2
TechnischeInformation/TechnicalInformation
FZ1200R45HL3
IGBT-Modul
IGBT-Module
preparedby:WB
approvedby:DTS
dateofpublication:2014-06-10
revision:3.0
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = -40°C
Tvj = 150°C VCES 4500
4500 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 95°C, Tvj max = 150°C IC nom 1200 A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 2400 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 150°C Ptot 15,0 kW
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 1200 A, VGE = 15 V
IC = 1200 A, VGE = 15 V
IC = 1200 A, VGE = 15 V
VCE sat
2,35
2,90
3,00
2,80
3,45
3,55
V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 105 mA, VCE = VGE, Tvj = 25°C VGEth 5,5 6,0 6,5 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG33,5 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 0,42 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 280 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 4,70 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 4500 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 1200 A, VCE = 2800 V
VGE = ±15 V
RGon = 4,0 Ω
td on 0,63
0,55
0,55
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 1200 A, VCE = 2800 V
VGE = ±15 V
RGon = 4,0 Ω
tr0,45
0,55
0,55
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 1200 A, VCE = 2800 V
VGE = ±15 V
RGoff = 5,1 Ω
td off 5,70
6,00
6,10
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 1200 A, VCE = 2800 V
VGE = ±15 V
RGoff = 5,1 Ω
tf0,34
0,50
0,57
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 1200 A, VCE = 2800 V, LS = 150 nH
VGE = ±15 V, di/dt = 4800 A/µs (Tvj = 150°C)
RGon = 1,3 ΩEon
4000
5300
6000
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 1200 A, VCE = 2800 V, LS = 150 nH
VGE = ±15 V, du/dt = 2000 V/µs (Tvj = 150°C)
RGoff = 5,1 ΩEoff
4100
5300
5700
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 2800 V
VCEmax = VCES -LsCE ·di/dt ISC 6900 A
Tvj = 125°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 8,20 K/kW
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 10,0 K/kW
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 150 °C