The Samsung ARTIKTM 053 Module is a highly integrated module for secure Internet of Things (IoT) devices that require (R) (R) (R) Wi-Fi Connectivity. It is based on an ARM Cortex R4 core, with on-module RAM and flash memory, a complete 2.4GHz Wi-Fi subsystem with on-module antenna, an independent security subsystem, PUF-based module authentication, and a large complement of standard I/O interfaces. ARTIK 053 Module provides excellent performance in a variety of environments, with a feature set tailored specifically for IoT end nodes. Top View (Left) and Bottom View (Right) of ARTIK 053 Module Module Overview ................................................................................................................................................................... 2 Table of Contents ................................................................................................................................................................... 3 List of Figures .......................................................................................................................................................................... 4 List of Tables ........................................................................................................................................................................... 4 Version History ....................................................................................................................................................................... 5 Block Diagram ......................................................................................................................................................................... 6 CPU ......................................................................................................................................................................................................... 6 Memory .................................................................................................................................................................................................. 6 Real Time Clock ..................................................................................................................................................................................... 6 PUF Unit ................................................................................................................................................................................................. 7 Security Subsystem ............................................................................................................................................................................... 7 Wi-Fi Subsystem .................................................................................................................................................................................... 7 UART Interface ....................................................................................................................................................................................... 7 GPIO Interface ....................................................................................................................................................................................... 7 2 I C Interface ........................................................................................................................................................................................... 7 PWM Interface ....................................................................................................................................................................................... 8 SPI Interface .......................................................................................................................................................................................... 8 ADC Interface ......................................................................................................................................................................................... 8 Module Edge Pinout ............................................................................................................................................................... 9 Module Edge Pinout by Function ....................................................................................................................................... 12 ADC Interface ....................................................................................................................................................................................... 12 Debug Interface ................................................................................................................................................................................... 12 2 I C Interface ......................................................................................................................................................................................... 12 INT Interface ........................................................................................................................................................................................ 12 Power Interface ................................................................................................................................................................................... 12 GPIO Interface ..................................................................................................................................................................................... 13 PWM Interface ..................................................................................................................................................................................... 13 Reset Interface ..................................................................................................................................................................................... 13 SPI Interface ........................................................................................................................................................................................ 14 UART Interface ..................................................................................................................................................................................... 14 Electrical Specifications ....................................................................................................................................................... 15 Absolute Maximum Rating................................................................................................................................................................. 15 DC Electrical Characteristics .............................................................................................................................................................. 15 ESD Ratings .......................................................................................................................................................................................... 16 AC Electrical Characteristics .............................................................................................................................................................. 16 RF Electrical Characteristics ............................................................................................................................................................... 16 Mechanical Specifications ................................................................................................................................................... 17 Module Antenna Placement Requirements...................................................................................................................................... 18 Certification ........................................................................................................................................................................... 19 FCC Regulatory Disclosures................................................................................................................................................................ 19 Industry Canada Regulatory Disclosures ......................................................................................................................................... 20 EU Regulatory Disclosures ................................................................................................................................................................. 21 Ordering Information .......................................................................................................................................................... 22 Legal Information ................................................................................................................................................................. 23 Figure 1. ARTIK 053 Module Block Diagram .........................................................................................................................6 Figure 2. ADC LSB behavior ....................................................................................................................................................8 Figure 3. ARTIK 053 Module Edge Pinout ..............................................................................................................................9 Figure 4. ARTIK 053 Module Mechanical Dimensions ...................................................................................................... 17 Figure 5.Module Placement Restrictions ........................................................................................................................... 18 Table 1. ARTIK 053 Module Edge Pinout Signal Descriptions .......................................................................................... 10 Table 2. ADC Interface .......................................................................................................................................................... 12 Table 3. Debug Interface ...................................................................................................................................................... 12 2 Table 4. I C Interface ............................................................................................................................................................. 12 Table 5. Interrupt Interface .................................................................................................................................................. 12 Table 6. GPIO Interface ......................................................................................................................................................... 13 Table 7. PWM Interface......................................................................................................................................................... 13 Table 8. Reset Interface ........................................................................................................................................................ 13 Table 9. SPI Interface ............................................................................................................................................................ 14 Table 10. UART Interface ...................................................................................................................................................... 14 Table 11. Absolute Maximum Ratings ................................................................................................................................ 15 Table 12. I/O DC Electrical Characteristics (PAD: [2-13, 18, 19], [21-26], [28-31], [33-45], [48-75], I/O) ..................... 15 Table 13. I/O DC Electrical Characteristics (PAD: [14-17], ADC)....................................................................................... 15 Table 14. Recommended Operating Conditions ............................................................................................................... 16 Table 15. GPIO Signal Drive Strength ................................................................................................................................. 16 Table 16. ESD Ratings ........................................................................................................................................................... 16 Table 17.Level Shifter AC Electrical Characteristics .......................................................................................................... 16 Table 18.Tx Performance Characteristics .......................................................................................................................... 16 Table 19.Rx Performance Characteristics .......................................................................................................................... 16 Revision Date V1.0 04/26/2017 Description Public release Datasheet Maturity Release Figure 1 shows the functional Block Diagram of the ARTIK 053 Module. (R) (R) The ARTIK 053 Module CPU has an ARM Cortex R4. It has the following features: 32KB of Instruction Cache (I-Cache) 32KB of Data Cache (D-Cache) 320 MHz execution clock R4 core tuned for embedded and real-time applications The ARTIK 053 Module on-module memory has the following features: CPU and general purpose RAM o 1280KB CPU RAM o 128KB global Inter-Process Communication (IPC) RAM 8MB flash The ARTIK 053 Module has a Real Time Clock (RTC) for tracking date/time. The RTC has the following features: Binary-Coded Decimal (BCD) coded seconds, minutes, hour, day of the week, day, month, and year Leap year detection and compensation Millisecond tick time interrupt for Real-Time Operating System (RTOS) kernel time tick The ARTIK 053 Module has a Physically Unclonable Function (PUF) unit. The PUF unit has the following features: Generates unique key values, locked to an individual ARTIK 053 Module The algorithm construction is unique to each module Allows individual ARTIK 053 Modules to be "fingerprint-identified" The ARTIK 053 Module has an independent security subsystem to ensure secure end-to-end operation in any IoT environment. The security subsystem includes the following features: Protected Execution Environment o Secure IPC Mailbox for inter-subsystem communication o Encapsulated key support Backup encryption key - 256 bits Security subsystem root private key - 521 bits Storage key - 256 bits Symmetric key engines o Secure AES o Secure DES/Triple-DES Stream cipher engine o ARC4 engine Various Hash engines o SHA-1, SHA2-256, SHA2-384, SHA2-512, MD5 HMAC Asymmetric key engines o PKA (Public Key Accelerator) engine PRNG (Pseudo Random Number Generator) DTRNG (Digital True Random Number Generator) Secure key storage The ARTIK 053 Module has an 802.11b/g/n Wi-Fi subsystem. The Wi-Fi subsystem has the following features: 802.11TM b/g/n support at 2.4GHz 20MHz single stream (802.11n) WPA/WPA2/WAPI Dedicated Wi-Fi Processor subsystem The ARTIK 053 Module has four 2-pin UART interfaces, each with the following features: Can be operated in DMA or interrupt-based mode Support for 5, 6, 7 or 8 bit serial data transmit and receive Programmable baud rate One or two stop bit insertion The ARTIK 053 Module has flexible General Purpose Input Output (GPIO) interfaces: 29 configurable GPIO ports Independently configurable for either input or output Configurable internal pull-up or pull-down resistors 2 The ARTIK 053 Module has two high speed multi-master I C interfaces available, with speeds up to 3.4Mbps. The ARTIK 053 Module has five PWM timers available, each with the following features: 32 bits of resolution for each PWM signal Two 8 bit pre-scalers (first level of division) and 5 clock-dividers/multiplexers for second level division Continuous run or one-shot pulse mode Dead zone generator to avoid simultaneous change of multiple PWM signals Interrupt generation The ARTIK 053 Module has two SPI interfaces, each with the following features: Full duplex communication 8, 16 or 32 bit shift registers and bus interface Motorola SPI protocol and National Semiconductor Microwire protocol Master and slave mode operation Two independent 32 bit wide transmit/receive FIFOs Transmit and receive speeds up to 50MHz The ARTIK 053 Module has four channels of analog-to-digital converter. The A/D interface has the following features: 12 bit resolution ADC conversion clock at 1.08 MSPS (Sampling per Second) using a main 6.5 MHz clock Support sample averaging over 1, 2, 4, 8, 16, 32, 64 samples Differential non-linearity error 2 LSB Integral non-linearity error 6 LSB Top offset error 10 LSB Bottom offset error 10 LSB Voltage range up to 1.8V Figure 2 depicts the dynamic behavior between input voltage on the ADC and resulting LSB value in the ADC register. The ARTIK 053 Module utilizes 79 signal, power, and ground pads. Figure 3 shows how the Edge Pinout is oriented and how signal coordinates are assigned to the edge of the ARTIK 053 Module. Table 1 shows the edge pads and the signal names. Pad Number Pad Name I/O Type* PU/PD Power Default Function 1 GND - - - GND 2 XGPIO26 I PD VDDQ33_EXT0 GPIO 3 XGPIO25 I PD VDDQ33_EXT0 GPIO 4 XGPIO24 I PD VDDQ33_EXT0 GPIO 5 XGPIO21 I PD VDDQ33_EXT0 GPIO 6 XGPIO19 I PD VDDQ33_EXT0 GPIO 7 XGPIO18 I PD VDDQ33_EXT0 GPIO 8 XGPIO17 I PD VDDQ33_EXT0 GPIO 9 XGPIO14 I PD VDDQ33_EXT0 GPIO 10 XGPIO13 I PD VDDQ33_EXT0 GPIO 11 XGPIO16 I PD VDDQ33_EXT0 GPIO 12 XGPIO15 I PD VDDQ33_EXT0 GPIO 13 XGPIO20 I PD VDDQ33_EXT0 GPIO 14 XADC0AIN_1 - - AVDD18_ADC0 ADC 15 XADC0AIN_0 - - AVDD18_ADC0 ADC 16 XADC0AIN_2 - - AVDD18_ADC0 ADC 17 XADC0AIN_3 - - AVDD18_ADC0 ADC 18 XGPIO23 I PD VDDQ1833_SDIO_0 GPIO 19 XGPIO22 I PD VDDQ1833_SDIO_0 GPIO 20 GND - - - GND 21 XRESET_N I - VDDQ33_EXT1 RESET 22 XJTAG_TMS I PU VDDQ33_EXT1 DEBUG 23 XJTAG_TDI I PU VDDQ33_EXT1 DEBUG 24 XJTAG_TCK I PD VDDQ33_EXT1 DEBUG 25 XJTAG_TDO I PD VDDQ33_EXT1 DEBUG 26 XJTAG_TRST_N I PD VDDQ33_EXT1 DEBUG 27 3V3_EXT_LDO2 - - - POWER 28 XEINT_0 I PD VDDQ33_EXT1 INT 29 XEINT_2 I PD VDDQ33_EXT1 INT 30 XEINT_1 I PD VDDQ33_EXT1 INT 31 PWR_RST - - - RESET 32 DC_5V_12V - - - POWER 33 XI2C0_SCL I PD VDDQ33_EXT1 I2C 34 XI2C0_SDA I PD VDDQ33_EXT1 I2C 35 XI2C1_SCL I PD VDDQ33_EXT1 I2C 36 XI2C1_SDA I PD VDDQ33_EXT1 I2C 37 XDEBUG_TXD I PD VDDQ33_EXT1 DEBUG 38 XDEBUG_RXD I PD VDDQ33_EXT1 DEBUG 39 XGPIO28 I PD VDDQ33_EXT0 GPIO 40 XPWMTOUT_4 I PD VDDQ33_EXT0 PWM 41 XPWMTOUT_1 I PD VDDQ33_EXT0 PWM 42 XPWMTOUT_0 I PD VDDQ33_EXT0 PWM 43 XPWMTOUT_5 I PD VDDQ33_EXT0 PWM 44 XPWMTOUT_2 I PD VDDQ33_EXT0 PWM 45 XPWMTOUT_3 I PD VDDQ33_EXT0 PWM 46 XUART0_TXD - - - LEVEL SHIFTED 47 XUART0_RXD - - - LEVEL SHIFTED 48 XSPI0_MISO I PD VDDQ33_EXT0 SPI 49 XSPI0_CSN I PD VDDQ33_EXT0 SPI 50 XSPI0_MOSI I PD VDDQ33_EXT0 SPI 51 XSPI0_CLK I PD VDDQ33_EXT0 SPI Pad Number Pad Name I/O Type* PU/PD Power Default Function 52 XUART1_TXD I PD VDDQ33_EXT0 UART 53 XUART1_RXD I PD VDDQ33_EXT0 UART 54 XUART2_RXD I PD VDDQ33_EXT0 UART 55 XUART2_TXD I PD VDDQ33_EXT0 UART 56 XUART3_RXD I PD VDDQ33_EXT0 UART 57 XUART3_TXD I PD VDDQ33_EXT0 UART 58 XGPIO12 I PD VDDQ33_EXT0 GPIO 59 XGPIO10 I PD VDDQ33_EXT0 GPIO 60 XGPIO9 I PD VDDQ33_EXT0 GPIO 61 XGPIO11 I PD VDDQ33_EXT0 GPIO 62 XGPIO6 I PD VDDQ33_EXT0 GPIO 63 XGPIO8 I PD VDDQ33_EXT0 GPIO 64 XGPIO7 I PD VDDQ33_EXT0 GPIO 65 XGPIO2 I PD VDDQ33_EXT0 GPIO 66 XGPIO4 I PD VDDQ33_EXT0 GPIO 67 XGPIO5 I PD VDDQ33_EXT0 GPIO 68 XGPIO1 I PD VDDQ33_EXT0 GPIO 69 XGPIO3 I PD VDDQ33_EXT0 GPIO 70 XGPIO0 I PD VDDQ33_EXT0 GPIO 71 XSPI1_MISO I PD VDDQ33_EXT0 SPI 72 XSPI1_CLK I PD VDDQ33_EXT0 SPI 73 XSPI1_MOSI I PD VDDQ33_EXT0 SPI 74 XSPI1_CSN I PD VDDQ33_EXT0 SPI 75 XGPIO27 I PD VDDQ33_EXT0 GPIO 76 GND - - - GND Note: 1. 2. 3. * Default setting after reset I/O pad type definition - I:input, O:output, I/O:input/output Internal pull up/pull down definition - PU:pull-up, PD:pull-down, N:no pull Pad Number Pad Name Power Default Function 14 XADC0AIN_1 I/O Type PU/PD - - AVDD18_ADC0 XADC0AIN_1 15 XADC0AIN_0 - - AVDD18_ADC0 XADC0AIN_0 16 XADC0AIN_2 - - AVDD18_ADC0 XADC0AIN_2 17 XADC0AIN_3 - - AVDD18_ADC0 XADC0AIN_3 Pad Number Pad Name Power Default Function 22 XJTAG_TMS I PU VDDQ33_EXT1 XJTAG_TMS 23 XJTAG_TDI I PU VDDQ33_EXT1 XJTAG_TDI 24 XJTAG_TCK I PD VDDQ33_EXT1 XJTAG_TCK 25 XJTAG_TDO I PD VDDQ33_EXT1 XJTAG_TDO 26 XJTAG_TRST_N I PD VDDQ33_EXT1 XJTAG_TRST_N 37 XDEBUG_TXD I PD VDDQ33_EXT1 XDEBUG_TXD 38 XDEBUG_RXD I PD VDDQ33_EXT1 XDEBUG_RXD Pad Number Pad Name Power Default Function I/O Type PU/PD I/O Type PU/PD 33 XI2C0_SCL I PD VDDQ33_EXT1 XI2C0_SCL 34 XI2C0_SDA I PD VDDQ33_EXT1 XI2C0_SDA 35 XI2C1_SCL I PD VDDQ33_EXT1 XI2C1_SCL 36 XI2C1_SDA I PD VDDQ33_EXT1 XI2C1_SDA Pad Number Pad Name Power Default Function 28 XEINT_0 I PD VDDQ33_EXT1 XEINT_0 29 XEINT_2 I PD VDDQ33_EXT1 XEINT_2 30 XEINT_1 I PD VDDQ33_EXT1 XEINT_1 Pad Number Pad Name Power Default Function I/O Type PU/PD I/O Type PU/PD 1 GND - - - - 20 GND - - - - 27 3V3_EXT_LDO2 - - - - 32 DC_5V_12V - - - - 76 GND - - - - Pad Number Pad Name Power Default Function 2 XGPIO26 I/O Type PU/PD I PD VDDQ33_EXT0 XGPIO26 3 XGPIO25 I PD VDDQ33_EXT0 XGPIO25 4 XGPIO24 I PD VDDQ33_EXT0 XGPIO24 5 XGPIO21 I PD VDDQ33_EXT0 XGPIO21 6 XGPIO19 I PD VDDQ33_EXT0 XGPIO19 7 XGPIO18 I PD VDDQ33_EXT0 XGPIO18 8 XGPIO17 I PD VDDQ33_EXT0 XGPIO17 9 XGPIO14 I PD VDDQ33_EXT0 XGPIO14 10 XGPIO13 I PD VDDQ33_EXT0 XGPIO13 11 XGPIO16 I PD VDDQ33_EXT0 XGPIO16 12 XGPIO15 I PD VDDQ33_EXT0 XGPIO15 13 XGPIO20 I PD VDDQ33_EXT0 XGPIO20 18 XGPIO23 I PD VDDQ1833_SDIO_0 XGPIO23 19 XGPIO22 I PD VDDQ1833_SDIO_0 XGPIO22 39 XGPIO28 I PD VDDQ33_EXT0 XGPIO28 58 XGPIO12 I PD VDDQ33_EXT0 XGPIO12 59 XGPIO10 I PD VDDQ33_EXT0 XGPIO10 60 XGPIO9 I PD VDDQ33_EXT0 XGPIO9 61 XGPIO11 I PD VDDQ33_EXT0 XGPIO11 62 XGPIO6 I PD VDDQ33_EXT0 XGPIO6 63 XGPIO8 I PD VDDQ33_EXT0 XGPIO8 64 XGPIO7 I PD VDDQ33_EXT0 XGPIO7 65 XGPIO2 I PD VDDQ33_EXT0 XGPIO2 66 XGPIO4 I PD VDDQ33_EXT0 XGPIO4 67 XGPIO5 I PD VDDQ33_EXT0 XGPIO5 68 XGPIO1 I PD VDDQ33_EXT0 XGPIO1 69 XGPIO3 I PD VDDQ33_EXT0 XGPIO3 70 XGPIO0 I PD VDDQ33_EXT0 XGPIO0 75 XGPIO27 I PD VDDQ33_EXT0 XGPIO27 Pad Number Pad Name Power Default Function 40 XPWMTOUT_4 I/O Type PU/PD I PD VDDQ33_EXT0 XPWMTOUT_4 41 XPWMTOUT_1 I PD VDDQ33_EXT0 XPWMTOUT_1 42 XPWMTOUT_0 I PD VDDQ33_EXT0 XPWMTOUT_0 43 XPWMTOUT_5 I PD VDDQ33_EXT0 XPWMTOUT_5 44 XPWMTOUT_2 I PD VDDQ33_EXT0 XPWMTOUT_2 45 XPWMTOUT_3 I PD VDDQ33_EXT0 XPWMTOUT_3 Pad Number Pad Name Power Default Function 21 XRESET_N I - VDDQ33_EXT1 XRESET_N 31 PWR_RST - - - - I/O Type PU/PD Pad Number Pad Name Power Default Function 48 XSPI0_MISO I/O Type PU/PD I PD VDDQ33_EXT0 XSPI0_MISO 49 XSPI0_CSN I PD VDDQ33_EXT0 XSPI0_CSN 50 XSPI0_MOSI I PD VDDQ33_EXT0 XSPI0_MOSI 51 XSPI0_CLK I PD VDDQ33_EXT0 XSPI0_CLK 71 XSPI1_MISO I PD VDDQ33_EXT0 XSPI1_MISO 72 XSPI1_CLK I PD VDDQ33_EXT0 XSPI1_CLK 73 XSPI1_MOSI I PD VDDQ33_EXT0 XSPI1_MOSI 74 XSPI1_CSN I PD VDDQ33_EXT0 XSPI1_CSN Power Default Function Comment - XUART0_TXD Through Level Shifter Pad Number Pad Name 46 XUART0_TXD I/O Type PU/PD - 47 XUART0_RXD - - - XUART0_RXD Through Level Shifter 52 XUART1_TXD I PD VDDQ33_EXT0 XUART1_TXD - 53 XUART1_RXD I PD VDDQ33_EXT0 XUART1_RXD - 54 XUART2_RXD I PD VDDQ33_EXT0 XUART2_RXD - 55 XUART2_TXD I PD VDDQ33_EXT0 XUART2_TXD - 56 XUART3_RXD I PD VDDQ33_EXT0 XUART3_RXD - 57 XUART3_TXD I PD VDDQ33_EXT0 XUART3_TXD - - PAD Number Symbol Condition Min Typ Max Units VIN Input voltage VIN on the high efficiency step down converter - - 20 V PAD: [2-19], [21-26], [28-31], [33-45], [48-75] Vundershoot Undershoot voltage for I/O -0.3 - - V PAD: [31] PWR_RST - -0.3 - 6 V VMAX Based on 3V3 I/O signalling - - 63.3 V Continuous - - 305 mA Pulsed - - 800 mA Min Typ Max Units - - 3.60 V 2.31 - 3.60 V -0.30 - 0.70 V 0.15 - - V VDD=3.30V Power On -3.00 - 3.00 A VDD=3.30V Power Off & SNS=0 -5.00 - 5.00 A 13 40 90 A PAD: [32] PAD: [46, 47] IMAX Parameter Tolerant External Voltage Condition VTOL 3.3 Power Off and On High-Level Input Voltage CMOS Interface VIH Low-Level Input Voltage CMOS Interface VIL Hysteresis Voltage V VDD=3.30V High-Level Input Current Input Buffer IIH Input Buffer with Pull-Down VIN=3.30V VIN=3.30V VDD=3.30V Low-Level Input Current Input Buffer Input Buffer with Pull-Down IIL VIN=0V VDD=3.30V Power On and Off -3.00 - 3.00 A VIN=0V VDD=3.30V -13.00 - -90.00 A 2.64 - 3.30 V Output High Voltage VOH IOH = 2.0mA, 4.0mA, 8.0mA and 12.0mA Output Low Voltage VOL IOL = -2.0mA, -4.0mA, -8.0mA and -12.0mA Output Hi-Z Current VOZ Input Capacitance CIN Any input and bi-directional buffers Parameter High Level Input Voltage Acronym Condition 0 - 0.66 V -5 - 5 A - - 5 pF Min Typ Max Units 1.26 - 1.80 V VIH Guaranteed Logic High Level Low Level Input Voltage VIL Guaranteed Logic Low Level 0 - 0.54 V Output High Voltage VOH IOH=2mA, 4mA, 8mA and 12mA 1.44 - 1.80 V Output Low Voltage VOL IOL=2mA, 4mA, 8mA and 12mA 0 - 0.36 V Input Pull-Up Resistor Current IRPU VPAD=0 15 - 77 A Input Pull-Down Resistor Current IRPD VPAD=1.80 17 - 77 A Input Hysteresis VH 0.18 - - V Input Leakage Current for Non Tolerant Cells IPAD DVDD=1.80, VPAD=0 or 1.80V - -6 - +6 A Off State Leakage Current IOZ DVDD=1.80, VPAD=0 or 1.80V -6 - +6 A Parameter Main Power Supply: PAD: [32] Symbol Min Typ Max DC_5V_12V 4.50 - 18.00 V Tc -20 - 85 C Maximum Operating Temperature Units State Currents: Max conditions VDD=3.30V Units 0 2 mA 1 4 mA 2 8 (Default) mA 3 12 mA Parameter Min Typ Max Units ESD stress voltage Human Body Model (JEDEC) -1.0 - 1.0 kV - 250 - V Min Typ Max Units - - 50 pF - - 25 pF - - 5 pF Parameter Min Typ Max Units RF frequency range 2412 - 2472 GHz 11b (1-11Mbps) - 16 - dBm 11g (6-54Mbps) - 14 - dBm 11n, HT20 (MCS0-7) - 12 - dBm Parameter Min Typ Max Units RF frequency range ESD stress voltage Charged Device Model PAD Number Symbol Condition Dynamic Characteristics PAD: [46, 47] CISS Input Capacitance COSS Output Capacitance CRSS Reverse Transfer Capacitance VDS=25V, f=1.0MHz, VGS=0V 2412 - 2472 GHz 11b (1Mbps) - -97.2 - dBm 11b (11Mbps) - -89.1 - dBm 11g (6Mbps) - -94.1 - dBm 11g (54Mbps) - -76.2 - dBm 11n, HT20 (MCS0) - -93.9 - dBm 11n, HT20 (MCS07) - -73.8 - dBm Figure 4 shows the mechanical dimensions of the ARTIK 053 Module. All dimensions are in mm. Note: The top layer "NO PCB ROUTING" gray areas are to prevent any shorts between exposed vias or traces and unused ARTIK 053 Module pads. The ARTIK 053 Module has an integrated on-module antenna. Figure 5 describes the precise restrictions on location that must be accounted for when placing the ARTIK 053 Module on your native PCB design. In addition please adhere to the following guidelines: Avoid severe WiFi radiation loss by allocating at least a 5x6.7mm "No PCB Routing" area (all layers) on either side of the ARTIK 053 Module, next to the on-module antenna. Locate the antenna area at the edge of your PCB board, and as far away from other electronics as possible. See Figure 4 for additional routing restrictions. This device complies with Part 15 of the FCCs Rules. Operation is subject to the following two Conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesirable operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/ TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the transmitter's radiating structure(s) and the body of the user or nearby persons. This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely responsible for certification and testing and labeling of its own products. In addition to any independently required labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the wording "Contains Transmitter Module FCCID: A3LCWAM210S." The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm between the equipment's radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end user of this requirement as required by applicable rules. The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or modifications to this module not expressly approved by the manufacturer will void the warranty and the users' authority to operate the equipment. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'operation est soumise aux deux conditions suivantes:(1) cet appareil ne peut causer d'interferences, et (2) cet appareil doit accepter toute interference, y compris les interferences qui peuvent causer un mauvais fonctionnement de l'appareil. Industry Canada Radiation Exposures Statement and Limitations on Use This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This equipment should be installed and must not be co-located or operating in conjunction with any other antenna or transmitter. In the United States and Canada, only Channel 1~11 can be operated and these channel assignments deal only with the 2.4 GHz range. The end product must be labeled to display the Industry Canada certification number of the module Contains transmitter module IC: 649E-CWAM210S Le dispositif d'accueil doivent etre etiquetes pour afficher le numero de certification d'Industrie Canada du module. Contient module emetteur IC : 649E-CWAM210S The following statement must be supplied with each product but can be printed in the user manual, the packaging, or provided as a separated leaflet. Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other relevant provisions of Article 3 of the R&TTE Directive 1999/5/EC, 2004/108/EC and RoHS directive 2011/65/EU. "The declaration of conformity may be consulted at www.artik.io/certification" The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of 20 cm between the equipment's radiating structure(s) and the body of the user or nearby persons. The OEM shall also advise its end user of this requirement as required by applicable rules. Type ARTIK 053 Module Order Number SIP-0P5WRS301 Description One ARTIK 053 Module For volume ordering of evaluation kits, please contact a sales representative in your area or visit https://www.artik.io/contact-us/. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIKTM DEVELOPMENT KIT AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER "SAMSUNG PRODUCTS"). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIKTM DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIKTM DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, "SAMSUNG") ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN "AS IS" BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN. 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