VDD Internal VDD External JP1.1 JP1.2 JP1.3 JP2.1 JP2.2 JP2.3 9.00mm [0.354"] GND 4.00mm [0.157"] A1 Mictor 2 3.00mm [0.118"] VDDQ External Mictor 1 26.00mm [1.024"] GND 10.50mm [0.413"] 3.00mm [0.118"] Orientation Dot VDDQ Internal Top View 18.50mm [0.728"] 36.50mm [1.437"] Side View 8.94mm [0.352"] 1 4.67mm [0.184"] assembled 2 0402 cap 8.00mm [0.315"] 1 Target PCB 2 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] FR4/G10 or equivalent high temp rigid-flex material. 17m [1/2 oz.] Cu clad. SnPb plating. Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25m [10"] Au over 1.27m [50"] Ni (min.). Description: BGA rigid-flex cable adapter. 60 pin, 0.8mm pitch BGA rigid-flex carrier adapter with AMP mictor connectors and PGA foot. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.13mm [0.005"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. PB-BGA60C-DDRRAM-01 Drawing (c) 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 1:0.75 Rev: A Drawing: H. Hansen Date: 4/11/05 File: PB-BGA60C-DDRRAM-01 Dwg Modified: