Ampro by ADLINK™ Extreme Rugged™
http://www.adlinktech.com/ampro/
Express-HRR
Choose Ampro by ADLINK™ Express-HRR for…
A modular and power efcient solution for extreme rugged
and mobile environments.
Description
The Ampro by ADLINK™ Express-HRR is a COM Express®
Type 6 module with quad/dual-core 2nd Generation Intel®
Core™ i7/i5/i3 Processor. The Express-HRR is designed
Extreme Rugged to support the extremes of shock,
vibration, humidity, and temperature.
Specifications
Core System
CPU 2nd Generation Intel® Core™ i7, 32 nm process, BGA type
Intel® Core™ i7-2715QE 2.1 GHz (3.0 GHz Turbo),
6MB L3 cache, 45W
Intel® Core™ i7-2655LE 2.2 GHz (2.9 GHz Turbo),
4MB L3 cache, 25W
Intel® Core™ i7-2610UE 1.5 GHz (2.4 GHz Turbo),
4MB L3 cache, 17W
Intel® Core™ i5-2515E 2.5 GHz (3.1 GHz Turbo),
3MB L3 cache, 35W
Intel® Core™ i3-2340UE 1.3 GHz, 3MB L3 cache, 17W
Intel® Celeron® 847E 1.1 GHz, 2MB L3 cache, 17W
Intel® Celeron® 807UE 1.0 GHz, 1MB L3 cache, 10W
Memory Dual channel ECC 1333 MHz DDR3 memory up to 16 GB in
dual SODIMM sockets
BIOS AMI EFI with CMOS backup in 16 Mb SPI ash
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Watchdog Timer Programmable timer range to generate RESET
Expansion Busses PCI Express x16 (Gen2) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
8 PCI Express x1: Lanes 0/1/2/3/4/5/6 are free, lane 7 is
occupied by GbE
LPC bus, SMBus (system), I2C (user)
Multi I/O
Chipset Integrated on QM67
USB Supports up to eight ports USB 2.0
SATA Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID
0,1,5,10
LAN
Chipset Intel® Gigabit LAN PHY WG82579LM
Speed 10/100/1000 Mbps Ethernet
Video
Integrated in Processor HD Graphics 3000 at 650-1300 MHz
Integrated Video DirectX 10.1 and OpenGL 3.0
Feature Support Intel
®
Clear Video HD Technology
Advanced Scheduler 2.0, 1.0, XPDM support
DirectX Video Acceleration (DXVA) support for full AVC/VC1/
MPEG2 hardware decode
VGA Interface Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA hot
plug
LVDS Interface Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO
Audio
Chipset Integrated on Intel® PCH QM67
Audio Codec Implemented on carrier board
Super I/O
Connected to LPC bus on carrier if needed
TPM
Chipset Atmel AT97SC3204
Type TPM 1.2
Power Specications
Input Power AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption TBD
Smart Battery Support Yes
Mechanical and Environmental
Size COM Express Basic, 125 mm x 95 mm
Board Thickness 0.093” (2.3mm)
Operating Temp. Standard
-20°C to 70°C
Operating Temp. Extended
-40°C to 85°C (not available for Core™ i7-2715QE)
Storage Temp. -55°C to 85°C
Humidity 90% at 60°C non-condensing
Shock 50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
Vibration Operating: 11.96 Grms, 50-20,000 Hz, each axis,
MIL-STD-202G Method 214A
Compatibility PICMG COM Express COM.0 R2.1 Type 6
Certications CE, FCC, HALT
Operating Systems
Standard Support Windows 7, Linux
Extended Support (BSP) WES 2009/7, WEC 7, Linux, VxWorks 6.9, QNX 6.5, AIDI
Library
Extreme Rugged™ COM Express® Type 6 Computer-on-
Module with Intel® Core™ i7/i5/i3 processor and QM67 Chipset
Features
Quad/dual core Intel® Core™ i7/i5/i3 Processor
Intel® QM67 Chipset
Up to 16GB ECC 1333Mhz DDR3 memory in two
SODIMM sockets
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1, one PCIe x16 (Gen2) for graphics
(or general purpose x8/4/1)
Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit
Ethernet, eight USB 2.0
COM Express® COM.0 R2.1 Type 6 Pinout
Extended Temperature: -40°C to +85°C
50% Thicker PCB for high vibration environments