame can vary by about tROW. Image Acquisition Modes The AR0130 supports two image acquisition modes: video (also known as master) and single frame. Automatic Exposure Control Video The video mode takes pictures by scanning the rows of the sensor twice. On the first scan, each row is released from reset, starting the exposure. On the second scan, the row is sampled, processed, and returned to the reset state. The exposure for any row is therefore the time between the first and second scans. Each row is exposed for the same duration, but at slightly different point in time, which can cause a shear in moving subjects as is typical with electronic rolling shutter sensors. The integrated automatic exposure control (AEC) is responsible for ensuring that optimal settings of exposure and gain are computed and updated every other frame. AEC can be enabled or disabled by R0x3100[0]. When AEC is disabled (R0x3100[0] = 0), the sensor uses the manual exposure value in coarse and fine shutter width registers and the manual gain value in the gain registers. When AEC is enabled (R0x3100[0]=1), the target luma value is set by R0x3102. For the AR0130 this target luma has a default value of 0x0800 or about half scale. The exposure control measures current scene luminosity by accumulating a histogram of pixel values while reading out a frame. It then compares the current luminosity to the desired output luminosity. Finally, the appropriate adjustments are made to the exposure time and gain. All pixels are used, regardless of color or mono mode. AEC does not work if digital binning is enabled. Single Frame The single-frame mode operates similar to the video mode. It also scans the rows of the sensor twice, first to reset the rows and second to read the rows. Unlike video mode where a continuous stream of images are output from the image sensor, the single-frame mode outputs a single frame in response to a high state placed on the TRIGGER input pin. As long as the TRIGGER pin is held in a high state, new images will be read out. After the TRIGGER pin is returned to a low state, the image sensor will not output any new images and will wait for the next high state on the TRIGGER pin. The TRIGGER pin state is detected during the vertical blanking period (i.e. the FV signal is low). The pin is level sensitive rather than edge sensitive. As such, image integration will only begin when the sensor detects that the TRIGGER pin has been held high for 3 consecutive clock cycles. During integration time of single-frame mode and video mode, the FLASH output pin is at high. Embedded Data and Statistics The AR0130 has the capability to output image data and statistics embedded within the frame timing. There are two types of information embedded within the frame readout: 1. Embedded Data: If enabled, these are displayed on the two rows immediately before the first active pixel row is displayed. 2. Embedded Statistics: If enabled, these are displayed on the two rows immediately after the last active pixel row is displayed. NOTE: Both embedded statistics and data must be enabled and disabled together. www.onsemi.com 18 AR0130CS EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE EEEEEEEEEEEEEEE Register Data Image HBlank Status & Statistics Data VBlank Figure 17. Frame Format with Embedded Data Lines Enabled transferred over 2 pixels where the register data will be broken up into 8 MSB and 8 LSB. The alignment of the 8-bit data will be on the 8 MSB bits of the 12-bit pixel word. For example, of a register value of 0x1234 is to be transmitted, it will be transmitted over 2, 12-bit pixels as follows: 0x120, 0x340. The first pixel of each line in the embedded data is a tag value of 0x0A0. This signifies that all subsequent data is 8 bit data aligned to the MSB of the 12-bit pixel. The figure below summarizes how the embedded data transmission looks like. It should be noted that data, as shown in Figure 18, is aligned to the MSB of each word: Embedded Data The embedded data contains the configuration of the image being displayed. This includes all register settings used to capture the current frame. The registers embedded in these rows are as follows: Line 1: Registers R0x3000 to R0x312F Line 2: Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF NOTE: All undefined registers will have a value of 0. In parallel mode, since the pixel word depth is 12-bits/pixel, the sensor 16-bit register data will be data_format_ code =8'h0A 8'hAA {register_ address_MSB} {register_ address_LSB} 8'hA5 8'h5A {register_ value_MSB} 8'h5A Data line 1 data_format_ code =8'h0A Data line 2 8'hAA {register_ value_LSB} 8'h5A {register_ address_MSB} 8'hA5 {register_ value_LSB} {register_ address_LSB} 8'h5A {register_ value_MSB} 8'h5A 8'h5A Figure 18. Format of Embedded Data Output within a Frame * * * * * * * * The data embedded in these rows are as follows: * 0x0A0 - identifier * 0xAA0 * Register Address MSB of the first register * 0xA50 * Register Address LSB of the first register * 0x5A0 * Register Value MSB of the first register addressed 0x5A0 Register Value LSB of the first register addressed 0x5A0 Register Value MSB of the register at first address + 2 0x5A0 Register Value LSB of the register at first address + 2 0x5A0 etc. www.onsemi.com 19 AR0130CS The first pixel of each line in the embedded statistics is a tag value of 0x0B0. This signifies that all subsequent statistics data is 10 bit data aligned to the MSB of the 12-bit pixel. The figure below summarizes how the embedded statistics transmission looks like. It should be noted that data, as shown in Figure 19, is aligned to the msb of each word: Embedded Statistics The embedded statistics contain frame identifiers and histogram information of the image in the frame. This can be used by downstream auto-exposure algorithm blocks to make decisions about exposure adjustment. This histogram is divided into 244 bins with a bin spacing of 64 evenly spaced bins for digital code values 0 to 212, 120 evenly spaced bins for values 212 to 216, 60 evenly spaced bins for values 216 to 220. data_format_ code =8'h0B #words = 10'h1EC {2'b00, frame _count MSB} {2'b00, frame {2'b00, frame _ID MSB} _ID LSB} {2'b00, frame _count LSB} histogram bin0 [19:10] histogram bin0 [9:0] stats line 1 histogram bin1 [19:10] data_format_ code =8'h0B stats line 2 #words = 10'h1C mean [ 19:10] histogram bin1 [9:0] histogram bin243 [19:10] hist_begin [19:10] mean [9:0] lowEndMean lowEndMean [9:0] [19:10] hist_begin [9:10] perc_lowEnd perc_lowEnd [9:0] [19:10] histogram bin243 [9:0] hist_end [19:10] 8'h07 8'h07 hist_end [9:10] norm_abs_dev lnorm_abs_dev [9:0] [19:10] 8'h07 Figure 19. Format of Embedded Statistics Output within a Frame There are two stages of analog gain, the first stage can be set to 1x, 2x, 4x or 8x. This is can be set in R0x30B0[5:4](Context A) or R0x30B0[9:8] (Context B). The second stage is capable of setting an additional 1x or 1.25x gain which can be set in R0x3EE4[8]. This allows the maximum possible analog gain to be set to 10x. The statistics embedded in these rows are as follows: Line 1: * 0x0B0 - identifier * Register 0x303A - frame_count * Register 0x31D2 - frame ID * Histogram data - histogram bins 0-243 * * * * * * * Line 2: 0x0B0 (identifier) Mean Histogram Begin Histogram End Low End Histogram Mean Percentage of Pixels Below Low End Mean Normal Absolute Deviation Black Level Correction Black level correction is handled automatically by the image sensor. No adjustments are provided except to enable or disable this feature. Setting R0x30EA[15] disables the automatic black level correction. Default setting is for automatic black level calibration to be enabled. The automatic black level correction measures the average value of pixels from a set of optically black lines in the image sensor. The pixels are averaged as if they were light-sensitive and passed through the appropriate gain. This line average is then digitally low-pass filtered over many frames to remove temporal noise and random instabilities associated with this measurement. The new filtered average is then compared to a minimum acceptable level, low threshold, and a maximum acceptable level, high threshold. If the average is lower than the minimum acceptable level, the offset correction value is increased by a predetermined amount. If it is above the maximum level, the offset correction value is decreased by a predetermined amount. The high and low thresholds have been calculated to avoid oscillation of the black level from below to above the targeted black level. At high gain, long exposure, and high temperature conditions, the performance of this function can degrade. Gain Digital Gain Digital gain can be controlled globally by R0x305E (Context A) or R0x30C4 (Context B). There are also registers that allow individual control over each Bayer color (GreenR, GreenB, Red, Blue). The format for digital gain setting is xxx.yyyyy where 0b00100000 represents a 1x gain setting and 0b00110000 represents a 1.5x gain setting. The step size for yyyyy is 0.03125 while the step size for xxx is 1. Therefore to set a gain of 2.09375 one would set digital gain to 01000011. Analog Gain The AR0130 has a column parallel architecture and therefore has an Analog gain stage per column. www.onsemi.com 20 AR0130CS Row-wise Noise Correction 9. Disable streaming (R0x301A[2] = 0) or drive the TRIGGER pin LOW. After this, the sensor has calculated the proper column correction coefficients and the sensor is ready for streaming. Any other settings (including gain, integration time and conversion gain etc.) can be done afterwards without affecting column correction. Row (Line)-wise Noise Correction is handled automatically by the image sensor. No adjustments are provided except to enable or disable this feature. Clearing R0x3044[10] disables the row noise correction. Default setting is for row noise correction to be enabled. Row-wise noise correction is performed by calculating an average from a set of optically black pixels at the start of each line and then applying each average to all the active pixels of the line. Column Correction Retriggering Due to Mode Change Since column offsets is sensitive to changes in the analog signal path, such changes require column correction circuitry to be retriggered for the new path. Examples of such mode changes include: horizontal mirror, vertical mirror, changes to column correction settings. When such changes take place, the following sequence needs to take place: 1. Disable streaming (R0x301A[2]=0) or drive the TRIGGER pin LOW. 2. Enable streaming (R0x301A[2]=1) or drive the TRIGGER pin HIGH. 3. Wait 9 frames to settle. NOTE: The above steps are not needed if the sensor is being reset (soft or hard reset) upon the mode change. Column Correction The AR0130 uses column parallel readout architecture to achieve fast frame rate. Without any corrections, the consequence of this architecture is that different column signal paths have slightly different offsets that might show up on the final image as structured fixed pattern noise. AR0130 has column correction circuitry that measures this offset and removes it from the image before output. This is done by sampling dark rows containing tied pixels and measuring an offset coefficient per column to be corrected later in the signal path. Column correction can be enabled/disabled via R0x30D4[15]. Additionally, the number of rows used for this offset coefficient measurement is set in R0x30D4[3:0]. By default this register is set to 0x7, which means that 8 rows are used. This is the recommended value. Other control features regarding column correction can be viewed in the AR0130 Register reference. Any changes to column correction settings need to be done when the sensor streaming is disabled and the appropriate triggering sequence must be followed as described below. Test Patterns The AR0130 has the capability of injecting a number of test patterns into the top of the datapath to debug the digital logic. With one of the test patterns activated, any of the datapath functions can be enabled to exercise it in a deterministic fashion. Test patterns are selected by Test_Pattern_Mode register (R0x3070). Only one of the test patterns can be enabled at a given point in time by setting the Test_Pattern_Mode register according to Table 7. When test patterns are enabled the active area will receive the value specified by the selected test pattern and the dark pixels will receive the value in Test_Pattern_Green (R0x3074 and R0x3078) for green pixels, Test_Pattern_Blue (R0x3076) for blue pixels, and Test_Pattern_Red (R0x3072) for red pixels. NOTE: Turn off black level calibration (BLC) when Test Pattern is enabled. Column Correction Triggering Column correction requires a special procedure to trigger depending on which state the sensor is in. Column Triggering on Startup When streaming the sensor for the first time after power-up, a special sequence needs to be followed to make sure that the column correction coefficients are internally calculated properly. 1. Follow proper power up sequence for power supplies and clocks 2. Apply sequencer settings if needed 3. Apply frame timing and PLL settings as required by application 4. Set analog gain to 1x and low conversion gain 5. Enable column correction and settings 6. Disable auto re-trigger for change in conversion gain or col_gain, and enable column correction always. (R0x30BA = 0x0008). 7. Enable streaming (R0x301A[2] = 1) or drive the TRIGGER pin HIGH. 8. Wait 9 frames to settle. (First frame after coming up from standby is internally column correction disabled.) Table 7. TEST PATTERN MODES Test_Pattern_Mode Test Pattern Output 0 No test pattern (normal operation) 1 Solid color test pattern 2 100% color bar test pattern 3 Fade-to-gray color bar test pattern 256 Walking 1s test pattern (12-bit) Color Field When the color field mode is selected, the value for each pixel is determined by its color. Green pixels will receive the value in Test_Pattern_Green, red pixels will receive the www.onsemi.com 21 AR0130CS value in Test_Pattern_Red, and blue pixels will receive the value in Test_Pattern_Blue. Walking 1s When the walking 1s mode is selected, a walking 1s pattern will be sent through the digital pipeline. The first value in each row is 1. Vertical Color Bars When the vertical color bars mode is selected, a typical color bar pattern will be sent through the digital pipeline. www.onsemi.com 22 AR0130CS TWO-WIRE SERIAL REGISTER INTERFACE The two-wire serial interface bus enables read/write access to control and status registers within the AR0130. This interface is designed to be compatible with the electrical characteristics and transfer protocols of the two-wire serial interface specification. The interface protocol uses a master/slave model in which a master controls one or more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers. Data is transferred between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to VDD_IO off-chip by a 1.5 kW resistor. Either the slave or master device can drive SDATA LOW - the interface protocol determines which device is allowed to drive SDATA at any given time. The protocols described in the two-wire serial interface specification allow the slave device to drive SCLK LOW; the AR0130 uses SCLK as an input only and therefore never drives it LOW. bit [0] indicates a WRITE, and a "1" indicates a READ. The default slave addresses used by the AR0130CS are 0x20 (write address) and 0x21 (read address) in accordance with the specification. Alternate slave addresses of 0x30 (write address) and 0x31 (read address) can be selected by enabling and asserting the SADDR input. An alternate slave address can also be programmed through R0x31FC. Message Byte Message bytes are used for sending register addresses and register write data to the slave device and for retrieving register read data. Acknowledge Bit Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the SCLK clock period following the data transfer. The transmitter (which is the master when writing, or the slave when reading) releases SDATA. The receiver indicates an acknowledge bit by driving SDATA LOW. As for data transfers, SDATA can change when SCLK is LOW and must be stable while SCLK is HIGH. Protocol Data transfers on the two-wire serial interface bus are performed by a sequence of low-level protocol elements: 1. a (repeated) start condition 2. a slave address/data direction byte 3. an (a no) acknowledge bit 4. a message byte 5. a stop condition No-Acknowledge Bit The no-acknowledge bit is generated when the receiver does not drive SDATA LOW during the SCLK clock period following a data transfer. A no-acknowledge bit is used to terminate a read sequence. Typical Sequence A typical READ or WRITE sequence begins by the master generating a start condition on the bus. After the start condition, the master sends the 8-bit slave address/data direction byte. The last bit indicates whether the request is for a read or a write, where a "0" indicates a write and a "1" indicates a read. If the address matches the address of the slave device, the slave device acknowledges receipt of the address by generating an acknowledge bit on the bus. If the request was a WRITE, the master then transfers the 16-bit register address to which the WRITE should take place. This transfer takes place as two 8-bit sequences and the slave sends an acknowledge bit after each sequence to indicate that the byte has been received. The master then transfers the data as an 8-bit sequence; the slave sends an acknowledge bit at the end of the sequence. The master stops writing by generating a (re)start or stop condition. If the request was a READ, the master sends the 8-bit write slave address/data direction byte and 16-bit register address, the same way as with a WRITE request. The master then generates a (re)start condition and the 8-bit read slave address/data direction byte, and clocks out the register data, eight bits at a time. The master generates an acknowledge bit after each 8-bit transfer. The slave's internal register address is automatically incremented after every 8 bits are transferred. The data transfer is stopped when the master sends a no-acknowledge bit. The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a start condition, and the bus is released with a stop condition. Only the master can generate the start and stop conditions. Start Condition A start condition is defined as a HIGH-to-LOW transition on SDATA while SCLK is HIGH. At the end of a transfer, the master can generate a start condition without previously generating a stop condition; this is known as a "repeated start" or "restart" condition. Stop Condition A stop condition is defined as a LOW-to-HIGH transition on SDATA while SCLK is HIGH. Data Transfer Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer mechanism is used for the slave address/data direction byte and for message bytes. One data bit is transferred during each SCLK clock period. SDATA can change when SCLK is LOW and must be stable while SCLK is HIGH. Slave Address/Data Direction Byte Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data transfer direction. A "0" in www.onsemi.com 23 AR0130CS Single READ from Random Location This sequence (Figure 20) starts with a dummy WRITE to the 16-bit address that is to be used for the READ. The master terminates the WRITE by generating a restart condition. The master then sends the 8-bit read slave address/data direction byte and clocks out one byte of register data. The master terminates the READ by generating a no-acknowledge bit followed by a stop condition. Figure 20 shows how the internal register address maintained by the AR0130 is loaded and incremented as the sequence proceeds. Previous Reg Address, N S Slave Address 0 A S = Start Condition P = Stop Condition Sr = Restart Condition A = Acknowledge A = No-acknowledge Reg Address[15:8] Reg Address, M Reg Address[7:0] A A Sr Slave Address 1 A M+1 Read Data A P Slave to Master Master to Slave Figure 20. Single READ from Random Location Single READ from Current Location The master terminates the READ by generating a no-acknowledge bit followed by a stop condition. The figure shows two independent READ sequences. This sequence (Figure 21) performs a read using the current value of the AR0130 internal register address. Previous Reg Address, N S Slave Address 1 A Reg Address, N+1 Read Data A P S Slave Address N+2 1 A Read Data A P Figure 21. Single READ from Current Location Sequential READ, Start from Random Location This sequence (Figure 22) starts in the same way as the single READ from random location (Figure 20). Instead of generating a no-acknowledge bit after the first byte of data has been transferred, the master generates an acknowledge bit and continues to perform byte READs until "L" bytes have been read. Previous Reg Address, N S Slave Address 0 A Reg Address[15:8] M+1 Read Data A Reg Address[7:0] M+2 A Read Data Reg Address, M M+3 A Sr Slave Address M+L-2 A Read Data 1 A M+L-1 A Read Data Figure 22. Sequential READ, Start from Random Location www.onsemi.com 24 M+1 Read Data M+L A P A AR0130CS Sequential READ, Start from Current Location This sequence (Figure 23) starts in the same way as the single READ from current location (Figure 21). Instead of generating a no-acknowledge bit after the first byte of data Previous Reg Address, N S Slave Address 1 A has been transferred, the master generates an acknowledge bit and continues to perform byte READs until "L" bytes have been read. N+1 Read Data A N+2 Read Data A N+L-1 Read Data A N+L Read Data A P Figure 23. Sequential READ, Start from Current Location Single WRITE to Random Location then LOW bytes of the register address that is to be written. The master follows this with the byte of write data. The WRITE is terminated by the master generating a stop condition. This sequence (Figure 24) begins with the master generating a start condition. The slave address/data direction byte signals a WRITE and is followed by the HIGH Previous Reg Address, N S Slave Address 0 A Reg Address[15:8] Reg Address, M A A Reg Address[7:0] M+1 A A Write Data P Figure 24. Single WRITE to Random Location Sequential WRITE, Start at Random Location has been transferred, the master generates an acknowledge bit and continues to perform byte WRITEs until "L" bytes have been written. The WRITE is terminated by the master generating a stop condition. This sequence (Figure 25) starts in the same way as the single WRITE to random location (Figure 24). Instead of generating a no-acknowledge bit after the first byte of data Previous Reg Address, N S Slave Address 0 A M+1 Write Data Reg Address[15:8] A M+2 A Write Data Reg Address, M Reg Address[7:0] M+3 A Write Data M+L-2 A Write Data 25 A M+L-1 A Figure 25. Sequential WRITE, Start at Random Location www.onsemi.com M+1 Write Data M+L A A P AR0130CS SPECTRAL CHARACTERISTICS 90 80 Quantum Efficiency (%) 70 60 50 40 30 20 10 0 350 450 550 650 750 850 950 1050 1150 Wavelength (nm) Figure 26. Quantum Efficiency - Monochrome Sensor 80 re d g re e n blue 70 Quantum Efficiency (%) 60 50 40 30 20 10 0 350 400 450 500 550 600 650 700 750 800 850 900 Wavelength (nm) Figure 27. Quantum Efficiency - Color Sensor www.onsemi.com 26 950 1000 1050 1100 1150 AR0130CS ELECTRICAL SPECIFICATIONS Unless otherwise stated, the following specifications apply to the following conditions: VDD = 1.8 V -0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8 V 0.3 V; VDD_SLVS = 0.4 V -0.1/+0.2; TA = -30C to +70C; Output Load = 10 pF; Frequency = 74.25 MHz. Two-Wire Serial Register Interface The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are shown in Figure 28 and Table 8. SDATA tLOW tf tSU;DAT tr tf tHD;STA tBUF tr SCLK tHD;STA tHD;DAT S NOTE: tSU;STA tHIGH tSU;STO Sr P S Read sequence: For an 8-bit READ, read waveforms start after READ command and register address are issued. Figure 28. Two-Wire Serial Bus Timing Parameters Table 8. TWO-WIRE SERIAL BUS CHARACTERISTICS (fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25C) Standard Mode Fast-Mode Symbol Min Max Min Max Unit fSCL 0 100 0 400 kHz tHD;STA 4.0 - 0.6 - ms LOW Period of the SCLK Clock tLOW 4.7 - 1.3 - ms HIGH Period of the SCLK Clock tHIGH 4.0 - 0.6 - ms Set-up Time for a Repeated START Condition tSU;STA 4.7 - 0.6 - ms Data Hold Time tHD;DAT 0 (Note 4) 3.45 (Note 5) 0 (Note 6) 0.9 (Note 5) ms Data Set-up Time tSU;DAT 250 - 100 (Note 6) - ns Rise Time of both SDATA and SCLK Signals tr - 1000 20 + 0.1Cb (Note 7) 300 ns Fall Time of both SDATA and SCLK Signals tf - 300 20 + 0.1Cb (Note 7) 300 ns Set-up Time for STOP Condition tSU;STO 4.0 - 0.6 - ms Parameter SCLK Clock Frequency After This Period, the First Clock Pulse is Generated 1. 2. 3. 4. I2C This table is based on standard (v2.1 January 2000). Philips Semiconductor. Two-wire control is I2C-compatible. All values referred to VIHmin = 0.9 VDD_IO and VILmax = 0.1 VDD_IO levels. Sensor EXTCLK = 27 MHz. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK. 5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal. 6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCLK line is released. 7. Cb = total capacitance of one bus line in pF. www.onsemi.com 27 AR0130CS Table 8. TWO-WIRE SERIAL BUS CHARACTERISTICS (continued) (fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25C) Standard Mode Fast-Mode Symbol Min Max Min Max Unit tBUF 4.7 - 1.3 - ms Capacitive Load for each Bus Line Cb - 400 - 400 pF Serial Interface Input Pin Capacitance CIN_SI - 3.3 - 3.3 pF CLOAD_SD - 30 - 30 pF RSD 1.5 4.7 1.5 4.7 kW Parameter Bus Free Time between a STOP and START Condition SDATA Max Load Capacitance SDATA Pull-up Resistor I2C 1. 2. 3. 4. This table is based on standard (v2.1 January 2000). Philips Semiconductor. Two-wire control is I2C-compatible. All values referred to VIHmin = 0.9 VDD_IO and VILmax = 0.1 VDD_IO levels. Sensor EXTCLK = 27 MHz. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK. 5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal. 6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCLK line is released. 7. Cb = total capacitance of one bus line in pF. I/O Timing By default, the AR0130 launches pixel data, FV and LV with the falling edge of PIXCLK. The expectation is that the user captures DOUT[11:0], FV and LV using the rising edge of PIXCLK. tR See Figure 29 and Table 9 for I/O timing (AC) characteristics. tF 90% 10% tRP tFP 90% 90% 10% 10% 90% 10% tEXTCLK EXTCLK PIXCLK tPD Data[11:0] Pxl_0 Pxl_1 Pxl_2 Pxl_n tPFL tPLL tPLH tPFH LINE_VALID/ FRAME_VALID FRAME_VALID Leads LINE_VALID by 6 PIXCLKs FRAME_VALID Trails LINE_VALID by 6 PIXCLKs Figure 29. I/O Timing Diagram Table 9. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO) (Note 8) Conditions: fPIXCLK = 74.25 MHz (720 P 60 fps) VDD_IO = 2.8 V; Slew Rate Setting = 4 for PIXCLK; Slew Rate Setting = 7 for Parallel Ports Symbol Definition Condition Min Typ Max Unit fEXTCLK Input Clock Frequency PLL Enabled 6 - 50 MHz tEXTCLK Input Clock Period PLL Enabled 20 - 166 ns tR Input Clock Rise Time - 3 - ns tF Input Clock Fall Time - 3 - ns www.onsemi.com 28 AR0130CS Table 9. I/O TIMING CHARACTERISTICS (2.8 V VDD_IO) (Note 8) Conditions: fPIXCLK = 74.25 MHz (720 P 60 fps) VDD_IO = 2.8 V; Slew Rate Setting = 4 for PIXCLK; Slew Rate Setting = 7 for Parallel Ports Symbol Min Typ Max Unit Input Clock Duty Cycle 45 50 55 % tJITTER (Note 9) Input Clock Jitter at 27 MHz - 600 - ps tcp EXTCLK to PIXCLK Propagation Delay 12 - 20 ns fPIXCLK PIXCLK Frequency (Note 9) 6 - 74.25 MHz tRP PIXCLK Rise Time Slew Rate Setting = 4 1.60 2.70 7.50 ns tFP PIXCLK Fall Time Slew Rate Setting = 4 tPIXJITTER Definition Condition Nominal Voltages, PLL Disabled, PIXCLK Slew Rate = 4 1.50 2.60 7.20 ns PIXCLK Duty Cycle 45 50 55 % Jitter on PIXCLK - 1 - ns tPD PIXCLK to Data[11:0] PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -2.5 - 3.5 ns tPFH PIXCLK to FV HIGH PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -2.5 - 0.5 ns tPLH PIXCLK to LV HIGH PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -3.0 - 0.0 ns tPFL PIXCLK to FV LOW PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -2.5 - 0.5 ns tPLL PIXCLK to LV LOW PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -3.0 - 0.0 ns Output Load Capacitance - 10 - pF Input Pin Capacitance - 2.5 - pF CLOAD CIN 8. Minimum and maximum values are for the spec limits: 3.1 V, -30C and 2.50 V, 70C. All values are taken at the 50% transition point. 9. Jitter from PIXCLK is already taken into account as the data of all the output parameters. Table 10. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 10) Conditions: fPIXCLK = 74.25 MHz (720 P 60 fps) VDD_IO = 1.8 V; Slew Rate Setting = 4 for PIXCLK; Slew Rate Setting = 7 for Parallel Ports Symbol Definition Condition Min Typ Max Unit fEXTCLK Input Clock Frequency PLL Enabled 6 - 50 MHz tEXTCLK Input Clock Period PLL Enabled 20 - 166 ns tR Input Clock Rise Time - 3 - ns tF Input Clock Fall Time - 3 - ns Input Clock Duty Cycle 45 50 55 % tJITTER (Note 11) Input Clock Jitter at 27 MHz - 600 - ps tcp EXTCLK to PIXCLK Propagation Delay 12 - 20 ns fPIXCLK PIXCLK Frequency (Note 11) 74.25 MHz Nominal Voltages, PLL Disabled, Slew Setting = 4 6 tRP Pixel Rise Time Slew Rate Setting = 4 2.50 4.30 7.10 ns tFP Pixel Fall Time Slew Rate Setting = 4 2.20 3.80 6.50 ns PIXCLK Duty Cycle PLL Enabled 45 50 55 % tPIXJITTER - 1 - ns tPD Jitter on PIXCLK PIXCLK to Data Valid PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -4.5 - 2.0 ns tPFH PIXCLK to FV HIGH PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -4.0 - -0.5 ns tPLH PIXCLK to LV HIGH PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -4.0 - -0.5 ns 10. Minimum and maximum values are are for the spec limits: 1.95 V, -30C and 1.70 V, 70C. All values are taken at the 50% transition point. 11. Jitter from PIXCLK is already taken into account as the data of all the output parameters. www.onsemi.com 29 AR0130CS Table 10. I/O TIMING CHARACTERISTICS (1.8 V VDD_IO) (Note 10) Conditions: fPIXCLK = 74.25 MHz (720 P 60 fps) VDD_IO = 1.8 V; Slew Rate Setting = 4 for PIXCLK; Slew Rate Setting = 7 for Parallel Ports(continued) Symbol Definition Condition Min Typ Max Unit - -0.5 ns tPFL PIXCLK to FV LOW PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 -4.0 tPLL PIXCLK to LV LOW PIXCLK Slew Rate = 4, Parallel Slew Rate = 7 CLOAD CIN -4.0 - -0.5 ns Output Load Capacitance - 10 - pF Input Pin Capacitance - 2.5 - pF 10. Minimum and maximum values are are for the spec limits: 1.95 V, -30C and 1.70 V, 70C. All values are taken at the 50% transition point. 11. Jitter from PIXCLK is already taken into account as the data of all the output parameters. Table 11. I/O RISE SLEW RATE (2.8 V VDD_IO) (Note 12) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 1.50 2.50 3.90 V/ns 6 Default 0.98 1.62 2.52 V/ns 5 Default 0.71 1.12 1.79 V/ns 4 Default 0.52 0.82 1.26 V/ns 3 Default 0.37 0.58 0.88 V/ns 2 Default 0.26 0.40 0.61 V/ns 1 Default 0.17 0.27 0.40 V/ns 0 Default 0.10 0.16 0.23 V/ns 12. Minimum and maximum values are taken at 70C, 2.5 V and -30C, 3.1 V. The loading used is 10 pF. Table 12. I/O FALL SLEW RATE (2.8 V VDD_IO) (Note 13) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 1.40 2.30 3.50 V/ns 6 Default 0.97 1.61 2.48 V/ns 5 Default 0.73 1.21 1.86 V/ns 4 Default 0.54 0.88 1.36 V/ns 3 Default 0.39 0.63 0.88 V/ns 2 Default 0.27 0.43 0.66 V/ns 1 Default 0.18 0.29 0.44 V/ns 0 Default 0.11 0.17 0.25 V/ns 13. Minimum and maximum values are taken at 70C, 2.5 V and -30C, 3.1 V. The loading used is 10 pF. Table 13. I/O RISE SLEW RATE (1.8 V VDD_IO) (Note 14) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 0.57 0.91 1.55 V/ns 6 Default 0.39 0.61 1.02 V/ns 5 Default 0.29 0.46 0.75 V/ns 4 Default 0.22 0.34 0.54 V/ns 3 Default 0.16 0.24 0.39 V/ns 2 Default 0.12 0.17 0.27 V/ns 1 Default 0.08 0.11 0.18 V/ns 0 Default 0.05 0.07 0.10 V/ns 14. Minimum and maximum values are taken at 70C, 1.7 V and -30C, 1.95 V. The loading used is 10 pF. www.onsemi.com 30 AR0130CS Table 14. I/O FALL SLEW RATE (1.8 V VDD_IO) (Note 15) Parallel Slew (R0x306E[15:13]) Condition Min Typ Max Unit 7 Default 0.57 0.92 1.55 V/ns 6 Default 0.40 0.64 1.08 V/ns 5 Default 0.31 0.50 0.82 V/ns 4 Default 0.24 0.38 0.61 V/ns 3 Default 0.18 0.27 0.44 V/ns 2 Default 0.13 0.19 0.31 V/ns 1 Default 0.09 0.13 0.20 V/ns 0 Default 0.05 0.08 0.12 V/ns 15. Minimum and maximum values are taken at 70C, 1.7 V and -30C, 1.95 V. The loading used is 10 pF. www.onsemi.com 31 AR0130CS DC Electrical Characteristics The DC electrical characteristics are shown in Table 15, Table 16, Table 17, and Table 18. Table 15. DC ELECTRICAL CHARACTERISTICS Symbol Definition VDD Condition Min Typ Max Unit 1.7 1.8 1.95 V 1.7/2.5 1.8/2.8 1.9/3.1 V Core Digital Voltage VDD_IO I/O Digital Voltage Analog Voltage 2.5 2.8 3.1 V VAA_PIX VAA Pixel Supply Voltage 2.5 2.8 3.1 V VDD_PLL PLL Supply Voltage 2.5 2.8 3.1 V VDD_SLVS - - - V VIH Input HIGH Voltage VDD_IO * 0.7 - - V VIL Input LOW Voltage - - VDD_IO * 0.3 V IIN Input Leakage Current 20 - - mA VOH Output HIGH Voltage VDD_IO - 0.3 - - V VOL Output LOW Voltage - - 0.4 V IOH Output HIGH Current At Specified VOH -22 - - mA IOL Output LOW Current At Specified VOL - - 22 mA CAUTION: Digital Supply Voltage Do not connect. No Pull-up Resistor; VIN = VDD_IO or DGND Stresses greater than those listed in Table 16 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Table 16. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Minimum Maximum Unit VSUPPLY Power Supply Voltage (All Supplies) -0.3 4.5 V ISUPPLY Total Power Supply Current - 200 mA IGND Total Ground Current - 200 mA VIN DC Input Voltage -0.3 VDD_IO + 0.3 V VOUT DC Output Voltage -0.3 VDD_IO + 0.3 V TSTG Storage Temperature (Note 16) -40 +85 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 16. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 17. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum. Table 17. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT (Operating currents are measured at the following conditions: VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V; VDD = 1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; TA = 25C) Symbol IDD1 IDD_IO IAA Parameter Condition Min Typ Max Unit Digital Operating Current Streaming, 1280 x 960 45 fps - 40 65 mA I/O Digital Operating Current Streaming, 1280 x 960 45 fps - 35 - mA Analog Operating Current Streaming, 1280 x 960 45 fps - 30 55 mA IAA_PIX Pixel Supply Current Streaming, 1280 x 960 45 fps - 10 15 mA IDD_PLL PLL Supply Current Streaming, 1280 x 960 45 fps - 7 - mA Digital Operating Current Streaming, 720p 60 fps - 40 - mA I/O Digital Operating Current Streaming, 720p 60 fps - 35 - mA Analog Operating Current Streaming, 720p 60 fps - 30 - mA IDD1 IDD_IO IAA www.onsemi.com 32 AR0130CS Table 17. OPERATING CURRENT CONSUMPTION IN PARALLEL OUTPUT (continued) (Operating currents are measured at the following conditions: VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8 V; VDD = 1.8 V; PLL Enabled and PIXCLK = 74.25 MHz; TA = 25C) Symbol Parameter IAA_PIX Pixel Supply Current IDD_PLL PLL Supply Current Condition Min Typ Max Unit Streaming, 720p 60 fps - 10 15 mA Streaming, 720p 60 fps - 7 - mA Table 18. STANDBY CURRENT CONSUMPTION (Analog - VAA + VAA_PIX + VDD_PLL; Digital - VDD + VDD_IO + VDD_SLVS) Definition Condition Min Analog, 2.8 V Digital, 1.8 V Analog, 2.8 V Digital, 1.8 V Soft Standby (Clock Off) Soft Standby (Clock On) Digital, 1.8 V Hard Standby (Clock Off) Hard Standby (Clock On) Typ Max Unit - 70 200 mA - 640 900 mA - 275 - mA - 1.55 - mA Analog, 2.8 V - 70 200 mA Digital, 1.8 V - 640 900 mA Analog, 2.8 V - 275 - mA - 1.55 - mA 70 60 PSRR (dB) 50 40 30 20 10 0 1,000 10,000 100,000 Frequency (Hz) Figure 30. Power Supply Rejection Ratio www.onsemi.com 33 1,000,000 AR0130CS POWER-ON RESET AND STANDBY TIMING Power-Up Sequence The recommended power-up sequence for the AR0130 is shown in Figure 31. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Turn on VDD_PLL power supply. 2. After 0-10 ms, turn on VAA and VAA_PIX power supply. 3. After 0-10 ms, turn on VDD power supply. 4. After 0-10 ms, turn on VDD_IO power supply. VDD_PLL (2.8) 5. After the last power supply is stable, enable EXTCLK. 6. Assert RESET_BAR for at least 1 ms. 7. Wait 150,000 EXTCLKs (for internal initialization into software standby). 8. Configure PLL, output, and image settings to desired values. 9. Wait 1 ms for the PLL to lock. 10. Set streaming mode (R0x301a[2] = 1). t0 VAA_PIX VAA (2.8) t1 t2 VDD (1.8) VDD_IO (1.8/2.8) t3 VDD_SLVS EXTCLK t4 RESET_BAR t5 tX Hard Reset t6 Internal Initialization Software Standby PLL Clock Streaming Figure 31. Power Up Table 19. POWER-UP SEQUENCE Symbol Definition Min Typ Max Unit t0 VDD_PLL to VAA/VAA_PIX (Note 20) 0 10 - ms t1 VAA/VAA_PIX to VDD 0 10 - ms t2 VDD to VDD_IO 0 (Note 21) 10 - ms t3 VDD_IO to VDD_SLVS 0 10 - ms tX Xtal Settle Time - 30 (Note 18) - ms t4 Hard Reset 1 (Note 19) - - ms t5 Internal Initialization 150,000 - - EXTCLKs t6 PLL Lock Time 1 - - ms 18. Xtal settling time is component-dependent, usually taking about 10-100 ms. 19. Hard reset time is the minimum time required after power rails are settled. In a circuit where hard reset is held down by RC circuit, then the RC time must include the all power rail settle time and Xtal settle time. 20. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the others. If the case happens that VDD_PLL is powered after other supplies then the sensor may have functionality issues and will experience high current draw on this supply. 21. For the case where VDD_IO is 2.8 V and VDD is 1.8 V, it is recommended that the minimum time be 5 ms. www.onsemi.com 34 AR0130CS Power-Down Sequence The recommended power-down sequence for the AR0130 is shown in Figure 32. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the separation specified below. 1. Disable streaming if output is active by setting standby R0x301a[2] = 0. 2. The soft standby state is reached after the current row or frame, depending on configuration, has ended. 3. Turn off VDD_SLVS, if used. 4. Turn off VDD_IO. 5. Turn off VDD. 6. Turn off VAA/VAA_PIX. 7. Turn off VDD_PLL. VDD_SLVS t0 VDD_IO (1.8/2.8) t1 VDD (1.8) t2 VAA_PIX VAA (2.8) t3 VDD_PLL (2.8) EXTCLK t4 Power Down until Next Power Up Cycle Figure 32. Power Down Table 20. POWER-DOWN SEQUENCE Symbol Parameter Min Typ Max Unit t0 VDD_SLVS to VDD_IO 0 - - ms t1 VDD_IO to VDD 0 - - ms t2 VDD to VAA/VAA_PIX 0 - - ms t3 VAA/VAA_PIX to VDD_PLL 0 - - ms t4 PwrDn until Next PwrUp Time 100 - - ms 22. t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged. www.onsemi.com 35 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PLCC48 11.43x11.43 CASE 776AL ISSUE A DOCUMENT NUMBER: DESCRIPTION: 98AON93134F PLCC48 11.43X11.43 DATE 21 DEC 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ILCC48 10x10 CASE 847AC ISSUE B DATE 13 FEB 2020 GENERIC MARKING DIAGRAM* XXXX = Specific Device Code Y = Year ZZZ = Lot Traceability *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "G", may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: 98AON93694F DESCRIPTION: ILCC48 10X10 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 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