ASMT-Ax00
1W Power LED Light Source
Data Sheet
Description
This 1W Power LED Light Source is a high performance
energy efficient device which can handle high thermal
and high driving current. The exposed pad design enables
excellent heat transfer from the package to the mother-
board. Option with electrically isolated metal slug is also
available.
The White Power LED is available in the range of color
temperature from 2700K to 10000K
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reflow soldering process.
This part has a foot print that is compatible to most of the
high power LED in the market today.
Features
x Available in Red, Red Orange, Amber, Blue, Royal Blue,
Green, Cool White, Neutral White and Warm White color
x Energy efficient
x Exposed metal slug for excellent heat transfer
x Compatible with reflow soldering process
x High current operation
x Long operation life
x Wide viewing angle at 130°
x Silicone encapsulation
x Non-ESD sensitive (threshold > 16 kV)
x MSL 2a products
Applications
x Architectural lighting
x Channel backlighting
x Contour lighting
x Retail Display lighting
x Decorative lighting
x Garden lighting
2
Package Dimensions
Figure 1. ASMT-Ax00 package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Metal slug is connected to anode for electrically non-isolated option.
3. Tolerance is ±0.1 mm unless otherwise specified.
4 . Terminal Finish: Ag plating
Part Numbering System
Note:
1. Please refer to Page 10 for selection details.
7.4
2.3
Ø 8.0
7.4
1.1
1.5
Ø 6.0
Metal Slug
Anode
Lead Lens
Cathode
Lead
Body
Metal Slug
13.6
0.5
4.1 (ref:)
6.0
TOP VIEW BOTTOM VIEW
3.0 2.0
ASMT – A x 00 – x x3 x4x5x6
Packaging Option
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Color
R – Red
H – Red Orange
A – Amber
G – Green
B – Blue
L – Royal Blue
W – Cool White
N – Neutral White
Y – Warm White
12
3
Device Selection Guide (Tj = 25°C)
Part Number Color
Luminous Flux (lm) / Radiometric Power (mW),
ΦV [1,2]Test
Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-AR00-AQR00 Red 30.6 43.0 51.7 350 AllnGaP No [3]
ASMT-AR00-ARR00 39.8 46.0 51.7
ASMT-AH00-AQR00 Red Orange 30.6 43.0 51.7 350AlInGaP No [3]
ASMT-AH00-ARR00 39.8 46.0 51.7
ASMT-AA00-AQR00 Amber 30.6 43.0 51.7 350 AllnGaP No [3]
ASMT-AA00-ARR00 39.8 46.0 51.7
ASMT-AB00-NLN00 Blue 10.7 15.0 23.5350InGaN Yes
ASMT-AB00-NMP00 13.9 18.0 30.6
ASMT-AL00-NMP00 Royal Blue 225 mW 320 mW 435 mW 350InGaN Yes
ASMT-AL00-NNP00 275 mW 350 mW 435 mW
ASMT-AG00-NST00 Green 51.7 65.0 87.4 350InGaN Yes
ASMT-AW00-NST00 Cool White 51.7 65.0 87.4 350InGaN Yes
ASMT-AW00-NSU00 51.7 70.0 99.6
ASMT-AW00-NTU00 67.2 80.0 99.6
ASMT-AN00-NSU00 Neutral White 51.7 70.0 99.6 350InGaN Yes
ASMT-AN00-NTU00 67.2 80.0 99.6
ASMT-AY00-NRT00 Warm White 39.8 60.0 87.4 350InGaN Yes
ASMT-AY00-NST00 51.7 65.0 87.4
Notes:
1. ΦV is the total luminous flux / radiometric power output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux and power tolerance is ±10 %
3. Electrically isolated metal slug option is also available. Please contact your Avago sale representative.
Absolute Maximum Ratings
Parameter AllnGaP InGaN Units
DC Forward Current [1] 350350mA
Peak Pulsing Current [2] 1000 1000 mA
Power Dissipation 10851400 mW
Reverse Voltage 55V
LED Junction Temperature 125135°C
Operating Metal Slug Temperature Range at 350 mA -40 to +115-40 to +120 °C
Storage Temperature Range -40 to +120 -40 to +120 °C
Soldering Temperature Refer to Figure 24
Notes:
1. Derate linearly based on Figure 10 for AlInGaP and Figure 17 for InGaN.
2. Pulse condition duty factor = 10%, Frequency = 1 kHz.
4
Optical Characteristics at 350 mA (TJ = 25 °C)
Part Number Color
Peak Wavelength,
OPEAK (nm)
Dominant
Wavelength,
OD [1] (nm)
Viewing Angle,
2T½ [2] (°)
Luminous Efficiency
(lm/W)
Typ. Typ. Typ. Typ.
ASMT-AR00-AQR00 Red 635625130 51
ASMT-AR00-ARR00 635625130 55
ASMT-AH00-AQR00 Red Orange 625615130 51
ASMT-AH00-ARR00 625615130 55
ASMT-AA00-AQR00 Amber 598 590 130 51
ASMT-AA00-ARR00 598 590 130 55
ASMT-AG00-NST00 Green 519 525130 53
ASMT-AB00-NLN00 Blue 460 470 130 12
ASMT-AB00-NMP00 460 470 130 15
ASMT-AL00-NMP00 Royal Blue 450455 130 Not applicable
ASMT-AL00-NNP00 450455 130 Not applicable
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2T½ [2] (°)
Luminous Efficiency
(lm/W)
Min. Max. Typ. Typ.
ASMT-AW00-NST00 Cool White 4500 10000 130 53
ASMT-AW00-NSU00 4500 10000 130 57
ASMT-AW00-NTU00 4500 10000 130 65
ASMT-AN00-NSU00 Neutral White 3500 4500 130 57
ASMT-AN00-NTU00 3500 4500 130 65
ASMT-AY00-NRT00 Warm White 2700 3500 130 53
ASMT-AY00-NST00 2700 3500 130 53
Notes:
1. The dominant wavelength, OD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage,
VF (Volts) at IF = 350mA
Thermal Resistance,
RTj-ms(°C/W) [1]
Min. Typ Max. Typ.
AllnGaP 1.9 2.4 3.1 10
InGaN 2.8 3.54.0 10
Notes:
1. RTj-ms is Thermal Resistance from LED junction to metal slug.
5
0
50
100
150
200
250
300
350
400
450
500
0 0.5 1 1.5 2 2.5 3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
530545 560575 590605620635 650665 680
WAVELENGTH - nm
RELATIVE INTENSITY
AMBER
RED
RED ORANGE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
050100 150200 250300 350
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
Figure 2. Relative Intensity vs. Wavelength for Red, Red Orange and Amber. Figure 3. Relative Luminous Flux vs. Mono Pulse Current.
Figure 4. Forward Current vs. Forward Voltage. Figure 5. Radiation Pattern for Red, Red Orange and Amber.
AlInGaP
Figure 6. Maximum pulse current vs. ambient temperature.
Derated based on TA = 25°C, RθJ-A = 50°C/W.
Figure 7. Maximum pulse current vs. ambient temperature.
Derated based on TA = 85°C, RθJ-A = 50°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1.00
D =
0.05
0.10
0.25
0.50
1.00
6
MAX ALLOWABLE DC CURRENT - mA
0
50
100
150
200
250
300
350
400
0 20 40 60 80 100 120 140
METAL SLUG TEMPERATURE, TMS - °C
0
50
100
150
200
250
300
350
400
0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
RTJ-A = 30°C/W
RTJ-A = 50°C/W
RTJ-A = 40°C/W
RTJ-MS = 10°C/W
0.0
20.0
40.0
60.0
80.0
100.0
120.0
140.0
160.0
180.0
200.0
220.0
240.0
260.0
280.0
300.0
-50-25 025 5075 100 125
JUNCTION TEMPERATURE, TJ -°C
RELATIVE LIGHT OUTPUT (%)
(NORMALIZED AT 25°C)
RED
AMBER
-0.20
-0.10
0.00
0.10
0.20
0.30
0.40
0.50
0.60
-50-25 025 5075 100 125
JUNCTION TEMPERATURE, TJ -°C
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
RED-ORANGERED
AMBER
RED-ORANGE
Figure 8. Relative Light Output vs. Junction Temperature. Figure 9. Forward Voltage Shift vs. Junction Temperature.
Figure 10. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125°C, RTJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 11. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125°C, RTJ-MS = 10°C/W.
7
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
0
50
100
150
200
250
300
350
400
450
500
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
WARM WHITE
COOL WHITE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
NORMALIZED INTENSITY
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
380405430455 480505530555 580605630
WAVELENGTH - nm
RELATIVE INTENSITY
BLUE
GREEN
ROYAL BLUE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
050100 150200 250300 350
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
Figure 12. Relative Intensity vs. Wavelength for Cool and Warm White. Figure 13. Relative Intensity vs. Wavelength for Blue, Royal Blue and Green.
Figure 14. Relative Luminous Flux vs. Mono Pulse Current. Figure 15. Forward Current vs. Forward Voltage.
InGaN
Figure 16. Radiation Pattern for Blue, Royal Blue and Green. Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White.
8
0
50
100
150
200
250
300
350
400
0 25 50 75 100 125 150
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 30°C/W
RθJ-A = 50°C/W
RθJ-A = 40°C/W
0
50
100
150
200
250
300
350
400
0 25 50 75 100 125 150
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-MS = 10°C/W
-0.35
-0.25
-0.15
-0.05
0.05
0.15
0.25
0.35
-50-25 025 5075 100 125 150
JUNCTION TEMPERATURE, TJ -°C
FORWARD VOLTAGE SHIFT - V
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
120.0
-50-25 025 5075 100 125 150
JUNCTION TEMPERATURE, TJ -°C
RELATIVE LIGHT OUTPUT (%)
(NORMALIZED AT 25°C)
GREEN
WHITE
BLUE
ROYAL BLUE
WHITE
BLUE
ROYAL BLUE
GREEN
Figure 20. Relative Light Output vs. Junction Temperature. Figure 21. Forward Voltage Shift vs. Junction Temperature.
Figure 22. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 135°C, RTJ-A = 30°C/W, 40°C/W and 50°C/W.
Figure 23. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 135°C, RTJ-MS = 10°C/W.
Figure 18. Maximum pulse current vs. ambient temperature.
Derated based on TA = 25°C, RθJ-A = 50°C/W.
Figure 19. Maximum pulse current vs. ambient temperature.
Derated based on TA = 85°C, RθJ-A = 50°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D=tp
T
tp
IF
T
D=tp
T
tp
IF
TD =
0.05
0.10
0.25
0.50
1.00
D =
0.05
0.10
0.25
0.50
1.00
9
Figure 24. Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs,
do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 25. Recommended pick and place nozzle tip.
Inner diameter = 5.8 mm.
Figure 26. Recommended Reflow Soldering.
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
∅5.8
Ø 6.40
1.10
1.60
2.65
8.80
4.38
14.10
10
Option Selection Details
ASMT-Ax100 – x2 x3 x4 x5 x6
x3 – Minimum Flux Bin Selection
x4 – Maximum Flux Bin Selection
x5 – Color Bin Selection
x6 – Packaging Option
Color Bin Selection [x5]
Individual reel will contain parts from one full bin only.
Cool White
0 Full Distribution
E VM, UM, VN and UN
F WM, VM, WN and VN
G XM, WM, XN and WN
H UN, VN, U0 and V0
J WN, VN, W0 and V0
K XN, WN, X0 and W0
L V0, U0, VP and UP
M W0, V0, WP, VP and WQ
N X0, W0, XP, WP and WQ
P Y0
Q YA
Warm White
0 Full Distribution
E NM, MM, N1 and M1
F PM, NM, P1 and N1
G QM, PM, Q1 and P1
H M1, N1, M0 and N0
J P1, N1, P0 and N0
K Q1, P1, Q0 and P0
L N0, M0, NA and MA
M P0, N0, PA and NA
N Q0, P0, QA and PA
Neutral White
0 Full Distribution
E SM, RM, S1 and R1
F TM, SM, TN and S1
G S1, R1, S0 and R0
H TN, S1, T0 and S0
J S0, R0, SA and RA
K T0, S0, TP and SA
Others Colors
0 Full Distribution
Z A and B
YB and C
W C and D
V D and E
Q A, B and C
P B, C and D
N C, D and E
M D, E and F
Flux / Power Bin Limit [x3, x4]
Color Bin ID
Luminous Flux (lm) / Radiometric
Power (mW) at 350 mA
Min. Max.
Blue K 8.2 10.7
L 10.7 13.9
M 13.9 18.1
N 18.1 23.5
P 23.530.6
Other Colors Q 30.6 39.8
R 39.8 51.7
S51.7 67.2
T 67.2 87.4
U 87.4 99.6
Royal Blue M 225.0 275.0
N275.0 355.0
P355.0 435.0
Tolerance for each bin limits is ±10 %
11
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
X-COORDINATE
Y-COORDINATE
10000K
7000K
6300K
Y0
YA
UM
UN
U0
UP
V0
VM
VN
VP
X0
XP
XM
XNW0
WN
WQ
WM
WP
5650K
5000K
4500K
BLACK BODY CURVE
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.38 0.40 0.42 0.44 0.46 0.48 0.50
X-COORDINATE
Y-COORDINATE
QM
PM
MM
NM
Q1
Q0
QA
P0
P1
PA
M0
M1
MA
N0
N1
NA
3050K 2850K
BLACK BODY CURVE
2700K
3500K 3250K
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.34 0.36 0.38 0.40 0.42 0.44
X-COORDINATE
Y-COORDINATE
RM
R1
R0
RA
T0
SM
S1
SA
TM
TN
TP
S0
4500K
4100K
BLACK BODY CURVE
3500K
3800K
Figure 27. Color bin structure for Cool White. Figure 28. Color bin structure for Warm White.
Figure 29. Color bin structure for Neutral White.
12
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin UM X 0.365 0.367 0.348 0.347
Y 0.385 0.400 0.385 0.372
Bin UN X 0.365 0.362 0.346 0.347
Y 0.386 0.372 0.359 0.372
Bin U0 X 0.362 0.360 0.344 0.346
Y 0.372 0.357 0.344 0.359
Bin UP X 0.360 0.357 0.343 0.344
Y 0.357 0.342 0.311 0.344
Bin VM X 0.329 0.329 0.348 0.347
Y 0.357 0.369 0.385 0.372
Bin VN X 0.329 0.329 0.347 0.346
Y 0.345 0.357 0.372 0.359
Bin V0 X 0.329 0.329 0.346 0.344
Y 0.311 0.345 0.359 0.344
Bin VP X 0.329 0.344 0.343 0.329
Y 0.331 0.344 0.331 0.320
Bin WM X 0.329 0.329 0.315 0.314
Y 0.369 0.357 0.344 0.355
Bin WN X 0.329 0.316 0.315 0.329
Y 0.345 0.333 0.344 0.357
Bin W0 X 0.329 0.329 0.317 0.316
Y 0.345 0.331 0.320 0.333
Bin WP X 0.329 0.329 0.318 0.317
Y 0.331 0.320 0.310 0.320
Bin WQ X 0.329 0.329 0.319 0.318
Y 0.320 0.310 0.300 0.310
Bin XM X 0.301 0.314 0.315 0.303
Y 0.342 0.355 0.344 0.333
Bin XN X 0.305 0.303 0.315 0.316
Y 0.322 0.333 0.344 0.333
Bin X0 X 0.308 0.305 0.316 0.317
Y 0.311 0.322 0.333 0.320
Bin XP X 0.308 0.317 0.319 0.311
Y 0.311 0.320 0.300 0.293
Bin Y0 X 0.308 0.283 0.274 0.303
Y 0.311 0.284 0.301 0.333
Bin YA X 0.308 0.311 0.290 0.283
Y 0.311 0.293 0.270 0.284
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin MM X 0.471 0.460 0.473 0.486
Y 0.451 0.430 0.432 0.455
Bin M1 X 0.460 0.453 0.467 0.473
Y 0.430 0.416 0.419 0.432
Bin M0 X 0.453 0.444 0.459 0.467
Y 0.416 0.399 0.403 0.419
Bin MA X 0.459 0.444 0.436 0.451
Y 0.403 0.399 0.384 0.389
Bin NM X 0.454 0.444 0.460 0.471
Y 0.446 0.426 0.430 0.451
Bin N1 X 0.444 0.438 0.453 0.460
Y 0.426 0.412 0.416 0.430
Bin N0 X 0.438 0.429 0.444 0.453
Y 0.412 0.394 0.399 0.416
Bin NA X 0.444 0.429 0.422 0.436
Y 0.399 0.394 0.379 0.384
Bin PM X 0.438 0.430 0.444 0.454
Y 0.440 0.421 0.426 0.446
Bin P1 X 0.430 0.424 0.438 0.444
Y 0.421 0.407 0.412 0.426
Bin P0 X 0.424 0.416 0.429 0.438
Y 0.407 0.389 0.394 0.412
Bin PA X 0.429 0.416 0.410 0.422
Y 0.394 0.389 0.374 0.379
Bin QM X 0.421 0.414 0.430 0.438
Y 0.433 0.414 0.421 0.440
Bin Q1 X 0.414 0.409 0.424 0.430
Y 0.414 0.400 0.407 0.421
Bin Q0 X 0.409 0.402 0.416 0.424
Y 0.400 0.382 0.389 0.407
Bin QA X 0.416 0.402 0.396 0.410
Y 0.389 0.382 0.367 0.374
Tolerance: ± 0.01
13
Neutral Color Limits
White (Chromaticity Coordinates)
Bin RM X 0.421 0.414 0.397 0.402
Y 0.433 0.414 0.406 0.423
Bin R1 X 0.414 0.409 0.392 0.397
Y 0.414 0.400 0.391 0.406
Bin R0 X 0.392 0.387 0.402 0.409
Y 0.391 0.374 0.382 0.400
Bin RA X 0.387 0.383 0.396 0.402
Y 0.374 0.360 0.367 0.382
Bin SM X 0.402 0.397 0.382 0.386
Y 0.423 0.406 0.397 0.413
Bin S1 X 0.397 0.392 0.378 0.382
Y 0.406 0.391 0.382 0.397
Bin S0 X 0.392 0.387 0.374 0.378
Y 0.391 0.374 0.366 0.382
Bin SA X 0.387 0.383 0.370 0.374
Y 0.374 0.360 0.351 0.366
Bin TM X 0.386 0.382 0.365 0.367
Y 0.413 0.397 0.386 0.400
Bin TN X 0.382 0.378 0.362 0.365
Y 0.397 0.382 0.372 0.386
Bin T0 X 0.378 0.374 0.360 0.362
Y 0.382 0.366 0.357 0.372
Bin TP X 0.374 0.370 0.357 0.360
Y 0.366 0.351 0.342 0.357
Tolerance: ± 0.01
Color Bin ID
Dominant Wavelength (nm)
at 350 mA
Min. Max.
Red – 620.0 635.0
Red Orange – 610.0 620.0
Amber B 587.0 589.5
C 589.5 592.0
D 592.0 594.5
E 594.5 597.0
Blue A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Green A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
Color Bin ID
Peak Wavelength (nm) at 350 mA
Min. Max.
Royal Blue C 440.0 445.0
D445.0 450.0
E450.0 455.0
F455.0 460.0
Tolerance: ±2 nm
Example
ASMT-AW00-NST00
ASMT-AW00-Nxxxx – Cool White, InGaN, Electrically
isolated Heat Sink
X3 = S – Minimum Flux Bin S
X4 = T – Maximum Flux Bin T
X5 = 0 – Full DIstribution
X6 = 0 – Tube Option
Packaging Option [x6]
Selection Option
0 Tube
1 Tape and Reel
14
Figure 30. Package tube dimensions.
17.2 ±0.1
7.3 ±0.10.4 ±0.1
3.4 ±0.1 5.0 ±0.1
8.4 ±0.1
395mm
Packing Tube – Option 0
15
Figure 32. Reel dimensions.
Tape and Reel – Option 1
Figure 31. Carrier tape dimensions.
Ø 330.0 ± 2.0
2.0 ±0.5
Ø 21.0 ±0.8
Ø 13.0 +0.5
–0.2
See Detail – 1
Detail – 1
1.8 +0.2
0.0
24.0 +0.2
0.0
100 ±0.5
Ø 1.50 +0.10
0.00
Ø 8.10 +0.10
0.00
4.00 ±0.10
2.00 ±0.10
1.75 ±0.10
24.00 ±0.30
11.50 ±0.10
12.00 ±0.10
‘AO’
8.10 ±0.10
2.55
Section 'A-A'
Section 'B-B'
B
B
A
A
‘KO’
4.50 ±0.10
0.40 ±0.05
‘BO’
14.30 ±0.10
R 0.30 Max (TYP.)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1640EN - February 4, 2010
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage
the product and cause premature failure. During assembly
of handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “60%” HIC indicator is NOT blue.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LED floor life exceeded 672hrs.
Recommended baking condition: 60±5°C for 20hrs.
