Metal Film, Cylindrical Resistors ctparts.com
Manufacturer of Passive and Discrete Semiconductor Components
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CTMFCR Series
05.05.08
ENVIRONMENTAL CHARACTERISTICS
Test Item
Requirements Permissible Change (ΔΔR)
Test Method
0.25% 0.50% 0.50%
Stability for
product
types
CTMFCR0204 50ΩΩ~220KΩΩ10ΩΩ~<50ΩΩ>220KΩΩ
CTMFCR0207 50ΩΩ~1MΩΩ10ΩΩ~<50ΩΩ>1MΩΩ
Temperature Coefficient of
Resistance As Spec MIL-STD-202F Method 304
+25/-55/+25/+125/+25°C
Short Time Overload
ΔR±0.1% JIS-C-5202-5.5
RCWV*2.5 or Max Overloading Voltage
5 seconds
no visible damage
Thermal Shock
ΔR±0.1% ΔR±0.25% ΔR±0.1% MIL-STD-202F Method 107G
-55°C~150°C, 100 cycles
no visible damage
Load Life ΔR±0.25% ΔR±0.25% ΔR±0.50%
MIL-STD-202F Method 108A
RCWV, 70°C, 1.5 hours ON, 0.5 hours OFF, total
1000~1048 hours
Humidity (Steady State)
ΔR±0.25% ΔR±0.50% ΔR±0.50% MIL-STD-202F Method 103B
40°C, 90~95%RH,RCWV 1.5 hours ON, 0.5 hours
OFF, total 1000~1048 hours
no visible damage
Resistance to Dry Heat ΔR±0.50% ΔR±1.00% ΔR±1.00% JIS-C-5202-7.2
96 hours @ +155°C without load
Low Temperature Operation
ΔR±0.25% ΔR±0.50% ΔR±0.50% JIS-C-5202-7.1
1 hour, -65°C, followed by 45 minutes of RCWV
no visible damage
Solderability 95%min coverage MIL-STD-202F Method 208H
245°C±5°C, 2±0.5 (sec)
Resistance to Soldering Heat
ΔR±0.10% ΔR±0.25% ΔR±0.10% MIL-STD-202F Method 210E
260±5°C, 10±1 seconds
no visible damage
*Storage Temperature: 25±3°C; Humidity <80%RH