POLY-FUSE® Resettable PTCs
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/22/17
Surface Mount > 0805L Series
Environmental Specifications
Operating/Storage
Temperature -40°C to +85°C
Maximum Device Surface
Temperature in Tripped
State
125°C
Passive Aging +85°C, 1000 hours
-/+5% typical resistance change
Humidity Aging +85°C, 85%, R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MIL–STD–202, Method 107
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance MIL–STD–202, Method 215
No change
Vibration
MIL–STD–883, Method 2007,
Condition A
No change
Moisture Sensitivity Level Level 1, J–STD–020
Physical Specifications
Terminal Material Solder-Plated Copper
(Solder Material: Matte Tin (Sn))
Lead Solderability Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
reheat
Ramp-up
amp-up
Ramp-down
amp-d
Critical Zone
tL to tP
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (TS(max) to TP) 3°C/second max
Pre Heat:
Temperature Min (Ts(min))150°C
Temperature Max (Ts(max))200°C
Time (Min to Max) (ts)60 – 180 secs
Time Maintained
Above:
Temperature (TL)217°C
Temperature (tL)60 – 150 seconds
Peak / Classification Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment
for lead
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices