Datasheet
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
1/20 14.Dec.2015.Rev.004
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TSZ22111・14・001
TSZ02201-0GBG0A600020-1-
2
CMOS LDO Regulator for Portable Equipments
High Ripple Rejection,
Low Current Consumption,
Versatile Package
FULL CMOS LDO Regulator (500mA)
BUXXTH5WNVX
General Description
BUXXTH5WNVX is high-performance FULL CMOS
regulator with 500-mA output, which is mounted on
versatile package SSON004X1010 (1.00mm × 1.00 mm
× 0.60mm). It has excellent ripple rejection, noise
characteristics and load responsiveness characteristics
despite its low circuit current consumption of 10µA. It is
most appropriate for various applications such as power
supplies for logic IC, RF, and camera modules.
Features
High accuracy detection
High ripple rejection
low current consumption
Compatible with small ceramic capacitor
(Cin=Co=1.0uF)
With built-in output discharge circuit
ON/OFF control of output voltage
With built-in over current protection circuit
Typical Application Circuit
Key Specifications
Load Current: 500mA
Accuracy output voltage: ±1.0%
Power Supply rejection Ratio: 80dB@1KHz
Low current consumption: 10µA (TYP)
Operating temperature range: -20°C to +85°C
Applications
Smartphone, Battery-powered portable equipment, etc.
Package
SSON004X1010 : 1.00mm x 1.00mm x 0.60mm
Figure 1. Application Circuit
V
IN
GND
CE
GND
GND
V
OUT
V
OUT
V
IN
1.0µF
CE
1.0µF
2/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Connection Diagram
Pin Descriptions
Ordering Information
B U X X T H 5 W N V X - 1 T L
Part Output Voltage High Ripple Rejection with Package None: Packageing and forming specification
Number 1A : 1.05V Maximum Output Current output discharge NVX : SSON004X1010 Chip Rev.1 Embossed tape and reel
⇓ 500mA 1:
TL : The pin number 1 is the lower left
35 : 3.50V Chip Rev.2
(XX=1A,12)
Lineup
Marking Di Ci 6i Ai
Output
Voltage 1.05V 1.20V 2.85V 3.50V
Part
Number BU1ATH5WNVX-1
BU12TH5WNVX-1
BU2JTH5WNVX BU35TH5WNVX
SSON004X1010 TOP VIEW
1 VOUT 2 GND
3 CE 4 VIN
Part Number Marking
LOT Number
1PIN MARK
SSON004X1010
PIN No. Symbol
Function
1 VOUT Output Voltage
2 GND Grounding
3 CE ON/OFF control of output voltage
(High: ON, Low: OFF)
4 VIN Power Supply Voltage
reverse FIN Substrate (Connect to GND)
SSON004X1010
(Unit : mm)
1.0±0.1
1.0±0.1
1PIN MARK
0.6MAX
0.02+0.03
−0.02
S
0.05
(0.12)
0.65±0.05
0.48±0.05
0.07±0.1
0.25±0.05
0.25±0.1
1
45º
4
2
3
3-C0.18
R0.05
0.48±0.05
0.32±0.1
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the lower left when you hold
reel on the left hand and you pull out the tape on the left hand
5000pcs
TL
( )
Direction of feed
Reel 1pin
BOTTOM VIEW
1 VOUT 2 GND
3 CE
4 VIN
reverse FIN
3/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Absolute Maximum Ratings (Ta=25°C)
PARAMETER Symbol Limit Unit
Power Supply Voltage
VMAX -0.3 to +6.5 V
Power Dissipation
Pd 560
(Note1)
mW
Maximum junction temperature
TjMAX +125 °C
Operating Temperature Range
Topr -20 to +85 °C
Storage Temperature Range
Tstg -55 to +125 °C
(Note1) Pd deleted at 5.6mW/°C at temperatures above Ta=25°C, mounted on 70×70×1.6 mm glass-epoxy PCB.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
RECOMMENDED OPERATING RANGE (not to exceed Pd)
PARAMETER Symbol Limit Unit
Power Supply Voltage VIN 1.7 to 6.0 V
Maximum Output Current IMAX 500 mA
OPERATING CONDITIONS
PARAMETER Symbol MIN. TYP. MAX. Unit CONDITION
Input Capacitor Cin 1.0
(Note2)
- - µF Ceramic capacitor recommended
Output Capacitor Co 1.0
(Note2)
- - µF
(
Note2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias, changing as time
progresses characteristic.
Electrical Characteristics
(Ta=25°C, V
IN
= V
OUT
+1.0V, C
IN
=1.0µF, Co=1.0µF, unless otherwise noted.)
Parameter Symbol Limits Unit Conditions
Min.
Typ.
Max.
Input Voltage V
IN
1.7 - 6.0 V
Output Voltage V
OUT
V
OUT
-25mV
V
OUT
V
OUT
+25mV
V I
OUT
=10µA, VOUT＜2.5V
V
OUT
×0.99
V
OUT
×1.01
V I
OUT
=10µA, VOUT≧2.5V
Line Regulation ⊿V
OUT-line
- - 20 mV From (V
OUT
+0.3V) to 5.0V, I
OUT
=10mA
Load Regulation ⊿V
OUT-load
- 21
40 mV I
OUT
=5mA to 250mA
Voltage Dropout ⊿V
drop-out
- 520
700 mV VOUT=1.05V (IOUT=250mA)
- 440
550 mV VOUT=1.20V (IOUT=250mA)
- 160
250 mV VOUT=2.85V (IOUT=250mA)
- 150
230 mV VOUT=3.50V (IOUT=250mA)
Load Current I
load
500 - - mA
No Load Quiescent Current I
cq
- 10
20 µA I
OUT
=0mA
Power Supply
Rejection Ratio RR1 - 82
- dB f
RR
=100Hz
RR2 - 80
- dB f
RR
=1kHz
Output Noise Voltage Noise - 40
- nV√Hz
@10KHz
Operating Temperature range Topr -20 - 85 °C
Discharge Resistor RDSC 20 50
80 Ω
CE Pin Pull-down Current ISTB 0.1 0.9
8.0 uA
CE Pin Control Voltage ON
V
CEH
1.2 - 6.0 V
OFF
V
CEL
-0.3 - 0.3 V
4/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Block Diagrams
Figure 2. Block Diagrams
C
IN
･･･1.0µF (Ceramic capacitor)
Co ･･･1.0µF (Ceramic capacitor)
C
IN
V
IN
GND
CE
V
OUT
V
OUT
Co
V
REF
OCP
V
IN
CE
5/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU1ATH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 3. Figure 4.
Figure 5. Figure 6.
LINE REGULATION
0.99
1.00
1.01
1.02
1.03
1.04
1.05
1.06
1.07
1.08
1.7 2.0 2.3 2.6 2.9 3.2 3.5
VIN[V]
VOUT[V]
-20℃
25℃
85℃
CE=VIN
Iout=10mA
OUTPUT VOLTAGE vs TEMPERATURE
0.95
1.00
1.05
1.10
1.15
-20 0 20 40 60 80
Temperature[℃]
VOUT[V]
VIN=2.5V
CE=VIN
IOUT=10uA
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
1.7 2.0 2.3 2.6 2.9 3.2 3.5
VIN[V]
IGND[uA]
-20℃
25℃
85℃
CE=VIN
IOUT=0mA
0.950
1.000
1.050
1.100
1.150
0 50 100 150 200 250 300
VOUT [V]
IOUT[mA]
Load Regulation
-20℃
25℃
85℃
VIN=2.5V
CE=VIN
6/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU1ATH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 8.
Figure 7.
Figure 12. Figure 11.
Figure 10.
Figure 9.
GROUND PIN CURRENT vs TEMPERATURE
0
2
4
6
8
10
12
14
16
18
20
-20 0 20 40 60 80
Temperature[℃]
IGND[uA]
VIN=2.5V
CE=VIN
IOUT=0mA
GROUND PIN CURRENT vs LOAD
0
100
200
300
0 100 200 300 400 500
IOUT [mA]
IGND [uA]
VIN=2.5V
CE=VIN
Ta=25℃
OCP
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 100 200 300 400 500 600 700 800 900 1000 1100
IOUT[mA]
VOUT[V]
VIN=2.5V
CE=VIN
Ta=25℃
VOUT
200us/div
2.5V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=10mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
1.05V
2.5V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=150mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
1.05V
200us/div
PSRR vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
100 1,000 10,000 100,000 1,000,000
Frequency[Hz]
PSRR[dB]
VIN=2.5V
CE=VIN
Ta=25℃
7/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU1ATH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 13. Figure 14.
Figure 15.
SHUTDOWN CURRENT vs INPUT VOLTAGE
0.01
0.10
1.00
10.00
-20 0 20 40 60 80
Temperature[℃]
ISTBY[uA]
VIN=5.5V
CE=0V
Figure 16.
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
0V
CE
VOUT
20µs/div
1V/div
START UP TIME
1V/div
1.5V
1V/div
1V/div
40µs/div
0V
CE
VOUT
1.5V
DISCHARGE TIME
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
1mA
250mA
IOUT
VOUT
Trise=12us
20µs/div
200mA/div
200mV/div
LOAD TRANSIENT RESPONSE
VIN=2.5V
CE=VIN
Ta=25℃
8/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.22
1.23
1.7 2.0 2.3 2.6 2.9 3.2 3.5
VOUT[V]
VIN[V]
LINE REGULATION
-20℃
25℃
85℃
CE=VIN
Iout=10mA
CE=VIN
Iout=10mA
CE=VIN
Iout=10mA
CE=VIN
Iout=10mA
1.100
1.150
1.200
1.250
1.300
0 50 100 150 200 250 300
VOUT [V]
IOUT[mA]
Load Regulation
-20℃
25℃
85℃
VIN=2.5V
CE=VIN
1.10
1.15
1.20
1.25
1.30
-20 0 20 40 60 80
VOUT[V]
Temperature[℃]
OUTPUT VOLTAGE vs TEMPERATURE
VIN=2.5V
CE=VIN
IOUT=10uA
Reference data BU12TH5WNVX-1
(Ta=25ºC unless otherwise specified.)
Figure 17. Figure 18.
Figure 19. Figure 20.
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
1.7 2.0 2.3 2.6 2.9 3.2 3.5
VIN[V]
IGND[uA]
-20℃
25℃
85℃
CE=VIN
IOUT=0mA
9/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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TSZ22111・15・001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 100 200 300 400 500 600 700 800 900 1000 1100
VOUT[V]
IOUT[mA]
OCP
VIN=2.5V
CE=VIN
Ta=25℃
0
10
20
30
40
50
60
70
80
90
100
100 1,000 10,000 100,000 1,000,000
PSRR[dB]
Frequency[Hz]
PSRR vs FREQUENCY
VIN=2.5V
CE=VIN
VOUT
200us/div
2.5V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=10mA
100mV/div500mV/div
LINE TRANSIENT RESPONSE
VOUT
1.2V
2.5V
3.5V
VIN
CE=VIN
Ta=25℃
Iout=150mA
100mV/div500mV/div
LINE TRANSIENT RESPONSE
VOUT
1.2V
200us/div
Reference data BU12TH5WNVX-1
(Ta=25ºC unless otherwise specified.)
Figure 22.
Figure 21.
Figure 26. Figure 25.
Figure 24.
Figure 23.
GROUND PIN CURRENT vs TEMPERATURE
0
2
4
6
8
10
12
14
16
18
20
-20 0 20 40 60 80
Temperature[℃]
IGND[uA]
VIN=2.5V
CE=VIN
IOUT=0mA
GROUND PIN CURRENT vs LOAD
0
100
200
300
0 100 200 300 400 500
IOUT [mA]
IGND [uA]
VIN=2.5V
CE=VIN
Ta=25℃
10/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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TSZ22111・15・001
1mA
250mA
IOUT
VOUT
Trise=12us
20µs/div
200mA/div
200mV/div
LOAD TRANSIENT RESPONSE
VIN=2.5V
CE=VIN
Reference data BU12TH5WNVX-1
(Ta=25ºC unless otherwise specified.)
Figure 27. Figure 28.
Figure 29.
SHUTDOWN CURRENT vs INPUT VOLTAGE
0.01
0.10
1.00
10.00
-20 0 20 40 60 80
Temperature[℃]
ISTBY[uA]
VIN=5.5V
CE=0V
Figure 30.
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
0V
CE
VOUT
20µs/div
1V/div
START UP TIME
1V/div
1.5V
1V/div
1V/div
40µs/div
0V
CE
VOUT
1.5V
DISCHARGE TIME
VIN=2.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
11/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU2JTH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 31. Figure 32.
Figure 33. Figure 34.
LINE REGULATION
2.79
2.80
2.81
2.82
2.83
2.84
2.85
2.86
2.87
2.88
3.3 3.8 4.3 4.8
VIN[V]
VOUT[V]
-20℃
25℃
85℃
CE=VIN
Iout=10mA
OUTPUT VOLTAGE vs TEMPERATURE
2.75
2.80
2.85
2.90
2.95
-20 0 20 40 60 80
Temperature[℃]
VOUT[V]
VIN=3.85V
CE=VIN
IOUT=10uA
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
3.9 4.4 4.9 5.4
VIN[V]
IGND[uA]
-20℃
25℃
85℃
CE=VIN
IOUT=0mA
2.750
2.800
2.850
2.900
2.950
0 50 100 150 200 250 300
VOUT [V]
IOUT[mA]
Load Regulation
-20℃
25℃
85℃
VIN=3.85V
CE=VIN
12/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU2JTH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 36.
Figure 35.
GROUND PIN CURRENT vs LOAD
0
100
200
300
0 100 200 300 400 500
IOUT [mA]
IGND [uA]
VIN=3.85V
CE=VIN
Ta=25℃
GROUND PIN CURRENT vs TEMPERATURE
0
2
4
6
8
10
12
14
16
18
20
-20 0 20 40 60 80
Temperature[℃]
IGND[uA]
VIN=3.85V
CE=VIN
IOUT=0mA
Figure 40. Figure 39.
Figure 38.
Figure 37.
OCP
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 100 200 300 400 500 600 700 800 900 1000 1100
IOUT [mA]
VOUT [V]
VIN=3.85V
CE=VIN
Ta=25℃
PSRR vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
100 1,000 10,000 100,000 1,000,000
Frequency[Hz]
PSRR[dB]
VIN=4.3V
CE=VIN
Ta=25℃
200us/div
3.2V
4.2V
VIN
CE=VIN
Ta=25℃
Iout=10mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
2.85V
3.2V
4.2V
VIN
CE=VIN
Ta=25℃
Iout=150mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
2.85V
200us/div
13/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU2JTH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 41. Figure 42.
VIN=3.85V
Ta=25℃
Iout=0mA
Cout=1.0uF
0V
CE
VOUT
20µs/div
1V/div
START UP TIME
1V/div
1.5V
1V/div
1V/div
40µs/div
0V
CE
VOUT
1.5V
DISCHARGE TIME
VIN=3.85V
Ta=25℃
Iout=0mA
Cout=1.0uF
Figure 43.
1mA
250mA
IOUT
VOUT
Trise=12us
20µs/div
200mA/div
200mV/div
LOAD TRANSIENT RESPONSE
VIN=3.85V
CE=VIN
Ta=25℃
SHUTDOWN CURRENT vs INPUT VOLTAGE
0.01
0.10
1.00
10.00
-20 0 20 40 60 80
Temperature[℃]
ISTBY[uA]
VIN=5.5V
CE=0V
Figure 44.
14/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU35TH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 45. Figure 46.
Figure 47. Figure 48.
LINE REGULATION
3.45
3.46
3.47
3.48
3.49
3.50
3.51
3.52
3.53
3.54
3.55
4.0 4.5 5.0 5.5
VIN[V]
VOUT[V]
-20℃
25℃
85℃
CE=VIN
Iout=10mA
OUTPUT VOLTAGE vs TEMPERATURE
3.40
3.45
3.50
3.55
3.60
-20 0 20 40 60 80
Temperature[℃]
VOUT[V]
VIN=4.5V
CE=VIN
IOUT=10uA
GROUND PIN CURRENT vs INPUT VOLTAGE
0
5
10
15
20
4.0 4.5 5.0 5.5
VIN[V]
IGND[uA]
-20℃
25℃
85℃
CE=VIN
IOUT=0mA
3.400
3.450
3.500
3.550
3.600
0 50 100 150 200 250 300
VOUT [V]
IOUT[mA]
Load Regulation
-20℃
25℃
85℃
VIN=4.5V
CE=VIN
15/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
TSZ02201-0GBG0A600020-1-
2
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reference data BU35TH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 50.
Figure 49.
Figure 54. Figure 53.
Figure 52.
Figure 51.
GROUND PIN CURRENT vs TEMPERATURE
0
2
4
6
8
10
12
14
16
18
20
-20 0 20 40 60 80
Temperature[℃]
IGND[uA]
VIN=4.5V
CE=VIN
IOUT=0mA
GROUND PIN CURRENT vs LOAD
0
100
200
300
400
0 100 200 300 400 500
IOUT [mA]
IGND [uA]
VIN=4.5V
CE=VIN
Ta=25℃
OCP
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 100 200 300 400 500 600 700 800 900 1000 1100 1200
IOUT[mA]
VOUT[V]
VIN=4.5V
CE=VIN
Ta=25℃
VOUT
200us/div
4.0V
5.0V
VIN
CE=VIN
Ta=25℃
Iout=10mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
3.50V
4.0V
5.0V
VIN
CE=VIN
Ta=25℃
Iout=150mA
100mV/div
500mV/div
LINE TRANSIENT RESPONSE
VOUT
3.50V
200us/div
PSRR vs FREQUENCY
0
10
20
30
40
50
60
70
80
90
100
100 1,000 10,000 100,000 1,000,000
Frequency[Hz]
PSRR[dB]
VIN=4.5V
CE=VIN
Ta=25℃
16/20 14.Dec.2015.Rev.004
BUXXTH5WNVX
Datasheet
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TSZ22111・15・001
Reference data BU35TH5WNVX
(Ta=25ºC unless otherwise specified.)
Figure 55. Figure 56.
Figure 57. Figure 58.
1mA
250mA
IOUT
VOUT
Trise=12us
20µs/div
200mA/div
200mV/div
LOAD TRANSIENT RESPONSE
VIN=4.5V
CE=VIN
Ta
=
25
℃
SHUTDOWN CURRENT vs INPUT VOLTAGE
0.01
0.10
1.00
10.00
-20 0 20 40 60 80
Temperature[℃]
ISTBY[uA]
VIN=5.5V
CE=0V
1V/div
1V/div
40µs/div
0V
CE
VOUT
1.5V
DISCHARGE TIME
VIN=4.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
VIN=4.5V
Ta=25℃
Iout=0mA
Cout=1.0uF
0V
CE
VOUT
20µs/div
1V/div
START UP TIME
1V/div
1.5V
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Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as reduction in current capability. Therefore, be sure to prepare sufficient margin within power
dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board Evaluation Board 1
Layout of Board for
Measurement
IC
Implementation
Position
Top Layer (Top View) Top Layer (Top View)
Bottom Layer (Top View) Bottom Layer (Top View)
Measurement State With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material Glass epoxy resin (Double-side board) Glass epoxy resin (Double-side board)
Board Size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1.6 mm
Wiring
Rate
Top layer Metal (GND) wiring rate: Approx. 0% Metal (GND) wiring rate: Approx. 50%
Bottom
layer Metal (GND) wiring rate: Approx. 50% Metal (GND) wiring rate: Approx. 50%
Through Hole Diameter 0.5mm x 6 holes Diameter 0.5mm x 25 holes
Power Dissipation 0.56W 0.39W
Thermal Resistance
θja=178.6°C/W θja=256.4°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAX<Pd)
within the usage temperature range
Figure 59. SSON004X1010 Power dissipation heat reduction characteristics (Reference)
0
0.1
0.2
0.3
0.4
0.5
0.6
0 25 50 75 100 125
Ta [℃]
Pd [W]
0.56W
85
0.39W
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Datasheet
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Voltage of CE pin
To enable standby mode for all channels, set the CE pin to 0.3 V or less, and for normal operation, to 1.2 V or more.
Setting CE to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time
between high and low (or vice versa) to a minimum.
Additionally, if CE is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing
a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always
be completely discharged before turning the IC on.
14. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
15. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Datasheet
Revision History
Date Revision Changes
27.Mar.2014
001 New Release.
27.May.2014
002 Adding a lineup.
Reference data LOAD REGULATION extension of IOUT.
CE Pin Control Voltage is changed.
4.Nov.2015 003 Adding chip Rev2 to line up of P2.
14.Dec.2015
004 Adding evaluation result of BU1ATH5WNVX-1 and BU12TH5WNVX-1.
Datasheet
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your o wn responsibilities, adequate
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[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation depending on ambient temperat ure. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall n ot be in any way responsible or liable for failure induce d under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a hig hly active hal ogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
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incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products ar e exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after openin g a humidity b arrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
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3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
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