Technical Data 10515 Effective February 2016 Supersedes March 2007 0603ESDA-MLP ESD suppressor Pb Product description * Ultra-low capacitance (0.05 pF) ideal for high speed data applications * Provides Electro Static Discharge (ESD) protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 Level 4 test * Single-line, bi-directional device * 0603 (1608 metric) compact design utilizes less board space * Lead free, RoHS compliant Applications * ESD port protection for mobile/smart phones * Game console ESD port protection * High speed ESD data port protection * Set-top-boxes * Tablets, notebooks, netbooks, laptops * High definition television (HDTV) * Media players * Digital cameras * Medical equipment * Computers and peripherals ESD port protection * Consumer electronics Ordering * Specify part number and packaging suffix (e.g. 0603ESDA-MLP7) 0603ESDA-MLP = part number, 7 = packaging suffix) Packaging suffixes * 7 (Tape and reel, 5 000 parts per 7" diameter reel) 0603ESDA-MLP ESD suppressor Technical Data 10515 Effective February 2016 Product specifications Part number4 Rated voltage (VDC) maximum Clamping voltage1 (V) typical Trigger voltage2 (V) typical Capacitance @ 1 MHz (pF) typical Capacitance @ 1 MHz (pF) maximum Attenuation change (0-6 GHz) (dB) typical Leakage current @ 12 VDC (nA) typical ESD capability IEC61000-42 Direct discharge (kV) typical 0603ESDA-MLP 30 35 300 0.05 0.15 -0.2 <0.1 8 1. Clamping voltage: Per IEC61000-4-2, Level 4 waveform (8 kV direct 30 A) measured 30 ns after initial pulse. 2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method. ESD capability IEC61000-42 Air discharge (kV) typical ESD pulse withstand3 typical 15 >1000 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. 4. Part Number Definition: 0603ESDA-MLP 0603ESDA= Product code and size -MLP= Form designation Dimensions--mm [in] Design considerations The location in the circuit for the 0603ESDA-MLP has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a "0-stub" pad design (pad directly on the signal/data line and second pad directly on common ground). Environmental data Operating temperature: - 55 C to +125 C Storage temperature (component): - 55 C to +125 C Load humidity: 12 VDC per EIA/IS- 722 +85 C, 85% relative humidity for 1 000 hours Thermal shock: 10 cycles, - 55 C to +125 C, 30 minute dwell time Moisture resistance: MIL-STD-202G, method 106G, 10 cycles Mechanical shock: EIA/IS- 722 paragraph 4.9 Mechanical vibration: EIA/IS- 722 paragraph 4.10 Resistance to solvent: EIA/IS- 722 paragraph 4.11 2 www.eaton.com/elx 0603ESDA-MLP ESD suppressor Technical Data 10515 Effective February 2016 Wave solder profile Reflow soldering not recommended tp Temperature Tp First Wave Second Wave Tsmax Tstyp Tsmin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 100C * Temperature typ. (Tstyp) 120C 120C * Temperature max. (Tsmax) 130C 130C * Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150C max. 150C max. Peak temperature (TP)* 235C - 260C 250C - 260C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25C to 25C 4 minutes 4 minutes Preheat Manual solder 350C, 4-5 seconds (by soldering iron), generally manual hand soldering is not recommended. www.eaton.com/elx 3 0603ESDA-MLP ESD suppressor Technical Data 10515 Effective February 2016 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2016 Eaton All Rights Reserved Printed in USA Publication No. 10515 February 2016 Eaton is a registered trademark. All other trademarks are property of their respective owners.