Datasheet CMOS LDO Regulator for Portable Equipments High Ripple Rejection, Low Current Consumption, Versatile Package FULL CMOS LDO Regulator (500mA) BUXXTH5WNVX General Description Key Specifications BUXXTH5WNVX is high-performance FULL CMOS regulator with 500-mA output, which is mounted on versatile package SSON004X1010 (1.00mm x 1.00 mm x 0.60mm). It has excellent ripple rejection, noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 10A. It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. Load Current: Accuracy output voltage: Power Supply rejection Ratio: Low current consumption: Operating temperature range: 500mA 1.0% 80dB@1KHz 10A (TYP) -20C to +85C Applications Smartphone, Battery-powered portable equipment, etc. Features Package High accuracy detection High ripple rejection low current consumption Compatible with small ceramic capacitor (Cin=Co=1.0uF) With built-in output discharge circuit ON/OFF control of output voltage With built-in over current protection circuit SSON004X1010 : 1.00mm x 1.00mm x 0.60mm Typical Application Circuit CE CE VIN VIN 1.0F VOUT VOUT 1.0F GND GND GND Figure 1. Application Circuit Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product is not designed for protection against radioactive rays 1/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Connection Diagram SSON004X1010 TOP VIEW 4 VIN BOTTOM VIEW 3 CE 1 VOUT 2 GND LOT Number reverse FIN Part Number Marking 3 CE 4 VIN 2 GND 1 VOUT 1PIN MARK Pin Descriptions SSON004X1010 Symbol Function VOUT Output Voltage GND Grounding ON/OFF control of output voltage CE (High: ON, Low: OFF) VIN Power Supply Voltage FIN Substrate (Connect to GND) PIN No. 1 2 3 4 reverse Ordering Information B U X Part Number X T Output Voltage 1A : 1.05V 35 : 3.50V H 5 High Ripple Rejection Maximum Output Current 500mA W N V X - 1 with Package output discharge NVX : SSON004X1010 None: Chip Rev.1 1: Chip Rev.2 (XX=1A,12) T L Packageing and forming specification Embossed tape and reel TL : The pin number 1 is the lower left SSON004X1010 <Tape and Reel information> 1.00.1 Tape 1.00.1 1PIN MARK 0.6MAX 0.320.1 48 0. Direction of feed 05 0.650.05 0. 1 2 (0.12) +0.03 0.02 -0.02 S 0.05 Embossed carrier tape Quantity 5000pcs TL The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the left hand ) 3-C0.18 R0.05 45 0 0. 5 0.250.05 0.070.1 48 3 0.250.1 0. 4 Direction of feed 1pin (Unit : mm) Reel Order quantity needs to be multiple of the minimum quantity. Lineup Marking Output Voltage Part Number Di Ci 6i Ai 1.05V 1.20V 2.85V 3.50V BU1ATH5WNVX-1 BU12TH5WNVX-1 BU2JTH5WNVX BU35TH5WNVX www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Absolute Maximum Ratings (Ta=25C) PARAMETER Symbol Limit VMAX -0.3 to +6.5 Power Supply Voltage Power Dissipation Maximum junction temperature Operating Temperature Range Storage Temperature Range Pd 560 TjMAX Unit V (Note1) mW +125 C Topr -20 to +85 C Tstg -55 to +125 C (Note1) Pd deleted at 5.6mW/C at temperatures above Ta=25C, mounted on 70x70x1.6 mm glass-epoxy PCB. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. RECOMMENDED OPERATING RANGE (not to exceed Pd) PARAMETER Power Supply Voltage Maximum Output Current Symbol VIN Limit 1.7 to 6.0 Unit V IMAX 500 mA OPERATING CONDITIONS PARAMETER Input Capacitor Symbol Cin MIN. 1.0 (Note2) TYP. - MAX. - Unit F Co 1.0 (Note2) - - F Output Capacitor (Note2) Make sure that CONDITION Ceramic capacitor recommended the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time progresses characteristic. Electrical Characteristics (Ta=25C, VIN= VOUT+1.0V, CIN=1.0F, Co=1.0F, unless otherwise noted.) Limits Parameter Symbol Unit Min. Typ. Max. Input Voltage VIN Output Voltage VOUT 1.7 VOUT -25mV VOUT 6.0 VOUT +25mV Conditions V V IOUT=10A, VOUT2.5V V IOUT=10A, VOUT2.5V Line Regulation VOUT-line VOUT x0.99 - - VOUT x1.01 20 mV From (VOUT+0.3V) to 5.0V, IOUT=10mA Load Regulation VOUT-load - 21 40 mV IOUT=5mA to 250mA - 520 700 mV VOUT=1.05V (IOUT=250mA) - 440 550 mV VOUT=1.20V (IOUT=250mA) - 160 250 mV VOUT=2.85V (IOUT=250mA) - 150 230 mV VOUT=3.50V (IOUT=250mA) Vdrop-out Voltage Dropout Load Current Iload 500 - - mA No Load Quiescent Current Icq - 10 20 A IOUT=0mA Power Supply Rejection Ratio RR1 - 82 - dB fRR=100Hz RR2 - 80 - dB fRR=1kHz Output Noise Voltage Noise - 40 - nVHz @10KHz Topr -20 - 85 C RDSC 20 50 80 Operating Temperature range Discharge Resistor CE Pin Pull-down Current CE Pin Control Voltage ISTB 0.1 0.9 8.0 uA ON VCEH 1.2 - 6.0 V OFF VCEL -0.3 - 0.3 V www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Block Diagrams VIN VIN VREF VOUT CIN OCP GND CE VOUT Co CIN1.0F (Ceramic capacitor) Co 1.0F (Ceramic capacitor) CE Figure 2. Block Diagrams www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU1ATH5WNVX (Ta=25C unless otherwise specified.) LINEREGULATION 1.08 25 85 1.07 Load Regulation 1.150 -20 25 85 CE=VIN Iout=10mA -20 1.06 VIN=2.5V CE=VIN 1.100 VOUT [V] VOUT[V] 1.05 1.04 1.03 1.050 1.02 1.000 1.01 1.00 0.950 0.99 1.7 2.0 2.3 2.6 2.9 3.2 0 3.5 50 100 Figure 3. 200 250 300 Figure 4. OUTPUT VOLTAGE vs TEMPERATURE GROUND PIN CURRENT vs INPUT VOLTAGE 20 1.15 VIN=2.5V CE=VIN IOUT=10uA -20 25 CE=VIN IOUT=0mA 85 15 IGND[uA] 1.10 VOUT[V] 150 IOUT[mA] VIN[V] 1.05 10 1.00 5 0.95 -20 0 20 40 Temperature[] 60 0 80 1.7 2.3 2.6 VIN[V] 2.9 3.2 3.5 Figure 6. Figure 5. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2.0 5/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU1ATH5WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE 20 GROUND PIN CURRENT vs LOAD 300 VIN=2.5V CE=VIN IOUT=0mA 18 16 VIN=2.5V CE=VIN Ta=25 200 12 IGND [uA] IGND[uA] 14 10 8 6 100 4 2 0 -20 0 20 40 Temperature[] 60 0 80 0 100 200 Figure 7. VIN=2.5V CE=VIN Ta=25 90 80 70 0.8 PSRR[dB] VOUT[V] 500 PSRR vs FREQUENCY 100 VIN=2.5V CE=VIN Ta=25 1.0 400 Figure 8. OCP 1.2 300 IOUT [mA] 0.6 0.4 60 50 40 30 20 0.2 10 0.0 0 0 100 200 300 400 500 600 700 800 900 1000 1100 IOUT[mA] 100 1,000 100mV/div 1.05V 500mV/div 100mV/div 500mV/div VOUT CE=VIN VOUT Ta=25 Iout=10mA 2.5V VOUT 1.05V 3.5V VIN CE=VIN Ta=25 Iout=150mA 2.5V 200us/div 200us/div Figure 11. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1,000,000 LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE VIN 100,000 Figure 10. Figure 9. 3.5V 10,000 Frequency[Hz] Figure 12. 6/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU1ATH5WNVX (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V CE CE 1V/div 1V/div 0V VIN=2.5V Ta=25 Iout=0mA Cout=1.0uF VOUT VIN=2.5V Ta=25 Iout=0mA Cout=1.0uF VOUT 20s/div 40s/div Figure 13. Figure 14. LOAD TRANSIENT RESPONSE SHUTDOWN CURRENT vs INPUT VOLTAGE 10.00 Trise=12us VIN=5.5V CE=0V 250mA IOUT 1mA ISTBY[uA] 200mA/div 0V 1.00 200mV/div 0.10 VOUT VIN=2.5V CE=VIN Ta=25 0.01 -20 0 20 40 60 80 Temperature[] 20s/div Figure 16. Figure 15. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU12TH5WNVX-1 (Ta=25C unless otherwise specified.) LINE REGULATION 1.23 -20 25 85 1.22 1.21 Load Regulation 1.300 CE=VIN Iout=10mA -20 25 85 VIN=2.5V CE=VIN 1.250 VOUT[V] VOUT [V] 1.20 1.19 1.18 1.200 1.17 1.150 1.16 1.15 1.100 1.14 1.7 2.0 2.3 2.6 2.9 3.2 0 3.5 150 Figure 17. Figure 18. VIN=2.5V CE=VIN IOUT=10uA 200 250 300 GROUND PIN CURRENT vs INPUT VOLTAGE 20 -20 25 CE=VIN IOUT=0mA 85 15 IGND[uA] 1.25 VOUT[V] 100 IOUT[mA] OUTPUT VOLTAGE vs TEMPERATURE 1.30 50 VIN[V] 1.20 10 1.15 5 1.10 -20 0 20 40 Temperature[] 60 0 80 1.7 2.3 2.6 VIN[V] 2.9 3.2 3.5 Figure 20. Figure 19. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2.0 8/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU12TH5WNVX-1 (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE 20 GROUND PIN CURRENT vs LOAD 300 VIN=2.5V CE=VIN IOUT=0mA 18 16 VIN=2.5V CE=VIN Ta=25 200 12 IGND [uA] IGND[uA] 14 10 8 6 100 4 2 0 -20 0 20 40 Temperature[] 60 0 80 0 100 200 Figure 21. VIN=2.5V CE=VIN 90 80 70 1.0 60 0.8 PSRR[dB] VOUT[V] 500 PSRR vs FREQUENCY 100 VIN=2.5V CE=VIN Ta=25 1.2 400 Figure 22. OCP 1.4 300 IOUT [mA] 0.6 0.4 50 40 30 20 0.2 10 0 0.0 0 100 100 200 300 400 500 600 700 800 900 1000 1100 1,000 100mV/div VOUT 1.2V CE=VIN VOUT Ta=25 Iout=10mA 2.5V 200us/div VOUT 1.2V 3.5V VIN CE=VIN Ta=25 Iout=150mA 2.5V 200us/div Figure 25. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1,000,000 LINE TRANSIENT RESPONSE 500mV/div 500mV/div 100mV/div LINE TRANSIENT RESPONSE VIN 100,000 Figure 24. Figure 23. 3.5V 10,000 Frequency[Hz] IOUT[mA] Figure 26. 9/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU12TH5WNVX-1 (Ta=25C unless otherwise specified.) DISCHARGE TIME START UP TIME 1.5V 1V/div 1V/div 1.5V CE CE 1V/div 1V/div 0V VIN=2.5V Ta=25 Iout=0mA Cout=1.0uF VOUT 0V VIN=2.5V Ta=25 Iout=0mA Cout=1.0uF VOUT 20s/div 40s/div Figure 27. Figure 28. LOAD TRANSIENT RESPONSE SHUTDOWN CURRENT vs INPUT VOLTAGE Trise=12us VIN=5.5V CE=0V 250mA IOUT 1mA ISTBY[uA] 200mA/div 10.00 1.00 200mV/div 0.10 VOUT VIN=2.5V CE=VIN 0.01 -20 0 20 40 60 80 Temperature[] 20s/div Figure 30. Figure 29. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU2JTH5WNVX (Ta=25C unless otherwise specified.) LINEREGULATION 2.88 2.87 -20 25 85 CE=VIN Iout=10mA 2.86 VIN=3.85V CE=VIN 2.900 VOUT [V] 2.85 VOUT[V] Load Regulation 2.950 -20 25 85 2.84 2.83 2.850 2.82 2.800 2.81 2.80 2.750 2.79 3.3 3.8 4.3 0 4.8 VIN[V] 50 100 Figure 31. 250 300 GROUND PIN CURRENT vs INPUT VOLTAGE 20 VIN=3.85V CE=VIN IOUT=10uA 2.90 -20 25 85 CE=VIN IOUT=0mA 15 IGND[uA] VOUT[V] 200 Figure 32. OUTPUT VOLTAGE vs TEMPERATURE 2.95 150 IOUT[mA] 2.85 2.80 10 5 2.75 -20 0 20 40 Temperature[] 60 0 80 3.9 VIN[V] 4.9 5.4 Figure 34. Figure 33. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4.4 11/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU2JTH5WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE 20 18 16 GROUND PIN CURRENT vs LOAD 300 VIN=3.85V CE=VIN IOUT=0mA VIN=3.85V CE=VIN Ta=25 200 12 IGND [uA] IGND[uA] 14 10 8 6 100 4 2 0 -20 0 20 40 60 Temperature[] 0 80 0 100 200 Figure 35. 500 PSRR vs FREQUENCY 100 VIN=3.85V CE=VIN Ta=25 3.0 VIN=4.3V CE=VIN Ta=25 90 80 70 PSRR[dB] 2.5 VOUT [V] 400 Figure 36. OCP 3.5 300 IOUT [mA] 2.0 1.5 60 50 40 30 1.0 20 0.5 10 0 0.0 0 100 200 300 400 500 600 700 800 900 100 1000 1100 1,000 100mV/div VOUT 2.85V CE=VIN Ta=25 Iout=10mA 3.2V VOUT 2.85V 4.2V VIN CE=VIN Ta=25 Iout=150mA 3.2V 200us/div 200us/div Figure 39. Figure 40. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1,000,000 LINE TRANSIENT RESPONSE 500mV/div 500mV/div 100mV/div LINE TRANSIENT RESPONSE VIN 100,000 Figure 38. Figure 37. 4.2V 10,000 Frequency[Hz] IOUT [mA] 12/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU2JTH5WNVX (Ta=25C unless otherwise specified.) START UP TIME DISCHARGE TIME 1.5V 1V/div 1V/div 1.5V CE CE VOUT VIN=3.85V Ta=25 Iout=0mA Cout=1.0uF 0V VIN=3.85V Ta=25 Iout=0mA Cout=1.0uF VOUT 1V/div 1V/div 0V 40s/div 20s/div Figure 42. Figure 41. LOAD TRANSIENT RESPONSE VIN=5.5V CE=0V 250mA IOUT 1mA ISTBY[uA] 200mA/div SHUTDOWN CURRENT vs INPUT VOLTAGE 10.00 Trise=12us 1.00 200mV/div 0.10 VOUT VIN=3.85V CE=VIN Ta=25 0.01 -20 0 20 40 60 80 Temperature[] 20s/div Figure 44. Figure 43. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU35TH5WNVX (Ta=25C unless otherwise specified.) LINEREGULATION 3.55 3.54 25 85 3.53 Load Regulation 3.600 -20 -20 25 85 CE=VIN Iout=10mA VIN=4.5V CE=VIN 3.550 VOUT [V] 3.52 VOUT[V] 3.51 3.50 3.49 3.48 3.500 3.450 3.47 3.46 3.400 3.45 4.0 4.5 5.0 0 5.5 50 100 Figure 45. 250 300 GROUND PIN CURRENT vs INPUT VOLTAGE 20 VIN=4.5V CE=VIN IOUT=10uA -20 25 CE=VIN IOUT=0mA 85 3.55 15 IGND[uA] VOUT[V] 200 Figure 46. OUTPUT VOLTAGE vs TEMPERATURE 3.60 150 IOUT[mA] VIN[V] 3.50 10 3.45 5 3.40 -20 0 20 40 Temperature[] 60 0 80 4.0 VIN[V] 5.0 5.5 Figure 48. Figure 47. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4.5 14/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU35TH5WNVX (Ta=25C unless otherwise specified.) GROUND PIN CURRENT vs TEMPERATURE 20 GROUND PIN CURRENT vs LOAD 400 VIN=4.5V CE=VIN IOUT=0mA 18 16 300 12 IGND [uA] IGND[uA] 14 10 8 6 200 VIN=4.5V CE=VIN Ta=25 100 4 2 0 -20 0 20 40 Temperature[] 60 0 80 0 100 200 Figure 49. 500 PSRR vs FREQUENCY 100 VIN=4.5V CE=VIN Ta=25 90 3.5 80 3.0 70 2.5 VIN=4.5V CE=VIN Ta=25 2.0 PSRR[dB] VOUT[V] 400 Figure 50. OCP 4.0 300 IOUT [mA] 1.5 60 50 40 30 1.0 20 0.5 10 0 0.0 0 100 200 300 400 500 600 700 800 100 900 1000 1100 1200 1,000 IOUT[mA] 100mV/div VOUT 3.50V CE=VIN VOUT Ta=25 Iout=10mA 4.0V VOUT 3.50V 5.0V VIN CE=VIN Ta=25 Iout=150mA 4.0V 200us/div 200us/div Figure 53. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1,000,000 LINE TRANSIENT RESPONSE 500mV/div 500mV/div 100mV/div LINE TRANSIENT RESPONSE VIN 100,000 Figure 52. Figure 51. 5.0V 10,000 Frequency[Hz] Figure 54. 15/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Reference data BU35TH5WNVX (Ta=25C unless otherwise specified.) START UP TIME DISCHARGE TIME 1.5V 1V/div 1V/div 1.5V CE CE 1V/div 1V/div 0V VIN=4.5V Ta=25 Iout=0mA Cout=1.0uF VOUT 0V VIN=4.5V Ta=25 Iout=0mA Cout=1.0uF VOUT 40s/div 20s/div Figure 56. Figure 55. LOAD TRANSIENT RESPONSE VIN=5.5V CE=0V 250mA IOUT 1mA ISTBY[uA] 200mA/div SHUTDOWN CURRENT vs INPUT VOLTAGE 10.00 Trise=12us 1.00 200mV/div 0.10 VOUT VIN=4.5V CE=VIN Ta=25 0.01 -20 0 20 40 60 80 Temperature[] 20s/div Figure 58. Figure 57. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX About power dissipation (Pd) As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)xIOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current) Measurement conditions Standard ROHM Board Evaluation Board 1 Top Layer (Top View) Top Layer (Top View) Bottom Layer (Top View) Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Glass epoxy resin (Double-side board) Layout of Board for Measurement IC Implementation Position Board Size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1.6 mm Top layer Wiring Bottom Rate layer Through Hole Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50% Diameter 0.5mm x 6 holes Diameter 0.5mm x 25 holes Power Dissipation 0.56W 0.39W Thermal Resistance ja=178.6C/W ja=256.4C/W 0.6 0.56W 0.5 Pd [W] 0.4 0.39W 0.3 * Please design the margin so that PMAX becomes is than Pd (PMAX<Pd) within the usage temperature range 0.2 0.1 0 0 25 50 75 85 100 125 Ta [] Figure 59. SSON004X1010 www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Power dissipation heat reduction characteristics (Reference) 17/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Voltage of CE pin To enable standby mode for all channels, set the CE pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting CE to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if CE is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 14. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 15. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet BUXXTH5WNVX Revision History Date Revision 27.Mar.2014 001 27.May.2014 002 Changes 4.Nov.2015 003 New Release. Adding a lineup. Reference data LOAD REGULATION extension of IOUT. CE Pin Control Voltage is changed. Adding chip Rev2 to line up of P2. 14.Dec.2015 004 Adding evaluation result of BU1ATH5WNVX-1 and BU12TH5WNVX-1. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/20 TSZ02201-0GBG0A600020-1-2 14.Dec.2015.Rev.004 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU12TH5WNVX-1 - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU12TH5WNVX-1 SSON004X1010 5000 5000 Taping inquiry Yes