HSMx-A10x-xxxxx PLCC-2, Surface Mount LED Indicator Data Sheet Description Features This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. * Industry standard PLCC-2 package To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. * Available in 8 mm carrier tape on 7 inch reel (2000 pieces) These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 120 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. * High reliability LED package * High brightness using AlInGaP and InGaN dice technologies * Available in full selection of colors * Super wide viewing angle at 120 * Compatible with both IR and TTW soldering process Applications * Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin backlighting * Electronic signs and signals - Interior full color sign - Variable message sign * Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.8 0.2 2.2 0.2 3.2 0.2 1.9 0.2 0.1 TYP. 0.8 0.1 3.5 0.2 0.8 0.3 0.5 0.1 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES) TOP MOUNT 2.8 0.2 2.2 0.2 1.9 0.2 5.2 0.2 3.2 0.2 0.1 TYP. CATHODE MARKING REVERSE MOUNT NOTE: ALL DIMENSIONS IN MILLIMETERS. 2 0.5 0.1 Table 1. Device Selection Guide Red Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.50 15.00 - 20 GaP HSMS-A100-L00J1 11.20 15.00 - 20 GaP HSMS-A100-H70J2 3.55 - 7.20 10 GaP HSMS-A100-J80J2 5.60 - 14.00 10 GaP HSMH-A100-L00J1 11.20 15.00 - 20 AlGaAs HSMH-A100-N00J1 28.50 50.00 - 20 AlGaAs HSMH-A100-M80J2 22.40 - 56.00 10 AlGaAs HSMC-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMC-A100-R00J1 112.50 140.00 - 20 AlInGaP HSMC-A101-S00J1 180.00 220.00 - 20 AlInGaP HSMZ-A100-T00J1 285.00 350.00 - 20 AlInGaP HSMC-A100-P30J1 45.00 - 90.00 20 AlInGaP Red Orange Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMJ-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMJ-A101-S00J1 180.00 200.00 - 20 AlInGaP HSMV-A100-T00J1 285.00 350.00 - 20 AlInGaP HSMJ-A100-R40J1 112.50 - 285.00 20 AlInGaP HSMV-A100-S80J1 224.00 - 560.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology Orange Part Number HSMD-A100-J00J1 4.50 15.00 - 20 GaP HSMD-A100-L00J1 11.20 15.00 - 20 GaP HSMD-A100-K4PJ2 7.20 - 18.00 10 GaP HSML-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSML-A101-S00J1 180.00 220.00 - 20 AlInGaP 3 Yellow / Amber Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.50 12.00 - 20 GaP HSMY-A100-L00J1 11.20 12.00 - 20 GaP HSMY-A100-J35J2 4.50 - 9.00 10 GaP HSMA-A100-Q00J1 71.50 100.00 - 20 AlInGaP HSMA-A101-S00J1 180.00 220.00 - 20 AlInGaP HSMU-A100-S00J1 180.00 320.00 - 20 AlInGaP HSMA-A101-R8WJ1 140.00 - 355.00 20 AlInGaP HSMU-A100-S4WJ1 180.00 - 450.00 20 AlInGaP Yellow Green Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.50 18.00 - 20 GaP HSMG-A100-K72J2 9.00 - 18.00 10 GaP HSME-A100-M02J1 18.00 70.00 - 20 AlInGaP HSME-A100-N82J1 35.50 - 90.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology 2.80 8.00 - 20 GaP Emerald Green Part Number HSMG-A100-H01J1 HSMG-A100-H41J2 2.80 - 7.20 10 GaP HSME-A100-L01J1 11.20 40.00 - 20 AlInGaP HSME-A100-M3PJ1 18.00 - 35.50 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMM-A101-R00J1 112.50 200.00 - 20 InGaN HSMM-A100-S00J1 180.00 350.00 - 20 InGaN HSMM-A100-U4PJ1 450.00 - 1125.00 20 InGaN HSMM-A100-V7PJ1 900.00 - 1800.00 20 InGaN Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMN-A101-N00J1 28.50 50.00 - 20 InGaN HSMN-A100-P00J1 45.00 70.00 - 20 InGaN HSMN-A100-R4YJ1 112.50 - 285.00 20 InGaN Green Part Number Blue Part Number Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV Tolerance = 12% 4 Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25C) Parameters DC Forward Current[1] Peak Forward Current[2] Power Dissipation HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/K/B/N 30 mA 30 mA 30 mA[3,4] 20 mA[4] 30 mA[3,4] 30 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 63 mW 60 mW 63 mW 48 mW 72 mW 114 mW Reverse Voltage 5V Junction Temperature 110C Operating Temperature -55C to +100C Storage Temperature -55C to +100C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 30 mA is recommended for best long term performance. 4. Operation at current below 5 mA is not recommended. 5 Optical Characteristics (TA = 25C) Viewing Luminous Peak Dominant Angle Luminous Intensity/ Wavelength Wavelength[1] 2 1/2[2] Efficacy v[3] Total Flux Dice PEAK (nm) D (nm) (Degrees) (lm/W) Iv(mcd)/v(mlm) Color Part Number Technology Typ. Typ. Typ. Typ. Typ. Red HSMS-A100 GaP 635 626 120 120 0.45 HSMH-A100 AlGaAs 645 637 120 63 0.45 HSMC-A10x AlInGaP 635 626 120 150 0.45 HSMZ-A100 AlInGaP 639 630 120 155 0.45 HSMJ-A10x AlInGaP 621 615 120 240 0.45 HSMV-A100 AlInGaP 623 617 120 263 0.45 HSMD-A100 GaP 600 602 120 380 0.45 HSML-A10x AlInGaP 609 605 120 320 0.45 HSMY-A100 GaP 583 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 HSMU-A100 AlInGaP 594 592 120 500 0.45 HSMG-A100 GaP 565 569 120 590 0.45 HSME-A100 AlInGaP 575 570 120 560 0.45 HSMG-A100 GaP 558 560 120 650 0.45 HSME-A100 AlInGaP 566 560 120 610 0.45 Green HSMM-A10x InGaN 523 525 120 500 0.45 Cyan HSMK-A10x InGaN 502 505 120 300 0.45 Blue HSMB-A100 HSMN-A10x GaN InGaN 428 468 462 470 120 120 65 75 0.45 0.45 Red Orange Orange Amber Yellow Green Emerald Green Notes: 1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25C) Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Voltage VR @ 100 A Min. Reverse Voltage VR @ 10 A Min. Thermal Resistance RJP (C/W) HSMS/D/Y/G 2.2 2.6 5 -- 180 HSMH 1.9 2.6 5 -- 180 HSMC/J/L/A/E 1.9 2.4 5 -- 280 HSMZ/V/U 2.2 2.6 5 -- 280 HSMB 3.9 4.3 -- 5 280 HSMM/K/N 3.4 4.05 -- 5 280 6 0.9 RELATIVE INTENSITY 0.8 BLUE EMERALD GREEN CYAN YELLOW GREEN GREEN 0.7 35 30 FORWARD CURRENT - mA 1.0 AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE 0.3 RED 0.2 HSMS/D/Y/G HSMZ/V/U 25 20 HSMH 15 HSMC/J/L/A/E HSMM/K/N 10 0.1 HSMB 5 0 380 430 480 530 630 580 680 730 780 0 WAVELENGTH - nm 1 0 2 4 3 5 FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 0.8 RELATIVE INTENSITY HSMx-A100 fig 1 GaP EMERALD GREEN 1.8 GaP YELLOW GREEN 0.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 GaP YELLOW GaP ORANGE GaN BLUE 0.4 GaP RED 0.2 0 380 430 480 530 580 680 630 730 1.6 Gap AlInGaP AlGaAs 1.4 GaN 1.0 0.8 0.6 0.4 0.2 0 780 5 0 WAVELENGTH - nm 10 25 CURRENT - mA CURRENT - mA HSMS/D/G/Y/H HSMC/J/L/A HSME HSMM/K/B/N 5 5 100 120 Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110C, RJA = 500C/W. 7 HSMZ/V/U HSME 15 10 40 60 80 TEMPERATURE (C) HSMC/J/L/A 20 10 20 DOMINANT WAVELENGTH - nm HSMS/D/G/ Y/H/Z/V/U 0 30 35 540 30 30 0 25 HSMx-A100 fig 3 35 35 15 20 Figure 3. Relative intensity vs. forward current. HSMx-A100 fig 1b 20 15 DC FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength. 25 InGaN 1.2 0 HSMM/K/N HSMB 530 510 20 40 60 80 TEMPERATURE (C) 100 120 Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 110C, RJP = 180C/W or 280C/W. CYAN 500 490 480 BLUE 470 460 0 GREEN 520 0 5 10 15 20 25 30 CURRENT - mA Figure 5. Dominant wavelength vs. forward current - InGaN devices. HSMx-A100 fig 5 35 1.0 0.4 0.3 NORMALIZED INTENSITY DELTA VF (NORMALIZED AT 25C) 0.5 0.2 0.1 GaP/AlGaAs/ AlInGaP 0 -0.1 -0.2 InGaN/GaN -0.3 -100 -50 50 0 100 0.8 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 150 0 10 20 30 40 50 ANGULAR DISPLACEMENT - DEGREES TEMPERATURE - C Figure 6. Forward voltage shift vs. temperature. Figure 7. Radiation Pattern. HSMx-A100 fig 6 TEMPERATURE 10 to 30 SEC. 255 - 260 C 3 C/SEC. MAX. 217 C 200 C 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 8. Recommended Pb-free reflow soldering profile. 4.50 Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 1.50 2.60 LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE TEMPERATURE - C 250 200 150 FLUXING 100 BOTTOM SIDE OF PC BOARD 50 30 TOP SIDE OF PC BOARD PREHEAT 0 10 20 30 40 50 60 70 80 90 100 TIME - SECONDS CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. SOLDER RESIST Figure 9. Recommended wave soldering profile. 8 Figure 10. Recommended soldering pad pattern. 60 70 80 90 TRAILER COMPONENT LEADER 200 mm MIN. FOR O180 REEL. 200 mm MIN. FOR O330 REEL. 480 mm MIN. FOR O180 REEL. 960 mm MIN. FOR O330 REEL. C A USER FEED DIRECTION Figure 11. Tape leader and trailer dimensions. HSMx-A100 fig 8 4 0.1 4 0.1 2 0.05 2.29 0.1 1.75 0.1 +0.1 O 1.5 -0 C 3.5 0.05 +0.3 8 -0.1 3.81 0.1 A 3.05 0.1 +0.1 O1 -0 8 0.229 0.01 Figure 12. Tape dimensions. HSMx-A100 fig 9 9 2 +0.5 -0 O 20.5 0.3 62.5 180 +0 -2.5 O 13 0.2 +1.50 8.4 -0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 13. Reel dimensions. HSMx-A100 fig 10 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 14. Reeling orientation. HSMx-A100 fig 11 10 Intensity Bin Select (X5X6) Intensity Bin Limits Individual reel will contain parts from one half bin only. X5 Min Iv Bin Bin ID Min. (mcd) Max. (mcd) G1 1.80 2.24 G2 2.24 2.80 H1 2.80 3.55 H2 3.55 4.50 4.50 5.60 X6 0 Full Distribution J1 2 2 half bins starting from X51 J2 5.60 7.20 3 3 half bins starting from X51 K1 7.20 9.00 4 4 half bins starting from X51 K2 9.00 11.20 5 5 half bins starting from X51 L1 11.20 14.00 6 2 half bins starting from X52 L2 14.00 18.00 7 3 half bins starting from X52 M1 18.00 22.40 8 4 half bins starting from X52 M2 22.40 28.50 9 5 half bins starting from X52 N1 28.50 35.50 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Tolerance of each bin limit = 12% 11 Color Bin Select (X7) Color Bin Limits Individual reel will contain parts from one full bin only. X7 Blue Min. (nm) Max. (nm) Amber Min. (nm) Max. (nm) A 460.0 465.0 A 582.0 584.5 B 465.0 470.0 B 584.5 587.0 C 470.0 475.0 C 587.0 589.5 480.0 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Orange Min. (nm) Max. (nm) A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 0 Full Distribution Z A and B only Y B and C only W C and D only V D and E only U E and F only T F and G only S G and H only Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only D 475.0 Color Bin Limits Cyan Min. (nm) Max. (nm) A 490.0 495.0 B 495.0 500.0 C 500.0 505.0 D 505.0 510.0 Green Min. (nm) Max. (nm) A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Emerald Green Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Yellow Green Min. (nm) Max. (nm) E 12 564.5 567.5 F 567.5 570.5 G 570.5 573.5 H 573.5 576.5 Red Orange Min. (nm) Max. (nm) A 611.0 616.0 B 616.0 620.0 Red Min. (nm) Max. (nm) Full Distribution Tolerance of each bin limit = 1 nm. Moisture Sensitivity Packaging Option (X8X9) Option Test Current Package Type Reel Size J1 20 mA Top Mount 7 inch J4 20 mA Top Mount 13 inch H1 20 mA Reverse Mount 7 inch H4 20 mA Reverse Mount 13 inch This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. J2 10 mA Top Mount 7 inch A. Storage before use J5 10 mA Top Mount 13 inch H2 10 mA Reverse Mount 7 inch H5 10 mA Reverse Mount 13 inch L2 2 mA Top Mount 7 inch - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" is Not blue and "5%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0040EN AV02-0198EN - July 5, 2013