EA5070 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Resonator 5.0mm x 7.0mm x 1.3mm 4 Pad Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 6MHz to 66MHz Frequency Tolerance/Stability 50ppm at 25C, 100ppm over 0C to +70C 50ppm at 25C, 100ppm over -20C to +70C 50ppm at 25C, 100ppm over -40C to +85C 30ppm at 25C, 50ppm over 0C to +70C 30ppm at 25C, 50ppm over -20C to +70C 30ppm at 25C, 50ppm over -40C to +85C 15ppm at 25C, 30ppm over 0C to +70C 15ppm at 25C, 30ppm over -20C to +70C 15ppm at 25C, 30ppm over -40C to +85C 15ppm at 25C, 20ppm over 0C to +70C 15ppm at 25C, 20ppm over -20C to +70C 15ppm at 25C, 20ppm over -40C to +85C 10ppm at 25C, 15ppm over 0C to +70C 10ppm at 25C, 15ppm over -20C to +70C Aging at 25C 3ppm/year Maximum Load Capacitance Series Resonant, 12pF Parallel Resonant to 50pF Parallel Resonant Shunt Capacitance 7pF Maximum Equivalent Series Resistance See the Equivalent Series Resistance (ESR), Mode of Operation, and Crystal Cut Table Below Mode of Operation AT-Cut Fundamental (Only available over Nominal Frequency range of 6MHz to 40MHz) AT-Cut Third Overtone (Only available over Nominal Frequency range of 35.328MHz to 66MHz) Drive Level 50Watts Maximum Spurious Response Measured from Fo to Fo +5000ppm -3dB Minimum -40C to +85C Storage Temperature Range Insulation Resistance Measured at 100Vdc 500 Megaohms Minimum EQUIVALENT SERIES RESISTANCE (ESR), MODE OF OPERATION AND CRYSTAL CUT Frequency Range ESR (Ohms Max) Mode Frequency Range ESR (Ohms Max) Mode 6MHz to 9.999999MHz 90 AT-Cut Fundamental 16MHz to 40MHz 30 AT-Cut Fundamental 10MHz to 10.999999MHz 60 AT-Cut Fundamental 35.328MHz to 39.999999MHz 100 11MHz to 13.999999MHz 50 AT-Cut Fundamental 40MHz to 59.999999MHz 80 AT-Cut Third Overtone 14MHz to 15.999999MHz 40 AT-Cut Fundamental 60MHz to 66MHz 80 AT-Cut Third Overtone Revised B: 12/1/2015 Page 2 of 10 AT-Cut Third Overtone www.ecliptek.com EA5070 Series PART NUMBERING GUIDE Revised B: 12/1/2015 Page 3 of 10 www.ecliptek.com EA5070 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground All Tolerances are 0.1 All Dimensions in Millimeters Revised B: 12/1/2015 Page 4 of 10 www.ecliptek.com EA5070 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised B: 12/1/2015 Page 5 of 10 www.ecliptek.com EA5070 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 150C 175C 200C 60 - 180 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3C/Second Maximum Peak Temperature (TP) 260C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250C +0/-5C Time within 5C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6C/Second Maximum Time 25C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 217C 60 - 150 Seconds High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised B: 12/1/2015 Page 6 of 10 www.ecliptek.com EA5070 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150C N/A 30 - 60 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5C/Second Maximum Peak Temperature (TP) 245C Maximum Target Peak Temperature (TP Target) 245C Maximum 2 Times / 230C Maximum 1 Time Time within 5C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5C/Second Maximum Time 25C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150C 200 Seconds Maximum Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised B: 12/1/2015 Page 7 of 10 www.ecliptek.com