MC74LCX541DTR2G - ON Semiconductor

July, 2012 − Rev. 7

1Publication Order Number:

MC74LCX541/D

MC74LCX541

Low-Voltage CMOS Octal

Buffer Flow Through Pinout

With 5 V−Tolerant Inputs and Outputs

(3−State, Non−Inverting)

The MC74LCX541 is a high performance, non−inverting octal

buffer operating from a 2.3 to 3.6 V supply. This device is similar in

function to the MC74LCX244, while providing flow through

architecture. High impedance TTL compatible inputs significantly

reduce current loading to input drivers while TTL compatible outputs

offer improved switching noise performance. A VI specification of

5.5 V allows MC74LCX541 inputs to be safely driven from 5 V

devices. The MC74LCX541 is suitable for memory address driving

and all TTL level bus oriented transceiver applications.

Current drive capability is 24 mA at the outputs. The Output Enable

(OE1. OE2) inputs, when HIGH, disables the output by placing them

in a HIGH Z condition.

Features

•Designed for 2.3 to 3.6 V VCC Operation

•5 V Tolerant − Interface Capability With 5 V TTL Logic

•Supports Live Insertion and Withdrawal

•IOFF Specification Guarantees High Impedance When VCC = 0 V

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current in All Three Logic States (10 mA)

Substantially Reduces System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance:

♦Human Body Model >2000 V

♦Machine Model >200 V

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAMS

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

A = Assembly Location

L, WL = Wafer Lot

Y, YY = Year

W, WW = Work Week

G or G=Pb−Free Package

SOIC−20 WB

DW SUFFIX

CASE 751D

LCX541

AWLYYWWG

LCX

541

ALYW G

TSSOP−20

DT SUFFIX

CASE 948E

(Note: Microdot may be in either location)

MC74LCX541

http://onsemi.com

Figure 1. Pinout: 20−Lead (Top View)

1920 18 17 16 15 14

21 34567

VCC

OE2 O0 O1 O2 O3 O4 O5 O6 O7

OE1 D0 D1 D2 D3 D4 D5 D6 D7 GND

Figure 2. Logic Diagram

OE1 1

D0 2O0

D1 3O1

D2 4O2

D3 5O3

D4 6O4

D5 7O5

D6 8O6

D7 9O7

OE2 19

PIN NAMES

Function

Output Enable Inputs

Data Inputs

3−State Outputs

Pins

OEn

TRUTH TABLE

Inputs Outputs

OE1 OE2 Dn On

L L L L

L L H H

X H X Z

H X X Z

H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State;

X = High or Low Voltage Level and Transitions are Acceptable, for ICC reasons,

DO NOT FLOAT Inputs

MC74LCX541

http://onsemi.com

MAXIMUM RATINGS

Symbol Parameter Value Condition Units

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V

−0.5 ≤ VO ≤ VCC + 0.5 (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Units

VCC Supply Voltage

Operating

Data Retention Only

2.0

1.5

3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage

(HIGH or LOW State)

(3−State)

VCC

5.5

IOH HIGH Level Output Current, VCC = 3.0 V − 3.6 V −24 mA

IOL LOW Level Output Current, VCC = 3.0 V − 3.6 V 24 mA

IOH HIGH Level Output Current, VCC = 2.7 V − 3.0 V −12 mA

IOL LOW Level Output Current, VCC = 2.7 V − 3.0 V 12 mA

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

ORDERING INFORMATION

Device Package Shipping†

MC74LCX541DWR2G SOIC−20

(Pb−Free)

1000 Tape & Reel

NLV74LCX541DWR2G* 1000 Tape & Reel

MC74LCX541DWG SOIC−20

(Pb−Free)

38 Units / Rail

NLV74LCX541DWG* 38 Units / Rail

MC74LCX541DTG TSSOP−20

(Pb−Free)

75 Units / Rail

NLV74LCX541DTG* 75 Units / Rail

MC74LCX541DTR2G TSSOP−20

(Pb−Free)

2500 Tape & Reel

NLV74LCX541DTR2G* 2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

MC74LCX541

http://onsemi.com

DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Units

VIH HIGH Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V 2.0 V

VIL LOW Level Input Voltage (Note 2) 2.7 V ≤ VCC ≤ 3.6 V 0.8 V

VOH HIGH Level Output Voltage 2.7 V ≤ VCC ≤ 3.6 V; IOH = −100 mAVCC −0.2 V

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL,

VOUT = 0 to 3.6 V

±5mA

IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA

IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

2. These values of VI are used to test DC electrical characteristics only.

AC ELECTRICAL CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)

Limits

TA = −40°C to +85°C

VCC = 3.0 V to 3.6 V VCC = 2.7 V

Symbol Parameter Waveform Min Max Max Units

tPLH

tPHL

Propagation Delay

Input to Output

1 1.5

1.5

6.5

7.5

tPZH

tPZL

Output Enable Time to

High and Low Level

2 1.5

1.5

8.5

9.5

tPHZ

tPLZ

Output Disable Time From

High and Low Level

2 1.5

1.5

7.5

8.5

tOSHL

tOSLH

Output−to−Output Skew (Note 3) 1.0

1.0

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Units

VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V

VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Units

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

MC74LCX541

http://onsemi.com

WAVEFORM 1 - PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

2.7 V

0 V

VOH

VOL

tPHL

tPLH

WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

2.7 V

0 V

≈ 0 V

OEn

tPZH

≈ 3.0 V

tPHZ

tPZL tPLZ

1.5 V

1.5 V1.5 V

1.5 V 1.5 V

Figure 3. AC Waveforms

1.5 V

VCC

VOH - 0.3 V

VOL + 0.3 V

GND

OPEN

PULSE

GENERATOR

DUT

VCC

6 V

GND

Test Switch

tPLH, tPHL Open

tPZL, tPLZ 6 V

Open Collector/Drain tPLH and tPHL 6 V

tPZH, tPHZ GND

CL = 50 pF or equivalent (Includes jig and probe capacitance)

RL = R1 = 500 W or equivalent

RT = ZOUT of pulse generator (typically 50 W)

Figure 4. Test Circuit

MC74LCX541

http://onsemi.com

PACKAGE DIMENSIONS

B20X

H10X

18X A1

SEATING

PLANE

hX 45_

0.25 M

0.25 S

DIM MIN MAX

MILLIMETERS

A2.35 2.65

A1 0.10 0.25

B0.35 0.49

C0.23 0.32

D12.65 12.95

E7.40 7.60

e1.27 BSC

H10.05 10.55

h0.25 0.75

L0.50 0.90

q0 7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

SOIC−20 WB

CASE 751D−05

ISSUE G

MC74LCX541

http://onsemi.com

PACKAGE DIMENSIONS

TSSOP−20

CASE 948E−02

ISSUE C

DIM

MIN MAX MIN MAX

INCHES

6.60 0.260

MILLIMETERS

B4.30 4.50 0.169 0.177

C1.20 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.27 0.37 0.011 0.015

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

____

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

ÍÍÍÍ

110

1120

PIN 1

IDENT

−T−

0.100 (0.004)

DGH

SECTION N−N

JJ1

−W−

SEATING

PLANE

−V−

−U−

0.10 (0.004) V S

20X REFK

L/2

U0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40 0.252

--- ---

U0.15 (0.006) T

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

MC74LCX541

http://onsemi.com

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,

copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without

limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for

surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where

personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and

its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,

any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture

of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74LCX541/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loca

Sales Representative