HDSP-A4xC Series Alphanumeric Display, 0.54" (13.7 mm) 4 Character As AlInGaP Red Data Sheet Description Features These 0.54" (13.7 mm) AS AlInGaP displays are available in either common anode or common cathode. As AlInGaP red color Devices Design flexibility - Common anode or common cathode As AlInGaP Red Description HDSP-A42C Common Anode HDSP-A47C Common Cathode Gray face paint - Gray package gives optimum contrast Applications Suitable for alphanumeric Operating temperature range -40C to 105C Package Dimensions 1.60 (0.063) 8.17 (0.322) 1.20 (0.047) 5 0.30 (0.012) 13.80 (0.543) 21.15 (0.833) PIN 1 12.70 (0.500) 1.84 (0.072) 12.70 (0.500) 12.70 (0.500) 50.96 (2.006) 6.00 (0.236) 7.00 (0.276) 3.70 (0.140) 2.37 (0.093) 5.59 (0.220) 0.50 (0.020) 48.6 (1.913) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. UNLESS OTHERWISE STATED, TOLERANCES ARE 0.25 mm. 15.24 (0.600) Part Numbering System 5082 -X XX X-X X X XX HDSP-X XX X-X X X XX Mechanical Options [1] 00: No Mechanical Option Color Bin Options [1,2] 0: No Color Bin Limitation Maximum Intensity Bin [1,2] 0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2] 0: No Minimum Intensity Bin Limitation Device Configuration/Color [1] C: AlInGaP Red Device Specific Configuration [1] Refer to Respective Datasheet Package [1] Refer to Respective Datasheet Notes: 1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Avago representative for details. 2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1 bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information. 2 Internal Circuit DIG 1 DIG 2 DIG 3 A DIG 4 DP1 F P G H B J N DP2 E M L K C COM 2 DIG 2 D 30 A 28 B A 9 7 C 1 D B C 36 E D F 33 G E F 32 H G 6 5 J H 4 K J 2 L 31 M K L 8 COM 3 DIG 3 11 16 COM 1 DIG 1 34 29 P N 19 25 26 DP1 P N M 35 COM 4 DIG 4 A DP2 B A B 18 12 10 27 C D E F 22 G 20 13 17 15 H J K L 14 M C D E F G H J K L M N 25 19 18 12 10 27 22 20 13 17 15 14 A B C D E F J K L 24 23 N P P COMMON ANODE COM 2 DIG 2 30 A 28 B A 9 7 C B 1 D C E D 36 33 32 6 F G H J E F G H 5 4 K J 2 L K M L 31 8 11 COM 4 DIG 4 16 P N M 35 COM 1 DIG 1 34 29 COM 3 DIG 3 N 26 DP1 P A DP2 B C D E F G G H H J K L COMMON CATHODE Pin Pin Configuration A Common Anode Pin Configuration B Common Cathode Pin Pin Configuration A Common Anode Pin Configuration B Common Cathode 1 1E/2E Cathode 1E/2E Anode 19 3B/4B Cathode 3B/4B Anode 2 1M/2M Cathode 1M/2M Anode 20 3H/4H Cathode 3H/4H Anode 3 No Connection No Connection 21 No Connection No Connection 4 1L/2L Cathode 1L/2L Anode 22 3G/4G Cathode 3G/4G Anode 5 1K/2K Cathode 1K/2K Anode 23 3P/4P Cathode 3P/4P Anode 6 1J/2J Cathode 1J/2J Anode 24 3N/4N Cathode 3N/4N Anode 7 1D/2D Cathode 1D/2D Anode 25 3A/4A Cathode 3A/4A Anode 8 DP2 Cathode DP2 Anode 26 DP1 Cathode DP1 Anode 9 1C/2C Cathode 1C/2C Anode 27 3F/4F Cathode 3F/4F Anode 10 3E/4E Cathode 3E/4E Anode 28 1B/2B Cathode 1B/2B Anode 11 DIGIT No. 3 Common Anode DIGIT No. 3 Common Cathode 29 DIGIT No. 2 Common Anode DIGIT No. 2 Common Cathode 12 3D/4D Cathode 3D/4D Anode 30 1A/2A Cathode 1A/2A Anode 13 3J/4J Cathode 3J/4J Anode 31 1N/2N Cathode 1N/2N Anode 14 3M/4M Cathode 3M/4M Anode 32 1H/2H Cathode 1H/2H Anode 15 3L/4L Cathode 3L/4L Anode 33 1G/2G Cathode 1G/2G Anode 16 DIGIT No. 4 Common Anode DIGIT No. 4 Common Cathode 34 DIGIT No. 1 Common Anode DIGIT No. 1 Common Cathode 17 3K/4K Cathode 3K/4K Anode 35 1P/2P Cathode 1P/2P Anode 18 3C/4C Cathode 3C/4C Anode 36 1F/2F Cathode 1F/2F Anode 3 M M N 24 23 N P P Absolute Maximum Ratings at TA = 25C Description Symbol HDSP-A42C/HDSP-A47C Units DC Forward Current per Segment or DP [1,2,3] IF 50 mA Peak Forward Current per Segment or DP [2,3] IPEAK 100 mA Average Forward Current [3] IAVE 30 mA Reverse Voltage per Segment or DP (IR = 100 A) VR 5 V Operating Temperature TO -40 to +105 C Storage Temperature TS -40 to +105 C Wave Soldering Conditions Temperature 250 C Time 3 s Notes: 1. Derate linearly as shown in Figure 1. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E). 3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information. Optical/Electrical Characteristics at TA = 25C Device Series HDSP- Parameter Symbol Min. Typ. Max. Units Test Conditions A42C A47C Forward Voltage Reverse Voltage IV VR 1.70 5 1.90 20 2.20 V V IF = 20 mA IF = 100 A Peak Wavelength PEAK nm Peak Wavelength of Spectral Distribution at IF = 20 mA Dominant Wavelength [3] d Spectral Halfwidth 1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Speed of Response s 20 ns Exponential Time Constant, e-ts Capacitance C 40 pF VF = 0, f = 1 MHz Intensity Bin Limits [1] (mcd at 10 mA) Bin Name Min. [2] Max. [2] U 25 36 V 36 50 W 50 80 Notes: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. 2. Tolerance for each bin limit is 10%. 4 635 622.5 626 630 nm IF - FORWARD CURRENT PER SEGMENT - mA IF - MAXIMUM AVERAGE CURRENT - mA 60 50 40 30 20 10 0 20 0 40 60 80 100 TA - AMBIENT TEMPERATURE - C 120 100 80 60 40 20 0 0.0 3.5 1.4 3.0 1.2 2.5 2.0 1.5 1.0 0.5 0 0 40 10 20 30 50 IF - FORWARD CURRENT PER SEGMENT - mA 1.0 1.5 2.5 2.0 VF - FORWARD VOLTAGE - V 3.0 Figure 2. Forward current vs. forwrad voltage. RELATIVE EFFICIENCY (NORMALIZED TO 1 AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED TO 1 AT 10 mA) Figure 1. Maximum forward current vs. ambient temperature. Derating based on TJMAX = 130C. 120 60 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 40 60 50 IPEAK - PEAK FORWARD CURRENT PER SEGMENT - mA Figure 3. Relative luminous intensity vs. DC forward current. Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. Contrast Enhancement Soldering/Cleaning For information on contrast enhancement, please see Application Note 1015. Cleaning agents from ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. For information on soldering LEDs, please refer to Application Note 1027. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5988-9665EN AV02-1103EN - August 19, 2010 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Avago Technologies: HDSP-A42C HDSP-A47C