LM49155
www.ti.com
SNAS492 –JULY 2010
LM49155
PRODUCT BRIEF Uplink Noise Suppression & Downlink
SNR Enhancement Analog Audio Subsystem
Check for Samples: LM49155
1FEATURES • E2S Class D Amplifier with ALC
• Ground Referenced Headphone Outputs with
2• Noise cancellation for uplink and downlink Advanced Click Pop Suppression
without DSP-type artifacts, distortions or
delays • Micro-power shutdown
• Adapting AGC on ambient noise level & APPLICATIONS
downlink signal strength for earpiece
• Downlink adjustable noise-reducing high pass • Mobile Phones
filter • Portable Electronic Devices
DESCRIPTION
The LM49155 is a fully integrated audio subsystem designed for portable handheld applications such as cellular
phones. The LM49155 combines a Noise Suppression microphone amplifier, a 1.35W mono class D amplifier
with ALC, class AB earpiece driver with AGC, a high efficiency, stereo, ground referenced headphone amplifier
with click pop suppression and I2C modes select and volume control.
The LM49155 features analog fully differential input, and differential output microphone amplifier designed to
reduce background acoustic noise, while delivering superb speech clarity in voice communication applications.
Downlink SNR enhancement with an advanced acoustic AGC technology to adjust output levels.
The LM49155 speaker amplifier features National’s unique output limiter that provides both a no-clip feature and
speaker protection. The E2S class D amplifier features a patented, ultra low EMI PWM architecture that
significantly reduces RF emissions while preserving audio quality and efficiency. The headphone drivers feature
National’s ground referenced architecture that creates a ground-referenced output from a single, low-voltage
supply.
The LM49155 is available in an ultra-small 36-bump micro SMD package (3.434mm x 3.459mm x 0.6mm).
Notice: This document is not a full datasheet. For more information regarding this product or to order
samples please contact your local National Semiconductor sales office or visit
http://www.national.com/support/dir.html
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. Key Specifications
VALUE UNIT
Uplink Far Field Noise Suppression 34 dB (typ)
Electrical FFNSEat f = 1kHz Near-Field SNR Enhancement 6 to 18
Downlink SNR Enhancement Earpiece Amplifier dB (typ)
Downlink SNRIE16
Class D Loudspeaker Amplifier RL= 15μH+8Ω+15μH1.35 W (typ)
POUT, THD+N ≤%, VDD = 5.0V
Headphone Amplifier RL= 32Ω19 mW (typ)
POUT, THD+N ≤%, HPVDD = 1.8V
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
BIAS
I2C
INTERFACE
INM+
INM-
INL
INR
BYPASS
I2CVDD
SDA
SCL
GND
VDD
LSOUT+
LSOUT-
SET
HPL
HPR
CHARGE PUMP
CIN CIP CPGND
HPVDD
1.7V to 2.7V
MIC_GND
LSVDD
MIC1+
MIC_GND
12 dB to 36 dB
PRE-AMP
POST-AMP
MICOUT+
LPF+
LPF-
MICOUT-
MIC_BIAS VOLTAGE
ANALOG
UPLINK/
DOWNLINK
NOISE
CANCELLING
PROCESSOR
and
SNR
ENHANCER
AUTOMATIC
LEVEL
CONTROL
EPOUT+
EPOUT-
Mixer and
Output
Mode
VOLUME
-80 dB to +18
dB
VOLUME
-80 dB to +18
dB
Audio
Differential
Input
MIC1-
MIC2-
MIC2+
6 dB/12 dB
CSET RSET
(Optional)
0.1 µF
CT1
CT2
CT3
AGC AMP
Class D
+12 dB,
+18 dB
-18 dB
to
0 dB
-18 dB
to
0 dB
C1
2.2 µF
2.2 µF
CPVSS
Ci8
0.22 µF
Audio
Single-Ended
Inputs
Ci5
68 nF
Ci7
0.22 µF
Ci6
68 nF
CB
2.2 µF
VOLUME
-80 dB to +18
dB
OUTPUT
POWER
LIMITER
2.7V to 5.5V 2.7V to 5.5V
CS1
1 µFCS2
1 µF
CS3
1 µF
DCAP
Ci1
470 nF
Ci2
470 nF
Ci4
470 nF
Ci3
470 nF
CLP1
CLP2
To Uplink
Signal Path
-6 dB
4.7 µF
4.7 µF
4.7 µF
4.7 µF
LM49155
www.ti.com
SNAS492 –JULY 2010
Typical Application
Figure 1. Typical Application Circuit
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM49155
XXYY
GN7
Bump A1
Top View
A B C
3
2
1
4
D
5
6
E F
LM49155
SNAS492 –JULY 2010
www.ti.com
Connection Diagrams
TL Package
(3.434mm x 3.459mm x 0.6mm)
Figure 2. Top View (Bump Side Down)
spacer
spacer
36 Bump micro SMD Marking
Figure 3. Top View
XX — Date Code
YY — Die Traceability
G — Boomer
N7 — LM49155TL
4Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Links: LM49155
PACKAGE OPTION ADDENDUM
www.ti.com 26-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM49155TL/NOPB NRND DSBGA YZR 36 250 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM GN7
LM49155TLX/NOPB NRND DSBGA YZR 36 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM GN7
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 26-Nov-2013
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM49155TL/NOPB DSBGA YZR 36 250 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1
LM49155TLX/NOPB DSBGA YZR 36 1000 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM49155TL/NOPB DSBGA YZR 36 250 210.0 185.0 35.0
LM49155TLX/NOPB DSBGA YZR 36 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 2
MECHANICAL DATA
YZR0036xxx
www.ti.com
TLA36XXX (Rev D)
0.600±0.075
D
E
A
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
4215058/A 12/12
D: Max =
E: Max =
3.489 mm, Min =
3.465 mm, Min =
3.429 mm
3.405 mm
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